Samsung Electronics Co., Ltd., the world leader in advanced semiconductor technology solutions, today announced that the industry's first 30-nanometer-class DRAM has just successfully completed customer evaluations, in two gigabit (Gb) densities. With DDR3 SDRAM becoming the predominant main memory this quarter, Samsung's aggressive advancement in process technology will raise productivity and expedite dissemination of high performance, 1.5V and 1.35V DDR3 for servers, desktops and notebook PCs.

"Our accelerated development of next generation 30nm-class DRAM should keep us in the most competitive position in the memory market," said Soo-In Cho, president, Memory Division, Samsung Electronics.

Transcend Information Inc., a worldwide leader in storage and multimedia products, is proud to announce its launch of 8GB DDR3-1066 Registered DIMM (RDIMM) and 4GB DDR3-1333 VLP (Very Low Profile) RDIMM modules. Featuring enhanced capacity, support for triple-channel memory configurations, and an onboard thermal sensor, these new high-density RDIMMs provide customers with cutting-edge support for higher data frequencies and significantly increase memory space.

As Transcend's highest density DDR3 module, the 8GB DDR3-1066 RDIMM is constructed with a robust ten-layer PCB that offers stable performance and durability, and also includes a high thermal efficiency aluminum heat sink to help maintain cool temperatures under load. Offering memory bandwidth up to 8.5GB/s and the flexibility to expand maximum capacity to 48GB (per processor), the 8GB DDR3-1066 RDIMM module allows administrators to create a robust infrastructure that runs memory-intensive applications such as virtualization and cloud computing with ease.

AMD's upcoming six-core desktop processor, codenamed "Thuban" is on course for a May 2010, suggests a report. The series is likely to receive the brand name Phenom II X6. There are four models planned for release within Q2, 2010. The Thuban core is AMD's desktop implementation of the Istanbul core, in the socket AM3 package, supporting dual-channel DDR3 memory. It is a monolithic multi-core design with six x86-64 cores, each with 128 KB of L1, 512 KB of L2 cache, and a 6 MB L3 cache shared between the six cores. Just as with K10 dual, triple, and quad core processors where AMD used a HyperTransport interface clock speed of 1800 MHz (3600 MT/s), or 2000 MHz (4000 MT/s), the new processor will take advantage of HyperTransport 3.x interface, with a HT speed of 2400 MHz (4800 MT/s). Thuban will be built on GlobalFoundaries' 45 nm node.

The table below lists out details of the four planned models. The model number of the top part isn't known. Most likely it is a Black Edition part, which comes with an unlocked BClk multiplier. It operates at 2.80 GHz, with a TDP of 140W. A step below is the Phenom II X6 1075T, which has an expected TDP of 125W, the 1055T is a notch below, and 1035T being the cheapest part. The exact clock speeds of the latter three models isn't known as yet. A month ahead of releasing these chips, AMD will announce the AMD 8-series chipset platform, led by 890FX (high-end, best for CrossFireX), 890GX (performance integrated graphics with CrossFire support). The AMD SB800 series southbridge chips will feature native support for SATA 6 Gb/s. Its on-die SATA controller gives out six SATA ports complete with RAID support. Some existing AM3 motherboards based on 7-series chipsets may also support Phenom II X6 with a BIOS update.

Corsair, a worldwide leader in high-performance computer and flash memory products, today announced that the Dominator GTX1 ultra-high performance DDR3 memory module (CMGTX1) has passed Intel's XMP-Ready certification at the blistering speed of 2333MHz, surpassing Corsair's 2000MHz modules as the fastest XMP-certified memory in the world.

Corsair Dominator GTX modules are individually hand-screened and tested to ensure unmatched performance. They are designed specifically for enthusiasts and overclockers who want to achieve the highest performance possible, and to break benchmark world records.

Followed by Intel recent 32nm "Clarkdale" Core i5 / i3 processor launch with built-in GPU engine, it is now a brand new page and competition for all-in-one PC. BIOSTAR, a professional manufacturer of motherboards after its top-line H55 motherboards "TH55XE" being released, today we see another main stream board "TH55B HD" in the market remains high quality component design, outstanding over clocking capabilities and new colorful slots. And of course, it also offers more competitive prices.

"TH55B HD" - a member of BIOSTAR famous "T-Series" with Micro ATX form factor design, black color PCB, and supporting latest Intel 32nm "Clarkdale" Core i5 / i3 processor.

Mushkin Enhanced, a global leader in high-performance computer products, announced today the release of three groundbreaking memory kits for Intel's LGA1156 and LGA1366 platforms.

Boasting ultra-low CL7 performance in high-density 4GB modules, the 996798 and 998798 memory kits provide free slots for future memory expansion while boosting memory performance to exceptional levels.

A-DATA Technology Co., Ltd., the worldwide leading manufacturer in high-performance DRAM modules and flash application products, today introduced its new XPG Gaming Series v2.0 DRAM module, offering multitude killer speed ranging from DDR3-1600, DDR3-1866, and DDR3-2200 MHz frequency with dual channel kit and triple channel kit options. Designed for gaming enthusiast, the new XPG Gaming Series v2.0 DRAM module are equipped with Thermal Conductive Technology (TCT), and doubling the amount of copper in the PCB to give gamers the speed and stability they need for demanding higher gaming experiences.

The new XPG Gaming Series v2.0 DRAM module features with Thermal Conductive Technology (TCT), each memory chip is direct contact with the heatsink to perform immediate heat spreading from critical areas, the increased surface area of heatsink also provide the efficiency of offload heat away from the DRAM module. Moreover, the doubling amount of copper in the PCB can improve the energy efficiency to lower the system temperature, in order to enhance the system stability.

At the ongoing CES event, ASUS displayed some of its upcoming motherboards which included the M4A89GTOD PRO, an ATX form-factor model based on the AMD 890G chipset. The AMD 890G seems to be a successor to the AMD 790GX, in being a performance integrated graphics part. It integrates a DirectX 10.1 compliant IGP while supporting discrete graphics with 2-way ATI CrossFireX.

The M4A89GTOD PRO comes with an expansive feature-set thanks to the AMD 890G. The more interesting component being the AMD SB800 southbridge chip, which is on its way to being one of the first PC motherboard chipsets to natively support SATA 6 Gb/s. The chip doles out six SATA 6 Gb/s ports, while doing away with its on-die IDE controller. An external JMicron-made storage controller compensates with an IDE connector, a SATA 3 Gb/s port (colored black) and perhaps an eSATA port (at 3 Gb/s speeds), too.

MSI G-Series and C-Series of laptop computers have reached a new apex in their evolution. The first NBs equipped with Intel's new generation Calpella platform to be shown at CES 2010, both series come with Intel's most advanced family of New Core processors and Microsoft's Windows 7 operating system. They also come with cinema-class screens coupled with top-end Surround Sound for maximum audiovisual enjoyment.

"We've had great success with our existing ZOTAC GeForce Eco series graphics cards but many users wanted a higher end model, and thus we engineered the ZOTAC GeForce GTS 250 Eco series," said Carsten Berger, marketing director, ZOTAC International. "Using our experience from the existing ZOTAC GeForce Eco series, we were able to optimize and reduce energy consumption of the award-winning GeForce GTS 250 architecture by a noticeable amount."

Powered by NVIDIA Unified Architecture with 128 unified shaders, the ZOTAC GeForce GTS 250 Eco series deliver compatibility with Microsoft DirectX 10, OpenGL 3.2, NVIDIA PhysX and CUDA enabled games and applications. High-performance DDR3 memory connected via 256-bit memory interface feeds the high-performance graphics processor with maximum energy-efficiency for a visual computing experience that's loaded with stunning realism and performance while maintaining optimal energy-efficiency.

Elitegroup Computer Systems (ECS), a leading motherboard, graphics card, barebone system and notebook manufacturer, today announced the launch of the ECS H57/H55 motherboard family with a lot of options of brand new technologies and unique features to meet the next generation of HTPC.

Kingston Technology Company, Inc., the independent world leader in memory products, today announced it is shipping the largest HyperX DDR3 memory kits to date. Users of the Intel Core i7 and X58 platforms can now take their systems to the memory extreme with Kingston's 1600MHz 24GB HyperX kit made up of six 4GB modules. For Core i5, P55 chipset enthusiasts, Kingston has released a 1600MHz 16GB kit of four 4GB modules to take full advantage of dual-channel performance.

"We are pleased to make available the largest HyperX memory kits ever for the prosumers, multimedia pro or super enthusiast who wants everything," said Mark Tekunoff, senior technology manager, Kingston. "Users working with the latest operating systems like Windows 7 can keep multiple programs open, run memory intensive video or photo applications, or run numerous virtual machines using 24GB or 16GB of DDR3 HyperX memory and create more efficiency and performance gains than ever before."

KINGMAX, leading manufacturer of DRAM Module and Flash Products, announces the high density solution for DDR3 memory for Intel Core i5 and i7, provide the most stable compatibility for desktop and laptop platforms. These DIMMs are available in single, dual and triple channel configurations and are specifically tuned for Intel CPUs; unleash the best performance for gaming operation.

KINGMAX high density solution DRAM Module improves the performance of 64 bit OS efficiently. The efficiency would be upturned after adopting KINGMAX high density DRAM Module, while operating video decoding, large image file handling and modifying and performance demanding games.

Super Talent Technology, a leading manufacturer of Flash storage solutions and DRAM memory modules, today announced two new hand tested 1600 MHz 1.65V DDR3 kits based on high density 256Mx8 DRAM ICs. WP160UX8G9 is a dual channel 8GB (2x 4GB) kit designed for high performance P55 based systems, and WB160T12G9 is a triple channel 12GB (3x 4GB) kit designed for exceptional performance in X58 based systems. Both new kits are clad in Super Talent's Chrome Series heatsinks for optimal thermal efficiency.

"These new high density kits will deliver refreshing performance gains in 64-bit desktop environments. We select the fastest available RAMs to build these kits, and we cherry pick the fastest modules to support high speeds", stated Super Talent Director of Marketing, Joe James. Both these kits will be available this week through Super Talent resellers. For more information, visit this page.

G.Skill International Co. Ltd., manufacturer of extreme performance memory and high performance solid-state storage, has today released its ultimate DDR3 memory kit. At 2400 MHz CL9 and 2000 MHz CL6, these ultra high frequency memory modules are available in standard 4GB (2GBx2) memory kits and are specifically tailored for Intel's P55 chipset and LGA-1156 CPUs.

The 2,400MHz CL9 memory modules are the fastest commercially available memory product in the world, allowing overclocking enthusiasts to reach unprecedented levels of performance to achieve the ultimate PC. In addition, G.Skill has also announced a series of ultra low latency DDR3 2,000MHz memory kits, including an extreme CL6, followed by CL7, CL8 and CL9, which perfectly match current Intel Core i5 750 and Core i7 860, 870 CPUs.

World class flash memory module manufacturer, Silicon Power announces today the new Xpower DDR3 overclocking series memory module. Complete with dual (2GBx2) and tri-channel (2GBx3) packs, it is available in DDR3-1600, 1800, 2000, 2133 MHz variants. Completely compatible with Intel quad-core Core i5 and Core i7 platforms, Xpower DDR3 modules use "oblique groove manufacturing process" and pure aluminum heat sink to resolve heat dissipation issues. In addition, Xpower DDR3 applies 1.65V to maintain high speed and stability to meet the needs of enthusiasts and gamers.

The oblique groove heat sink design of Silicon Power's Xpower DDR3 overclocking series increases the heat dissipation area of the heat sink and can provide up to twice the heat dissipation ability over standard heat sinks. In addition, the Xpower DDR3 series use 8-layered PCBs and new fly-by topology design for more efficient commands, addresses, control signals, and clocks signals. It also supports On-DIE Termination (ODT) to dramatically reduce unwanted reflection signals and maximize speed. Silicon Power insists on using original memory modules and FBGA packaging for better heat dissipation and accurate data transfer.

Lenovo today unveiled 11 new IdeaPad laptops and IdeaCentre desktops at the 2010 International Consumer Electronics Show that demonstrate the company's re-energized commitment to personal computing design and engineering specifically for consumers. The new IdeaPad laptop PCs - S10-3t, S10-3, Y460, Y560, G460, G560, V460 and V360 and IdeaCentre desktop PCs - A300, C310 and K320 - include industry leading design and technology that will help enhance performance, style and entertainment capabilities across Lenovo's consumer products lineup.

"Our new Idea PCs are the next step in our exciting new worldwide product portfolio designed with the consumer in mind," said Liu Jun, senior vice president, Idea Product Group, Lenovo. "These additions to our Idea portfolio demonstrate Lenovo's commitment to giving our customers the capabilities they expect, at prices they can afford, while showcasing our forward-thinking innovations."

The recently surfaced high-end dual socket LGA-1366 motherboard is pictured in full, without its cooling assembly. The picture reveals quite a bit about EVGA's new monstrosity. To begin with, the motherboard is neither ATX, nor EATX in the truest sense. Like the recently announced X58 Classified 4-way SLI which was based on the "XL-ATX" form-factor, this motherboard seems to be 13.58 inches (344.93 mm) long, and about as wide as EATX (330 mm, 13 inches), or maybe a little more.

Each LGA-1366 socket is wired to six DDR3 DIMM slots for triple-channel memory, and is powered by an 8-phase digital-PWM circuit. Each socket further has a 3-phase power circuit for its DIMM slots. The CPU VRM for each socket takes input from an 8-pin ATX, and what appears to be a 6-pin +12V (PCI-E?) connector. The motherboard further takes power from a 6-pin PCI-E power connector apart from the usual 24-pin ATX power connector. Some of these inputs may be redundant and needed only for additional electrical stability to support competitive overclocking.

GeIL announces the launch of the all new DDR3 Gaming Series Black Dragon Triple Channel Kit to be added to the performance DDR3 memory module lineup. The Gaming Series DDR3 Black Dragon Triple Channel Kits will be available for the full range of speed with enhanced performance and stability by GeILs' DBT - Die-hard Burn-in Technology.

Available Speeds:

• 1066 MHz CL7&8, 1333 MHz CL6, 7&9, 1600 MHz CL7,8&9,
• 1800 MHz CL7, 8&9, 2000 MHz CL8&9, 2133 MHz CL9

To build on the popularity of its NVIDIA ION based nettops, ASRock plans to release a new Intel Atom + NVIDIA ION motherboard based on the mini-ITX form factor, in 2010. The motherboard will be one of the first of its kind, with a stronger memory sub-system. The NVIDIA ION chipset will drive dual-channel DDR3 1066 MHz memory. The board makes use of dual-core Atom 330 processor which is passively cooled, while the NVIDIA ION chipset is cooled actively. The chipset embeds DirectX 10 compliant NVIDIA GeForce 9400M graphics. It gives out four internal SATA 3 Gb/s ports and two Power-eSATA (eSATA+USB combo) ports making use of all its ATA channels. The lone expansion slot is a PCI-Express 2.0 x16 (full-bandwidth).

ASRock-exclusive features include Dura-Cap Japanese solid-state capacitors, Instant Boot, Instant Flash, OC DNA, and Night LED. Connectivity includes 8-channel HD audio with optical SPDIF driven by VIA VT2020 CODEC, gigabit Ethernet, six external and four internal USB 2.0 ports, and display connectivity which includes DVI-D, D-Sub, and HDMI. While the motherboard supports up to 4 GB of memory, the graphics processor supports full-HD display resolutions including smooth playback of HD video. It passes Windows 7 compatibility. ASRock is yet to reveal pricing and availability.

Elpida Memory, Inc., Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced that its Hiroshima Plant has begun volume production of 40nm process 2-gigabit DDR3 SDRAMs. Since completing development of the DDR3 SDRAM last October it has taken Elpida only two months to ramp up mass production.

The new 2-gigabit DDR3 SDRAM achieves 44% more chips per wafer compared with Elpida's 50nm DDR3 SDRAM and a 100% yield for DDR3 products that operate at 1.6 Gbps, the fastest speed standard for current DDR3. It also supports high-speed products. Compared with 50nm products, it uses about two-thirds less current and supports 1.2V/1.35V operation as well as DDR3 standard 1.5V, resulting in reduced power consumption of around 50%.

Initially, Elpida plans a phased expansion of 40nm 2-gigabit DDR3 SDRAM mass production at its Hiroshima Plant. In the second quarter of 2010, 40nm process production will also begin at Rexchip, a subsidiary in Taiwan, to increase the manufacture of 40nm process products in order to lower products costs. Depending on conditions in the DRAM market, Elpida may transfer 40nm process technology to foundry partners ProMOS and Winbond to expand production based on this technology to an even higher level.

Elpida Memory, Inc., Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced that it had completed development of a 65nm XS extra-shrink version 1-Gigabit DDR3 SDRAM that is as cost-competitive as 50nm process memory devices.

In response to the slump in the DRAM market that has lasted since 2008, Elpida is taking a two-track R&D approach that focuses on conventional process migration and on layout innovations that reduce the cost of capital investment. Along with migrating to advanced processes such as 50nm and 40nm the company is developing shrunken chip versions through extensive use of existing ArF dry scanner equipment. As a result, a 65nm S shrink version was developed in 2008 and now a 65nm XS extra-shrink version has been completed.

The 65nm XS is a smaller version of the already shrunken 65nm S and delivers 25% more chips per 300mm wafer compared with its predecessor. In addition to its extremely small chip size the XS shortens the manufacturing process and helps to greatly reduce equipment costs through the use of ArF dry scanner equipment. Chips costs are comparable to 50nm process products.

Transcend Information Inc., a worldwide leader in the manufacture of high-performance memory modules, today launched 4GB aXeRam DDR3-2000 memory kits for use with Intel's LGA1156 Core i5 and Core i7 platforms. The XMP-ready DDR3 kits are designed to operate at a blazing-fast clock frequency of 2000 MHz with an exceptionally low voltage of just 1.65V.

Featuring memory bandwidth up to an incredible 32GB/s, Transcend's new aXeRam dual-channel memory kit is rated at 2000MHz with timings of 9-9-9-24, allowing performance enthusiasts and gamers to take their Intel Core i5 platform to the next level of memory overclocking performance. The Core i5, based on Intel's new Nehalem architecture, is the first Intel processor to integrate both a 16-lane PCI Express 2.0 graphics port and a two-channel DDR3 memory controller, enabling all input/output and manageability functions to be handled by the single-chip Intel P55 core-logic.

EVGA expanded its lineup of socket LGA1156 motherboards, this time with the entry-level EVGA P55V. This micro-ATX motherboard provides the bare essentials for the platform, but surprisingly doesn't leave out PCI-Express external switching that provides two PCI-Express 2.0 x16 slots at dual x8 bandwidth, and with it, SLI support. The already lean PCB has a 4-phase (2+2) CPU VRM, with four DDR3 DIMM slots next to it. Expansion slots include two PCI-E x16 (x16, NC, or x8, x8 depending on how they're populated), and two PCI-E x1. One out of the six SATA 3 Gbps ports from the P55 PCH is assigned as an eSATA port, it neighbours the 8-channel audio connector cluster, four USB 2.0 ports, and an RJ-45 for the gigabit Ethernet. It is priced at US $120.

Corsair, a worldwide leader in high-performance computer and flash memory products, today announced the launch of its new Dominator GTX ultra-high performance DDR3 memory modules for Intel and AMD platforms, designed specifically for performance enthusiasts, gamers and extreme overclockers.

Corsair Dominator GTX modules are individually screened and tested on multiple high-performance Intel X58 and P55 chipset platforms to ensure that they operate at the incredible frequency of 2250MHz at low-latency timings of 8-8-8-24 at 1.65V. They are designed specifically for performance enthusiasts and overclockers who want to achieve the highest performance possible and to break benchmark world records.