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HP Delivers High-performance Desktop and Mobile Workstations

HP today announced the new HP Z220 Workstations and HP EliteBook Mobile Workstations, packed with reliable and professional-class features.

HP's most affordable, no-compromise workstations, the Z220, features next-generation Intel Core and Intel Xeon processors, the latest integrated and discrete professional graphics from Intel, NVIDIA and AMD and four integrated USB 3.0 high-speed ports. The Z220 entry-level workstation is available in a choice of an exceptionally expandable, Convertible Mini-Tower (CMT) or a highly compact Small Form Factor (SFF) that's 65 percent smaller and perfect for tight spaces.

J&W Readies Consumer Variant of M001 Fanless PC

Earlier this month, J&W unveiled the M001, a fanless industrial PC (IPC). The company is poised to unveil its affordable variant targeting the consumer nettop market, at Computex. It will be launched in two affordable models, starting at US $149, the M001-AP1I42110 and M001-AP6I62C10. The former is driven by Intel Atom D2550 processor, 2 GB DDR3 memory, and packs a 320 GB HDD; while the latter is driven by Atom D2800 processor, 2 GB memory, and a 32 GB SSD. Most modern nettop features, including WiFi b/g/n, multi-format card-reader, gigabit Ethernet, and 1080p-capable graphics, will be included.

GIGABYTE Intros 6PXSV3 Workstation Motherboard

GIGABYTE recently rolled out the 6PXSV3, a workstation motherboard designed for Xeon E5-1600/2600 processors in the LGA2011 package. Based on the Intel C604 chipset, the motherboard is designed to provide essential modern and legacy connectivity to workstations in mission-critical environments. The LGA2011 socket is powered by a 6-phase VRM with CPL-made chokes, and IR-made FETs and VRM controller. It is wired to eight DIMM slots, which support up to 256 GB (RDIMM) and 64 GB (UDIMM) of quad-channel DDR3-1600 MHz memory.

There are just the three expansion slots, two PCI-Express 3.0 x16, and one open-ended PCI-Express 2.0 x4. The remainder of the processor and chipset's PCI-Express lane budgets are allocated PCI-Express DMI-assist, which helps drive the mini SAS with 4 x SAS ports (3Gb/s), apart from four SATA 3 Gb/s, and two SATA 6 Gb/s ports. An ASPEED 2300 provides display output (resolutions up to 1920x1200 supported), and remote management (iKVM, IPMI 2.0). There are two gigbit Ethernet interfaces, driven by Intel 82574L chips, a third management port is also available. The GA-6PXSV3 will be available shortly.

Super Micro Intros X9 5X GPU Workstation with NVIDIA Maximus Certification

Super Micro Computer, Inc., a global leader in high-performance, high-efficiency server technology and green computing, now offers NVIDIA Maximus technology in its latest high-end, enterprise-class X9 SuperWorkstation (7047GR-TRF), allowing users to simultaneously design, render and simulate on the same workstation, avoiding traditional, time-consuming and costly processing downtime. Supermicro's NVIDIA Maximus certified solution integrates an NVIDIA Quadro series graphics processing unit (GPU) dedicated for design and visualization tasks with four NVIDIA Tesla C2075 co-processors dedicated to handling compute-intensive tasks like simulation-an industry-first configuration of NVIDIA Maximus technology.

Team Group Launches Industrial Memory Modules

The largest professional computer show in Asia, the COMPUTEX TAIPEI, is coming on June 5. Team Group Inc., one of the leading memory manufacturers in the world, is ready to reveal its latest industrial memory modules to professional buyers around the world, including industrial-standard and server-grade memory modules, embedded industrial flash memories, and so on. The emphasis on customization, product performance and after-sale service quality are the live demonstration of how Team Group is determined for the industrial grade/SI market.

Team Group's industrial memory modules come with Standard series, Green series and Wide temperature series. The modules are produced with chips from original manufacturers and go through multiple meticulous and sophisticated verification analyses and hi-low temperature tests. The Wide temperature series is capable of working at the temperature ranging from -40℃ to 95℃, and provides stable operation performance even in conditions as punishing as at a desert or in arctic environment. The Green series works only with minimal voltage as low as 1.35V. You cannot be any greener than that. The newly developed high frequency and large volume memory modules complete the full product series for various demands in medial equipment, surveillance systems and industrial computers.

Dell Reimagines the All-in-One Computer for Consumers

Dell is reimagining the all-in-one computer with a new portfolio of solutions for consumers who desire beautifully designed systems for multimedia creation and entertainment. The new computers include the XPS One 27, Dell's largest ever all-in-one and part of the premium XPS performance family, and the Inspiron One 23 and Inspiron One 20 all-in-one computers for families. The three desktop computers are slim and stylish and reflect Dell's design aesthetic that places a premium on unique materials, form factors and experiences.

The XPS One 27 delivers a big-screen experience - from the diagonal to the resolution - with one of the most vibrant displays Dell has offered. The XPS One 27 is 27-inches of stunning 2560x1440 Full Quad HD clarity and color. The wide format 16:9 WLED display makes digital work, movies, games and photos appear crisp, colors vivid. It delivers optional high-performance graphics from NVIDIA and entertainment features such as Waves MaxxAudio 4 and Infinity-branded speakers, an optional slot load Blu-ray disc drive, and optional internal TV tuner, making it an entertainment and multimedia powerhouse.

GeForce GTX 690 Breaches P20000 at 3DMark 11

Taiwanese proverclocker TIN set a new 3DMark 11 record by scoring P20962 points using a single GeForce GTX 690 graphics card. The score included 25179 graphics, 15213 physics, and 12412 combined scores. The feat was achieved by overclocking an EVGA GeForce GTX 690 to clock speeds of 1509 MHz (base), 1639 MHz (GPU Boost), and 7336 MHz (memory, effective); and sustaining it using liquid nitrogen cooling. The double-headed eagle on steroids was supported by an Intel Core i7-3960X processor clocked at 4.50 GHz, 16 GB of quad-channel DDR3-2133 MHz memory, and EVGA X79 Classified motherboard. Find more information on the feat here.

Princeton Intros 12 New DDR3-1600 Memory Kits

With the advent of Intel's Core "Ivy Bridge" processors, and DDR3-1600 MHz becoming a standard memory speed, there is a push among memory vendors for affordable memory kits supporting the standard. Princeton Japan launched no less than 12 new memory kits, spanning across standard DIMMs, SO-DIMMs (for notebooks and AIOs); single-module and dual-channel kits, with module densities of 2 GB, 4 GB, and 8 GB. The modules bear basic appearance, and lack fancy heatspreaders. The modules achieve their rated speed of 1600 MHz DDR with a CAS latency as high as 11T, and module voltage of 1.5V. The modules are hence JEDEC PC3-12800 specifications compliant, and don't require XMP profiles to operate at advertised speeds, on compatible platforms. The company is providing lifetime warranty. Prices start at 5,400 JPY (US $68).

Sapphire Pure White B75M-MA Motherboard Detailed

It looks like Sapphire wants slices of not just the performance and enthusiast pies, but also the high-volume mainstream one. Its latest creation is a motherboard based on Intel's small business-oriented B75 chipset, the Pure White B75M-MA. Built in the micro-ATX form-factor, this board doesn't add too much over the B75's feature set. To begin with, its LGA1155 socket, which supports current generation Core "Ivy Bridge" and previous generation Core "Sandy Bridge" processors, is powered by a 4+1 phase VRM, which draws power from an 8-pin EPS connector. That's a giveaway that a performance/enthusiast design team was behind this mainstream motherboard.

The LGA1155 socket is wired to two DDR3 DIMM slots, supporting up to 16 GB of dual-channel DDR3 memory; and a PCI-Express 3.0 x16 slot. Three PCI-Express 2.0 x1 slots that are wired to the B75 PCH, make up the rest of the all-PCIe layout. Storage connectivity includes one SATA 6 Gb/s, and three SATA 3 Gb/s ports. The board provides a total of four USB 3.0 ports (two on the rear-panel, two via headers). 6+2 channel HD audio, a number of USB 2.0 ports, a keyboard/mouse combo PS/2, and gigabit Ethernet make for the rest of the connectivity. Display outputs include DVI and D-Sub. Expect competitive pricing.

Habey Readies Fanless IPC with Core i3 Processor

Known more for its VIA Nano and Intel Atom-powered fanless IPCs (industrial PCs), Habey is readying BIS-6763, a new IPC model that is driven by a robust Core i3 "Sandy Bridge" dual-core processor. Measuring 190 x 190 x 67 mm, the IPC is made of a metal chassis, a portion of which is ridged, to double up as a heatsink. Beneath it is a pair of cylindrical heat pipes that transport heat to the top panel (heatsink), which cool the Core i3-2367M processor (dual-core, 1.40 GHz, 3 MB L3, 17W TDP), and Intel HM65 Express PCH.

Sadly, the IPC does not take advantage of the processor's dual-channel DDR3 IMC, there's just the one DDR3 SO-DIMM slot, supporting up to 8 GB of DDR3-1333 MHz memory. For expansion, there are two mini-PCIe slots. The sole storage option is a 2.5-inch SATA 6 Gb/s SSD/HDD bay. Connectivity includes one serial RS232 interface, six USB 2.0, gigabit Ethernet, and Intel HD 3000 graphics that gives out an HDMI, and a D-Sub display output. With 2 GB of DDR3 memory included, the BIS-6763 is expected to be priced at US $499. A variant that's powered by Intel Celeron 857 (dual-core, 1.20 GHz, 2 MB L3, 17W TDP), is also expected to be available, at US $299.

Production of AMD "Piledriver" FX Processors Begin Q3 2012

Production of AMD's next-generation FX processor family, which are based on its "Piledriver" microarchitecture, will commence in Q3 2012, according to industry sources. Some of the first client processor models based on the "Vishera" silicon, will be the eight-core FX-8350, six-core FX-6300, and quad-core FX-4320. The three model names were earlier misinterpreted with an "x" prefix from a roadmap slide.

A few more details are known about these chips. For starters, the chips will be built on the existing AM3+ package, retaining compatibility with current AM3+ platforms. The chips will also retain dual-channel DDR3-1866 MHz integrated memory controllers, and Turbo Core 2.0. The main differences here, are increases in IPC (performance to clock-speed ratio), and the implementation of resonant clock mesh technology, which increases energy efficiency.

Team Launches Vulcan Series Overclocking Memory

Team Group Inc., one of the leading memory manufacturers in the world, continues to make breakthroughs in over-clocking memory modules. Not only the new Team Vulcan series is making its entrance into the increasingly diversified and complete over-clocking product line, but also new 8GB memory modules are rolling out as a member of Xtreem, Dark and Vulcan series. The high clock speed and low timing design improves system operation performance dramatically, making it the perfect choice for players looking for extreme performance.

Toshiba dynabook REGZA PC D732 All-in-One Desktop Pictured

Here are the first pictures of Toshiba's first all-in-one (AIO) desktop under the dynabook REGZA brand, the REGZA PC D732/T9. Built with 23-inch full-HD LED displays, the AIOs come in three color options, black, white, and red. Its clockwork is care of 3rd Generation Intel Core "Ivy Bridge" processors, the Core i7-3610QM with its 2.30 GHz clock speed, and 3.30 GHz Turbo Boost speed, comes standard. Other specifications include 8 GB of dual-channel DDR3 memory, 2 TB of storage, a Blu-ray XL (BDXL) drive, Toshiba Active Display OFF, audio device featuring SRS Premium Sound 3D, a digital TV tuner; and other connectivity options that include USB 3.0, HDMI, gigabit Ethernet, 802.11 b/g/n, and SD card reader. Prices start at 210,000 JPY (US $2,655).

Eurocom Racer 2.0 Scores P22111 in 3DMark Vantage Powered by Radeon HD 7970M

Eurocom Corporation, a developer of long lifespan, fully upgradable Notebooks and Mobile Workstations has been testing the AMD Radeon HD 7970M in its new line of 3rd Generation Intel Core i7 (Ivy Bridge) powered notebooks. Eurocom technicians achieved a score of P22111 in 3DMark Vantage in the EUROCOM Racer and a score of P5848 in 3DMark 11.

The AMD Radeon HD 7970M is currently the highest performing mobile GPU by AMD, giving Eurocom customers a superior choice of video processor options to configure into their new Eurocom system or upgrade into their existing system. The addition of the AMD Radeon 7970M GPU offers customers a greater selection of video processor options to fit any preference or performance level

Leadtek Announces a Trio of Winfast GeForce GT 600 Graphics Cards

Leadtek joined the GeForce GT 600 launch party with three new Winfast series graphics card models, based on the GeForce GT 630, GeForce GT 620, and GeForce GT 610 (pictured in that order, below). The GT 630 card (model: LR2741), dons a full-height PCB, a double-slot cooling solution, 1 GB of SDDR3 memory, and clock speeds of 810/1620/1600 MHz (core/CUDA cores/memory effective).

The GeForce GT 620 based card (model: LR2740), is low-profile capable, its cooling solution consists of an active fan-heatsink. Like the GT 630 model, this card utilizes 1 GB of SDDR3 memory as well. It comes with clock speeds of 700/1400/1333 MHz. Lastly, there's the GT 610-based card (model: LR2739), which packs a much more compact fan-heatsink, 1 GB of SDDR3 memory, and clock speeds of 810/1620/1066 MHz. All three cards provide DVI, D-Sub, and HDMI display outputs.

ADATA Adds DDR3-2133X 8 GB and 16 GB Dual Channel Kits to XPG Xtreme Series

ADATA Technology Co., Ltd announced a boost to its XPG Xtreme Series DDR3 lineup with the DDR3-2133X 8 GB and 16 GB dual channel kits. This new entry to XPG Xtreme Series satisfies enthusiasts' increasingly stringent demands for high capacity and performance DRAM modules.

The new ADATA XPG Xtreme Series DDR3-2133X runs at 2133 MHz and an operating voltage of 1.65V with latency settings of 10-11-11-30, allowing for predicted bandwidth up to 34.1 GB per second.

G.SKILL Remains Most Popular DDR3 Brand at HWBOT Since 2011-Q4

For the 2nd consecutive quarter, G.SKILL topped the ranking list by internationally renowned overclocking website, HWBOT, as the most popular DDR3 memory brand used within the overclocking community since 2011-Q4. During the 1st quarter of 2012, figures showed more than 1/3 of users within the community have chosen G.SKILL DDR3 kits as their memory solution for breaking overclocking records and benchmarking, while gaining a total of 7.4% of popularity share since Q1, 2011.

As Bill Wang, VP at G.SKILL, stated "G.SKILL memory is widely known for its superior quality and unlimited overclocking headroom. We are excited and thankful that our products are highly recognized by overclocking community and we will continue to strive for ultimate customer satisfaction in the years to come." For more detail, please refer to this page.

Crucial LRDIMM Server Memory Now Available to Support New Intel Xeon E5 Family

Crucial, a leading global brand of memory and storage upgrades, today announced the immediate availability of Crucial Load-Reduced DIMM (LRDIMM) server memory in support of the new Intel Xeon processor E5 family.

The rise of data center virtualization, cloud computing, and transactional databases has put additional strain on enterprise servers, causing them to struggle to meet user demands. Crucial LRDIMM server memory supports higher memory densities than standard DDR3 RDIMMs, allowing the addition of more DIMMs per channel, and providing flexible, scalable memory that allows applications to perform more effectively. By reducing the electrical loads presented to the CPU, Crucial LRDIMMs deliver up to twice the installed memory capacity for Intel Xeon processor E5 family-based servers, and increase memory bandwidth by up to 35 percent over standard DDR3 RDIMM modules, helping improve overall data center performance and efficiency.

Team Launches Xtream DDR3-3000 MHz Memory

After revealing Xtreem DDR3 2800 CL11 dual-channel memory module ahead of any one in the market, Team Group Inc., one of the leading memory manufacturers in the world, beats everyone else once again by rewriting the history of over-clocking memory market.The limited version of Xtreem DDR3 3000 CL11 designed with higher standard is making the impossible possible.

Team Group, powerful and strong at what we are doing, has always been working every minute to develop over-clocking products that are equipped with higher specifications and speed. Every time a product rolls out in the market, the wows never stop. This time Team Group leads the industry by launching Limited Edition Xtreem DDR3 3000 CL11 which is not only the fastest available. It is about to detonate the explosive desire of all overclocking maniacs. Xtreem DDR3 3000 CL11 is made of specially selected chips from major manufacturers and passes rigorous testing and verification procedures.

Apacer Intros New DDR3-1600 MHz SO-DIMM Modules

As the leading memory module maker, Apacer Technology Inc. has long been devoted to the industrial computer field, particularly the embedded systems. Apacer takes the lead by introducing today a memory module featuring high speed, high capacity and low power consumption as well as full compatibility with the 22-nm Ivy Bridge microprocessor platform released lately by Intel. Compared with the mainstream 8-GB DDR3-1333 memory module, Apacer's high-speed DDR3-1600 memory module dedicated to embedded systems requires a working voltage of only 1.35V, which can be applied into the module either to the fanless design or to the embedded system. Thanks to its 20% higher performance and 11% less power consumption, the module can save considerable power expenditure for enterprise users.

QNAP Targets the High-end SMBs with Two 16-Drive Turbo NAS Models

QNAP Systems, Inc. today announced its new additions for the high-end SMB market segment with two 16-drive 3U rackmount Turbo NAS models with up to 64TB storage capacity using 4 TB drives. The TS-EC1679U-RP and TS-1679U-RP, powered by the Intel Xeon processor and the Intel Core i3 processor respectively, are the highest capacity and highest performing NAS products ever developed by QNAP. Both models feature optional 10GbE networking and 6Gb/sec SATA interfaces, achieving incredible 2,000 MB/sec and 200,000 IOPS throughput; delivering sustained ultra-high performance suitable for demanding data center & high-end SMB environments. The new models feature cable-less disk drive backplanes, hot-swappable power supply, and cooling fan modules for maximum reliability and uptime.

J&W Intros M001 Nettop

J&W introduced a new fanless nettop and IPC, the M001. Driven by Intel "Cedar Trail" Atom D2550 or N2800 or N2600 processors, the M001 packs a nano-ITX system board. It has one vacant DDR3 SO-DIMM slot, supporting up to 4 GB of memory. For storage, there is one 2.5-inch SATA 3 Gb/s drive bay. Connectivity include 802.11 b/g/n, gigabit Ethernet, three USB 2.0 ports, SD/SDHC/MS/MS Pro/MMC card reader, HDMI and VGA display outputs, and RS232 serial (COM). The ridged metal body doubles up as a heatsink. Minus the antenna and stand, the system measures just 135 x 128 x 45 mm. Pricing and availability information is awaited.

MSI Readies AMD Brazos 2.0 Powered Wind U270 Netbook

MSI is working on a Wind U270 11.6-inch netbook variant that's driven by AMD E2-1800 "Brazos 2.0" dual-core APU. The E2-1800 packs two x86-64 cores clocked at 1.70 GHz, 1 MB of total cache, Radeon HD 7340 integrated graphics, and TDP of 17W. The APU is backed by AMD A68M FCH, which provides up to four SATA 6 Gb/s ports. 2 GB of single-channel DDR3 memory is included, so is a 320 GB 5400 RPM HDD. Connectivity options include 802.11 b/g/n, Bluetooth 2.1 + EDR, and gigabit Ethernet. Other features include a 1.3 MP webcam, and a 6-in-1 flash card reader supporting SD/SDHC/SDXC/XD/MMC/Memory Stick. Windows 7 Home Premium 64-bit comes pre-installed. The 11.6-inch screen packs a resolution of 1366x768 pixels. Slated for May 18, the Wind U270-412 is priced at 46,800 JPY (US $587), in Japan.

NEC Refreshes Lavie and ValueStar Models with Ivy Bridge Core Processors

NEC Japan updated the system configurations of two its ValueStar desktop and Lavie notebook models, the ValueStar L Series, and the Lavia L Series. The new ValueStar L is a conventional desktop, which is powered by Intel Core i7-3770S quad-core processor clocked at 3.10 GHz, with 8 GB of dual-channel DDR3 memory, and GeForce GT 435 graphics. Its storage subsystem includes a 2 TB hard drive. A 23-inch full-HD (1920x1080) monitor comes included.

The Lavie L Series, on the other hand, is a 15.6-incher powered by Intel Core i7-3610QM quad-core processor (2.30 GHz with 3.30 GHz Turbo Boost), 8 GB dual-channel DDR3 memory, and Intel HD Graphics. With storage, in packs a 1 TB hard drive, and a Blu-ray XL writer drive. Its 15.6-inch screen packs a resolution of 1366x768 pixels. A digital TV tuner module comes optional. Prices vary with configuration.

Dell Introduces 22 nm Xeon-Powered PowerEdge C5220 Micro-Servers

Dell today announced that customers such as Morphlabs and Vibrant Media are using Dell microserver technologies based on Intel Xeon processors to power business-critical web 2.0, cloud, and content delivery networks (CDN), as well as high-performance computing (HPC) applications. Driven by the emergence of a growing hardware and application ecosystem, x86-based microservers are rapidly evolving from a niche solution to one with widespread awareness and value.

"We're constantly inspired by the unique ways our customers are leveraging Dell microserver platforms to drive specialized web 2.0, HPC and cloud computing applications," said Forrest Norrod, vice president and general manager, Dell Server Solutions. "As the microserver market and ecosystem have matured, customers like Vibrant Media have validated that microservers are a cost-effective, scalable platform in web 2.0 environments."
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