March 6th 2012. G.SKILL, the worldwide leading high performance memory designer, has showcased the extreme dual channel memory kits, DDR3 2133 MHz 32 GB (4 x 8 GB), compatible with the latest Z77 motherboards at CeBIT 2012.

Working closely with leading motherboard manufacturers, G.Skill is ready to provide PC enthusiasts the best dual channel memory for the upcoming Z77 motherboards. On the MSI Z77A-GD65 and ASRock Z77 Extreme6 motherboards, G.Skill has demonstrated the 32 GB super size memory kits at DDR3 2133 MHz ultra high speed with Intel Core i7 2600K processors.

"It's just a warm-up. We are working on some faster memory kits and they will be released soon. It's going to be an exciting time" said Paul Chen, senior R&D manager at G.Skill.

Apart from other Z77 chipset-based models that have been exhaustively covered in the past, MSI is working on a media-oriented ATX LGA1155 motherboard based on the H77 chipset, the ZH77A-G43. Why MSI added a "Z" in the model name beats us. The LGA1155 socket is powered by a simple 5-phase VRM. MSI is kind enough to provide passive cooling for the entire CPU VRM area. The CPU is wired to four DDR3 DIMM slots, providing dual-channel DDR3 support.

Expansion slots include one PCI-Express 3.0 x16 (wired to the CPU), one PCI-Express 2.0 x16 (electrical x4, wired to the PCH), two PCI-Express 2.0 x1, and three legacy PCI slots. PCI slots are still in good demand by media-professionals who need them for pro-grade sound production cards. Storage connectivity includes two SATA 6 Gb/s, and four SATA 3 Gb/s. All four USB 3.0 ports on this board (two on the rear-panel, two via header) are provided by the H77 PCH. HDMI, DVI, and D-Sub form the display IO. To top it off, you get 8-channel HD audio with THX TruStudio Pro support, and gigabit Ethernet. Expect a value price-point.

A serious player in the PC motherboard industry, the world's 3rd biggest (in terms of volumes) at that, ASRock is one brand that has accumulated the engineering potential to make anything. It's far from finished with its LGA2011 motherboard lineup, and made sure visitors at its CeBIT booth had their jaws on the floor. Enter, the ASRock X79 Extreme11. This motherboard is designed for not just extremely-overclocked PCs, but battlestations holding their own huge storage arrays. This monster is built in the EATX form-factor.

The LGA2011 socket is powered by a 16+2 phase DigiPower VRM, which draws power from two 8-pin EPS connectors. It is wired to eight DDR3 DIMM slots, supporting up to 64 GB of quad-channel DDR3 memory with speeds of over DDR3-2400 MHz by overclocking. The memory areas are powered by 4+4 phase VRM. Apart from the 24-pin ATX connector, and the two EPS connectors, the board also draws power from two 4-pin Molex connectors. The board makes use of Japanese-made solid-state capacitors almost throughout.

Here are the first pictures of the GA-B75M-D3V up close. This micro-ATX form-factor board is designed for business desktops (small-businesses, home-offices), and is based on Intel's B75 chipset. The board supports "Ivy Bridge" and "Sandy Bridge" Core processors in the LGA1155 package. Its component loadout doesn't stretch too far beyond what the chipset offers. The LGA1155 CPU is powered by a simple 5-phase VRM, it is wired to just two DDR3 DIMM slots, supporting dual-channel DDR3 memory.

Expansion slots include one PCI-Express 3.0 x16, two PCI-Express 2.0 x1, and one legacy PCI. Storage connectivity includes two SATA 6 Gb/s, and four SATA 3 Gb/s, all internal. The 6 Gb/s ports are angled. Display connectivity includes one each of DVI and D-Sub. There are four USB 3.0 ports, two on the rear-panel, two via front-panel header, all wired to the PCH. 6-channel HD audio, gigabit Ethernet, Parallel/LPT, and PS/2 combo connector top it all off. Expect the GA-B75M-D3V to be hovering around the $100 mark.

The Z77A-G45 is going to be one of the more affordable socket LGA1155 motherboards based on the Intel Z77 chipset, by MSI. The Z77A series from MSI starts with high end Z77A-GD80, Z77A-GD65, and Z77A-GD55. eTeknix scored pictures of the Z77A-G45. The G45 uses a simple 6-phase VRM to power the LGA1155 CPU. It doesn't cheap out on cooling for the MOSFETs. The socket is wired to four DDR3 DIMM slots, supporting dual-channel DDR3 memory.

The expansion slot area is identical to that of all the other Z77A series motherboards, consisting of two PCI-Express 3.0 x16 (x8/x8 when both are populated), one PCI-Express 2.0 x16 (electrical x4), and four PCI-Express 2.0 x1. MSI gave legacy PCI the boot. Strangely enough, this board features NVIDIA SLI support (something unusual for a "G45" model, as "D" in the model name signifies SLI support. The motherboard doesn't appear to use third-party storage or USB 3.0 controllers. All six SATA ports are internal, wired to the Z77 PCH, and consist of two SATA 6 Gb/s, and four SATA 3 Gb/s. All four USB 3.0 ports (two on the rear-panel, two via front-panel header) are wired to the PCH.

Rambus Inc. (Nasdaq:RMBS), one of the world's premier technology licensing companies, today announced it received notice that the Administrative Law Judge (ALJ) for its U.S. International Trade Commission (ITC) action against LSI Logic, MediaTek, ST Microelectronics and other Respondents has issued an Initial Determination. According to the notice, ALJ Theodore R. Essex found there to be no violation of Section 337 of the Tariff Act of 1930 for the patents in question. The action is Investigation Number 337-TA-753.

Rambus may request a full Commission review of the ALJ's Initial Determination. If the Commission grants a petition for review, it may affirm, modify, reverse, set aside, or remand all or part of the ALJ's decision in developing the ITC's final determination.

A little earlier, we were treated to pictures and details of the Gigabyte G1.Sniper 3 motherboard based on Intel Z77 chipset, supporting LGA1155 "Ivy Bridge" and "Sandy Bridge" processors. Presenting, Gigabyte's first G1.Killer series motherboard in the micro-ATX form-factor, the G1.Sniper M3. This new board is based on the same Z77 chipset, and is backed by a fairly exhaustive feature-set that makes it a formidable high-end micro-ATX gaming desktop choice (good for LAN party rigs). The LGA1155 socket is powered by a 9-phase VRM, which draws power from a 4-pin ATX connector (instead of 8-pin EPS). The socket is wired to four DDR3 DIMM slots, supporting dual-channel memory.

Super Talent Technology, a leading manufacturer of NAND flash solutions, today announces the 2133 MHz Quadra kit, our fastest over-clocked quad-channel DDR3 kit to date.

The Quadra series was designed to give PC enthusiasts the ultimate computing experience. These new 2133 MHz module enable our customers to take full advantage of the new 6-Core processor based motherboards by running at speeds up to 2133 MHz. With these new 2133 MHz Quadra Series modules support, the new Sandy Bridge E based motherboards can now support a full 16 GB of DDR3 DRAM at over-clocked speeds of 2133 MHz.

On 27th February 2012, the highest DDR3 memory frequency record was smashed again by the well-known Swiss overclocker, Christian Ney. Using G.SKILL extreme RipjawsZ memory kit, Christian Ney has achieved the astonishing score of DDR3 3736MHz with 4GB high capacity memory stick. "It was a lot of fun while tweaking G.SKILL memory. You can feel the unlimited potential and always want to go higher and higher" said by Christian Ney.

Motherboards based on the Intel Z77 Express chipset are on course for an April 8 launch, even if you won't find compatible 3rd Generation Core processors on shelves, on that day. Here is the first picture of a finished and good-to-go ASRock Z77 Extreme6 motherboard, which will be the company's flagship board based on the Z77 chipset, in its main product line.

The Z77 Extreme6 comes with the same black and gold styling found on the company's X79 motherboard lineup. The LGA1155 CPU socket is powered by a 12-phase DigiPower VRM. It is wired to four DDR3 DIMM slots, supporting dual-channel DDR3 memory speeds with over DDR3-2800 MHz speeds by overclocking. Expansion slots include two PCI-Express 3.0 x16 (x8/x8 when both populated), wired to the CPU; one PCI-Express 2.0 x16 (electrical x4), wired to the PCH; a PCI-Express 2.0 x1; a mini-PCIe 2.0 x1 (for wireless network cards, etc.); and two legacy PCI slots (pray why?).

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash application products, once again achieves a breakthrough in overclocking memory specifications with the launch of single 8GB 1600MHz CL9 and dual kit 16GB memory modules. As a market solution for 1600 MHz 8 GB low latency overclocking, the new modules support the latest quad-channel X79 platform, and meet the demands of enthusiasts for high density memory.

ADATA's Product Planning Department DRAM Project Manager Alex Wu said: "In recent years, gamers and overclockers care about more than just the pursuit of extreme performance. Energy consumption has become a major consideration when purchasing electronics." He added: "The new XPG Gaming V 2.0 1600G 8 GB single and 16GB dual kit memory modules use voltage of only 1.35V, with 9-11-9-27 timing, and are compatible with the latest X79 four-channel platform. They provide gamers with the opportunity to significantly upgrade their RAM all the way to 64 GB, in order to experience faster operation and performance of desktop computers."

Lincredible phenomenon spreads around the world! Miracles did not only happen on the new basketball star Jeremy Lin, but also ASRock, the global top3 motherboard manufacturer! By updating the latest ME8 BIOS & Driver, ASRock today proudly announced their entire Intel H61 motherboard series now support Intel Rapid Start and Smart Connect Technologies! These new technologies are targeted to be supported with Intel next gen motherboard platforms, but ASRock offers an early chance to let users to experience new techniques on current H61 motherboard with 2nd Gen Intel Core Processor (Sandy Bridge).

"High-performance functions are not exclusive for high-end motherboards. ASRock's strength is to apply premium function on budget-level motherboards, making the function available by most of the users." commented James Lee, V.P. of Sales and Marketing at ASRock. "This time, miracles do happen at ASRock! Thanks to the excellent R&D team, ASRock is the first motherboard company to apply these two Intel new functions on H61 series motherboard in the world!"

Super Talent Technology, a leading manufacturer of NAND flash storage solutions, today announces a new line of 1066 & 1333 MHz, quad-rank registered DDR3 RDIMM modules for servers.

Many of today's new servers support a new 16 core processors and now require a new type of RDIMMs called quad-channel DDR3. On the heels of their single and dual rank RDIMMs, Super Talent is pleased to announce a new Quad-Rank Quad-Channel RDIMM Module designed for those who require even more DRAM capacity.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the latest VIA COMe-8X90 module, featuring a 1.2 GHz VIA Nano X2 E-Series dual core processor and the VIA VX900H media system processor (MSP). The ruggedized VIA COMe-8X90 module targets industrial PC and large OEM customers focused on dynamic application segments, including medical, advanced gaming, industrial automation and digital signage.

Measuring 95 mm x 125 mm, COM Express is an industry standard embedded form factor developed and maintained by the PICMG (PCI Industrial Computer Manufacturers Group). COM Express modules integrate core CPU, chipset and memory on the module, providing support for extensive connectivity options, including USB, audio, video, and Ethernet, through board-to-board connectors to an I/O carrier board. The modular approach allows for short time-to market, application-specific customization, simplified development, high stability and long life cycles.

Hiroshige Goto, contributor for PC Watch that is known for detailed schematics of dies estimated the layout of Ivy Bridge silicon. Ivy Bridge is Intel's brand new multi-core processor silicon built on its new 22 nanometer silicon fabrication process. The four core silicon, which four configurations can be carved, will be built into packages that are pin-compatible with today's Sandy Bridge processors. The die area of Ivy Bridge is 160 mm², it has a total transistor count of 1.48 billion, compared to the Sandy Bridge silicon, which has 1.16 billion transistors crammed into a die 216 mm² in area, built on the 32 nm process.

Ivy Bridge has essentially the same layout as Sandy Bridge. The central portion of the die has four x86-64 cores with 256 KB dedicated L2 cache each, and a shared 8 MB L3 cache, while either sides of the central portion has the system agent and the graphics core. All components are bound by a ring-bus, that transports tagged data between the four CPU cores, the graphics core, the L3 cache, and the system agent, which has interfaces for the dual-channel DDR3 integrated memory controller, the PCI-Express controller, and the DMI chipset bus.

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash application products, today announced the launch of new DDR3 server memory modules for cloud business solutions, which feature improved levels of energy efficiency and performance.

The most striking aspect of the new modules is their high efficiency. This results in major energy savings, leading to reduced overall power consumption for cloud businesses, and all-around lower carbon dioxide emissions. These benefits come with no sacrifice in terms of performance- the high speed operation and reduced memory-bus load of these modules leads to greatly enhanced overall system efficiency. Fully compatible with major motherboards, these server DIMM modules are a reliable solution that reduce power costs and increase environmental protection.

The world's leading brand, Team Group Inc. has made headway and gone on to another record breaking OC memory products. The newly unprecedented introduction of dual-channel Xtreem LV DDR3 2800 CL11 module is the highest standard of its kind on the market today, refreshing a new history in OC memory's market!

Team Group's Xtreem LV series have always been praised, not only OC memory products come with excellent cost-effective value and have been well received by all sectors. Following the publication of quad-channel Xtreem LV DDR3 2600 CL10, Team Group has once again led the industry and released the world's limited dual-channel Xtreem LV DDR3 2800 CL11. As it adopts strictly selected chips from original factories and has to pass through stringent tests and verification procedures, it is able to enhance even further its support capabilities after teaming up with the latest Intel XMP V1.3 version. In addition, it is also collocated with eight-layer PCB in order to increase its stability performance by up to 8GB (4GB*2) large capacity. Its built-in ultra-high clock design is able to allow the computer operation to reach an unimpeded speed.

NVIDIA's GeForce Kepler 107 (GK107) will go into making several of its entry-thru-mainstream SKUs, such as N13 GeForce M GPUs for notebooks, and N14 Quadro GPUs for professional graphics cards, but more importantly, it will also go into making the D14 GeForce 600 series discrete PC graphics cards for the retail and OEM markets. A CGI sketch of the reference design board was leaked to the web, which found its way to VR-Zone, which reports that the GK107 will be used in two desktop PC discrete graphics SKUs: D14M2-20, and D14P1-10, based on the GK107-200 (512 MB DDR3) and GK107-300 (GDDR3/GDDR5) variants of the chip, respectively.

The sketched GK107 graphics card appears to be similar to the GF108-based GeForce GT 440 board. The GPU will feature a 128-bit wide DDR3/GDDR3/GDDR5 memory interface. Its cooler design is similar, with a 11-blade axial fan, and a heatsink with spirally-projecting aluminum fins. Apparantly legacy D-Sub support will be dropped for the first DVI-I connector. There will be two dual-link DVI connectors, and a mini-HDMI.

Chinese motherboard manufacturer that specializes in high cost-performance motherboard, ONDA, is working on a micro-ATX motherboard based on the Z77 chipset. Its pictures made it to the press. The board mostly sticks to the chipset's feature set, except using an additional PCIe-PCI bridge that gives out two legacy PCI slots. As a Z77-based motherboard, it should support both overclocking and Smart Response SSD caching. The LGA1155 socket, which supports today's Sandy Bridge and tomorrow's Ivy Bridge processors, is powered by a simple 4+1 phase VRM. It is wired to four DDR3 DIMM slots, supporting dual-channel DDR3 memory.

All of the chipset's SATA ports are wired internally, including two SATA 6 Gb/s and four SATA 3 Gb/s. The board provides four USB 3.0 ports, two on the rear panel, two via header, all four are wired to the PCH. Apart from the two legacy PCI slots, we have one PCI-Express 3.0 x16 and one PCIe 2.0 x1. Display outputs include DVI, D-Sub, and HDMI. 6-channel HD audio and gigabit Ethernet make for the rest of the connectivity.

Two models from Intel's Desktop Board Executive series of motherboards for office PCs got pictured and detailed by VR-Zone. These socket LGA1155 motherboards are mostly based on Intel 7-series Q77 and B75 chipsets, that provide some manageability, and data security features over the feature-set of H77. Intel has three Executive series models planned, the DQ77MK, the DQ77KB, and DB75EN. Of these, the DQ77MK and DB75EN are built in the micro-ATX form-factor, while the DQ77KB is mini-ITX.

The two micro-ATX parts use a similar PCB layout, with some features differing between the two. The DQ77MK is pictured below, it has all the features a small-business PC will ever need. Expansion slots include one each of PCI-Express x16, PCI-Express x4 (open-ended), PCI-Express x1, and legacy PCI. Storage connectivity includes six SATA (one of which is mSATA, for SSD caching). The PCH gives out four USB 3.0 ports, which are wired two each on the rear-panel and via a header to the front-panel. It uses a simple 5-phase VRM that should be enough to run LGA1155 processors. The socket is wired to four DDR3 DIMM slots supporting dual-channel memory. It has a variety of external connectivity.

KINGMAX, a world renowned leading brand of DRAM and flash memory, adds another new product to its Nano Gaming Ram series: 8GB overclocking memory modules in one stick. This is the largest capacity in one stick and the only DDR3 memory modules which doesn't need heatsink for cooling. 8GB DDR3 memory modules with speed faster than 1600MHz also support Intel XMP - Extreme Memory Profiles. Further, 8GB DDR3 memory modules are compatible with Intel X79 platform, enabling quad channel memory setting and allowing memory upgrade up to 32GB. KINGMAX also announces standard desktop 8GB DDR3 modules.

For professionals and enthusiasts who need to work on high quality images or need mass computing, it is most awkward when applications require more memory than real memory can afford. The KINGMAX 8GB DDR3 memory modules with surpassing capacity are designed to solve abovementioned difficulties and to help computer system work much more smoothly and faster. Gamers and overclockers, who like to pursuit ultimate speed, are able to operate quad channel memory setting on the latest Intel X79 platform to boost the system equipped with Intel 2nd Generation Core i7 Extreme performance to the next high level.

A little earlier this month, Apple discontinued supplies of its 13-inch white MacBook (base) to educational institutions, which it stopped selling to consumers much earlier, last year. Apple has replaced this education variant of white MacBook with a new education variant of MacBook Air. The new variant will be offered to educational institutions at US $999 a piece, when purchased in packs of 5 (costing US $4,995), making it a viable replacement to the white MacBook.

The new MacBook Air variant is also a 13-incher, driven by Intel Core i5 ULV processor clocked at 1.60 GHz, with 2 GB of DDR3 memory, 64 GB solid-state storage (carried on from the 11-inch consumer base model of MacBook Air), but features the larger 13-inch display. Unfortunately, this model is only available to educational institutions that purchase in bulk (those packs of 5), and so the cheapest MacBook individual students can buy is the 11-inch MacBook Air.

Japanese built-to-order gaming PC maker Ark PC unveiled an AMD-powered variant of its Tathlum Gaming PC desktop (model: CY-AF8A99A-C2). The machine is built into a Cooler Master HAF 912 Advanced chassis, and is accompanied by a 23-inch full-HD monitor. In the driver's seat is AMD FX-8150 processor, seated on an ASRock Fatal1ty 990FX motherboard, with 8 GB dual-channel DDR3-1333 MHz memory, and AMD Radeon HD 7970 3 GB graphics. The processor is cooled by a Zalman CNPS9900MAX Red. Other components of interest include a Hitachi DeskStar 1 TB 7200 RPM SATA 6 Gb/s hard drive, onboard HD audio, and gigabit Ethernet. A SilverStone ST75F-SST-P 750W 80 Plus Silver PSU powers it all. Windows 7 Home Premium x64 is the OS of choice. The Tanthum CY-AF8A99A-C2 is priced at 167,800 JPY (US $2,175).

G.Skill, the worldwide leading high performance memory designer and manufacturer, has announced the brand new Ares series low profile performance DDR3 memory. Featured with low profile heat spreader design (3.2cm in height), G.Skill Ares series DDR3 memory modules are the perfect choices for building high performance PCs with large CPU coolers, small form factor desktop computers or any other systems with more restricted space.

Toshiba launched the Satellite U840 Ultrabook in Singapore. This 14-inch Ultrabook is Toshiba's first. It is 19.9 mm thin, and weighs as low as 1.59 kg. It uses an aluminum body with a silvery brushed-metal finish. The metal body also adds rigidity. It is driven by 2nd generation Core ULV "Sandy Bridge" processor, backed by DDR3 memory, and storage options that include either 128 GB SSD or a HybridHDD that has a 16 GB SSD subunit that caches hot data on the rest of the drive.

Toshiba's proprietary Hi-Speed Start technology works to reduce start-up time. The 14-inch display offers "HD resolution", we're guessing it's 1600 x 900 pixels. Network connectivity includes gigabit Ethernet, WiFi b/g/n, and Bluetooth. The lone display output is a full-size HDMI. Other connectivity includes USB 3.0, and USB 2.0. The SleepCharge technology allows you to charge your smartphone even with the notebook powered down. Slated for later this Q1, 2012, the Satellite U840 is priced at SGD $1,399 (US $1,125).