Wednesday, February 8th 2012
G.Skill Announces Ares Low Profile DDR3 Memory Kits
G.Skill, the worldwide leading high performance memory designer and manufacturer, has announced the brand new Ares series low profile performance DDR3 memory. Featured with low profile heat spreader design (3.2cm in height), G.Skill Ares series DDR3 memory modules are the perfect choices for building high performance PCs with large CPU coolers, small form factor desktop computers or any other systems with more restricted space.Every Ares memory kit is hand-tested with G.Skill rigorous internal validation process to ensure the maximum stability and compatibility with both Intel and AMD platforms.Compliant with the latest Intel XMP (Extreme Memory Profile) function, G.Skill Ares series DDR3 memory provides PC enthusiasts and extreme gamers a trouble free overclocking experience on Intel platforms, while enjoying the enhanced memory bandwidth. G.Skill Ares specifications are listed as below. Specifications are subject to change without notice. For further details please check the G.Skill website at www.gskill.com
24 Comments on G.Skill Announces Ares Low Profile DDR3 Memory Kits
:P
I emailed G.Skill to come up with a low profile 2133 model comparable to the samsungs but with heatspreaders and XMP profile 2 weeks ago and lo and behold!
:toast:
It is a good time to buy moar rams.
EDIT
Good to see Gskill jumping on board with low profile sticks. I'm really hoping it's the trend across the board.
I doubt there would be much of a change for faster speeds and volts. FFS
FYI, the heatspreaders that do not cool ram properly are typically made of thick metal, much as KInston's T1 heatsink, and Mushkin's Ridgeback heatsink. The thin metal on these DIMMs isn't going to affect cooling ability much, as is probably there for esthetics.
Speaking of esthetics, i really like this new look.
FACTS no WORDS
Same with Kingston? YES, tested by me!
OF course, not many users remove heatsinks like this, but I do. What happens is that the heat gets trapped in the metal covering the memory IC, and the thickness ofthe metal prevents quick removal. With the heatisnks on, the sticks get quite warm to the touch, probably 40c-45c. With the heatspreaders removed, they barely hit 32c.
This is was measured with a thermal diode attached to the DIMM next to the middle ICs.
Keep in mind that as a reviewer, I have to stay 100% in fact as much as possible. It is FACT that some heatspreaders..some only, mind you, do the opposite of what they were intended to do.
I always leave feedback about obnoxiously tall heatspreaders. Looks like they are listening to consumer input at g.skill.
I have bought quite a few of these $5 copper ones to replace stupid hair comb style ones that block more airflow than much of anything else.
EVERCOOL EC-MC-CO Copper Heatsinks only
I'm sure you meant "are not really needed" though.
Yeah, the heatspreaders are basically for aesthetics now. I got blue RipjawsX/Vengeance LP to match the MSI boards, and the red RipjawsX and RipjawsZ to match the ASUS boards.
BTW GSkill, these are not LP!!! they are standard height just without the gargantuan heatspreaders that are rife among sticks these days :rolleyes:
In fact, I've already posted pictures, as have other users of the same modules, and it's been proven that the sticks, although of the same model number, do have different memory under the heatspreaders, and they clock a bit differently. The heatspreaders are there specifically because of this, and I see no problems with that what-so-ever.
Now, if my testing had shown that the modules were failing at stock, because of the heatspreaders, then I might make some noise about it....but as it stands, right now, it's a "secret" that if you buy, will give you much more than you asked for, once the heatspreaders are removed.
Anyway, that has nothign to do with these modules. G.Skill tends to use very thin heatspreders, that work very well, and do not limit airflow around the module.