As soon as Intel rolls out its Ivy Bridge mobile processors ASUS' ultrabook offering will be updated through the release of two Zenbooks, the 11.6-inch UX21A and the 13.3-inch UX31A. Design-wise, these upcoming models are expected to resemble their predecessors (the UX21 and UX31) but they'll feature more juicy specs like (optional) Full HD IPS screens (the UX21A will have a 1366 x 768 display by default, whereas the 'base' UX31A comes with a 1600 x 900 panel), and one of three Ivy Bridge CPUs - the 1.8 GHz Core i3-3217U, 2.4 GHz Core i5-3317U or 2.8 GHz Core i7-3517U, with a 17 W TDP.

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash application products, announced its latest product offering aimed at satisfying the needs of extreme gamers. In an industry first, the company has launched the single 8GB XPG Gaming Series DDR3L 1333G Desktop overclocking memory. With a high density of 8GB and low voltage of only 1.35V, it is anticipated to provide excellent system performance and overclocking capabilities to meet the requirements of power users and overclockers.

ADATA DRAM product planning department project manager Alex Wu explained, "With the popularity of 64-bit operating systems, high-density memory is a prerequisite in many gamers' minds. We are the first to launch DDR3L 1333G high-density 8GB memory modules, achieved in the XPG Gaming Series". He further stated: "This product adopts a 1.35 volt design, to offer gamers excellent stability and efficiency and also reduce waste heat and power consumption costs". The XPG Gaming Series DDR3L 1333G desktop overclocking memory features high density and low voltage, helping gamers achieve the ultimate in system effectiveness. At the same time, the reduced power consumption leads to lower carbon emissions, resulting in greater environmental sustainability.

ADATA Technology, a worldwide leading manufacturer in high-performance DRAM modules and NAND Flash application products, today introduced its latest XPG Series DDR3L 1333MHz 4GB dual-channel kit memory. The modules feature high-density, low timing and low voltage, enhanced system stability, and improved performance to meet market needs and especially those of gamers.

The latest XPG Plus series DDR3L 1333+ is available in 2GB single channel and 4GB dual channel kits, with latency of 8-8-8-24. The utilization of an exclusively designed aluminum heat sink and high quality circuit board ensures high efficiency and stability of the memory modules. The Gaming Series DDRL 1333G 4GB dual channel kit has latency of 9-9-9-24. They employ the same special heat sink design, and can effectively reduce running temperature to extend the life of the module.

One of AMD's design goals for its Fusion architecture must have been its application in mobile processors, where AMD isn't the brightest in terms of energy efficiency. The company's fastest product for the notebook platform is based on the Llano silicon, will release in 2011, and is a quad-core APU. Enter the AMD A8-3530MX.

Built on the 32 nm process with FS1 package, the A8-3530MX is an accelerated processing unit (APU), it combines a quad-core processor with a powerful GPU and northbridge component. With a default clock speed of 1.90 GHz and TurboCore speed of 2.60 GHz, the A8-3530MX packs 4 MB of L2 cache, and a dual-channel DDR3-1600 MHz memory controller, that also supports DDR3L-1333 MHz.

The GPU component is the DirectX 11 compliant AMD Radeon HD 6620G, with 400 stream processors, and engine clock speed of 444 MHz. To drive it, the northbridge component is entirely integrated into the APU, which packs a PCI-Express 2.0 hub to support discrete graphics. Despite so much machinery, the top-of-the-line chip maintains a TDP of 45W (common for notebook quad-core chips).

Elpida Memory, Inc., Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced it had developed a 2-gigabit DDR3 SDRAM using an industry-leading 25nm process for memory manufacturing. Using the most advanced process technology available Elpida has achieved the industry's smallest chip size for a 2-gigabit SDRAM.

The newly developed 25nm DRAM process technology requires 30% less cell area per bit compared with Elpida's 30nm process. The chip output for a 2-gigabit DDR3 SDRAM wafer using the new process is about 30% higher versus 30nm.

Elpida Memory, Inc., Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced that it had begun sample shipments of its new 2-gigabit DDR3 SDRAM (product names: EDJ2116DEBG and EDJ2108DEBG) geared for use in consumer electrical appliances. The new SDRAM is the industry's smallest 2-gigabit DDR3 that supports an x16-bit I/O interface.

The new 2-gigabit DDR3 SDRAM is well suited to consumer electrical appliances. It meets the high-speed DDR3-1600 (1600Mbps) standard likely to become the mainstream memory speed standard in 2011, uses energy-efficient 1.35V for the DDR3L-1333 memory speed and is compliant with DDR3-Plus (seamless BL4 access) for upgrading the performance of consumer electrical appliances.

Elpida Memory, Inc., Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced that it had completed development of a 30nm process 2-gigabit DDR3 SDRAM. The new 2-gigabit DDR3 SDRAM used 30nm-level advanced process migration technology to create the DRAM industry's smallest-level 2-gigabit DDR3 SDRAM. It achieves 45% more chips per wafer compared with Elpida's 40nm process products. Also, the new process design developed by Elpida will help contain rising chip costs associated with process migration. As a result, the 2-gigabit DDR3 is slated to become an extremely cost-competitive product.

Elpida's new chip meets the JEDEC specs for the high-speed DDR3-1866 and 1.35V low-voltage, high-speed DDR3L-1600 memory chips, both expected to become mainstream industry products in 2011. Also, the 30nm DDR3 SDRAM is eco-friendly. As a DDR3 SDRAM it achieves one of the industry's lowest levels of electric current usage (approximately 15% less operating and approximately 10% less standby usage compared with Elpida's 40nm products), which contributes to lower PC and digital consumer electronics power consumption.

OCZ Technology Group, Inc., a leading provider of high-performance solid-state drives (SSDs) and memory modules for computing devices and systems, unveils new Ultra-Low Voltage (ULV) and Extreme-Low Voltage (ELV) high-speed DDR3 desktop memory, providing the optimal balance of performance and power efficiency in one solution. Committed to staying ahead of the curve, OCZ is offering enthusiast-grade memory that complies with the latest JEDEC "DDR3L" low-voltage standards which ensures that system RAM runs cooler and more efficiently during intensive multi-tasking, gaming, and productivity applications.

"We are pleased to announce a complete range of low-voltage memory offerings designed for the latest crop of energy efficient platforms," said Eugene Chang, Vice President of Product Management. "In the past, lower voltage meant lower performance, but now with our extreme-low voltage optimized memory, consumers don't have to sacrifice high performance to also achieve energy savings."

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced the publication of JEDEC DDR3L, a widely anticipated addendum to its JESD79-3 DDR3 Memory Device Standard. Continuing the evolution of DDR3 as the dominant DRAM standard today, DDR3L will enable a significant reduction in power consumption for a broad range of products that utilize memory; including laptops, desktops, servers, networking systems and a wide array of consumer electronics products. The updated version of JESD79-3, including the DDR3L addendum, is available for free download here.

Called DDR3L for DDR3 Low Voltage, devices adhering to the new standard will operate from a single 1.35V power supply voltage compared to 1.5V in existing devices. Under the new standard, DDR3L memory devices will be functionally compatible to DDR3 memory devices, but not all devices will be interoperable at both voltage ranges.

A-DATA Technology Co., Ltd., the worldwide leading manufacturer in high-performance DRAM modules and flash application products, today announced its DDR3L ("L" for low voltage) 1066/1333 (1.35volt) MHz Registered DIMM and DDR3L 1066/1333 MHz (1.35volt) ECC DIMM low voltage server memories have been certified by Intel, that able to perform lower power consumption with great reliability to increase better efficiency on Westmere-EP processor-based server.

"Enterprise often requires 24x7 operations from server memory for data accessing and collecting with reliability and performance requirements," said Richard Shen, manager of A-DATA product management department. "We are proud to offer our DDR3L 1066/1333 MHz R-DIMM and DDR3L 1066/1333 MHz ECC DIMM low voltage server memory that has certified by Intel to enterprise customers, which delivers high performance and great reliability with less power consumption to meet enterprise's critical requirements, as well as to protect and to preserve the environment."

Lexar Media, a leading global provider of memory products for digital media, today introduced Crucial DDR3L-1333Mhz 1.35v energy-efficient server memory modules in support of the new Intel Xeon processor 5600 series. Available in 1GB, 2GB and 4GB RDIMM and VLP (very low profile) RDIMM modules, Crucial DDR3L memory modules are fully compatible and have been validated with the new Intel Xeon processor 5600 series. Servers across the enterprise, including those utilized for virtualization, data storage and processing, and blade servers will reap the benefits of new Crucial DDR3L memory. Crucial DDR3L memory is available through select resellers worldwide and online at Crucial.com/server.

"The benefits of energy-efficient DDR3L memory are clear - most notably the significant reduction in memory sub-system energy consumption and overall system cooling demands. Moreover, these benefits come without sacrificing the performance gains our customers expect from Intel's next-generation servers," said Jim Jardine, Lexar Media senior worldwide product manager. "Additionally, all Crucial DDR3L 1.35v memory has been fully validated and certified compatible with the Intel Xeon Processor 5600 series, so customers can rest assured their server infrastructure investment will perform reliably and efficiently with Intel's newest processors."