BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices, is proud to launch an edgy addition to its 4th generation of RACING motherboards with the gaming ready BIOSTAR RACING B365GTA. Built for gamers who want an A-Grade motherboard equipped with A+ gaming features, the RACING B365GTA is equipped with premium quality components that ensure professional level performance without compromising on durability. While remaining affordable, the new motherboard features a refreshing and futuristic new design that pushes the conventional norm, enthusiasts will be able to build a PC that outshines the others and set a new standard for PC design.

The BIOSTAR RACING B365GTA, equipped with the latest Intel B365 chipset, brings support for the 9th & 8th Generation Intel Core processors for the most modern features available on the market. Namely, PCI-E M.2 32 Gb/s (with Intel Optane Technology Ready) for faster boot time as well as a bandwidth boost to your traditional stored device for rapid access to your game, USB 3.1 Gen1 support (5 Gb/s) for an easy plug-and-play experience with your external devices and faster transfer speed (compared with USB 2.0), and HDMI 4K resolution for a better than life visual gameplay. Up to 64 GB of DDR4 memory spread over 4-DIMMs give the user plenty of RAM to multitask without compromise, and with such a bold grey and black design and futuristic heatsink, it is sure to make heads turn and eyes sparkle with envy.

GIGABYTE, a leading server systems builder which recently released a total of 17 new AMD EPYC 7002 Series "Rome" server platforms simultaneously with AMD's own official launch of their next generation CPU, is proud to announce that our new systems have already broken 11 different SPEC benchmark world records. These new world records have not only been achieved against results from all alternative processor based systems but even against competing vendor solutions using the same 2nd Generation AMD EPYC 7002 Series "Rome" processor platform, illustrating that GIGABYTE's system design and engineering is perfectly optimized to deliver the maximum performance possible from the 2nd Generation AMD EPYC.

Micron Technology, Inc. (Nasdaq: MU), today announced advancements in DRAM scaling, making Micron the first memory company to begin mass production of 16 Gb DDR4 products using 1z nm process technology

"Development and mass production of the industry's smallest feature size DRAM node are a testament to Micron's world-class engineering and manufacturing capabilities, especially at a time when DRAM scaling is becoming extremely complex," said Scott DeBoer, executive vice president of Technology Development for Micron Technology. "Being first to market strongly positions us to continue offering high-value solutions across a wide portfolio of end customer applications."

HyperX, the gaming division of Kingston Technology, Inc., today announced the release of FURY DDR4 RGB and a new look to the FURY DDR4 lineup. The new memory kits both offer automatic Plug N Play overclocking functionality. For DDR4 users that need fast, high-density memory, HyperX has added models up to 64 GB at 3466 MHz. The new FURY DDR4 and FURY DDR4 RGB are cost-effective, high-performance upgrades for Intel and AMD's latest platforms that feature Plug N Play, which enables automatic memory overclocking at standard DDR4 1.2 V settings. The new FURY models also feature Intel XMP-ready profiles optimized for Intel's latest platform.

The HyperX FURY DDR4 RGB comes equipped with an LED light bar with fluid RGB lighting effects and utilizes HyperX Infrared Sync, which allows the modules to remain synchronized. The memory is compatible with lighting control software from a range of motherboard vendors, including ASUS Aura Sync, Gigabyte RGB Fusion, and MSI Mystic Light Sync. Additional information about software and motherboard compatibility is available online at respective partner websites. FURY DDR4 RGB memory is also compatible with HyperX NGenuity software.

Earlier this month, premium PC memory maker ZADAK and TechPowerUp brought you the Summer DDR4 Giveaway, with a chance for two lucky winners to get a ZADAK Spark DDR4-4133 16 GB (2x 8 GB) dual-channel memory kit, each. These modules don't just luck great in a new-age industrial case-mod, but also pack some serious chops. Hundreds of entries are in, with much love given to the Facebook pages of ZADAK and TechPowerUp. Without further ado, the Winners:

• Stoyan from Bulgaria
• Kevin from Kansas, USA

A huge Congratulations to you, Stoyan and Kevin! TechPowerUp will return with more such interesting Giveaways.

Samsung Electronics, Ltd., has taken its leadership position in the memory market a step further today by announcing support of the Samsung PM1733 PCIe Gen4 Solid State Drive (SSD) and high density RDIMM and LRDIMM dynamic random access memory (DRAM) for the AMD EPYC 7002 Generation Processors. AMD launched the 2nd Gen AMD EPYC processor in San Francisco yesterday.

"AMD has listened to the needs of its customers in developing the 2nd Gen AMD EPYC processors and has worked closely with us to integrate the best of our cutting-edge memory and storage products," said Jinman Han, senior VP of Memory Product Planning, Samsung Electronics. "With these new datacenter processors, AMD is providing customers with a processor that enables a new standard for the modern datacenter."

SK Hynix Inc. announced today that its DRAM and Enterprise SSD (eSSD) solutions, including the up-to-date 1Y nm 8 Gb DDR4 DRAM, have been fully tested and validated with the new AMD EPYC 7002 Generation Processors, which were unveiled during AMD's launch event on August 7. The Company has worked closely with AMD to provide memory solutions fully compatible with the 2nd Gen AMD EPYC Processors, targeting high performance data centers.

The SK Hynix DDR4 DRAM supports the maximum speed of 3200 Mbps of the 2nd Gen EPYC Processors, which will increase memory performance more than 20% compared to the 1st Gen AMD EPYC Processors. The Company's various DDR4 DRAM solutions, based on the 1Xnm and 1Y nm technology with density of 8 Gb and 16 Gb, have been fully tested and validated with the 2nd Gen EPYC Processors. SK Hynix provides high-density DIMMs with density over 64 GB to support up to 64 cores per socket in the 2nd Gen EPYC.

SK Hynix also provides a full line-up of SATA and PCIe from 480 GB to 8 TB, which have also been validated and tested with the 2nd Gen EPYC. SK Hynix's eSSD solutions are optimized for the latest data center's read-intensive and mixed workload environment.

MSI today announced that their in-house overclocker Kovan Yang has broken the world overclocking record for DDR4 memory. The record-breaking feat was achieved with a pair of HyperX Predator DDR4 memory modules paired with MSI's MPG Z390I GAMING EDGE AC motherboard, with a little help from liquid nitrogen cooling.

The overclock was achieved with some compromises: the Intel Core i9-9900K processor that powered the system was running in a pared-down configuration with only a pair of active cores, and the DDR4 memory was working in single-channel mode with a single 8 GB stick and highly relaxed timings of 31-63-6363-2. While this isn't usable in your regular machine, that's not the point of these extreme overclocking feats, anyway. The goal is to showcase component quality and stability whilst working way beyond specifications.

ZADAK and TechPowerUp bring you a unique opportunity to upgrade your PC's memory with a swanky new ZADAK Spark DDR4-4133 16 GB dual-channel memory kit. This memory kit derives from ZADAK's legacy as a highly sought-after boutique component brand, and a robust enthusiast memory design targeting the enthusiast community. The modules feature heatspreaders crowned by a unique RGB LED embellishment that adds a part-industrial, part-cyberpunk flare to your build. Two lucky winners stand to win a ZADAK Spark DDR4-4133 16 GB (2x 8 GB) dual-channel memory kit, each. To participate, simply fill up a short form that helps us get back to you if you've won, and Like ZADAK HQ on Facebook by clicking on the button in the Giveaway page. The Giveaway is open worldwide, wherever legal, and entries are open till August 16. All the best!

For more information and to participate, visit this page.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is releasing a highly optimized, extremely low latency Trident Z Neo series DDR4-3800MHz CL14 RGB memory kit in 16 GB (8 GB x2) and 32 GB (8 GB x4) capacities for the AMD Ryzen 3000 series CPU and X570 chipset platform. Built with the powerful Samsung B-die component, this is the perfect DDR4 memory kit for those looking to push the limits of memory bandwidth on your new AMD Ryzen 3000 platform.

At this point, it's well-known that memory performance with the new AMD Ryzen 3000 processor series is best when Infinity Fabric being tied to the memory clock at a 1:1 ratio. The G.SKILL R&D team is dedicated to push the performance boundaries even further and developed a high-frequency, low-latency memory kit at DDR4-3800 CL14-16-16-36 in capacity configurations of 8GBx2 and 8GBx4, reaching a superb memory bandwidth performance under the optimal 1:1 ratio.

Thermaltake, the leading PC DIY premium brand for Cooling, Gaming Gear and Enthusiast Memory solutions, today announced the release of Thermaltake WaterRam RGB Liquid Cooling DDR4 Memory 3600 MHz 32 GB, followed by WaterRam RGB 3200 MHz 32 GB & 16 GB, now are all available on the market.

This is the world's first two-way cooling DDR4 memory that offers ultimate flexibility for cooling options, users can either choose liquid cooling or heatsink convection heat dissipation with ease; whilst, enjoying 16.8 M RGB colors across 12 super-bright addressable LEDs for stunning RGB illumination. Built with the highest quality of components to the highest of standards, the WaterRam RGB delivers outstanding gaming performance with stunning RGB lighting effects for effortless sync with 5 V header motherboards from ASUS, GIGABYTE, MSI and AsRock to maximize your RGB ecosystem.

ZOTAC Technology, a global manufacturer of innovation, makes the super-compact gaming desktop, MEK MINI, even more powerful. Boasting a mere 9.18 liter, MEK MINI packs up to a 9th Gen 8-core Intel Core i7 processor and a discrete ZOTAC GAMING GeForce RTX SUPER graphics card.

Utilizing over 12 years of design and engineering expertise, ZOTAC has been pioneering its way with many things MINI. First with the ZBOX Mini PC ranging from impossibly small to ones capable of rivaling desktops, secondly with MINI graphics cards that still retain the potent power and performance of larger sized ones, and now ZOTAC continues its sights on the Gaming PC segment with the small and stronger MEK MINI.MEK MINI taps into the power of the all-new ZOTAC GAMING GeForce RTX SUPER desktop graphics card. In the first of its kind, MEK MINI is equipped with the world's smallest ZOTAC GAMING GeForce RTX SUPER 2070 graphics card powered by the NVIDIA Turing GPU architecture.

During its second quarter earnings call, Intel announced that it has started shipping of 10th generation "Core" CPUs to OEMs. Making use of 10 nm lithography, the 10th generation of "Core" CPUs, codenamed Ice Lake, were qualified by OEMs earlier in 2019 in order to be integrated into future products. Ice Lake is on track for holiday season 2019, meaning that we can expect products on-shelves by the end of this year. That is exciting news as the 10th generation of Core CPUs is bringing some exciting micro-architectural improvements along with the long awaited and delayed Intel's 10nm manufacturing process node.

The new CPUs are supposed to get around 18% IPC improvement on average when looking at direct comparison to previous generation of Intel CPUs, while being clocked at same frequency. This time, even regular mobile/desktop parts will get AVX512 support, alongside VNNI and Cryptography ISA extensions that are supposed to bring additional security and performance for the ever increasing number of tasks, especially new ones like Neural Network processing. Core configurations will be ranging from dual core i3 to quad core i7, where we will see total of 11 models available.

Motherboard manufacturers seem to be rushing the fill the void of cost-effective motherboards with out of the box Ryzen 3000 support, as AMD X570 motherboards start at $170. The latest entrant is the Racing X470GTA by BIOSTAR, priced around the $120-mark, and packing an interesting mix of modern- and legacy connectivity. Built in the ATX form-factor, the board draws power from 24-pin ATX and 8-pin EPS power connectors, conditioning it for the SoC with a simple 4+3 phase VRM. Out of the box, the board supports all Ryzen 3000-series processors launched so far, in addition to 1st and 2nd generation Ryzen, A-series, and Athlon "Bristol Ridge," which make up pretty much every socket AM4 chip launched so far.

The AM4 socket is wired to four DDR4 DIMM slots, a PCI-Express 3.0 x16 slot, and the board's lone M.2 slot. Two PCIe gen 2.0 x1, and a PCI-Express x16 slot with gen 2.0 x4 wiring, make for the rest of the expansion area; while six SATA 6 Gbps ports make the remaining storage options. This is probably the only AMD X470 motherboard to feature legacy PCI slots, using an ASMedia bridge chip. USB connectivity includes two 10 Gbps USB 3.1 gen 2 ports (from which one is type-C), and eight 5 Gb/s USB 3.1 gen 1 ports (from which four are by headers) The lone network interface is a 1 GbE driven by a Realtek 8118AS "DragonLAN" chip. The onboard audio solution is powered by an entry-level Realtek ALC892. Other legacy connectivity includes a PS/2 combo port and a serial COM header. Despite these, there are some wacky enthusiast-friendly features, including onboard buttons for automated overclocking, power/reset; dual-BIOS with a manual 2-way switch, and diagnostic LEDs.

MSI, the world's leading motherboard brand, is proud to announce AMD AM4 300- and 400- series MAX motherboards. Since AMD Ryzen 3000 series processors launched and have attracted public attention all over the world, AM4 socket compatibility has become a contentious topic for people who are interested in buying Ryzen CPUs. Currently AMD has 300-, 400-, and X570 platforms with the same AM4 socket, which might cause confusion. End users might feel a bit overwhelmed in terms of choosing a either a new CPU or a new motherboard or both a new CPU and a new motherboard.

To make everything simple, MAX motherboards provide maximum compatibility for AM4 socket. This means users do not have to worry about the collocation of CPU and motherboard. We have clear information both on the packaging and product page if customers are still confused.

ASUS today rolled out of the WS C246-ACE, a sober-looking workstation motherboard in the ATX form-factor based on the Intel C246 chipset, which supports not just Intel Xeon E-series processors in the LGA1151 package, but also 8th and 9th generation Core processors. The board draws power from a combination of 24-pin ATX and 8-pin EPS power connectors, conditioning it for the processor with a 9-phase VRM that's cooled by heavy ridged heatsinks. The CPU socket is wired to four DDR4 DIMM slots that support up to 128 GB of dual-channel DDR4 memory, and two metal-reinforced PCI-Express 3.0 x16 slots (x16/NC or x8/x8). Two open-ended PCIe 3.0 x1 and a PCI-Express x16 (electrical gen 3.0 x4) make for the rest of the expansion area.

Storage connectivity on the ASUS WS C246-ACE include two M.2-22110 slots with PCI-Express 3.0 x4 and SATA 6 Gbps wiring, a U.2 port, and four SATA 6 Gbps ports. Networking is care of two 1 GbE interfaces, driven by a combination of Intel i211-AT and i219-LM controllers. The onboard audio solution combines a Realtek ALC1220S CODEC with EMI shielding, ground-layer isolation, and a headphones amp circuit. USB connectivity includes four 10 Gbps USB 3.1 gen 2 ports, all on rear panel, one of which is a type-C port; and six 5 Gbps USB 3.1 gen 1 ports, of which two are via headers. Display connectivity include HDMI and DisplayPort. The company didn't reveal pricing.

Prices of DRAM shot up by 20 percent as Japan put in place export curbs that restrict high-technology exports to South Korea, and as Toshiba recovers from a power blackout that temporarily halted production. This could impact prices of end-user products such as PC memory modules, or consumer electronics, such as smartphones, in the coming weeks, as inventories either dry up, or are marked-up at various stages of the supply-chain. The memory industry is inter-dependent between fabrication and packaging units spread across South Korea, Japan, and Taiwan.

Memory and flash industry observer DRAMeXchange reported that spot-pricing of 8-gigabit DDR4 DRAM chips, which is used as a benchmark for DRAM pricing as a whole, closed at USD $3.74 at the end of trading on Friday (19/07). It's up 14.6 percent week-over-week, and 23 percent up pricing as on 5th July. An industry observer who spoke with KBS World notes that the recent hikes are not directly infuenced by the trade-spat between Japan and Korea, but rather a power blackout experienced at a Toshiba DRAM manufacturing facility last month. The observer noted that if the trade-spat affects production at Samsung Electronics or SK Hynix, DRAM prices could "skyrocket."

CORSAIR, a world leader in PC gaming peripherals and enthusiast components, today announced the addition of 32 GB modules to its range of VENGEANCE LPX high-performance DDR4 memory, allowing PC builders to equip their systems with more DDR4 memory than ever before. VENGEANCE LPX has long been a premiere choice for custom PC builders looking for high frequencies and ambitious overclocks, and that tradition continues with the launch of 32 GB modules - the first time that such a capacity of premium DRAM has been made widely available to consumers in a standard size DDR4 module.

The new modules feature the same craftsmanship and quality that CORSAIR customers expect from the VENGEANCE LPX name. Thoroughly tested for wide compatibility with most current DDR4 motherboards, designed for high-performance overclocking with a pure aluminium heatspreader, and available in multiple colors to match your system's look, VENGEANCE LPX 32 GB DDR4 modules set the standard for enthusiast memory. Launching in frequencies of 2,400 MHz and 2,666 MHz in kits of 1x, 2x,4x and 8x modules, or 3,000 MHz in kits of 1x and 2x modules, you'll be sure to find a configuration to fit your custom PC and take its memory capacity up to 128 GB on mainstream 4-DIMM slot, and up to 256 GB on high-end desktop 8-DIMM slot motherboards.

GeIL, Golden Emperor International Ltd. - one of the world's leading PC components & peripheral manufacturers released new additions to their EVO X and EVO X ROG-certified RGB Gaming Memory today. The new EVO X II and EVO X II ROG-Certified inherit their previous generation, and provide an advanced modder-friendly "cableless RGB illumination design" for offering a fascinating RGB lighting effect without hassles of power cable management. Manufactured with outstanding components, the EVO X II dedicated to unlocking hidden overclocking ability and comprehensive compatibility across the latest 3rd Gen AMD Ryzen and Intel platforms. GeIL EVO X II ROG-certified RGB Gaming Memory perfectly supports ASUS AURA lighting control app, when paired with most ASUS ROG motherboards, an automatic performance boost will be enabled for a better overclocking experience.

The EVO X DDR4 series is one of the first RGB DDR4 memory modules in the industry, and it brought the series tremendous praise from gamers and PC enthusiasts around the world. The new EVO X II and EVO X II ROG-certified equipped with "cableless RGB illumination design" offering RGB lighting without power cables or the need for advanced cable management. The EVO X II is available in a new stealth black and frost white design and features high-quality aluminium for better heat dissipation and extra stability.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices, announces the latest B365 series motherboard supporting the newest 9th and 8th Generation Intel Core Processor in a compact Micro ATX form factor, the BIOSTAR B365MHC. It is perfect for running office tasks to browsing the web and watching videos online.

The Micro ATX form factor allows the motherboard to fit in most PC cases making it perfect for office space saving while being packed with features including supporting up to 32 GB of DDR4 memory at 2666 MHz GbE LAN with Super LAN surge protection for enhanced bandwidth capacity, stability and superior performance. HDMI offers up to a 4K resolution with highly detailed content, while the PCIe M.2 expansion slot offers up to 32 Gb/s and supports for Intel Optane Technology which reduces boot times and improves overall performance. The BIOSTAR B365MHC is designed to offer unanimity with Intel's B365 chipset to give the power and performance needed for office and home multimedia uses.

PATRIOT and Viper Gaming, a global leader in performance memory, SSDs, gaming peripherals, and flash storage solutions, announced the release of a new addition to their Viper 4 series line today. The Viper 4 DDR4 Blackout series is designed to be a PC-Build-friendly with a potential for overclocking and more extensive compatibility across various Intel and AMD platforms. The whole new matte-black heat spreader design covers a high-quality black PCB and offers a stylishly understated memory kit designed for PC enthusiasts, modders, and system builders. The Viper 4 Blackout series is available in frequencies of 3000 MHz up to 4000 MHz and is fully compatible with the latest 3rd Gen AMD Ryzen Desktop Processors and AMD X570 motherboards.

The all-black color theme matches any high-end system component from motherboards and graphics cards down to gaming cases and system coolers. The Viper Gaming team was inspired to create this highly tweakable memory kit in a sleek and stylish matte black aluminum heat spreader, and 100% compatible with current JEDEC memory standards.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is thrilled to announce the launch of Trident Z Neo DDR4 memory series for the latest AMD Ryzen 3000 series CPUs on AMD X570 platform. Featuring optimized specifications for the new AMD platform, a new sleek dual-tone heatspreader design, and fully customizable RGB lighting, the Trident Z Neo memory series is the ideal DDR4 DRAM for your next AMD gaming system or workstation.

Optimized Performance for AMD Ryzen 3000: Computer systems with AMD Ryzen processors are known for its performance scaling with memory speed, and Trident Z Neo is engineered to achieve optimal performance with the latest AMD Ryzen 3000 series processors on AMD X570 motherboards. Under the latest AMD Ryzen 3000 series platform, DDR4 memory frequency support has increased by leaps and bounds, allowing the X570 chipset platform to run an unprecedented memory speed record of DDR4-5774MHz- the fastest memory speed ever achieved on an AMD platform under extreme liquid nitrogen cooling - as seen in the following CPU-Z validation screenshot with the MSI MEG X570 GODLIKE motherboard.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is excited to announce that 23 overclocking records in various benchmark categories were broken during the Computex 2019 time frame, including the world record for the fastest memory frequency, all using G.SKILL DDR4 memory kits built with high performance Samsung 8Gb components, the latest Intel processors, and high performance motherboards.

This week at the G.SKILL Computex booth, a new world record for fastest memory frequency was set by Toppc, a renowned professional extreme overclocker, reaching an incredible DDR4-5886MHz using the Trident Z Royal memory on a MSI MPG Z390I GAMING EDGE AC motherboard and an Intel Core i9-9900K processor. At the end of Computex 2019, the top two results for the fastest memory frequency are set by team MSI using an identical hardware setup.

Last year, with the introduction of the Intel Z390 chipset, there was a spate of so-called "double capacity DIMMs" or DC DIMMs, tall memory modules with two rows of DRAM chips, which added up to 32 GB per DIMM. You needed a Z390 platform and a 9th generation Core processor that supported up to 128 GB of memory, to use these things. With the introduction of 16 Gb DDR4 DRAM chips by both Micron and Samsung, JEDEC-compliant 32 GB unbuffered DIMMs of standard height are finally possible, and ADATA put together the first of these, shown off at Computex 2019.

The AD4U2666732GX16 is a 32-gigabyte dual-rank unbuffered DIMM made using 16 Gb chips supplied by Micron Technology. The modules tick at JEDEC-standard DDR4-2666 speeds, at a module voltage of 1.2 Volts. ADATA didn't disclose timings. The 16 Gb DRAM chips are made by Micron in an advanced (3rd generation) 10 nm-class silicon fabrication process to achieve the desired transistor-density. 32 GB DIMMs are expected to hit critical-mass in 2H-2019/2020, with the advent of AMD's 3rd generation Ryzen "Matisse," and Intel's "Ice Lake-S" desktop processors. Memory manufacturers are also expected to put out speedy and highly-compatible single-rank 16-gigabyte DIMMs using 16 Gb chips, which could finally make 32 GB dual-channel the mainstream memory configuration, moving up from half a decade of 2x 8 GB.

With AMD "Valhalla" desktop platform mainstreaming PCI-Express gen 4.0, several SSD manufacturers put out their first products that can take advantage of it, this Computex. The drive with the highest on-paper transfer rates has to be the HOF E16 from GALAX, which will also be sold under the Galaxy and KFA2 brands in various markets. Built in the M.2-2280 form-factor, the drive features an M.2 PCI-Express 4.0 x4 host interface (backwards-compatible with older PCIe generations), with 64 Gbps of interface bandwidth on tap. The drive comes in capacities of 1 TB, 2 TB, and segment-first 4 TB.

The HOF E16 uses the same heatsink GALAX deployed on the older generation of HOF M.2. A block of aluminium pulls heat from the drive's controller, while a flattened copper heat-pipe spreads heat across. The drive is based on the new Phison E16 controller that's cushioned by an LPDDR4 DRAM chip, and wired to 96-layer 3D TLC NAND flash memory. The drive offers sequential read speeds of up to 4,800 MB/s, and sequential writes of up to 4,000 MB/s. 4K random reads are rated at up to 750,000 IOPS, and 4K random writes up to 700,000 IOPS.