Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announced its 32GB, 16GB and 8GB Server Premier DDR4-2933 Registered DIMMs have received validation on the Intel Purley Platform, featuring the Intel Xeon Scalable processor family (formerly known as "Cascade Lake-SP"). A link to the validation page can be found here.

Kingston's Purley-validated Server Premier modules are specifically engineered to unleash the power of Intel's six-channel server microarchitecture. At 2933MT/s - the next-generation memory frequency supported in the latest Intel Xeon Scalable processor family - each DIMM provides peak bandwidth of 23.46 GB/s. When grouped for multi-channel performance, this provides a significant boost in performance for today's memory intensive server applications.

Intel late Tuesday made a boat-load of enterprise-relevant product announcements, including the all important update to its Xeon Scalable enterprise processor product-stack, with the addition of the new 56-core Xeon Scalable "Cascade Lake" processor. This chip is believed to be Intel's first response to the upcoming AMD 7 nm EPYC "Rome" processor with 64 cores and a monolithic memory interface. The 56-core "Cascade Lake" is a multi-chip module (MCM) of two 28-core dies, each with a 6-channel DDR4 memory interface, totaling 12-channel for the package. Each of the two 28-core dies are built on the existing 14 nm++ silicon fabrication process, and the IPC of each of the 56 cores are largely unchanged since "Skylake." Intel however, has added several HPC and AI-relevant instruction-sets.

To begin with, Intel introduced DL Boost, which could be a fixed-function hardware matrix multiplier that accelerates building and training of AI deep-learning neural networks. Next up, are hardware mitigation against several speculative execution CPU security vulnerabilities that haunted the computing world since early-2018, including certain variants of "Spectre" and "Meltdown." A hardware fix presents lesser performance impact compared to a software fix in the form of a firmware patch. Intel has added support for Optane Persistent Memory, which is the company's grand vision for what succeeds volatile primary memory such as DRAM. Currently slower than DRAM but faster than SSDs, Optane Persistent Memory is non-volatile, and its contents can be made to survive power-outages. This allows sysadmins to power-down entire servers to scale down with workloads, without worrying about long wait times to restore uptime when waking up those servers. Among the CPU instruction-sets added include AVX-512 and AES-NI.

OWC has confirmed support for 128GB memory upgrades for the new 2019 27-inch iMac 5K; doubling the maximum factory offered memory, 64GB, in the 3.1GHz, 3.6GHz and 3.7GHz models and quadrupling it in the 3.0GHz, 32GB base model. OWC high-performing memory kits enable customers to boost performance levels and run more apps, work with larger files, speed up render times, and manipulate larger data sets.

Apple offers 32GB and 64GB memory options in the 2019 27-inch iMac 5K. OWC has certified and supports up to 128GB memory for all 2019 27-inch iMac 5K models, giving users up to four times the factory-available memory. This upgrade is exclusive to OWC and allows users to take new iMacs to their maximum potential, to create with endless possibilities.

Colorful Technology Company Limited, professional manufacturer of motherboards, graphics cards, and high-performance storage solutions is proud to announce its latest motherboard featuring Intel B365 chipset to support both Intel 9th-gen and 8th-gen processors from Intel, the new COLORFUL CVN B365M Gaming Pro V20. This motherboard allows mainstream-to-entry level builds to avoid breaking the bank while still delivering a wide range of performance.

The new COLORFUL CVN B365M Gaming Pro V20 will feature support for both 8th-gen and 9th-gen Intel processors in the LGA1151 package. This allows users to upgrade from Intel's 8th-generation processor to the 9th-gen CPU that increases core count to give you a performance upgrade. The motherboard also supports DDR4 memory with higher bandwidth so applications can run as fast as possible.

Global industrial and IoT hardware manufacturer Logic Supply has combined the latest vision processing, security protocols, wireless communication technologies, and proven cloud architectures to create the Karbon 300 rugged fanless computer. The system has been engineered to help innovators overcome the limitations of deploying reliable computer hardware in challenging environments.

"Computing at the edge is increasingly at the core of today's Industry 4.0 and Industrial IoT solutions," says Logic Supply VP of Products Murat Erdogan. "These devices are being deployed in environments that would quickly destroy traditional computer hardware. The builders and creators we work with require a careful combination of connectivity, processing and environmental protections. With Karbon 300, we're providing the ideal mix of capabilities to help make the next generation of industry-shaping innovation a reality, and enable innovators to truly challenge what's possible."

AMD will launch its 3rd generation Ryzen 3000 Socket AM4 desktop processors in 2019, with a product unveiling expected mid-year, likely on the sidelines of Computex 2019. AMD is keeping its promise of making these chips backwards compatible with existing Socket AM4 motherboards. To that effect, motherboard vendors such as ASUS and MSI began rolling out BIOS updates with AGESA-Combo 0.0.7.x microcode, which adds initial support for the platform to run and validate engineering samples of the upcoming "Zen 2" chips.

At CES 2019, AMD unveiled more technical details and a prototype of a 3rd generation Ryzen socket AM4 processor. The company confirmed that it will implement a multi-chip module (MCM) design even for their mainstream-desktop processor, in which it will use one or two 7 nm "Zen 2" CPU core chiplets, which talk to a 14 nm I/O controller die over Infinity Fabric. The two biggest components of the IO die are the PCI-Express root complex, and the all-important dual-channel DDR4 memory controller. We bring you never before reported details of this memory controller.

When reading through the Gen11 GT2 whitepaper by Intel, which describes their upcoming integrated graphics architecture, we may have found a groundbreaking piece of information that concerns the memory architecture of computers running 10 nm "Ice Lake" processors. The whitepaper mentions the chip to feature a 4x32-bit LPDDR4/DDR4 interface as opposed to the 2x64-bit LPDDR4/DDR4 interface of current-generation chips such as "Coffee Lake." This is strong evidence that Intel's new architecture will have unganged dual-channel memory controllers (2x 64-bit), as opposed to the monolithic 128-bit IMC found on current-generation chips.

An unganged dual-channel memory interface consists of two independent memory controllers, each handling a 64-bit wide memory channel. This approach lets the processor execute two operations in tandem, given the accesses go to distinct memory banks. On top of that it's now possible to read and write at the same time, something that's can't be done in 128-bit memory mode. From a processor's perspective DRAM is very slow, and what takes up most of the time (= latency), is opening the memory and preparing the read/write operation - the actual data transfer is fairly quick.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has developed a 3rd-generation 10-nanometer-class (1z-nm) eight-gigabit (Gb) Double Data Rate 4 (DDR4) DRAM for the first time in the industry. In just 16 months since it began mass producing the 2nd-generation 10nm-class (1y-nm) 8Gb DDR4, development of 1z-nm 8Gb DDR4 without the use of Extreme Ultra-Violet (EUV) processing has pushed the limits of DRAM scaling even further.

As 1z-nm becomes the industry's smallest memory process node, Samsung is now primed to respond to increasing market demands with its new DDR4 DRAM that has more than 20-percent higher manufacturing productivity compared to the previous 1y-nm version. Mass production of the 1z-nm 8Gb DDR4 will begin within the second half of this year to accommodate next-generation enterprise servers and high-end PCs expected to be launched in 2020.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is excited to announce the 6th Annual OC World Cup 2019. The online qualifier competition stage will be held from March 13, 2019 until April 16, 2019 on hwbot.org. The top 9 winners of the online qualifier will be qualified to join the live competition at the G.SKILL booth during Computex 2019 week from May 29th to 31st and compete for a chunk of the $25,000 USD cash prize pool.

With the participation of top overclockers from around the world and carefully designed rules, G.SKILL OC World Cup is considered as one of the most challenging overclocking competition by professional overclockers. The G.SKILL OC World Cup consists of three rounds: Online Qualifier, Live Qualifier, and Grand Final. The top 9 winners of the Online Qualifier will receive eligibility to enter the Live Qualifier stage during Computex 2019 and demonstrate their finest LN2 extreme overclocking skills at the G.SKILL booth.

Today at Mobile World Congress (MWC) 2019, Intel announced the Intel FPGA Programmable Acceleration Card N3000 (Intel FPGA PAC N3000), designed for service providers to enable 5G next-generation core and virtualized radio access network solutions. The Intel FPGA PAC N3000 accelerates many virtualized workloads, ranging from 5G radio access networks to core network applications.

"As the mobile and telecommunications industry gears up for an explosion in internet protocol traffic and 5G rollouts, we designed the Intel FPGA PAC N3000 to provide the programmability and flexibility with the performance, power efficiency, density and system integration capabilities the market needs to fully support the capabilities of 5G networks," said Reynette Au, Intel vice president of marketing, Programmable Solutions Group.

T-FORCE gaming memory from TEAMGROUP goes beyond the limit and receives international awards again. After receiving COMPUTEX Golden Pin Design Award last year, T-FORCE XCALIBUR RGB gaming memory has won the iF International Design Award again earlier this year. The award-winning T-FORCE XCALIBUR RGB gaming memory has the Taiwan utility model patent (number: M565883). This memory is incomparable as a king's sword and it shines globally with its excellent all-round design.

The German iF Product Design Award is known as the Oscar Award in design field. This globally well-known product design award was founded in 1953 and it is also the world's top design quality indicator. This year, the German IF Award has gathered the world's top 67 international jury members and received 6375 entries from 52 countries. The T-FORCE XCALIBUR won the award over numerous outstanding entries. A remarkable result like this, once again proves the T-FORCE gaming memory has both top performance and a solid design strength that can stun everyone in the world stage.

Corsair unveiled four new Vengeance LPX series DDR4 memory kits tailored for high-end desktops based on the Xeon W-3175X processor. Of these, one is a 96 GB (12 x 8 GB) kit, and the other four 192 GB (12 x 16 GB), which max out the processor's memory support. The 96 GB kit (CMK96GX4M12P4000C19) ticks at DDR4-4000 MHz, and 19-23-23-45 timings at 1.35 V. The 192 GB kit comes in four flavors based on speed: DDR4-2667, DDR4-3200, DDR4-3600, and DDR4-4000. Corsair has tested the XMP 2.0 profiles of these modules to work on the ASUS ROG Dominus motherboard.

The top-dog 192 GB DDR4-4000 kit (CMK192GX4M12P4000C19) is priced at USD $2,999. It achieves DDR4-4000 with 19-23-23-45 timings and 1.35 V. The 192 GB DDR4-3600 kit (CMK192GX4M12P3600C18) goes for $2,319, with 18-19-19-39 timings, and 1.35 V. The 192 GB DDR4-3200 kit (CMK192GX4M12P3200C16) is significantly cheaper at $1,719, and ticks at 16-18-18-36. Lastly, the most "affordable" 192 GB DDR4-2666 kit (CMK192GX4M12P2666C16) can be yours for $1,584. You get 16-18-18-35 timings at 1.2 V. The DDR4-4000 models of both the 96 GB and 192 GB kits include a set of two Vengeance Airflow memory coolers.

Advantech, a leading global flash storage and memory solutions provider in the embedded market, announces the industry's most comprehensive lineup of 32GB DDR4 unbuffered DIMM memory. Advantech SQRAM offers single 32GB DRAM modules in various DIMM types including SODIMM, UDIMM, ECC DIMM, and extremely robust Rugged DIMM with guaranteed wide temperature operation for high performance computing in applications such as networking and military.

As the global IoT market gradually embraces big data and edge computing, demand for high data and performance processing is increasing. SQRAM 32 GB unbuffered DIMM memory uses Samsung's 16 Gb 2666 MT/s IC chips for high reliability requirements in mission critical applications. SQRAM 32 GB wide temperature operation (-40~85 °C) Rugged DIMM offers extreme vibration resistance, plus ECC checking to ensure data accuracy.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is exhilarated to announce new ultra-fast, ultra-high capacity Trident Z Royal DDR4 RGB memory specifications designed for use with the latest unlocked 28-core Intel Xeon W-3175X processor. Operating in hexa-channel with 6- or 12-module kit configurations, these new 6-channel Trident Z Royal memory kits can reach insane memory speeds of up to DDR4-4000 CL17-18-18-38 at 1.35V, which feature extreme performance Samsung B-die memory ICs. With fast memory speed and massive capacity, these hexa-channel memory kits are perfect for heavy-workload workstations when paired with the 28-core Xeon processor.

As computing technology improves, the amount of processed data also increases, leading to a demand for more memory channels and higher bandwidth. For the first time, this new platform introduces hexa-channel memory support to the larger consumer market, which was previously only found in server-class systems. While operating under 6-channels, the extreme performance DDR4-4000 CL17 96GB (8GBx12) memory kit reaches a blazing fast read bandwidth speed of 122GB/s - a substantial increase over currently available quad-channel platforms. See below for a screenshot of the bandwidth result from the AIDA64 memory benchmark:

The Intel Xeon W-3175X processor is available today. This unlocked 28-core workstation powerhouse is built for select, highly-threaded and computing-intensive applications such as architectural and industrial design and professional content creation. Built for handling heavily threaded applications and tasks, the Intel Xeon W-3175X processor delivers uncompromising single- and all-core world-class performance for the most advanced professional creators and their demanding workloads.

G.SKILL, the world's leading manufacturer of extreme performance memory and gaming peripherals, is delighted to announce high-frequency, high-capacity RGB memory kits at DDR4-4266MHz CL18-22-22-42 with 64GB (8x8GB) capacity. These ultimate specification memory kits are built with high performance Samsung B-die components and will be available under both Trident Z RGB and Trident Z Royal series.

Intel is giving final touches to a "Crimson Canyon" fully-assembled NUC desktop model which combines the company's first 10 nm Core processor, and AMD Radeon discrete graphics. The NUC8i3CYSM desktop from Intel packs a Core i3-8121U "Cannon Lake" SoC, 8 GB of dual-channel LPDDR4 memory, and discrete AMD Radeon RX 540 mobile GPU with 2 GB of dedicated GDDR5 memory. A 1 TB 2.5-inch hard drive comes included, although you also get an M.2-2280 slot with both PCIe 3.0 x4 (NVMe) and SATA 6 Gbps wiring. The i3-8121U packs a 2-core/4-thread CPU clocked up to 3.20 GHz and 4 MB of L3 cache; while the RX 540 packs 512 stream processors based on the "Polaris" architecture.

The NUC8i3CYSM offers plenty of modern connectivity, including 802.11ac + Bluetooth 5.0 powered by an Intel Wireless-AC 9560 WLAN card, wired 1 GbE from an Intel i219-V controller, consumer IR receiver, an included beam-forming microphone, an SDXC card reader, and stereo HD audio. USB connectivity includes four USB 3.1 type-A ports including a high-current port. Display outputs are care of two HDMI 2.0b, each with 7.1-channel digital audio passthrough. The company didn't reveal pricing, although you can already read a performance review of this NUC from the source link below.

ASUS today rolled out a pair of entry-level motherboards based on Intel B365 Express chipset for 8th and 9th generation Core processors. The B365 has been extensively detailed in our older article as trading off features such as integrated USB 3.1 gen 2 and an older version of Management Engine, in exchange for significantly more downstream PCIe lanes than the B360 Express. Intel's decision to fallback to the 22 nm node for chipsets resulted in the B365. Among ASUS' new motherboards include the Prime B365M-A and Prime B365M-K. The company is also working on three quasi gaming-grade motherboards targeting gaming i-Cafes, namely the B365M-KYLIN, B365M-BASALT, and the B365M-PIXIU, which are essentially cosmetic variations of the B365M-K with one less SATA port.

The Prime B365M-A is the slightly better endowed of the two micro-ATX boards launched today. Pulling power from a 24-pin ATX and an 8-pin EPS, it uses a 4+2 phase CPU VRM. The CPU is wired to four DDR4 DIMM slots, and the board's sole PCI-Express 3.0 x16 slot, which features a metal reinforcement brace. Two additional gen 3.0 x1 slots wired to the PCH make for the rest of the expansion. Storage connectivity includes an M.2 slot with PCIe gen 3.0 x4 and SATA 6 Gbps wiring, and six other SATA 6 Gbps ports. As expected, there are no USB 3.1 gen 2 ports, as the chipset lacks it. You get four USB 3.1 gen 1 (5 Gbps) ports, two of which are on the rear panel, and two via headers. A 1 GbE interface pulled by a Realtek RTL8111H controller, and 6-channel HD audio handled by an entry-level Realtek ALC887 make for the rest of it. The Prime B365M-K is the more cost-effective of the two Prime B365M-series boards, and is built with a narrower PCB, and hence only serves up two DDR4 memory slots. You also lose out on Vcore VRM heatsink, and metal reinforcement on the PCI-Express 3.0 x16 slot.

Years after year, MSI dominates the memory frequency record to show the strength on overclocking performance. Just in the beginning of 2019, MSI's in-house overclocker, Toppc, pushes the DDR4 speeds to 5.6GHz, setting another barrier using Kingston memory and the MSI Z390I GAMING EDGE AC motherboard by liquid nitrogen cooling. Undoubtedly, this is a revolutionary breakthrough for the Intel 9th generation processors for the first time. This world record not only shows MSI's dominant position on performance for Intel 9th generation processors by using MSI MPG Z390I GAMING EDGE AC and MSI's unique and patented DDR4 Boost technology, but also reveals team-up power with Kingston DDR4 memory.

More information on the record can be found here.

A quick trip to see Patriot at CES 2019 netted us a chance to look over a massive number of products from SSDs and DDR4 memory, to flash drives and Micro SD cards. In general, when it comes to anything memory or storage related they had everything but the kitchen sink on hand. That said, let's start with system memory. To begin with, they had their Signature Line on hand which uses a simple black aluminum heatshield and comes in capacities up to 16 GB per module with speeds up to 2666 MHz. For a single 16 GB stick at 2666 MHz the listed the timings at 19-19-19-43. Next was the new Viper Steel DDR4 SODIMMs with capacity that ranged from 8 GB to 32 GB and feature XMP 2.0 support for automatic overclocking. As for speeds they top out at 3000 MHz for these kits. Next up was the Viper RGB memory which comes in speeds of up to 4133 MHz and with timings listed at 19-21-21-41. They are also compatible with motherboard RGB sync applications and have been tested on the latest Intel and AMD platforms. Last but not least were the Viper Steel kits which top out at 4400 MHz with 19-19-19-39 timings.

ASRock at CEs announced what has become the world's first Mini STX PC to employ an AMD Ryzen APU. In the form of the DeskMini A300. With just 1.9 liters, it makes use of AMD's A300 chipset to guarantee support for both AMD's Ryzen (Raven Ridge) processors, as well as A-series Bristol Ridge processors with up to 65 W TDP. Take care that an integrated cooling solution isn't shipped with the A300, though - you'll have to find a cooling solution no taller than 45 mm.

2x DDR4 SO-DIMM slots allow for up to 32 GB of DDR4-2400 or DDR4-2933 memory (Ryzen or A-series). For the small form-factor, 2x M.2-2280 slots for SSDs (PCIe 3.0 x4 and x2/x4) and 2x 2.5-inch bays for SATA SSDs or HDDs sems more than plenty (RAID 0 and 1 modes are supported). No support for MXM graphics cards here - only integrated graphics can drive your displays, via 1x DisplayPort 1.2, 1x HDMI 2.0, or 1xD-Sub outputs. There's a RealtekRTL8111H GbE network connection, 2x USB 3.1 Gen 1 Type-A and 1x Type-C port, 1x USB 2.0 Type-A connector, as well as 1x M.2-2230 slot for a Wi-Fi + Bluetooth module. Power is delivered by an external, 120 W power-brick, which should help keep in-chassis temperatures in check.

Thermaltake at CES has just spread its wings towards another slice of the market: the system memory one. With their new WaterRam, the company is trying to offer a unique product that fuses watercooling and RGB lighting with the memory kits for both seamless performance and looks. Thermaltake says these are the world's first two-way cooling DDR4 memory, with a software-controlled water-block capable of displaying 16.8 million colors with 12 lumens. They say this cooling solutions lowers RAM temperature by 37% "compared to traditional natural passive cooling solutions, which ensures stable and instant performance and longer lifespan."

ASUS today announced ASUS Mini PC ProArt PA90, a new series of compact, workstation-class PCs that deliver powerful, fast and stable performance for designers and content creators. Featuring 9th Generation Intel Core processors, NVIDIA Quadro graphics, up to 64GB of high-speed DDR4 memory, Thunderbolt 3 connectivity and a triple-storage design that blends ultrafast SSD and high-capacity HDD storage, Mini PC ProArt PA90 provides uncompromising performance for computer-aided design (CAD) workflows for architecture, engineering and manufacturing in an attractively modern, compact form-factor that fits easily into any workspace.

Powered by the latest 9th Generation Intel Core i9 and Core i7 processors, which provide up to 30% better performance than the previous generation, Mini PC ProArt PA90 ensures smooth and responsive processing for content creators multitasking with the most demanding applications and working on complex projects.

ADATA Technology, a leading manufacturer of high-performance DRAM modules, NAND Flash products, and mobile accessories today announces that it will be in Las Vegas during this year's CES to showcase its exciting new products for gamers, overclockers, PC enthusiasts, and general users. Under the theme of "Innovating the Future," ADATA will be presenting its latest hardware including solid-state drives (SSD), memory modules, and gaming accessories. ADATA will be showcasing its products from January 9-12, 2019.

RAIDMAX launched the MX-902F, a set of two heatspreaders for full-length DDR4 thru DDR2 memory modules, which add RGB multi-color LED bling. The heatspreaders are made of an aluminium alloy, with silicone diffusers for five addressable RGB LEDs that can put out 16.7 million colors. Each of the two heatspreaders take in standardized 3-pin addressable-RGB input, and daisy-chain a single aRGB source between the two heatspreaders. The heatspreaders are 51 mm tall (factor in some additional height when installed with a module), 8 mm-thick, and 127 mm long. The company didn't reveal pricing.