Intel's Optane products, based on the joint venture with Micron, have been hailed as the next step in memory technology - delivering, according to Intel's own pre-launch slides, a mid-tier, al-dente point between DRAM's performance and NAND's density and pricing. Intel even demoed their most avant-garde product in recent times (arguably, of course) - the 3D XPoint DIMM SSD. Essentially, a new storage contraption that would occupy vacant DIMM channels, delivering yet another tier of storage up for grabs for speed and space-hungry applications - accelerating workloads that would otherwise become constrained by the SATA or even NVMe protocol towards NAND drives.

Of course, that product was a way off; and that product still hasn't come to light. The marriage of Optane's density and speed with a users' DRAM subsystem is just wishful thinking at best, and the dreams of pairing DRAM and 3D Xpoint in the same memory subsystem and extracting the best of both worlds remains, well... A figment of the imagination. But not according to some retailers' websites, though. Apparently, the usage of Intel's Optane products as DRAM memory has already surfaced for some vendors - Dell and HP included. How strange, then, that this didn't come out with adequate pomp and circumstance.

Ballistix announced its ASUS TUF Gaming Allinace co-branded Sport DDR4 memory module, and we got a chance to go hands on. These modules are essentially the company Sport series mid-range sticks with a ruggedized heat-spreader, and style elements from the TUF Gaming Alliance - black with sharp golden-yellow lines. The module comes in 8 GB (single-rank) and 16 GB (dual-rank) densities, which each come in two speed variants - DDR4-2666 and DDR4-3000, making up dual-channel kits of 16 GB and 32 GB, respectively.

Ever since from the release moment, TEAMGROUP T-FORCE gaming memory module series has been creating global gaming trends and won multiple major international design awards. Today, the long expected latest RGB memory module - T-FORCE XCALIBUR is released. The king's sword will dominate the industry by the outstanding unique design and extremely high-speed experience. Along with the gorgeous special edition and the simple general version with two ultra-high frequency DDR4 3600MHz and DDR4 4000MHz, T-FORCE XCALIBUR will fully satisfy global gamers who love building their own PC, meanwhile, it will also show the solid strength and the charm of T-FORCE product series in leading the global gaming market.

The unstoppable T-FORCE gaming product series has gained global consumers' interest in gaming ever since its release. In 2018, once again, T-FORCE releases the all new luminous memory module - T-FORCE XCALIBUR. TEAMGROUP design team continues the design concept of the ultra-wide-angle force flow effect, using the full color and dazzling RGB LED lighting with the full range, 120° ultra-wide angle luminous area at the top that emits colorful bright light. Moreover, they add unique totem element on the light guide for special edition with innovative ideas. The initial letters of T-FORCE, TF are designed as hilts of the king's sword on the heat spreader to bring an extraordinary visual experience to the gamers. The two ultra-high frequencies, DDR4 3600MHz and DDR4 4000MHz support the total capacity of 16GB(2x8GB) . With selected Samsung IC chips and strict testing standard, it offers excellent quality, optimal performance, stability and compatibility. It allows gamer to win every battle as if he/she is holding the king's sword in the gaming world, and also setting a new benchmark for RGB luminous memory modules.

Samsung Electronics, announced today that it is the first in the industry to begin volume production of modules containing a 16 gigabit (Gb) monolithic 64 gigabyte (GB) DDR4 memory solution. The new registered dual in-line memory module (RDIMM), which is designed primarily for use in enterprise and cloud server applications, will be shown at the HPE Discover Las Vegas conference and exhibition June 19-21 at the Venetian-Palazzo Resort Center in Booth #170.

"Large data centers are increasingly embracing Big Data, high-speed mobility, IoT, deep learning, AI and cloud-native technologies, with Samsung and other leaders like HPE and AMD delivering integrated solutions that are faster, denser, more scalable, and more power-conserving," said Sewon Chun, senior vice president of memory marketing at Samsung Electronics. "At Samsung, we are taking the industry to new horizons with our 16Gb, 64GB RDIMMs and other leading-edge memory and storage solutions in helping to fully enable the real-time needs of leading enterprise OEMs (original equipment manufacturers) worldwide," he added.

At Computex 2018, we witnessed two major HEDT (high-end desktop) processor announcements. Intel unveiled a client-segment implementation of its "Skylake XCC" (extreme core count) silicon, which requires a new motherboard, while AMD announced a doubling in core-counts of its Ryzen Threadripper family, with the introduction of new 24-core and 32-core models, which are multi-chip modules of its new 12 nm "Zen+" die, and compatible with existing X399 chipset motherboards. With frantic increases in core counts, the practicality of these chips to even the most hardcore enthusiast or productivity professional diminishes. The Computex 2018 demos reek of a pissing-contest between the x86 processor giants, with AMD having an upper hand.

The HEDT segment is intended to occupy the space between client desktops and serious scalar workstations. Intel is frantically putting together a new HEDT platform positioned above its current LGA2066 (X299) platform, built around its Purley enterprise platform, and a variant of the LGA3647 socket (this chip + your X299 motherboard is no bueno). This socket is needed to wire out the 28-core Skylake XCC (extreme core count) silicon, which has a six-channel DDR4 memory interface. The company put up a live demo at the teaser of this unnamed processor, where it was running at 5.00 GHz, which led many to believe that the processor runs at that speed out of the box, at least at its maximum Turbo Boost state, if not nominal clock. Intel admitted to "Tom's Hardware," that it "forgot" to mention to the crowds that the chip was overclocked.

Team Group showcased their long-expected T-Force Xcalibur RGB memory at their Computex booth this year. Staying true to its name, the Xcalibur RGB memory modules feature a unique design with totem elements combined with a heat spreader that resembles a sword's handle. Height of the modules is 88 mm. Team Group will be initially launching the T-Force Xcalibur RGB memory in 16 GB (2 x 8 GB) kits available in 3600 MHz and 4000 MHz configurations. Xcalibur RGB memory modules employ Samsung IC chips, which have been carefully selected and tested to provide the best performance, stability, and compatibility.

ADATA this Computex showed off its new XPG Gammix D50 line of performance-segment DDR4 memory modules. The Gammix D50 is positioned a notch below the enthusiast-segment Gammign D80 series. It lacks the "hybrid air+liquid" cooling heatspreaders from its pricier sibling, but still gives you chunky aluminium heatspreaders crowned by an acrylic diffuser, which interestingly, lacks any underlying LEDs. The Gammix D50 will come in a variety of speeds ranging from DDR4-2666 all the way to DDR4-4500, and in 8 GB single-rank and 16 GB dual-rank densities. The top-dog DDR4-4500 SKU sustains its clocks with timings of 19-19-18-39. It comes in both dual-channel (16 GB) and quad-channel (32 GB) kits.

Colorful is on a diversification drive, and its latest expansion in PC hardware is memory. The company showed off its first DDR4 memory modules under the iGame brand, and they're, well, colorful. The common theme is a die cast metal heatspreader with a silicone diffuser on top for either RGB or fixed color illumination. The modules come in both 8 GB and 16 GB densities, making up dual-channel kits. Among the first is a 16 GB DDR4-3600 module, which will be ready for the overseas market by the end of the year.

GALAX unveiled its Hall of Fame (HOF) Extreme series limited edition DDR4 memory with a staggering speed rating of DDR4-5000. Featuring a gold-plated heatspreader, this 16 GB (8 GB x2) dual-channel kit ticks at DDR4-5000 with timings of 21-36-36-46, and at 1.50V. If that's a little too much to handle, there's also an identical-looking kit with DDR4-4700 speeds, with tighter timings of 19-26-26-46, at 1.50V.

There's also chrome/silver colored kit clocked at DDR4-4500, with 19-19-19-39 timings and 1.40V DRAM voltage, though it lacks the limited edition tag. Getting into the mid-range of this series, we find the HOF Extreme DDR4-3600 kit, with a similar design, but matte-white heatspreaders, 17-18-18-38 timings, and safer voltages of 1.35V. The gateway to this series is the HOF Extreme DDR4-3200, with 16-18-18-38 timings, at 1.35V, and a matte-black heatspreader.

ASUS' backed TUF Gaming Alliance has been gaining tremendous traction in recent times, with many brands in the computing world launching products designed and branded under that initiative. Now, Ballistix has announced a new DDR4 product line, the SPORT AT DDR4 that aligns directly with the TUF branding and design philosophy.

While Corsair began as a memory maker and branched out into cases and power-supplies, Antec is taking the opposite route, starting out as a case and PSU maker. The company set up the new AntecMemory brand, complete with a new logo. Its first product is the mid-range "5-series," with the possibility of the entry-level 3-series, and high-end 7-series, for sheer driving computing pleasure. The 5-series DDR4 module features either an all-white or black+white heatspreader, with an RGB LED diffuser at a corner. For now, it only comes in 8 GB single-module kits. The module ticks at DDR4-3000, with timings of 16-18-18-36, at 1.35V. There's also an ASUS TUF Gaming Alliance co-branded kit, complete with the urban camo pattern.

In a bid to further extend their AORUS brand to other PC-critic components, Gigabyte is putting the finishing touches to another line of own-branded PC components - DDR4 memory modules. The new DDR4 modules, marketed under the company's gaming AORUS brand, feature a brushed aluminum heatspreader with AORUS' characteristic logo. Some artistic cutouts give the modules an aggressive look, and the top of the heatspreader houses an RGB diffuser that allows the modules to light up evenly. Gigabyte's tease is only that - a tease - and the company has said the final product will likely see the aluminum toned a few shades darker.

Golden Emperor International Ltd. - one of the world's leading PC components & peripheral manufacturers is announcing their Super Luce RGB SYNC Series TUF Gaming Alliance gaming memory featuring military camouflage design with RGB LED illumination. In collaboration with ASUS TUF Gaming motherboards, GeIL Super Luce RGB SYNC Series TUF Gaming Alliance gaming memory is a wise choice for mainstream gamers. The memory kit not only has an aesthetic RGB and heat spreader design but features a wide compatibility, unparalleled reliability and cost-efficiency.

INNOVENTIONS, Inc., the leading manufacturer of portable computer memory testers, is now shipping the RAMCHECK LX DDR4 and the RAMCHECK LX DDR4 Pro for testing and identifying industry standard DDR4 ECC and non-ECC SDRAM modules.

"DDR4 memory is now the standard for servers and PCs," said Dr. David Y. Feinstein, President of INNOVENTIONS. "With these new RAMCHECK LX memory testers, data centers, memory dealers and repair techs have a great tool to test and identify DDR4 DIMMs quickly and reliably. Considering the price of these big server DIMMs, the RAMCHECK LX pays for itself pretty quickly."

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has started mass producing the industry's first 32-gigabyte (GB) double data rate 4 (DDR4) memory for gaming laptops in the widely used format of small outline dual in-line memory modules (SoDIMMs). The new SoDIMMs are based on 10-nanometer (nm)-class process technology that will allow users to enjoy enriched PC-grade computer games on the go, with significantly more capacity, higher speeds and lower energy consumption.

Using the new memory solution, PC manufacturers can build faster top-of-the-line gaming-oriented laptops with longer battery life at capacities exceeding conventional mobile workstations, while maintaining existing PC configurations. "Samsung's 32GB DDR4 DRAM modules will deliver gaming experiences on laptops more powerful and immersive than ever before," said Sewon Chun, senior vice president of memory marketing at Samsung Electronics. "We will continue to provide the most advanced DRAM portfolios with enhanced speed and capacity for all key market segments including premium laptops and desktops."

PATRIOT, a global leader in performance memory, SSDs, gaming peripherals and flash storage solutions today announced the immediate availability of its new VIPER RGB Series Performance DDR4 Memory Kits. PATRIOT's VIPER RGB Series memory modules are designed for users who are obsessed with maximizing hardware performance without compromising stability. The VIPER RGB series are fully optimized for the latest Intel and AMD platforms and matched with a stunning heat shield design. VIPER RGB series offers RGB illumination control through a software application without additional cables to maintain an aesthetic look and stunning visuals.

The new heat spreader design is made from high-quality aluminum and designed to offer excellent thermal dissipation to maintain greater stability under heavy loads. In addition, VIPER RGB series memory is built with a customized PCB to guarantee good signal integrity for stable gaming while also offering increased overclocking potential. The memory ICs featured in VIPER RGB Series undergo a proprietary sorting process to retain strict quality standards and reliability on the latest Intel and AMD platform motherboards.

TEAMGROUP, the world's leading memory brand, officially announces the launch of an advanced version of T-FORCE DARK PRO memory kits with new specifications for the 2nd Generation AMD Ryzen processors. With the rollout of new AMD processors, TEAMGROUP releases an upgrade specification of T-FORCE DARK PRO DDR4 gaming ram up to 3466 MHz. Its high performance and stability prove to meet the requirements of the gaming CPU and provide the best experiences for overclockers and gamers.

T-FORCE DARK PRO is built with high efficiency forged aluminum heat spreader. A unique personal style can be created by matching red and gray nameplates to its low-profile iron gray. T-FORCE DARK PRO also provides absolute stability and reliability with laboratory-scale burn-in test and compatibility verification for major motherboard brands worldwide. From the moment it was released, the popularity of T-FORCE DARK PRO has been on the top demand of DDR4 gaming market. Now T-FORCE is pleased to announce the new specifications DDR4 3466 MHz which push the envelope to the ultra-high performance which will satisfy all the gamers' need for top-notch hardware gaming experience.

QNAP Systems, Inc. today released the new TS-832X 8-bay quad-core NAS with two built-in 10GbE SFP ports, providing users with a budget-friendly, high-speed network storage solution. It is also an ARM-based NAS that supports Qtier technology for auto-tiering, and its PCIe slots allow for the installation of peripheral cards like 10GbE NICs, QM2 cards, USB 3.1 10Gbps expansion cards, or wireless network cards to enhance the NAS with greater application potential.

"The TS-832X is a step up from the TS-831X, featuring an advanced 64-bit Cortex -A57 processor and DDR4 memory while also delivering computing power of 32K DMIPS to benefit performance upgrade by 40%," said Dan Lin, Product Manager of QNAP, continuing "Coupled with the 10GbE connectivity and PCIe expandability, it provides a highly cost-efficient private cloud NAS solution."

Silicon Power, a leading provider of memory storage solutions, today announces an upgraded addition to its breakthrough memory module lines. To meet the needs of evolving performance standards, SP introduces the DDR4 2666 SODIMM and UDIMM memory modules. Compatible with a range of upcoming platforms and motherboards, the two modules are an important upgrade for users in the months leading up to a DDR5 launch.

Perfecting An Already Great Product by Staying Current And Fast
Silicon Power released the DDR4 2666 SODIMM and UDIMM models to stay current and compatible with new releases that are revolutionizing the memory module industry.

QNAP Systems, Inc. today released the 10GbE-ready quad-core TS-932X, a budget-friendly NAS designed to accommodate five 3.5-inch hard drives and four 2.5-inch SSDs. It is an ARM-based NAS that supports Qtier technology, which automatically tiers files and data based on access frequency to provide optimal storage performance. Taking up less desktop space compared with other models in the same class, the slim TS-932X is ideal for small/medium businesses and small offices. The native dual 10GbE SFP+ ports also provide users with a NAS that is future-proofed for 10GbE network environments.

"The TS-932X is a 9-bay NAS that is the physical size of a standard 4-bay/6-bay NAS and strikes a balance between storage capacity and performance," said Dan Lin, Product Manager of QNAP, adding "Coupled with the advanced Qtier technology and 10GbE support, it provides a highly cost-efficient private cloud NAS solution."

Kingmax expanded its Zeus Dragon line of DDR4 memory kits, with the new Zeus Dragon RGB. The new module looks significantly different from the Zeus Dragon, with a polygonal heatspreader shape with RGB LED diffusers, which borrows some design ideas from G.Skill Trident-Z RGB. You have RGB diffusers not just along the top of the module, but also through cutouts on the surface, illuminating the logos. The modules support ASUS Aura Sync RGB software control.

The Kingmax Zeus Dragon RGB series comes in four speed-based variants - DDR4-2666, DDR4-3000, DDR4-3200, and DDR4-3466; and in module densities of 8 GB and 16 GB, making up 16 GB (2x 8 GB) and 32 GB (2x 16 GB) kits, respectively. For whatever reason, the slowest variant also has the loosest timings, with CAS latency of 17T, while the other three variants are CL 16T. You enable the advertised speeds at the click of a button thanks to XMP 2.0 support.

Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass producing 10-nanometer (nm)-class 16-gigabit (Gb) LPDDR4X DRAM for automobiles. The latest LPDDR4X features high performance and energy efficiency while significantly raising the thermal endurance level for automotive applications that often need to operate in extreme environments. The 10nm-class DRAM will also enable the industry's fastest automotive DRAM-based LPDDR4X interface with the highest density.

"The 16Gb LPDDR4X DRAM is our most advanced automotive solution yet, offering global automakers outstanding reliability, endurance, speed, capacity and energy efficiency, ," said Sewon Chun, senior vice president of memory marketing at Samsung Electronics. "Samsung will continue to closely collaborate with manufacturers developing diverse automotive systems, in delivering premium memory solutions anywhere."

TEAMGROUP, the world's leading memory brand, today officially announces the launch of the TUF Gaming Alliance certified T-FORCE VULCAN TUF Gaming Alliance memory, which is strictly tested by motherboard leader ASUS. After the cooperative launch with ASUS ROG, T-FORCE DARK ROG has created a trend around the world. Now once again, with creativity and ingenuity, TEAMGROUP design team adds TUF's unique military camouflage pattern on the heat spreader. T-FORCE VULCAN TUF Gaming Alliance memory is definitely gamer's best comrade on the battlefield of gaming or pursuit of extreme overclocking.

T-FORCE VULCAN TUF Gaming Alliance has passed strict burn in test held by ASUS. With clock frequency of up to 3600MHz, it offers consumers an experience of high-speed performance and a hardware with unique style. The memory is both distinctive and eye catching. With complete coverage design, the area of the high efficiency forged heat spreader is extended to the top and the two sides to provide memory a complete coverage of protection and enhance the radiating performance, so the system is able to maintain a longtime stable operation. The appearance is designed with unique military camouflage pattern. T-FORCE VULCAN TUF Gaming Alliance's exclusive asymmetrical cutting is most suitable for gamers who love military style design.

QNAP Systems, Inc. today unveiled new TVS-882BR RDX models (including the TVS-882BR-RDX and TVS-882BRT3-RDX) that integrates the Tandberg RDX QuikStor internal SATA 5.25-inch docking station (8813-RDX) for installing removable and portable RDX hard disk cartridges. Compared to standard external hard drives, the Tandberg RDX cartridge features a rugged dust-proof design that protects data for a longer period of time and allows users to easily transfer data with the cartridges.

"QNAP constantly integrates partner backup solutions to our existing NAS solutions. By supporting RDX hard disk backup, the new TVS-882BR RDX models allows users to enjoy longer data protection and the portable cartridges can easily be shared for data exchanging. Coupled with Media Asset Management (MAM) software and a wide range of backup solutions, the TVS-882BR helps improve work efficiency while also providing highly-scalable storage space and powerful hardware that meets the requirements from modern businesses and organizations" said Dan Lin, Product Manager of QNAP.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is excited to announce the release of new Trident Z RGB and Sniper X series specifications launching in conjunction with the release of the AMD Ryzen 2000 series processors and the X470 platform. Kit specifications starting from DDR4-3200MHz CL16-18-18-38 16GB (2x8GB) to DDR4-3600MHz 18-22-22-42 16GB (2x8GB), these new specifications push the boundaries of AMD system performance to the next level.

Armed with the latest IMC on the new 2nd generation AMD Ryzen processors, G.SKILL aims to bring users ultra-fast high performance memory kits to help increase overall system performance with the new X470 systems. Trident Z RGB, with model numbers ending with TZRX, and Sniper X memory series now introduce several new AMD X470-specific memory specifications. Please see below for a complete list of the new specifications.