Intel's 6-core "Coffee Lake" die was essentially a "Kaby Lake" die with two extra cores, and no physical changes to other components, such as iGPU or uncore. With its new 8-core "Coffee Lake" Refresh silicon, Intel has turned its attention to not just increasing the core-count, but also improving the processor's integrated memory controller, in addition to hardware fixes to certain security vulnerabilities. The 128-bit wide (dual-channel) integrated memory controller now supports up to 128 GB of memory. Intel's current DDR4-capable mainstream desktop processors only support up to 64 GB, as do rival AMD's Ryzen socket AM4 processors.

Support for up to 128 GB explains the emergence of off-spec memory standards such as ASUS' Double Capacity (DC) DIMMs. Samsung is ready with a JEDEC-compliant 32 GB dual-rank UDIMM memory module for client platforms. Introduction of 32 GB UDIMMs also comes amidst reports of DRAM pricing cool-off through 2019, which could make 32 GB dual-channel memory kits consisting of two 16 GB UDIMMs more affordable. The increase in maximum memory amount could also indicate Intel's seriousness to introduce 3D Xpoint-based Optane Persistent Memory modules as alternatives to DRAM-based main memory, with higher capacities compensating for worse latencies and data-rates compared to DRAM.

As HyperX begins shipping Cloud Mix , its first Bluetooth-enabled gaming and lifestyle headset this month, the gaming division of Kingston Technology Company, Inc. today announced that since its inception in 2002, it has shipped over 60 million memory modules, billions of bytes of memory. Chosen by OEMs, PC builders, overclockers, and the gaming community, HyperX has steadily grown as the largest independent gaming memory module manufacturer and performance leader. With this major milestone and the growth in sales of headsets, keyboards and mice, HyperX is projected to exceed $550 million in total revenue for branded products in 2018.

Since HyperX launched 16 years ago, it has increasingly expanded its product line and market reach. The HyperX brand is not only recognized for delivering high quality memory products, but also as a peripherals leader, providing gaming headsets, keyboards, mice, and mousepads to gamers across the globe. The HyperX Engineering Labs and engineering team is committed to developing technology to bring new performance memory products to the PC, mini-PC and notebook markets. HyperX provides a variety of memory solutions, including Predator DIMMs for high performance PC builds, FURY DIMMs for gamers building affordable PCs, and Impact SODIMMs for notebook updates and system builds.

GIGABYTE expanded its teething DDR4 memory lineup with a new 16 GB (2x 8 GB) dual-channel DDR4 memory kit, called simply "GIGABYTE Memory 2666MHz." These modules lack the Aorus branding featured on the company's very first DDR4 modules. You instead get 32 mm tall, 7 mm-thick modules with a restrained design, and plain GIGABYTE branding.

One area where the company refined its design is the heatspreaders, which are thicker, and have more mass to them, even if they lack finnage. GIGABYTE's module does what it says on the tin - DDR4-2666 with 16-16-16-35 timings, at 1.2 Volts. Out of the box, it packs both JEDEC and XMP SPD profiles. Memory controllers that support DDR4-2666 (such as Intel "Coffee Lake" and later), should run it at the advertised speeds without any user intervention. For older platforms, an XMP 2.0 profile helps achieve the advertised settings. The modules are backed by lifetime warranty.

ZADAK announces the very first double capacity DDR4 featuring personalized AURA2 RGB lighting which was built ahead of many competitors, the SHIELD DC(Double Capacity) DDR4. Co-developed with ASUS ROG team, it amazingly supports small form factor motherboards of Intel Z390 including ROG MAXIMUS XI APEX, MAXIMUS XI GENE, and ROG STRIX Z390-I Gaming. With the whole new architecture, it achieves not only double capacity of 32GB for single slot, but also high frequency of 3600MHz with impressive stability. Such a widely praised high-end memory module in the PC world comes along once in a lifetime.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, demonstrates two extreme DDR4 RGB specifications on the latest Intel Z390 chipset, including DDR4-4800MHz CL19 16GB (2x8GB) and DDR4-4500MHz CL19 32GB (4x8GB). Both kits are built with high performance Samsung DDR4 B-die ICs and provide the fastest XMP speed of each capacity configuration.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is excited to announce Trident Z RGB DC series DDR4 64GB (32GBx2) memory kits. Utilizing the latest Double Capacity DIMM technology closely developed with ASUS, the Trident Z RGB DC series DDR4 memory is able to provide double the maximum capacity of DDR4 UDIMM modules on select ASUS Z390 chipset motherboards.

In a recent live stream, MSI gave a sneak peek at their next generation of motherboards. The first one shown was a new red and black themed Gaming Plus model reminiscent of the early days in the MSI Gaming brand. It features a few quality of life improvements one of which is an enlarged PCIe latch making GPU removal a bit easier in cramped environments or when you happen to have a beefy air cooler. Keep out zones were also highlighted on the back of the motherboard giving users a visual cue to make sure other components, standoffs, screws etc do not come into contact with those particular regions. Furthermore, they also included an angled slot in the board's design for easier access to both the SATA ports and USB 3.0.

Colorful Technology Company Limited, professional manufacturer of graphics cards, motherboards and high-performance storage solutions is proud to announce the launch of its latest product to be part of its illustrious iGame series of high-performance parts. The new iGame DDR4 memory features speeds up to DDR4-3200 and sports the new, custom heatspreader from COLORFUL which fits in the iGame series theme. The new iGame memory features RGB lighting and supports for ASUS AURA Sync controls so you can customize the lighting to your personal style.

COLORFUL has designed the iGame DDR4 memory to compliment the full line of COLORFUL iGame products. Its heatspreaders feature an aggressive, gamer styling featuring the new iGame logo. Across the top is the lighting module capable of RGB lighting to give users full control of what they want their memories to look. The heatspreaders also add great cooling to the product ensuring consistent and reliable performance even in under instense gaming load.

32-gigabyte DDR4 UDIMMs are a reality. Samsung recently announced the development of a 32 GB DDR4 dual-rank UDIMM, using higher density DRAM chips. Those chips, however, are unlikely to be available anytime soon, compounded by Samsung's reported scumbaggery in the making. In the midst of all this, motherboard major ASUS designed its own non-JEDEC UDIMM standard, called "Double Capacity DIMM" or DC DIMM, with the likes of G.Skill and Zadak designing the first models. The utility of these modules is to max out the CPU memory controller's limit despite having fewer memory slots on the motherboard. Possible use-cases include LGA1151 mini-ITX motherboards with just one slot per memory channel (2 slots in all), or certain LGA2066 boards with just four slots (one slot per channel).

There is no word on the memory chip configuration modules, but it's highly likely they are dual-rank. The first DDR4 DC modules could be 32 GB, letting you max out the memory controller limit of 8th gen and 9th gen Core processors with just two modules. ASUS is heavily marketing this standard with its upcoming motherboards based on Intel's Z390 Express chipset, so it remains to be seen if other ASUS motherboards (or other motherboards in general) support the standard. Ironically, the Zadak-made module shown in ASUS marketing materials use DRAM chips made by Samsung.

AMD today announced a reimagined family of AMD Athlon desktop processors with Radeon Vega graphics that have been optimized for everyday PC users: the AMD Athlon 200GE, Athlon 220GE, and Athlon 240GE processor. Combining the high-performance x86 "Zen" core and "Vega] graphics architectures in a versatile System-on-Chip (SOC) design, the Athlon desktop processors offer responsive and reliable computing for a wide range of experiences, from day-to-day needs like web browsing and video streaming through more advanced workloads like high-definition PC gaming. Complementing this news, AMD announced the availability of the commercial-grade Athlon PRO 200GE desktop processor, along with three 2nd Gen Ryzen PRO desktop processor models for the commercial, enterprise, and the public sector: the Ryzen 7 PRO 2700X, Ryzen 7 PRO 2700, and Ryzen 5 PRO 2600 processors. With these new introductions, AMD now offers a top-to-bottom line-up of professional-grade computing solutions for experiences that range from premium content creation to advanced multitasking and office productivity.

"We are proud to expand our successful "Zen" core-based consumer and commercial product portfolios today with the addition of AMD Athlon, AMD Athlon PRO, and 2nd Gen AMD Ryzen PRO desktop processors. The new Athlon desktop processors, now incorporating the advanced "Zen" core and "Vega"3 graphics architectures, energize a legendary processor brand in AMD Athlon - a brand that consumers and PC enthusiasts alike trusted throughout nearly two decades of innovation," said Saeid Moshkelani, senior vice president and general manager, Client Compute, AMD. "Additionally, we are continuing to offer business PC users more processing power than we ever have before with the launch of 2nd Gen Ryzen PRO desktop processors into the commercial market."

Samsung is ready with a 32 GB DDR4 UDIMM (unbuffered DIMMs) targeted at desktops. Dual-channel kits with these modules could let you max out the 64 GB memory limit of today's mainstream desktop processors, and 128 GB limits of Intel's Core X HEDT processors, with quad-channel kits. AMD's Ryzen Threadripper processors are advertised to support up to 2 TB of memory (including ECC support), so it should finally be possible to pack up to 256 GB of memory on Threadripper-powered machines.

The new M378A4G43MB1-CTD DDR4 UDIMM from Samsung is, unsurprisingly, a dual-rank module (x8 / x16 Organization or up to 2 ranks per DIMM and 2DPC configuration). It ticks at DDR4-2666 at a module voltage of 1.2 V. The module itself won't be much to look at, with a green PCB and bare-naked DRAM chips. It is is currently sampling to PC OEMs. It could also be possible for more popular memory manufacturers to get in touch with Samsung for the DRAM chips that make up this module. A single-rank variant of this module could finally make it possible for AMD Ryzen AM4 machines to have 32 GB of dual-channel memory at acceptably high memory clocks.

Cryptocurrency mining rig motherboards have, until now, mostly been based on the Intel platform because Intel chipsets put out more PCIe lanes than AMD ones, and because Intel's sub-$100 Pentium/Celeron chips don't have narrower PCIe connectivity from the CPU. ASRock apparently has a lot of unsold AMD X370 chipset inventory, and with the possible introduction of sub-$100 Ryzen chips that have 28 PCIe lanes from the CPU, a use-case has emerged for a mining motherboard based on this platform. We hence have the X370 Pro BTC+. The board features an AM4 socket, with out of the box support for "Pinnacle Ridge" processors. The socket is wired to just one DDR4 DIMM slot, but all eight PCI-Express 3.0 x16 slots.

The topmost x16 slot runs at electrical gen 3.0 x4, while the remaining seven slots are gen 3.0 x1, taking advantage of PCIe segmentation of the X370 platform. The board draws power from three 24-pin ATX, 8+4 pin EPS, and a number of Molex outputs, although most of these power connectors are optional. A point to note here is that the D-sub/HDMI display outputs only work if an A-series "Bristol Ridge" or Ryzen "Raven Ridge" APU is used (which have fewer PCIe lanes), so you're bound to take display output from one of the 8 graphics cards. A 1 GbE interface and two USB 3.0 ports make for the rest of it.

GIGABYTE introduced an Aorus-branded, quasi-premium mini-ITX motherboard based on AMD B450 chipset, for socket AM4 processors, the B450-I Aorus Pro WiFi. The board draws power from a combination of 24-pin ATX and 8-pin EPS, conditioning it for the SoC with a lean 4+2 phase VRM. The AM4 SoC is wired to two DDR4 DIMM slots, supporting up to 32 GB of dual-channel DDR4 memory; and the board's lone PCI-Express 3.0 x16 slot.

Storage connectivity on the B450-I Aorus Pro WiFi includes an M.2-2280 slot with PCI-Express 3.0 x4 and SATA 6 Gbps wiring; and four SATA 6 Gbps ports. USB connectivity includes six USB 3.0 ports (four on the rear panel, two by headers); and two USB 3.1 gen 2 (both on the rear panel). With just 6-channel jacks, the onboard audio solution may look cheap, but is redeemed by Realtek ALC1220 CODEC. The Intel 9260 adapter is at the helm of wireless networking, with 802.11ac + Bluetooth 5.0, while GbE is handled by Intel i211AT. There's also some RGB LED fun to be had, with two 4-pin ARGB headers, and a small 8-pixel diffuser behind the PCB. GIGABYTE could price this board around $120.

MSI today announced the MEG X399 Creation, its flagship socket TR4 motherboard, with out of the box support for 2nd generation AMD Ryzen Threadripper 2000 processors. The company showed off this board at the 2018 Computex, held this June. Although built in the ATX form-factor, this board is recommended only for EATX-capable cases. The highlight of this board is its gargantuan 19-phase CPU VRM that's optimized for overclocking event the 32-core Threadripper 2990WX. The board draws power from a combination of 24-pin ATX, two 8-pin EPS, and an optional 4-pin Molex. Heat drawn from the CPU VRM MOSFETS is dissipated not just by a large heatsink that spans almost the entire width of the board, but also a secondary heatsink cooling the SoC phases, via a heat-pipe. The huge chipset heatsink cools not just the X399 chipset, but also three M.2-NVMe slots (two M.2-22110 and one M.2-2280). You get 4 more M.2-2280 slots over the new M.2-Xpander Aero, which is a PCI-Express 3.0 x16 riser card that converts the slot to four M.2-2280 slots with x4 wiring, ventilating them with a 100 mm fan. It ends up looking like a graphics card in doing so.

Expansion includes eight DDR4 DIMM slots supporting up to 2048 GB of DDR4 ECC memory; four PCI-Express 3.0 x16 slots (full-time x16/x8/x16/x4), and an x1. Storage connectivity includes 7 M.2-NVMe slots (3 onboard, 4 via the included M.2-Xpander Aero accessory); and eight SATA 6 Gbps ports. Connectivity includes MSI's highest-grade onboard audio solution combining an ALC1220 with a headphones amplifier, and audio-grade capacitors; and two 1 GbE interfaces driven by Intel i219-V controllers (10 GbE is a notable absentee); and 802.11ac + BT 5.0 WLAN. You get 10 USB 3.1 ports on the rear panel (including a type-C port), and four USB 3.1 ports via front-panel headers). RGB LED diffusers dot the rear I/O shroud, the chipset heatsink, and the reverse side of the PCB. The board is expected to be priced around $500.

One of the first Intel NUC (next unit of computing) mini PCs to feature completely discrete GPUs (and not MCMs of CPUs and GPUs), the "Crimson Canyon" NUC8i3CYSM and NUC8i3CYSN, are up for pre-order. The former is priced at USD $529, while the latter goes for $574. The two combine Intel's 10 nm Core i3-8121U "Cannon Lake" SoC with AMD Radeon 540 discrete GPU. Unlike the "Hades Canyon" NUC, which features an MCM with a powerful AMD Radeon Vega M GPU die and a quad-core "Kaby Lake" CPU die; the "Crimson Canyon" features its processor and GPU on separate packages. The Radeon 540 packs 512 stream processors, 32 TMUs, and 16 ROPs; with 2 GB of GDDR5 memory.

All that's differentiating the NUC8i3CYSM from the NUC8i3CYSN is memory. You get 4 GB of LPDDR4 memory with the former, and 8 GB of it with the latter. Both units come with a 2.5-inch 1 TB HDD pre-installed. You also get an M.2-2280 slot with PCIe 3.0 x4 wiring, and support for Optane caching. Intel Wireless-AC 9560 WLAN card handles wireless networking, while an i219-V handles wired. Connectivity includes four USB 3.0 type-A ports, one of which has high current; an SDXC card reader, CIR, two HDMI 2.0 outputs, and 7.1-channel HD audio. The NUC has certainly grown in size over the years. This one measures 117 mm x 112 mm x 52 mm (WxDxH). An external 90W power-brick adds to the bulk.

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash products, today announces the launch of the XPG SPECTRIX D41 TUF Gaming Edition DDR4 RGB memory module. The special edition memory module is TUF Gaming Alliance-certified, which means it has passed rigorous testing to meet the stringent standards of the alliance. While this memory module offers the same great performance and dazzling programmable RGB lighting as the original model, it sports a more combative look via its black heat spreaders with yellow trimming.

AMD announced its second-generation Ryzen Threadripper high-end desktop (HEDT) processor series, succeeding its lean and successful first-generation that disrupted much of Intel's Core X HEDT series, forcing Intel to open up new high-core-count (HCC) market segments beyond its traditional $1000 price-point. AMD's 16-core $999 1950X proved competitive with even Intel's 12-core and 14-core SKUs priced well above the $1200-mark; and now AMD looks to beat Intel at its game, with the introduction of new 24-core and 32-core SKUs at prices that are sure to spell trouble for Intel's Core X HCC lineup. The lineup is partially open to pre-orders, with two SKUs launching within August (including the 32-core one), and two others in October.

At the heart of AMD's second-generation Ryzen Threadripper is the new 12 nm "Pinnacle Ridge" die, which made its debut with the 2nd Generation Ryzen AM4 family. This die proved to introduce 3-5 percent IPC improvements in single-threaded tasks, and multi-threaded improvements with an improved Precision Boost II algorithm, which boosted frequencies of each of 8 cores on-die. The Threadripper is still a multi-chip module, with 2 to 4 of these dies, depending on the SKU. There are four of these - the 12-core/24-thread Threadripper 2920X, the 16-core/32-thread Threadripper 2950X; the 24-core/48-thread Threadripper 2970WX, and the flagship 32-core/64-thread Threadripper 2990WX.

ASUS today announced that the ROG Strix, Prime and TUF Gaming series motherboards built on the AMD B450 chipset and supporting the latest AMD Ryzen processors are now available. AMD's Ryzen platform offers an incredible desktop compute experience with multithreaded horsepower plus accessible overclocking and gaming prowess. Earlier this year AMD launched the second-generation Ryzen family with the updated X470 chipset designed to further enhance the performance of higher-end gaming and content creation rigs. Now, AMD is launching the B450 chipset for a new generation of affordable motherboards.

The B450 is streamlined for straightforward builds and smaller form factors, and ASUS has a complete collection available now. ROG Strix B450-I and B450-F Gaming elevate the platform with signature features for serious gamers, TUF B450-Plus and B450M-Plus Gaming focus on essentials and durability, and Prime B450-Plus, B450M-A and B450M-K put a more professional face on the platform.

User 1usmus is the programmer of Ryzen DRAM Calculator, a must-have tool for any PC enthusiast with AMD Ryzen-powered machines. The tool simplifies the process of finding the right memory clock, timing, and voltage combination by adjusting other settings to match the setting you key in. For example, if you're looking for a memory clock of DDR4-3200 and CAS latency of 14T, the tool will put out "safe" and "stable" combinations of other timings and voltages. You can also make the app read Intel XMP and other fast SPD profiles from your modules, and translate them to Ryzen-friendly settings that run stable. In short, this is the app that clears that last bit of hesitation you had to embrace Ryzen. Get it from the link below.DOWNLOAD: Ryzen DRAM Calculator by 1usmus v1.3.1

The change-log follows.

Ballistix, a leading global brand of gaming memory, today announced the immediate availability of Ballistix Sport AT memory in support of ASUS' TUF Gaming Alliance. Developed as a collaboration between ASUS, Ballistix, and other trusted industry partners, TUF Gaming Alliance ensures easier building, the best compatibility, and complementary aesthetics from components to cases.

"Our TUF Gaming Alliance relationship with Ballistix, the memory brand of choice for so many gamers, offers customers and partners an exciting new product for PC builds," said Sharon Pan, Division Director of the ASUS Motherboard Channel PM Department. "On the heels of all the positive feedback at Computex 2018, we're looking forward to a successful collaboration with Ballistix as we continue to create products that excel in both performance and aesthetics."

Sapphire introduced the FS-FP5V, a mini-ITX (147.3 mm x 139.7 mm) SFF motherboard designed for AIO desktops, digital signage boxes, and compact desktops. At the heart of this board is an AMD Ryzen Embedded V1000 series FP5 SoC based on the 14 nm "Raven Ridge" silicon. Since this SoC also integrates a southbridge, the board is practically chipset-less. The Ryzen Embedded V1000 chip is configured with a 4-core/8-thread "Zen" CPU clocked at 2.00 GHz with 3.35 GHz boost, and 4 MB L3 cache. The iGPU is a Radeon Vega 11, which may look overkill, but is required to pull the four DisplayPort 1.4 outputs of this board (handy for digital-signage applications).

The Ryzen Embedded V1000 is wired to two DDR4 SO-DIMM slots, supporting up to 32 GB of dual-channel DDR4-2933 memory. Storage connectivity includes an M.2-2280 slot with PCI-Express 3.0 x4 wiring, an M.2 E-key slot with x1 wiring for WLAN cards; and a SATA 6 Gbps port. Networking options include two 1 GbE interfaces. USB connectivity includes two USB 3.1 gen 1 ports at the rear-panel, and two USB 3.1 gen 1 ports (direct ports) at the front side of the board, one each of type-A and type-C. Stereo HD audio makes for the rest of it. The board draws power from either 2-pin DC (external) or 4-pin ATX.

ASUS expanded its mid-range TUF Gaming motherboard lineup with a new micro-ATX socket LGA1151 motherboard, the TUF B360M-Plus Gaming S. Built with the characteristic black+yellow color scheme and the polygonal shape, this board takes in 8th generation Core processors. It draws power from a combination of 24-pin ATX and 8-pin EPS power connectors, conditioning it for the CPU with a 4+3 phase VRM. The CPU is wired to four DDR4 DIMM slots, and a reinforced PCI-Express 3.0 x16 slot. Two other PCI-Express 3.0 x1 slots, and three M.2 PCIe slots make for the rest of the expansion.

Storage connectivity includes two M.2-2280 slots with PCIe gen 3.0 x4 wiring, one of which also has SATA 6 Gbps wiring; and six SATA 6 Gbps ports. The third M.2 slot is 30 mm long, has PCIe 3.0 x1 wiring, and is meant for CNVi WLAN cards. Networking is handled by an Intel i219-V controller driving a GbE interface. The onboard audio solution combines an entry-level Realtek ALC887 codec with 6-channel output, audio-grade capacitors, and ground-layer isolation. USB connectivity includes two USB 3.1 gen 2 (both type-A), four USB 3.1 gen 1 (three type-A, one type-C), two USB 3.1 gen 1 front-panel ports by header; and a number of USB 2.0 ports. The board features an RGB LED ornament at the top-right corner, and a 4-pin RGB LED header, controlled by Aura Sync RGB software. The board is expected to be priced around USD $120.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards and graphics cards, announced its first XMP supported DRAM, the AORUS RGB Memory. With DDR4 XMP 3200 16GB（8GB*2）memory modules and exclusive 2* RGB Infused Demo Modules, AORUS RGB Memory delivers outstanding value to anyone seeking a combination of high-end performance and glowing aesthetics. GIGABYTE RGB Fusion or RGB Fusion Link software allows users to easily control over 5 new lighting effects available only for DDR so they can enjoy the most impressive RGB lighting effects memory kits have to offer.

GIGABYTE introduced its AORUS RGB Memory at Computex 2018, garnering much praise among the media and receiving Best Product awards from U.S. based Tom's Hardware as well as U.K. based TechRadar. AORUS RGB Memory Modules feature aluminum heatsinks with anodized hairline surface for a sleek, metallic look. A standout feature of AORUS RGB Memory is the addition of 2 brand exclusive RGB Infused Demo Modules for pure RGB illumination and lighting effects. This feature makes it completely unnecessary for the user to purchase a completely different set of memory modules with RGB functionality to fill out the DIMM slots of the memory configuration, without affecting their budget. Users can now add RGB Infused Demo Modules to their boards to enjoy a full memory configuration packed with RGB brilliance.

With the rapid growth of the global eSports economy, the gaming laptop market is getting hotter and hotter. TEAMGROUP's gaming brand, T-FORCE releases VULCAN DDR4 3600 MHz memory module exclusively for gaming laptop. The clock frequency is as high as the maximum performance of DDR4 3600 MHz. The capacity of the memory module is up to 32 GB (16 GBx2), which allows gamers to possess high speed performance and master the key to winning every gaming battle.

For enthusiastic gamers and modders, powerful gear is a must. And after winning over the professional gaming crowd, Apacer is bringing some colorful bling to DRAM. Since its last incarnation, PANTHER RAGE DDR4 has evolved from single-light LED to splashy RGB, with its bold new color in Gold. Apacer is going to show that the new gear is definitely worth the wait.

By implementing the newly developed hardware architecture to enhance the RGB controller, PANTHER RAGE DDR4 RGB has improved the performance by 200%. It also seamlessly integrates with the latest ASUS Aura Sync software which is popular among gamers, and allows users to select various patterns based on their preference. On top of that, it is compatible with the latest platform by Intel and AMD.