With plenty of dominant new products, the world's leading memory brand, TEAMGROUP will exhibit its gaming brand T-FORCE at COMPUTEX Taipei 2019 during May 28th-June 1st. This year, TEAMGROUP's booth (J0218) at Nangang Exhibition Center Hall 1 will not only show the world eye-catching new T-FORCE RGB products but also announce many new storage products that are related to intelligent living. The core focuses of COMPUTEX 2019 are 'mirror design, water cooling, and extended concept. Also, the visitors will be able to fully understand TEAMGROUP's non-stop efforts over the years. At the same time, T-FORCE gaming memory modules, the winners of 2019 Red Dot Design Award and iF Design Award will be showcased at our booth. The world will witness the solid strength of T-FORCE which shines on the international design stage.

HyperX at COMPUTEX 2019 announced they've developed new, in-house mechanical switches they'll start employing on their products. HyperX says these are rated for up to 80 million clicks, and that they're brighter than the competition's offerings due to their DIP design. The switches feature a 1.8 mm actuation point, and a short 3.8 mm travel.

Thermaltake, the leading PC DIY premium brand for Cooling, Gaming Gear and Enthusiast Memory solutions, proactively participates in the memory market by announcing brand new premium memory products - TOUGHRAM RGB and TOUGHRAM. Besides, the innovative WaterRam RGB Liquid Cooling Memory kit, Thermaltake has expanded its lineup with the clock speed of 3600MHz.

The Thermaltake TOUGHRAM RGB and TOUGHRAM DDR4 Memory lineup is aiming at high performance gaming/overclocking. TOUGHRAM RGB series range from 3000MHz, 3200MHz and 3600MHz. The RGB lighting effects designed for the TOUGHRAM RGB with its addressable RGB lighting settings can be synchronized with the TT AI Voice Control, Amazon Alexa, and Razer Chroma. TOUGHRAM memory series range from 2400MHz to 3000MHz. These two memory series are supported by the TT Premium heatspreader design, which are tightly screened memory ICs that ensure outstanding cooling performance.

KLEVV at its Computex 2019 booth unveiled a new line of high-performance USB flash drives. It also brought along its latest variants of CRAS series M.2 NVMe SSDs and DDR4 memory, which come with a dazzling/blinding (take your pick) amount of RGB LED embellishment. We begin with the Portable Ghost, branded as a "portable SSD" and not a flash-drive. This is because the USB 3.1 gen 2 type-C connection pulls a PCIe/NVMe internal SSD. When plugged into a PC or a USB charger, the drive can also work as a wireless drive to your other devices over Bluetooth 4.2. The drive comes in two variants based on capacity, which significantly differ in hardware. The 240 GB variant is pulled by a JMicron JM5583 controller, while the 480 GB variant has a Silicon Motion SM2263EN. Both models use 72-layer 3D TLC NAND flash, and have the same on-paper performance figures, with up to 1,250 MB/s reads/writes. The drive isn't without two RGB LED diffusers.

The Blu RC30 is another fascinating, albeit slower drive, that's properly marketed as a flash drive. Built in the conventional 2-piece capped form-factor, the drive features a USB 3.1 gen 1 (5 Gbps) type-A connection. An internal battery which soaks up power when plugged in, lets the drive function wireless over Bluetooth 4.2, and also be used as a wireless presentation tool (a clicker), with capacitive touch surface and a couple of buttons, which imitate a mouse. Built in capacities of 32 GB, 64 GB, and 128 GB, the Blu RC30 offers sequential transfer-rates of up to 250 MB/s reads on all three models, and write-speeds rated at 40 MB/s for the 32 GB model, 50 MB/s for 64 GB, and 90 MB/s for the 128 GB model. Transfer rates are severely throttled in wireless mode. We then moved on to its SSD and memory products.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is showcasing several ultra-high speed and low latency DDR4 memory kits on Intel and AMD platforms at Computex 2019. These live demo systems feature motherboards from ASUS, ASRock, EVGA, Gigabyte, and MSI, as well as multiple memory kits made with Samsung B-die ICs.

DDR4-4000 384GB (32GBx12) - Massive Capacity DDR4 Beast of a Kit

Any experienced overclocker knows two factors that make achieving high-speed RAM more difficult - high module capacity and increased module count. This mystical beast of a memory kit runs at DDR4-4000MHz with an enormously massive total capacity of 384GB with 12 modules of 32GB each. While earlier 32GB modules were constructed with 8Gb components, these modules use higher density 16Gb ICs. This extremely high-capacity, high-performance live demo system is built with the Intel Xeon W-3175X processor and ASUS ROG Dominus Extreme motherboard.

Antec at Computex 2019 showcased a myriad of products, of which we bring you three families in this post: their Neptune ARGB CPU liquid coolers, the Signature Series of PSUs, and their Katana DDR4 memory modules.

The Neptune ARGB liquid coolers are available in either 120 mm or 240 mm AIO configurations, each packing a single or a dual fan setup (I leave it to you to guess which is which)s. These feature PWM controlled fans, have a flow rate of 1.5 L of cooling liquid per minute, feature RGb lighting (in case you hadn't noticed the ARGB in the name), and are rated for up to 40,000 H MTBF at a 25º room temperature.

An AMD-based system's most important performance pairing lies in the CPU and system RAM, as a million articles written ever since the introduction of AMD's first generation Ryzen CPUs have shown (remember the races for Samsung B-die based memory?). There are even tools that allow you to eke out the most performance out of your AMD system via fine memory overclocking and timings adjustment, which just goes to show the importance the enthusiast community derives from such tiny details that maximize your AMD Zen-based CPU performance. Now, notorious leaker @momomo_us has seemingly confirmed that AMD has worked wonders on its memory controller, achieving a base JEDEC 3200 MHz specification - up from the previously officially supported DDR4-2666 speeds in the first-gen Ryzen (updated to DDR4-2933 speeds on the 12 nm update).

ECS has introduced a new model into their Liva series of Mini PCs - this time, powered by AMD Ryzen APUs. The ECS LIVA A320 is a 1-liter Mini Pc (book-sized, according to the company, but I guess that depends on the books you prefer to read), and makes use of either an AMD Ryzen 3 or Ryzen 5 APU with up to 35 W TDP.

There's a lot to like about this little Mini PC that could, which ECS is marketing at light gaming workloads and all other content consumption and office-related shenanigans. There is a tooless design for easy upgradeability, 2x DDR4 support in the SO-DIMM form factor, internal support for an M.2 drive (which helps save space in such a small enclosure, even though a 2.5" HDD or SSD is still supported). A VESA mount means this can be installed in the back of a monitor or television for your content consumption needs.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices releases the H310MHG micro-ATX motherboard. Equipped with the latest INTEL H310 chipset and 4K HDMI compatible motherboard is sure to satisfy the needs of home entertainment enthusiasts. An array of cutting-edge motherboard technology, elevates immersion like never before, with its dual channel memory interface that supports the most demanding of DDR4 memory modules, an uncompromising PCIe M.2 10Gb/s storage interface and a speedy USB 3.1 Gen 1 brings together the most asked for home theatre enthusiast features onto a single small form factor. Together with its 'granite rock'-like dependability does the BIOSTAR H310MHG bring a fusion of gaming, home theatre, and corporate business needs, within a single solution.

ZADAK announced today the immediate worldwide release of their latest ultra-high-performance RGB gaming memory module, the SPARK RGB DDR4. Firmly aimed at the high-end PC enthusiasts and gamers market, the SPARK RGB DDR4 brings together powerful memory module, overclocking capability and top-notch design elements to form a valuable addition to the ZADAK DDR4 family that is compatible with high-end motherboards.

SPARK RGB DDR4 modules are available in kits ranging from 16GB (2x8GB) up to 64GB (4x16GB) with the top-end models running at 4133 MHz. Overclocking is made simple with XMP 2.0 support allowing users to select their preferred profile for stable and reliable overclocking.

As if the mother of all ironies, prior to its effective death-sentence dealt by the U.S. Department of Commerce, Huawei's server business developed an ambitious product roadmap for its Fusion Server family, aligning with Intel's enterprise processor roadmap. It describes in great detail the key features of these processors, such as core-counts, platform, and I/O. The "Sapphire Rapids" processor will introduce the biggest I/O advancements in close to a decade, when it releases sometime in 2021.

With an unannounced CPU core-count, the "Sapphire Rapids-SP" processor will introduce DDR5 memory support to the data-center, which aims to double bandwidth and memory capacity over the DDR4 generation. The processor features an 8-channel (512-bit wide) DDR5 memory interface. The second major I/O introduction is PCI-Express gen 5.0, which not only doubles bandwidth over gen 4.0 to 32 Gbps per lane, but also comes with a constellation of data-center-relevant features that Intel is pushing out in advance as part of the CXL Interconnect. CXL and PCIe gen 5 are practically identical.

ADATA Technology, a leading manufacturer of high-performance DRAM modules, NAND Flash products, and mobile accessories today announces that the XPG Overclocking Lab (XOCL) has overclocked the SPECTRIX D60G RGB DDR4 memory module to a frequency of 5738 MT/s, a new world record. The previous record was 5726 MT/s, which was set only a few days prior. The new record was achieved with an Intel Core i9 chipset and MSI MPG Z390I GAMING EDGE AC motherboard in an LN2-cooled configuration.

ZOTAC Technology, a global manufacturer of innovation, today introduced the more capable ZBOX Q Series Mini Creator PC featuring the advanced NVIDIA Quadro GPU and powerful workstation focused Intel Xeon processor. The new addition to the ZBOX Q Series leverages the ZBOX Mini PC's sleek and minimal design without compromising the powerful hardware components inside. From stunning industrial design and advanced special effects, to complex scientific visualization and sophisticated data modeling, to creating and editing images and videos, the ZBOX Q Series enables limitless creations.

The new ZBOX Q Series features the industry certified NVIDIA Quadro with up to 16GB GDDR5 memory. It's a tested and certified fully compatible hardware on many major professional design applications. The new Q Series models come equipped with an Intel Xeon processor to deliver fast and responsive performance.

ASRock today rolled out the Z390 Phantom Gaming 4S motherboard. Clearly built to a cost, the board ships with a narrow ATX PCB, and is positioned below both the Z390 Phantom Gaming 4 and the Z390 Pro4. It draws power from a 24-pin ATX and an 8-pin EPS, conditioning it for the CPU with a 6+2 phase VRM. The LGA1151 socket is wired to four DDR4 DIMM slots, and a single PCI-Express 3.0 x16. The second x16 slot is electrically x4 and wired to the PCH. An M.2 PCIe E-key slot (for WLAN cards) and three open-ended PCIe 3.0 x1 slots make for the rest of the expansion area. Storage connectivity includes just the one M.2-22110 slot (PCI-Express 3.0 x4 and SATA 6 Gbps wiring), and six SATA 6 Gbps ports.

Display outputs include just the one HDMI port. USB connectivity includes eight USB 3.2 gen 1 ports, four on the rear panel, four by headers. The board's sole 1 GbE network interface is driven by an Intel i219-V controller. The onboard audio solution combines a rather premium Realtek ALC1220 CODEC with 6-channel analog output, audio-grade capacitors, and ground-layer isolation. Separate PS/2 ports, one 3-pin addressable-RGB, two 4-pin RGB, and five 4-pin PWM fan headers make for the rest of this board. We expect this to be ASRock's cheapest Z390 offering, priced between USD $110-120.

ADATA Technology, a leading manufacturer of high-performance DRAM modules, NAND Flash products, and mobile accessories today announces that the XPG Overclocking Lab (XOCL) has overclocked the SPECTRIX D60G RGB DDR4 memory module to a frequency of 5634 MT/s, a new record. The previous record was 5608 MT/s. The milestone was achieved with an Intel Core i9 chipset and MSI MPG Z390I GAMING EDGE AC motherboard in an LN2-cooled configuration. The results have been certified and published on HWBOT.

The D60G is built with high-quality chips and a metal heat sink for excellent signal integrity, reliability, and stability, which effectively extends the lifespan of the memory module. What's more, Intel Extreme Memory (XMP) 2.0 profiles make overclocking a snap and enhance system stability. Instead of adjusting individual parameters in BIOS, users can do it right through their PC's operating system.

AMD's 3rd generation Ryzen (3000-series) processors will overcome a vast number of memory limitations faced by older Ryzen chips. With Zen 2, the company decided to separate the memory controller from the CPU cores into a separate chip, called "IO die". Our resident Ryzen memory guru Yuri "1usmus" Bubliy, author of DRAM Calculator for Ryzen, found technical info that confirms just how much progress AMD has been making.

The third generation Ryzen processors will be able to match their Intel counterparts when it comes to memory overclocking. In the Zen 2 BIOS, the memory frequency options go all the way up to "DDR4-5000", which is a huge increase over the first Ryzens. The DRAM clock is still linked to the Infinity Fabric (IF) clock domain, which means at DDR4-5000, Infinity Fabric would tick at 5000 MHz DDR, too. Since that rate is out of reach for IF, AMD has decided to add a new 1/2 divider mode for their on-chip bus. When enabled, it will run Infinity Fabric at half the DRAM actual clock (eg: 1250 MHz for DDR4-5000).

Apacer releases an all-new DDR4 desktop PC gaming memory with ultra-wide angle RGB lighting effects, built specifically for desktop gaming, overclocking and MOD enthusiasts. Designed with unique RGB lighting, high-class aluminum alloy heat sink, and based on the world's best industrial memory module and storage technologies, this state-of-the-art memory solution uses ICs that were meticulously selected for high gaming requirements and supports Intel XMP 2.0 for one-button overclocking. NOX RGB DDR4 has a mysterious, minimalist design for top gamers to unleash mysterious forces and enjoy ultimate gaming and overclocking experiences.

Apacer NOX RGB DDR4 uses unique ultra-wide angle RGB lighting effects featuring exquisitely carved lighting bar with natural, flowing RGB colors displayed in full view. NOX RGB DDR4 is certified by the software of major motherboard manufacturers such as ASUS AURA sync, GIGABYTE RGB Fusion, MSI Mystic Light Sync and ASRock Polychrome Sync. The RGB memory light effects can be easily controlled and synchronized with system lights, so that gamers have the freedom to configure light designs according to personal preferences to display unique styles, completely making your rig truly yours in bright fashion, day or night.

With inventories of the B360 Express digesting nicely, motherboard vendors are finally implementing its replacement, the B365 Express, in premium gaming-grade products. ASUS rolled out its first Republic of Gamers (ROG) product, with the ROG Strix B365-G Gaming. Built in the micro-ATX form-factor, this board packs many gamer-essentials and is targeted at PC gamers who don't bother with overclocking. With its in-BIOS memory frequency setting capped at DDR4-2667, ASUS is very specific about the target audience. The board draws power from a combination of 24-pin ATX and 8-pin EPS power connectors, conditioning it for the CPU with a 7+2 phase VRM. The board supports all 9th gen and 8th gen Core "Coffee Lake/Refresh" processors out of the box.

The LGA1151 socket is wired to four DDR4 DIMM slots that support up to 64 GB of dual-channel DDR4-2667 memory; and the board's sole PCI-Express 3.0 x16 slot with a metal reinforcement. A PCI-Express 3.0 x1, M.2 E-key slot (for WLAN cards), and PCI-Express 3.0 x4 (physical x16), make for the rest of the expansion area. Storage connectivity includes two M.2-2280 slots, one of which supports both PCI-Express 3.0 x4 and SATA 6 Gbps, while the other is just PCI-Express 3.0 x4; and six SATA 6 Gbps ports. The board's sole 1 GbE interface is driven by an Intel i219-V controller. USB connectivity includes two type-A 10 Gbps USB 3.1 gen 2 ports, besides six USB 3.0 ports (four on the rear panel, two by headers). The onboard audio solution combines a Realtek ALC1220A CODEC with dual OPAMPs, EMI shielding, audio-grade capacitors, and ground-layer isolation. A couple of 3-pin addressable RGB headers make for the rest of this board, which is expected to retail around the $100-mark.

PATRIOT , a global leader in performance memory, SSDs, gaming peripherals, and flash storage solutions, today has announced the release of their latest Signature Premium series line of DDR4 UDIMM memory, which are Non-ECC unbuffered memory designed to deliver outstanding quality, rock solid stability and great performance expected by today's mainstream PC builder.

Signature Premium DDR4 memory provides a wide range of capacities allowing the builder to choose from a variety of speeds and capacities starting with 4GB single modules up to 32GB dual channel kits. The minimalist heat spreader design offers great heat dissipation and is made from high-purity aluminum. Signature Premium DDR4 series modules offer reliability to those who upgrade or build systems for work or business and are cost effective too.

Intel put out interesting details about its upcoming 10 nanometer "Ice Lake" CPU microarchitecture rollout in its recent quarterly financial results call. The company has started qualification of its 10 nm "Ice Lake" processors. This involves sending engineering samples to OEMs, system integrators and other relevant industry partners, and getting the chips approved for their future product designs. The first implementation of "Ice Lake" will not be a desktop processor, but rather a low-power mobile SoC designed for ultraportables, codenamed "Ice Lake-U." This SoC packs a 4-core/8-thread CPU based on the "Sunny Cove" core design, and Gen11 GT2 integrated graphics with 64 execution units and nearly 1 TFLOP/s compute power. This SoC will also support WiFi 6 and LPDDR4X memory.

Intel CEO Bob Swan also remarked that the company has doubled its 10 nm yield expectations. "On the [10 nm] process technology front, our teams executed well in Q1 and our velocity is increasing," he said, adding "We remain on track to have volume client systems on shelves for the holiday selling season. And over the past four months, the organization drove a nearly 2X improvement in the rate at which 10nm products move through our factories." Intel is prioritizing enterprise over desktop, as "Ice Lake-U" will be followed by "Ice Lake-SP" Xeon rollout in 2020. There was no mention of desktop implementations such as "Ice Lake-S." Intel is rumored to be preparing a stopgap microarchitecture for the desktop platform to compete with AMD "Matisse" Zen 2 AM4 processors, codenamed "Comet Lake." This is essentially a Skylake 10-core die fabbed on existing 14 nm++ node. AMD in its CES keynote announced an achievement of per-core performance parity with Intel, so it could be interesting to see how Intel hopes 10 "Skylake" cores match up to 12-16 "Zen 2" cores.

HyperX, the gaming division of Kingston Technology, Inc., today announced the release of two new high speed Predator DDR4 memory kits in 4266 MHz and 4600 MHz frequency versions. The new frequency options will be available as 8GB modules in kits of two and include a black aluminum heat spreader and black PCB to complement the look of the latest PC builds by system builders and DIY PC enthusiasts.

"The HyperX team is excited to offer Predator DDR4 for the next generation of PC enthusiasts who want the best performance from their systems," said Kristy Ernt, DRAM business manager, HyperX. "As HyperX continues to support the world of gaming and esports, the community sees us as a trusted leader for high speed memory in the gaming hardware industry."

AMD Ryzen 3 3200G is an upcoming processor featuring integrated graphics, forming the tail-end of the company's 3rd generation Ryzen desktop processor family. A Chinese PC enthusiast with access to an early sample pictured and de-lidded the processor. We know from older posts that while the "Matisse" MCM will form the bulk of AMD's 3rd gen Ryzen lineup, with core counts ranging all the way from 6 to 12, and possibly 16 later, the APU lineup is rumored to be based on older "Zen+" architecture.

The Ryzen 3 3200G and possibly the Ryzen 5 3400G, will be based on a derivative of the "Raven Ridge" silicon built on the 12 nm process at GlobalFoundries, and comes with a handful innovations AMD introduced with "Pinnacle Ridge," such as an improved Precision Boost algorithm and faster on-die caches. The 12 nm shrink also allows AMD to dial up CPU and iGPU engine clock speeds, and improve DDR4 memory support to work with higher DRAM clock speeds. AMD has used thermal paste as the sub-IHS interface material instead of solder for its "Raven Ridge" chips, and the story repeats with the 3200G.

ADATA Technology, a leading manufacturer of high-performance DRAM modules, NAND Flash products, and mobile accessories today announces the launch of the SPECTRIX D60G DDR4 memory module. The XPG SPECTRIX D60G DDR4 memory features a unique dual RGB light diffuser design that gives it the largest RGB surface area of any memory module! What's more, it sports a wide frequency range from 3200-4133MHz and supports Intel XMP 2.0 profiles for easy overclocking.

The D60G sports more RGB lighting per mm² than any other memory module out there, which equates to over 60% of the module's surface area. The fully exposed light diffusers are extra-wide for maximum effect, and combined with a mesmerizing multi-colored flow effect users will outshine their competition! The unique avant-garde styling of the D60G will also turn heads. It includes XPG's signature X-light design with a diamond-inspired, multi-faceted surface that is a cut above the rest.

So you've spent anywhere between $170 to $600 on a G.Skill Trident Z Royal memory kit at a time when memory prices are on the decline, what do you do next? G.Skill thinks some users find their modules too pretty to be installed inside a computer, and has come up with a completely useless jewel case to let them admire G.Skill's creation. We initially dismissed FC-UM4A-TRK as an April Fool's joke, but turns out it's a real commercial product purchasable separately. Commonly sold as the "G.Skill Trident Z Royal Display Box" in cursive font, this jewel case clad with faux leather much like the faux diamonds on the memory modules' RGB LED diffusers, is somewhat functional.

You open its top lid to find four DDR4 memory slots. You seat your Trident-Z Royal memory modules, pull out the USB cable from the bottom drawer, and plug the jewel case to your PC. This lights up the memory modules, cycling through their lighting presets. If you were expecting the USB connection to do anything beyond powering the case, such as mounting the memory modules as a RAMdisk volume, we have bad news for you. On the plus side, you get a microfiber cloth to wipe the pristine mirror finish of your memory modules, and a 1-year warranty, just in case.

Prices of PC DDR4 memory modules are normalizing to 3-year lows as the pre-Summer PC upgrade season looms and several AAA game launches line up. 8 GB (2x 4 GB) dual-channel DDR4 memory kits have dropped to around USD $50 on popular PC component retailers such as Newegg, 16 GB (2x 8 GB) kits can be had for $80 at DDR4-2667 speeds. Premium 16 GB dual-channel kits (DDR4-3200 and above) start at $99. Premium 16 GB kits with RGB embellishments now typically start at $120.

Perhaps the biggest news from these memory price drops come in the form of capacity. 32 GB dual-channel (2x 16 GB) memory kits now start for as little as $144, for a kit with two dual-rank DDR4-2667 modules. Premium 32 GB kits, with RGB lighting and speeds as high as DDR4-3000 now start at $180. HEDT builders also have reason to cheer, as 32 GB quad-channel (4x 8 GB) kits start for as little as $150, and premium kits with DDR4-3000 frequency can be had for as little as $184. Newegg and the US aren't the only places you can find sharp drops in memory prices. Even across the big pond in Germany, we've been tracking significant drops in memory prices, with 16 GB dual-channel kits starting at 79€, premium 16 GB kits around 100€, 32 GB kits at 160€, and premium 32 GB kits around 190€.