Ahead of their launch, low-resolution pictures of two nearly identical MSI TRX40 PRO series motherboards surfaced on the web, the TRX40 PRO 10G, and the TRX40 PRO WiFi. The former is characterized by a 10 GbE wired Ethernet connection through an included add-on card, while the latter features 802.11ax Wi-Fi 6 WLAN. The two appear otherwise identical, with a couple of M.2 slots on the board, four additional M.2 slots on a cooled add-on card, four PCI-Express x16 slots, eight DDR4 DIMM slots, and other storage connectivity that includes four SATA 6 Gb/s ports, and U.2 port. From the looks of it, the new for the 3rd generation Ryzen Threadripper looks identical to TR4, which bodes well for people wanting to use their TR4-compatible CPU coolers or water-blocks on the new platform.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices, is proud to announce it's full support for the newly launched AMD Ryzen 9 3950X processor. The 3950X, a 16-core, 32-thread desktop CPU running at a 4.7GHz boosted clock, has been highly anticipated and BIOSTAR has been well prepared for it. Supported by BIOSTAR X570, X470, B450, X370, B350, and A320 chipset with AM4 socket motherboards, the monster CPU from AMD brings the latest in PC tech with support for dual-channel DDR4 memory at 3200+MHz and PCIe 4.0, a perfect match for the feature-loaded GEN4 RACING X570 and X470 motherboards from BIOSTAR.

By updating the supported motherboards with the latest AGESA 1.0.0.4 Patch B BIOS, the users can unlock support for the new AMD CPU and its benefits, as well as improved system boot time as tested by our engineers. By updating the supported motherboards with the latest AGESA 1.0.0.4 Patch B BIOS, users can unlock support for the new AMD CPU and its benefits, as well as improved system boot time as tested by our engineers.

Thermaltake, the leading PC DIY premium brand for Cooling, Gaming Gear and Enthusiast Memory solutions, today announced the release of the Thermaltake TOUGHRAM RGB DDR4 Memory Series which comes in new frequencies of 4,000 MHz, 4,266 MHz and 4,400 MHz 2x8 GB modules, supported by Intel and AMD platforms. Featuring 10-layer PCB construction, 2oz copper inner layers and 10μ gold fingers, the TOUGHRAM RGB enhances overclocking performance and betters gaming experiences. The high-frequency memory kits are constructed with higher standard chips, which have been tested to achieve higher and more stable overclocks. Our latest module 4,400 MHz and 4,000 MHz was tested with Intel's Core i7 platform, ASUS ROG MAXIMUS XI GENE and MAXIMUS XI HERO motherboards and remained stable under load.

Thermaltake CEO Kenny Lin is excited to launch the newest addition to the TOUGRAM RGB Series. "We are glad to embrace the new era of high-frequency memory. With the rapid rise of esports, higher frequency ram is essential for faster and smoother performance. Level up your gameplay with the next level TOUGHRAM RGB DDR4 16 GB Memory Kit in 4,000 MHz, 4,266 MHz, 4,400 MHz." stated Thermaltake CEO Kenny Lin.

GIGABYTE expanded its AORUS RGB DDR4 memory family with two new kits that introduce a proprietary performance enhancement dubbed AORUS Memory Boost. Exclusive to GIGABYTE's AORUS-branded motherboards (listed below), and requiring a BIOS update to use, AORUS Memory Boost is a toggle that runs the memory at a clock-speed and timing combination that's a notch above its highest Intel XMP profile. For example, the memory kits debuting with the feature today feature an XMP 2.0 profile for DDR4-3600. Flicking on AORUS Memory Boost runs them at DDR4-3733, in essence making it an additional memory profile that's exclusive to GIGABYTE motherboards.

The memory kits being launched today are GP-AR36C18S8K2HU416R and GP-AR36C18S8K2HU416RD. The former is 2x 8 GB (16 GB) dual-channel, while the latter is 2x 8 GB (16 GB) with two dummy modules. These dummy modules fill up vacant DIMM slots, look and light up like real modules, and could boost the aesthetics of your build without having you spend on two additional real modules. Out of the box, the memory modules (real ones) in these kits run at DDR4-2667 with 19-19-19-43 on Intel processors and 20-19-19-43 on AMD ones. The included DDR4-3600 XMP profile has timings of 18-19-19-39. GIGABYTE didn't mention how AORUS Memory Boost affects timings. Out of the box, the module voltage is 1.2 V, and the XMP profile dials it up to 1.35 V. The dummies work with whatever module voltage you specify in the BIOS, and interface with GIGABYTE RGB Fusion software. The company didn't reveal pricing.

AMD "Renoir" is the company's next-generation APU that improves iGPU and CPU performance over the current 12 nm "Picasso" APU. An AMD "Renoir" APU engineering sample running on a "Celadon-RN" platform prototyping board, was allegedly put through 3DMark 11, and its performance numbers surfaced on Reddit, in three data-sets corresponding with three hardware configurations. In the first one, dubbed "config 1," the CPU is clocked at 1.70 GHz, the iGPU at 1.50 GHz, and the system memory at DDR4-2667. In "config 2," the CPU runs at 1.80 GHz, and the iGPU and memory frequencies are unknown. In "config 3," the CPU runs at 2.00 GHz, the iGPU at 1.10 GHz, and the memory at DDR4-2667. Raw benchmark output from 3DMark 11 Performance preset are pasted for each of the configs below (in that order). The three mention 3DMark database result IDs, but all three are private when we tried to look them up.

The "config 1" machine scores 3,547 points in the performance preset of 3DMark 11. It's interesting to note here that the iGPU clock is significantly higher than that of "Picasso." In "config 2," a 3DMark performance score of 3,143 points is yielded. The CPU clock is increased compared to "config 1," but the score is reduced slightly, which indicates a possible reduction in iGPU clocks or memory speed, or perhaps even the iGPU's core-configuration. In "config 3," we see the highest CPU clock speed at 2.00 GHz, but a reduced iGPU clock speed at 1.10 GHz. This setup scores 2,374 points in the 3DMark performance preset, a 33% drop from "config 1," indicating not just reduced iGPU clocks, but possibly also reduced CU count. "Renoir" is expected to combine "Zen 2" CPU cores with an iGPU that has the number-crunching machinery of "Vega," but with the display- and multimedia-engines of "Navi."

HyperX, the gaming division of Kingston Technology Company, Inc., today announced it has sold over 10 million gaming headsets as it begins shipping its newest lifestyle headset, the Cloud MIX Rose Gold Edition. Since developing the first HyperX Cloud gaming headset in 2014, HyperX has produced 30 headset models, establishing itself as a leading PC and console gaming headset brand and moving into the lifestyle market with its Cloud MIX line of headsets. In addition, HyperX leads market share for PC compatible headsets according to latest NPD data.

HyperX also achieved milestones in two additional categories by shipping over one million gaming keyboards and 65 million memory modules. HyperX Alloy mechanical gaming keyboards launched with Cherry MX switches and now HyperX continues to build its gaming keyboard lineup with the release of the HyperX Alloy Origins mechanical gaming keyboard, including proprietary mechanical key switches. HyperX memory products include FURY and Predator DDR4 branded memory modules and include RGB modules with customizable LED lighting using NGENUITY software.

Team Group launched its first 32 GB memory module, the Team Elite TED432G2400C1601. This is a dual-rank DIMM with eight 32 Gbit DRAM chips, with a rated clock-speed of DDR4-2400, and timings of 16-16-16-39, and module voltage of 1.20 V. The module features a simple black PCB of standard height (32 mm), and comes without any heatspreader or heatsink.

Team Group is also selling a 64 GB (2x 32 GB) dual-channel kit with two of these DIMMs, which bears the SKU TED464G2400C16DC01. To use these modules, you'll need either a 9th generation or 10th generation Intel Core processor, or 3rd generation AMD Ryzen, as 32 GB dual-rank DIMMs are unlikely to be supported by older processors. Team Group is backing these modules with lifetime warranty, and is likely to price the 32 GB single-module at USD $150, and the dual-channel kit at $300.

SK hynix Inc. announced today that it has developed 1Znm 16Gb (Gigabits) DDR4 (Double Data Rate 4) DRAM. As 16Gb is the industry's largest density for a single chip, the total memory capacity per wafer is also the largest of the existing DRAMs. The productivity of this product has improved by about 27% compared to the previous generation, 1Y nm. It does not require highly expensive extreme ultraviolet (EUV) lithography, which gives it a competitive edge cost-wise.

The new 1Z nm DRAM also supports a data transfer rate of up to 3,200 Mbps, which is the fastest data processing speed in DDR4 interface. The Company significantly increased its power efficiency, successfully reducing power consumption by about 40% compared to modules of the same density made with 1Y nm 8 Gb DRAM.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is delighted to announce an extreme low-latency, high-speed DDR4 memory kit at DDR4-4000 CL15-16-16-36 in a 32 GB (8 GB x4) capacity configuration under the classic Trident Z and the RGB-enabled Trident Z Royal memory series. Once again, these extraordinary memory kits are manufactured using high-performance Samsung B-die ICs to achieve the world's lowest latency of CL15 at DDR4-4000.

At G.SKILL, we are always searching for the ultimate memory kit, tuned not only for speed, but also for efficiency. This means pushing for lower latency timings. Previously, the best CAS latency that memory kits at the DDR4-4000 level could achieve was at CL17. This is surpassed by the new DDR4-4000 CL15-16-16-36 32 GB (8 GB x4) memory kit running under 1.5 V, shown validated on the MSI MEG Z390 ACE motherboard and Intel Core i7-9700K processor in the screenshot below.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices, is proud to launch a new addition to its 4th generation of RACING motherboards with the powerful yet humble BIOSTAR RACING X570GTA. Built with designers and content creators in mind, the RACING X570GTA combines a set of onboard features to ensure that quality content can be produced with a system that users can rely on. The BIOSTAR RACING X570GTA is tastefully designed with the iconic BIOSTAR RACING GEN 4 features and grey lightning strikes that represents the lightning-fast performance and ultra-responsives that gives gamers the competitive edge to take their gaming experience to the next level.

The BIOSTAR RACING X570GTA, equipped with the latest X570 chipset for AMD socket AM4, brings support for 3rd Gen Ryzen processors, an essential tool for content creators. While designers rely on high performance and responsiveness to render videos or 3D content, which is supported by the RACING X570GTA PCI-e 4.0 lanes (offering bandwidth of 64 GB/s and compatibility for the latest as well as previous generation graphics cards), the users can rest assured their investment in high-end hardware is secured with the BIOSTAR's exclusive Iron Slot Protection on the x16 lanes which helps handle heavier graphics cards, prevent bending, and extend the longevity of the slots. In addition, PCI-e 4.0 also opens the door to PCI-e M.2 4.0, the latest storage interface which delivers the highest bandwidth (64 GB/s) and offers lower latency, making launching programs such as video and photo editing software, and accessing heavy files a flash.

CORSAIR, a world leader in PC gaming peripherals and enthusiast components, today announced a new kit of its award-winning CORSAIR VENGEANCE LPX DDR4 Memory, becoming the first commercially available high-frequency DRAM to break the 5,000 MHz barrier. This record-setting Micron-based memory is available now in a 2x 8 GB kit, reaching its full potential in select MSI X570 motherboards running 3rd Gen AMD Ryzen Desktop Processors.

VENGEANCE LPX once again sets a new milestone in the world of performance memory, continuing to deliver on its long-standing tradition of excellence thanks to the partnership between CORSAIR, MSI, and AMD. The new modules have been specifically designed and fully tested to achieve their record-breaking maximum frequency of 5,000 MHz on the Ryzen 3000 platform in MSI MEG X570 GODLIKE, MSI MEG X570 ACE, MSI MEG X570 UNIFY, and PRESTIGE X570 CREATION motherboards using their included automated overclocking utilities.

The world's leading memory brand, TEAMGROUP releases T-FORCE DARK Z α DDR4 Gaming Memory and CARDEA ZERO Z440 PCI-E Gen4 x4 M.2 Solid State Drive, which are specially made for AMD RYZEN 3000 processor series and the latest X570 platform. With the release of AMD RYZEN 3000 series worldwide, T-FORCE's invincible gaming performance offers the best DDR4 memory and SSD for AMD's next generation platform. The excellent overclocking capability and platform compatibility are created to perfectly release the potential performance of the latest AMD processors.

T-FORCE DARK Z α DDR4 Gaming Memory is an AMD memory specially made for AMD's latest Ryzen 3000 series processor and X570 motherboard. In order to satisfy gamers' experience with AMD 3000 series processor and X570 platform, DARK Z α uses high quality IC chips that are selected through rigorous testing process. With excellent overclocking capability and perfect compatibility, this DDR4 memory can provide extremely superior performance on the new generation platform of AMD. The body of T-FORCE DARK Z α DDR4 Gaming Memory is designed based on the concept of an armored knight. The sacred war rope offers a more complete protection. The tasteful black color is forever classic.Electrolytic anodizing process and metal electroforming logo design are used to echo with T-FORCE logo's energetic tech armor.

Ahead of their October 7th product launch and November availability, we have confirmation of the specifications and pricing of Intel's 10th generation Core X "Cascade Lake-X" HEDT processors in the LGA2066 package. These chips feature compatibility with existing socket LGA2066 motherboards with a UEFI BIOS update, although several motherboard manufacturers are launching new products with some of the latest connectivity options, such as 2.5 GbE wired Ethernet, and 802.11ax Wi-Fi 6 WLAN.

The 10th generation Core X HEDT processor family is based on the new 14 nm++ "Cascade Lake" silicon, which comes with hardware fixes against several classes side-channel vulnerabilities, and introduces an updated instruction-set that includes more AVX-512 instructions, and the new DLBoost instruction. DLBoost leverages new fixed-function hardware on silicon to accelerate AI deep-learning neural-set building and training by up to 5 times. Intel's first wave of 10th gen Core X lineup is rather slim, with just four processor models. The company did away with the Core i7 brand extension, as core-counts in the mainstream desktop segment have already reached 8-core. The lineup now begins at 10-core/20-thread, with the chip's full 48-lane PCI-Express and 4-channel DDR4 interfaces enabled across the board. All models feature the "XE" brand extension, and feature unlocked base-clock multipliers.

With its 10th generation Core X "Cascade Lake-X" HEDT processor series, Intel will not bother designing models with single-digit core-counts. The series is likely to start at 10 cores with the Core i9-10900X. This 10-core/20-thread processor features a quad-channel DDR4 memory interface, and comes with clock speeds of 3.70 GHz base, a 200 MHz speed-bump over the Core i9-9900X. The chip retains the mesh interconnect design and cache hierarchy of Intel's HEDT processors since "Skylake-X," with 1 MB of dedicated L2 cache per core, and 19.3 MB of shared L3 cache.

Geekbench tests run on the chip show it to perform roughly on par with the i9-9900X, with the 200 MHz speed-bump expected to marginally improve multi-threaded performance. Where the "Cascade Lake-X" silicon is expected to one-up "Skylake-X" is its support for DLBoost, an on-die fixed function hardware that multiplies matrices, improving AI DNN building and training; and pricing. Intel is expected to price its next-generation HEDT processors aggressively, to nearly double cores-per-Dollar.

CORSAIR, a world leader in PC gaming peripherals and enthusiast components, today announced the availability of a new kit of its award-winning CORSAIR VENGEANCE LPX DDR4 Memory, setting a new record for commercially available high-frequency DRAM with clock speeds up to an incredible 4,866 MHz. This blazingly fast memory is now available in a 2x 8 GB kit, reaching its full potential in systems with new 3rd Gen AMD Ryzen Desktop Processors and X570 motherboards.

VENGEANCE LPX has long pushed the limits of performance memory, and continues that tradition today thanks to the partnership between CORSAIR and AMD. While fully compatible with most modern platforms, the new modules have been specifically designed and fully tested to achieve their record-breaking maximum frequency of 4,866 MHz on the Ryzen 3000 platform in ASUS ROG Crosshair VIII Formula, MSI MEG X570 GODLIKE, and MSI PRESTIGE X570 CREATION motherboards using their included automated overclocking utilities.

MAINGEAR — an award-winning PC system integrator of custom gaming desktops, notebooks, and workstations — today launched the MAINGEAR ELEMENT, their new ultimate gaming notebook designed in collaboration with Intel. Custom engineered from the ground up, the ELEMENT features best-in-class hardware housed in a sleek machined magnesium alloy body, making it MAINGEAR's most professional notebook ever released.

The all-new ELEMENT fuses MAINGEAR's passion for design and performance into a truly modern gaming notebook with a thin, minimalist profile that doesn't compromise on raw power. The ELEMENT is optimized for the most demanding gamers and content creators, pairing a 9th Gen Intel i7-9750H processor and an NVIDIA GeForce RTX 2070 with Max-Q design GPU to hit peak performance in today's latest games. An ultra-smooth 144hz 15.6" IPS display with a narrow bezel delivers an incredibly immersive gaming experience. An RGB keyboard with individually-lit silent mechanical switches and a glass touchpad ensure users have precise control of the on-screen action. 32 GB of DDR4 memory and 2 TB of blazing-fast NVMe storage top off the ELEMENT's high-end specs.

Samsung's B die has been widely known as a good, high performance variant of DRAM memory, loved by overclockers because of its ability to get to a high frequency with relatively low timings. However, B die has been discontinued and now Samsung started offering its replacement in form of the newly developed A die manufactured in 1z nm (1z class) lithography process. Despite the lack of technical details surrounding the new die type, Hardwareluxx has received a tip from its reader about new RAM offering that incorporates A die memory.

The M378A4G43AB2-CVF, as it is called in the listing, is a 32 GB, single dimm DDR4 RAM with operating speed of 2933 MHz and CL21-21-21 timings. This particular offer isn't something to be excited about as the frequency is good, but the timings are quite high for that speed. Given that we don't know where the A die is targeted at, we can speculate that its current aim is at mid-tier systems, where the mediocre performance is okay and the system isn't suffering (performance wise) because of it. Nonetheless this find is quite interesting as it gives first hints at what can we expect in therms of future A die DRAM offerings. Remember, it took some time for B die as well to get to the level of performance we have today, so it is entirely possible that A die will improve and try to aim for greater performance level than it currently has.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices, is proud to announce a new addition to its AMD socket AM4 motherboards with the BIOSTAR X470MH. Built for office workers looking to smoothly cruise through their daily tasks without setbacks and for home users looking for a strong and stable platform to run their HTPC, the X470MH is equipped with the latest features the PC industry has to offer while maintaining an affordable price point. And for those looking to push the limit, the X470MH offers overclocking possibilities giving the user the added performance benefit for faster gaming and task management without risking to damage their investment.

The BIOSTAR X470MH, equipped with AMD's X470 chipset and AMD AM4 CPU socket, brings support for AMD's latest 3rd Gen Ryzen 7 nm processors. Built to make your daily computer needs a breeze, the X470MH is a Micro ATX motherboard featuring USB 3.1 Gen1 support (5 Gb/s) providing fast transfer speeds and support to a wide array of peripherals, PCI-e M.2 at 32 Gb/s for increased system responsiveness, as well as HDMI 4K resolution to sooth the eye while watching Netflix or Youtube, and a VGA port for a wider range of monitor compatibility. In addition, the Internet and network connectivity will not be a drag with the onboard Realtek GbE LAN. Overclockers are not left out either with enough room for 2x DDR4 RAM slots which support up to 32 GB and overclocks at 3200 MHz, making multitasking a pleasant experience.

Thermaltake, the leading PC DIY premium brand for Cooling, Gaming Gear and Enthusiast Memory solutions, today announced the release of the Thermaltake TOUGHRAM RGB DDR4 Memory Series, comes with the frequencies of 3,600 MHz, 3,200 MHz and 3,000 MHz 8x 2 GB modules. As the first Thermaltake gaming memory product, it aims to deliver outstanding performance for gaming enthusiasts.

Featuring 10-layer PCB construction for enhanced overclocking performance and stability, the TOUGHRAM RGB boasts to have the highest quality of components including tightly-selected memory chips, 2 oz copper PCB for enhanced electricity conduction, and 10μ gold fingers for high resistance to ensure the ultimate gaming performance. Meanwhile, the TOUGHRAM RGB memory can be controlled by the TOUGHRAM RGB software which can simply monitor the real-time temperature, frequency and performance.

ADATA Technology, a leading manufacturer of high-performance DRAM modules, NAND Flash products, and mobile accessories is pleased to announce new capacity 32 GB per DIMM of ADATA DDR4-2666 U-DIMM and DDR4-2666 SO-DIMM modules.

Made with the latest advancements in soldering and manufacturing, the ADATA DDR4-2666 U-DIMM and SO-DIMM 32GBwith a single slot has tested and provided excellent performance and support the latest Intel and AMD platforms.U-DIMM 32 GB will give discerning users, such as gamers and graphics professionals, the ability to break the memory limitations of two-slot platforms. For general laptop users, ADATA offers DDR4-2666 SO-DIMM 32 GB.

As with all ADATA memory modules, these modules and their components are produced and tested via a rigorous quality control process to ensure rapid performance and stable operation. Also, they meet strict JEDEC and RoHS standards to guarantee compatibility, stability, and environmentally friendliness and come backed by a lifetime warranty for maximum assurance.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is excited to announce high-frequency, high-capacity memory kit specifications to the G.SKILL Trident Z Royal series at DDR4-4300 MHz CL19-19-19-39 and DDR4-4000 MHz CL16-18-18-38, both in kit capacity of 64 GB (8x 8 GB) and 32 GB (4x8GB). Once again, these extraordinary G.SKILL Trident Z Royal memory kits are built with high performance Samsung B-die components.

As an excellent choice for tasks that require both high-capacity and extreme speed memory, the high-performance DDR4-4300 MHz CL19-19-19-39 64 GB (8x 8 GB) is shown in the stress test screenshot below, validated on the latest ASUS ROG Rampage VI Extreme Encore motherboard and the Intel Core i9-9820X processor. This is the perfect memory solution for building an all-powerful workstation for various content creation workloads, including 3D rendering and multimedia editing.

Intel today announced that it has begun shipments of the first Intel Agilex field programmable gate arrays (FPGAs) to early access program customers. Participants in the early access program include Colorado Engineering Inc., Mantaro Networks, Microsoft and Silicom. These customers are using Agilex FPGAs to develop advanced solutions for networking, 5G and accelerated data analytics.

"The Intel Agilex FPGA product family leverages the breadth of Intel innovation and technology leadership, including architecture, packaging, process technology, developer tools and a fast path to power reduction with eASIC technology. These unmatched assets enable new levels of heterogeneous computing, system integration and processor connectivity and will be the first 10nm FPGA to provide cache-coherent and low latency connectivity to Intel Xeon processors with the upcoming Compute Express Link," said Dan McNamara, Intel senior vice president and general manager of the Networking and Custom Logic Group.

AMD is preparing to surprise Intel with its 3rd generation Ryzen Threadripper processors derived from the "Rome" MCM (codenamed "Castle Peak" for the client-platform), that features up to 64 CPU cores, a monolithic 8-channel DDR4 memory interface, and 128 PCIe gen 4.0 lanes. For the HEDT platform, AMD could reconfigure the I/O controller die for two distinct sub-platforms within HEDT - one targeting gamers/enthusiasts, and another targeting the demographic that buys Xeon W processors, including the W-3175X. The gamer/enthusiast-targeted processor line could feature a monolithic 4-channel DDR4 memory interface, and 64 PCI-Express gen 4.0 lanes from the processor socket, and additional lanes from the chipset; while the workstation-targeted processor line could essentially be EPYCs, with a wider memory bus width and more platform PCIe lanes; while retaining drop-in backwards-compatibility with AMD X399 (at the cost of physically narrower memory and PCIe I/O).

To support this diverse line of processors, AMD is coming up with not one, but three new chipsets: TRX40, TRX80, and WRX80. The TRX40 could have a lighter I/O feature-set (similar to the X570), and probably 4-channel memory on the motherboards. The TRX80 and WRX80 could leverage the full I/O of the "Rome" MCM, with 8-channel memory and more than 64 PCIe lanes. We're not sure what differentiates the TRX80 and WRX80, but we believe motherboards based on the latter will resemble proper workstation boards in form-factors such as SSI, and be made by enterprise motherboard manufacturers such as TYAN. The chipsets made their way to the USB-IF for certification, and were sniffed out by momomo_us. ASUS is ready with its first motherboards based on the TRX40, the Prime TRX40-Pro, and the ROG Strix TRX40-E Gaming.

TEAMGROUP releases new T-FORCE gaming products gamers around the world have long been waiting for, which included the industry's first T-FORCE DELTA MAX RGB Solid State Drive and T-FORCE's latest gaming memory DARK Z. T-FORCE DELTA MAX RGB Solid State Drive uses its magnificent RGB mirror design to offer the largest visual proportion of the lighting effects. The magnificent mirror surface displays a transparent effect like a magic mirror, which is the first in the industry. The all-new T-FORCE DARK Z DDR4 Gaming Memory is designed with armor for complete protection and enhanced heat dissipation. Using only selected IC chips, these two new products can offer high performance, low power consumption, easy upgrade and completely satisfy the needs of the gaming market.

The latest generation of T-FORCE DELTA MAX RGB Solid State Drive has an innovative full mirror design which is a design breakthrough of the traditional solid state drive. It offers the largest proportion of luminous area in the industry and the largest area of color lighting effects. The densely arranged ARGB LED lighting effect design can offer a colorful light feast. The minimalist design mirror can present a magic mirror like reflection effect when the lighting is off. The advanced 3D NAND delivers up to 560 MB/s in read speed and 510 MB/s in write speed. It also supports motherboards with 5 V 3-pin ARGB Addressable LED header. T-FORCE DELTA MAX RGB Solid State Drive's lighting modes and effects can be customized via software of each brand's motherboard to light up consumers' storage devices. Maximum 2 TB of capacity is the most magnificent storage expansion you can get and the mirror design is creating a trend in the tech world. Currently applying for exclusive patents in three regions, including Taiwan/China/USA.

QNAP Systems, Inc. today launched the new TVS-x72N 5GbE NAS series, powered by 8th Generation Intel Core i3 processors and features a 5GBASE-T port to deliver transfer speeds up to five times faster than Gigabit Ethernet, making 4K video transfer, display, and editing smooth and streamlined. The TVS-x72N comes with two built-in M.2 SSD slots for enabling SSD caching, features HBS 3 with data de-duplication for faster data backup and recovery, and provides cloud storage gateway functions to create a cost-effective hybrid cloud storage environment.

"With computers and networking devices now widely supporting Wi-Fi 6 (802.11ax), the common Ethernet networking speed has increased from 1 Gigabit (GbE) to 2.5 GbE and 5 GbE," said David Tsao, Product Manager of QNAP, adding, "Users can add the TVS-x72N 5GbE NAS that offers four transfer speeds to their network environment to optimize their network storage usage experience."