AMD today announced at Smart Production Solutions 2023 the AMD Ryzen Embedded 7000 Series processor family, optimized for the high-performance requirements of industrial markets. By combining "Zen 4" architecture and integrated Radeon graphics, Ryzen Embedded 7000 Series processors deliver performance and functionality not previously offered for the embedded market. With its expanded features and integration, Ryzen Embedded 7000 Series processors are ideal for a wide range of embedded applications, including industrial automation, machine vision, robotics and edge servers.

The Ryzen Embedded 7000 Series processor is the first embedded processor to use next-generation 5 nm technology with a 7-year manufacturing availability commitment. The new embedded processor integrates AMD Radeon RDNA 2 graphics that eliminates the need for a discrete GPU for industrial applications. And because embedded applications require additional operating system software options, Ryzen Embedded 7000 Series processors include support for both Windows Server and Linux Ubuntu, on top of Windows 10 and Windows 11. Ryzen Embedded 7000 Series processors also include up to 12 high-performance "Zen 4" CPU cores, which combined with its integrated features and wide operating system choices, offers unparalleled ease of integration for system designers.

Sabrent Rocket 8 GB, 16 GB, and 32 GB DDR4 SO-DIMM 3200 MHz Memory Module for laptop, Ultrabook, and mini-PC. Expand your horizons with Sabrent Rocket DDR4 memory. Your favorite SSD company wants to make sure the rest of your system feels responsive, too. We provide affordable, high-capacity DRAM options to make sure you never feel left behind. Our passion for memory matches your desire to exceed the limits of your imagination. Our design is tight and cool, making sure never to get in the way of your dreams.

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G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is announcing new high-capacity, high-performance memory kit specifications based on 32 GB modules across several memory series, including Trident Z Royal DDR4-3200 CL16 256 GB (32 GB x8), Trident Z Royal DDR4-4000 CL18 128 GB (32 GB x4), Trident Z Neo DDR4-3600 CL18 128 GB (32 GB x4), and Trident Z Neo DDR4-3800 C18 64 GB (32 GB x2). Built with the latest high-density 16Gb components, these DDR4 memory kits are the perfect choice for pushing the performance limits of high memory capacity.

With the availability of higher density memory at the consumer level, G.SKILL memory is pushing the performance boundary to DDR4-3200 on current HEDT platforms with up to 8 modules of 32 GB for a total of 256 GB. As shown in the screenshot below, the Trident Z Royal DDR4-3200 CL16 256 GB (32GBx8) is validated on the latest X299-based ASUS ROG Rampage VI Extreme Encore motherboard and the Intel Core i9-9820X processor. Such extremely high-capacity memory kits are the ideal choice for powerful workstations or for systems running multiple virtual machines.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is showcasing several ultra-high speed and low latency DDR4 memory kits on Intel and AMD platforms at Computex 2019. These live demo systems feature motherboards from ASUS, ASRock, EVGA, Gigabyte, and MSI, as well as multiple memory kits made with Samsung B-die ICs.

DDR4-4000 384GB (32GBx12) - Massive Capacity DDR4 Beast of a Kit

Any experienced overclocker knows two factors that make achieving high-speed RAM more difficult - high module capacity and increased module count. This mystical beast of a memory kit runs at DDR4-4000MHz with an enormously massive total capacity of 384GB with 12 modules of 32GB each. While earlier 32GB modules were constructed with 8Gb components, these modules use higher density 16Gb ICs. This extremely high-capacity, high-performance live demo system is built with the Intel Xeon W-3175X processor and ASUS ROG Dominus Extreme motherboard.

When reading through the Gen11 GT2 whitepaper by Intel, which describes their upcoming integrated graphics architecture, we may have found a groundbreaking piece of information that concerns the memory architecture of computers running 10 nm "Ice Lake" processors. The whitepaper mentions the chip to feature a 4x32-bit LPDDR4/DDR4 interface as opposed to the 2x64-bit LPDDR4/DDR4 interface of current-generation chips such as "Coffee Lake." This is strong evidence that Intel's new architecture will have unganged dual-channel memory controllers (2x 64-bit), as opposed to the monolithic 128-bit IMC found on current-generation chips.

An unganged dual-channel memory interface consists of two independent memory controllers, each handling a 64-bit wide memory channel. This approach lets the processor execute two operations in tandem, given the accesses go to distinct memory banks. On top of that it's now possible to read and write at the same time, something that's can't be done in 128-bit memory mode. From a processor's perspective DRAM is very slow, and what takes up most of the time (= latency), is opening the memory and preparing the read/write operation - the actual data transfer is fairly quick.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is excited to announce the achievement of an unprecedented DDR4-5000 MHz memory in dual-channels. This major breakthrough is the world's first instance of two DDR4 RGB memory modules breaking the DDR4-5000 MHz barrier on just air cooling, when considering that this world-record class speed was only achievable under extreme liquid nitrogen cooling just two years ago. This massive technological feat is achieved with the high performance Samsung DDR4 B-die ICs, and running on the MSI Z370I GAMING PRO CARBON AC motherboard and the Intel Core i7-8700K processor.

Razer, the leading global lifestyle brand for gamers, today announced a new configuration option for the Razer Blade Pro, now with a Full HD display and an NVIDIA GeForce GTX 1060 GPU. This new build - at a lower price point than the Razer Blade Pro with a GeForce GTX 1080 - is targeted toward gamers and creative professionals that need a slim, powerful desktop replacement.

Equipped with a 7th gen Quad-Core Intel Core i7 processor, the latest Razer Blade Pro is a performance-focused system with stunning 17.3-inch Full HD, 120Hz screen. The 1920 x 1080 matte panel offers users a beautiful display that is ideal for pushing out high framerates, and providing amazing color with wide viewing angles.

GEIL's EVO Spear joins the company's DDR4 memory line-up with some inconspicuous looks and lack of LED lighting. The new series from GEIL also features something that's not all that common nowadays - a standard DIMM-sized heat spreader, which doesn't add much volume to the parts. This means these kits shouldn't pose many clearance problems (if any), which is a good thing in some smaller form-factor builds.

The new Kits from GEIL are available in both Intel and AMD-compatibility kits, and the new series is fully compatible with the Intel X299 HEDT platofrm (it remains to be see if the AMD-compatible parts will have the same compatibility towards the company's X399 Threadripper platform.). GEIL offers the module in speeds of 2133MHz up to 3466MHz, in single, dual or quad-channel kits. GEIL didn't release pricing information as of yet, but says that "EVO Spear Series is designed for PC gamers looking for well-performed standard-height gaming memory without high price tag." This probably means these kits will sell for less than comparable GEIL kits from other series. Expect these to hit the streets this July.