The European High Performance Computing Joint Undertaking (EuroHPC JU) has launched 3 new research and innovation projects. The projects aim to bring the EU and its partners in the EuroHPC JU closer to developing independent microprocessor and HPC technology and advance a sovereign European HPC ecosystem. The European Processor Initiative (EPI SGA2), The European PILOT and the European Pilot for Exascale (EUPEX) are interlinked projects and an important milestone towards a more autonomous European supply chain for digital technologies and specifically HPC.

With joint investments of €140 million from the European Union (EU) and the EuroHPC JU Participating States, the three projects will carry out research and innovation activities to contribute to the overarching goal of securing European autonomy and sovereignty in HPC components and technologies, especially in anticipation of the European exascale supercomputers.

The European Processor Initiative (EPI) https://www.european-processor-initiative.eu/, a project with 28 partners from 10 European countries, with the goal of making EU achieve independence in HPC chip technologies and HPC infrastructure, is proud to announce that EPAC 1.0 RISC-V Test Chip samples were delivered to EPI and initial tests of their operation were successful.

One key segment of EPI activities is to develop and demonstrate fully European-grown processor IPs based on the RISC-V Instruction Set Architecture, providing power-efficient and high-throughput accelerator cores named EPAC (European Processor Accelerators).

[Editor's note: This press release comes from the US division of Philips, so the news is more relevant to the USA.]

Envision Peripherals, Inc. (EPI), an affiliate of TPV Technology Limited (TPV) Philips' monitor license partner, announces the release of the world's first Designed for Xbox console gaming monitor. Philips Momentum Designed for Xbox console gaming monitors are built from the ground up to provide the ultimate experience for Xbox fans. These Designed for Xbox console gaming monitors set the standard for Xbox gaming. The inclusion of the new HDMI 2.1 spec now enables next-gen console gaming with 4K resolution and faster 120Hz refresh rates for ultra-clear and ultra-smooth gaming performance. Taking it the next level, TPV partnered with Xbox to tune these "Designed for Xbox" displays to deliver the optimal validated Xbox Series X performance from the moment you plug it in.

Unlike televisions, Philips Momentum gaming monitors are built for console gaming, with low latency and low lag as priorities to provide a much smoother, more realistic gaming experience. The series' low input lag is a great advantage when playing twitch-sensitive video games, allowing the input to register on the screen faster. The flagship 55" Philips Momentum (559M1RYV) will include a specially designed speaker enclosure from the engineers at Bowers & Wilkins, the British loudspeaker company globally renowned for their innovative designs and sound engineering, that completes the experience.

SiPearl has this week announced their collaboration with Open-Silicon Research, the India-based entity of OpenFive, to produce the next-generation SoC designed for HPC purposes. SiPearl is a part of the European Processor Initiative (EPI) team and is responsible for designing the SoC itself that is supposed to be a base for the European exascale supercomputer. In the partnership with Open-Silicon Research, SiPearl expects to get a service that will integrate all the IP blocks and help with the tape out of the chip once it is done. There is a deadline set for the year 2023, however, both companies expect the chip to get shipped by Q4 of 2022.

When it comes to details of the SoC, it is called Rhea and it will be a 72-core Arm ISA based processor with Neoverse Zeus cores interconnected by a mesh. There are going to be 68 mesh network L3 cache slices in between all of the cores. All of that will be manufactured using TSMC's 6 nm extreme ultraviolet lithography (EUV) technology for silicon manufacturing. The Rhea SoC design will utilize 2.5D packaging with many IP blocks stitched together and HBM2E memory present on the die. It is unknown exactly what configuration of HBM2E is going to be present. The system will also see support for DDR5 memory and thus enable two-level system memory by combining HBM and DDR. We are excited to see how the final product looks like and now we wait for more updates on the project.

SiPearl, the company that is designing the high-performance, low-power microprocessor for the European exascale supercomputer, has signed a major technological licensing agreement with Arm, the global semiconductor IP provider. The agreement will enable SiPearl to benefit from the high-performance, secure, and scalable next-generation Arm Neoverse platform, codenamed ''Zeusʺ, as well as leverage the robust software and hardware Arm ecosystem.

Taking advantage of the Arm "Zeus" platform, including Arm's POP IP, on advanced FinFET technologyenables SiPearl to accelerate its design and ensure outstanding reliability for a very high-end offering,in terms of both computing power and energy efficiency, and be ready to launch its first generation of microprocessors in 2022.

Envision Peripherals, Inc. (EPI), the sole distributor of Philips-branded monitors and audio products in North America, today announces an addition to the Philips audio line with the Philips ActionFit Wireless Earbud with ultraviolet (UV) cleaning technology (TAST702BK/00). The earbuds harbor a compact soak resistant design, clear sound and comfortable fit. The Philips ActionFit Wireless Earbuds are now available on Amazon, for $179.99 USD. [Editor's note: The product appears to already be on sale for $139.99 on Amazon at this time.]

"Active people today need a quality audio solution that fits their lifestyles. The new Philips TAST702s are the perfect solution to take to the gym or go on a long bike ride, because of their comfort and their hygienic features," said David Ray, Director of Marketing for EPI.

European Processor Initiative (EPI) is a Europe's project to kickstart a homegrown development of custom processors tailored towards different usage models that the European Union might need. The first task of EPI is to create a custom processor for high-performance computing applications like machine learning, and the chip prototypes are already on their way. The EPI chairman of the board Jean-Marc Denis recently spoke to the Next Platform and confirmed some information regarding the processor design goals and the timeframe of launch.

Supposed to be manufactured on TSMC's 6 nm EUV (TSMC N6 EUV) technology, the EPI processor will tape-out at the end of 2020 or the beginning of 2021, and it is going to be heterogeneous. That means that on its 2.5D die, many different IPs will be present. The processor will use a custom ARM CPU, based on a "Zeus" iteration of Neoverese server core, meant for general-purpose computation tasks like running the OS. When it comes to the special-purpose chips, EPI will incorporate a chip named Titan - a RISC-V based processor that uses vector and tensor processing units to compute AI tasks. The Titan will use every new standard for AI processing, including FP32, FP64, INT8, and bfloat16. The system will use HBM memory allocated to the Titan processor, have DDR5 links for the CPU, and feature PCIe 5.0 for the inner connection.

The European Processor Initiative(EPI), crucial element of the European exascale strategy, delivers its first architectural design to the European Commission and welcomes new partners Almost six months in, the project that kicked off last December has already delivered its first architectural designs to the European Commission, thus marking initial milestones successfully executed. The project that will be the cornerstone of the EU's strategic plans in HPC initially brought together 23 partners from 10 European countries, but has now welcomed three more strong additions to its EPI family. EPI consortium aims to bring a low-power microprocessor to the market and ensure that the key competences for high-end chip design remain in Europe. The European Union's Horizon 2020 program funds this project with a special Framework Partnership Agreement. The initial stage is a three-year Specific Grant Agreement, which lasts until November 2021.