AMD today announced the expansion of the AMD Versal adaptive system on chip (SoC) portfolio with the new Versal AI Edge Series Gen 2 and Versal Prime Series Gen 2 adaptive SoCs, which bring preprocessing, AI inference, and postprocessing together in a single device for end-to-end acceleration of AI-driven embedded systems.

These initial devices in the Versal Series Gen 2 portfolio build on the first generation with powerful new AI Engines expected to deliver up to 3x higher TOPs-per-watt than first generation Versal AI Edge Series devicesi, while new high-performance integrated Arm CPUs are expected to offer up to 10x more scalar compute than first gen Versal AI Edge and Prime series devicesii.

OpenHW Group today announced that the industry's most comprehensive Development Kit for an open-source RISC-V MCU is now available to be ordered. The OpenHW CORE-V MCU DevKit includes an open-source printed circuit board (PCB) which integrates OpenHW's CORE-V MCU and various peripherals, a software development kit (SDK) with a full-featured Eclipse-based integrated development environment (IDE), as well as connectivity to Amazon Web Services (AWS) via AWS IoT ExpressLink for secure and reliable connectivity between IoT devices and AWS cloud services.

The comprehensive open-source CORE-V MCU DevKit enables software development for embedded, internet-of-things (IoT), and artificial intelligence (AI)-driven applications. The CORE-V MCU is based on the open-source CV32E40P embedded-class processor, a small, efficient, 32-bit, in-order open-source RISC-V core with a four-stage pipeline that implements the RV32IM[F]C RISC-V instruction extensions.

AMD today announced it is bringing world-class performance and energy efficiency to embedded systems with AMD EPYC Embedded 9004 Series processors. The new 4th generation EPYC Embedded processors powered by "Zen 4" architecture provide technology and features for embedded networking, security/firewall and storage systems in cloud and enterprise computing as well as industrial edge servers for the factory floor.

Built on the "Zen 4" 5 nm core, the processors combine speed and performance while helping reduce both overall system energy costs and TCO. The series is comprised of 10 processor models with performance options ranging from 16 to 96 cores, and a thermal design power (TDP) profile ranging from 200 W to 400 W. The performance and power scalability afforded with AMD EPYC Embedded 9004 Series processors make them an ideal fit for embedded system OEMs expanding their product portfolios across a range of performance and pricing options. The AMD EPYC Embedded 9004 Series processors also include enhanced security features to help minimize threats and maintain a secure compute environment from power-on to run time, making them well suited for applications with enterprise-class performance and security needs.

Continuing our quick look series, this time we cover a product that came to us after our article on portable encrypted storage was published. That very article came about from two companies asking us if we would be interested in checking out their products, and when a startup company formed by Russians who specialize in data protection and embedded security asks you the same, you answer yes! Hawk Security was set up in 2018, and is actually based out of Hong Kong now, and offers data encryption solutions with military-grade encryption standards. They sent out their S-Drive, a portable solution with a 3D NAND-based memory and certification galore, with performance and privacy as the selling point.

The Hawk Security S-Drive ships in a thick cardboard box with a two-piece packaging, with aptly named security seals on the sides. The inner box slides out to reveal a premium unboxing experience with thick foam cut to shape, which in turn houses the user manual, the drive, and the connecting cable itself. The manual is handy for not only knowing the locking and unlocking procedures for this encrypted drive, but also the default password for using it the first time. The cable terminates in a standard USB 3.1 Gen 1 Type A connector on one end, but a 10-pin USB 3.1 Gen 1 Micro Type B super-speed connector on the other to help make the most of connection speeds. This means backwards compatibility with USB 2.0 ports is restricted to USB ports/hubs that provide enough power only, so keep that in mind. Read past the break for more on the drive.

Innodisk, the service-driven flash and DRAM provider, announces higher capacity 16GB versions of its DDR4 embedded and server unbuffered DRAM series. These 2133MHz UDIMMs and SODIMMS now come in industry-leading 16GB capacities, allowing more memory to be installed within space constrained embedded systems, industrial PCs and servers. Offering higher performance with lower power consumption compared to DDR3, the new DRAM modules have ECC available for reliability, as well as industrial strength features from Innodisk such as 30µ" Gold Finger connectors, thermal sensors, and protective conformal coatings. The new 16GB modules make Innodisk's range of DDR4 products the most complete line of embedded and server DDR4 memory on the market.

"16GB is the highest capacity unbuffered DDR4 module available on the market," said Samson Chang, Vice President of Embedded DRAM Business Unit of Innodisk. "We're proud that Innodisk is able to provide this memory capacity while bringing the performance and low power benefits of DDR4 to the embedded and server markets. In addition, we're bringing extra value to our industrial customers with Innodisk features like onboard thermal sensors and protective coatings.

SanDisk Corporation, a global leader in flash storage solutions, today introduced the new SanDisk Z400s SSD, a cost effective solid-state drive (SSD) designed to replace hard-disk drives (HDDs) in computing platforms and embedded applications. PCs and embedded systems need consistent, reliable access to storage in order to meet business demands. The Z400s outperforms HDDs by 20x, while providing 5x the reliability with 20x lower average power consumption, all at a price point on par with HDDs. The SanDisk Z400s SSD joins the company's existing portfolio of flash-based solutions that are designed to deliver a delightful user experience and reliability at an affordable price point

"The Z400s represents a feat of engineering that addresses the needs of two distinct markets-PC OEM manufacturers and embedded application designers," said Rizwan Ahmed, senior director of product marketing, client platform solutions, SanDisk. "With a single architecture, SanDisk is able to provide OEMs with an affordable solution for displacing HDDs in today's cutting edge consumer devices, and help embedded application designers avoid overpaying for un-needed space-all while delivering the peak performance and high-reliability that only SSDs can supply."

AMD today announced a multi-year agreement with Mentor Graphics Corporation to expand availability of open-source embedded Linux development for heterogeneous and multi-core processors from AMD. Dedicated to providing embedded developers with a more manageable and focused open source framework, the agreement will provide embedded developers with more supported processor options, robust development tools, and greater speed in open platform development.

As a Yocto Project compatible product, Mentor Embedded Linux will now bring standardized features and tools, and ensure quick access to the latest Board Support Packages (BSPs) for AMD 64-bit x86 architecture beginning with the upcoming AMD Embedded G-Series system-on-a-chip (SoC) (codenamed: "Steppe Eagle") and AMD Embedded R-Series APU/CPU (codenamed: "Bald Eagle").

SAPPHIRE Technology has just announced that it has begun delivering products from its newly formed Embedded Systems Business Unit, targeting graphics intensive embedded system designs and small format computing solutions for a wide range of applications. SAPPHIRE Technology is a leading manufacturer and global supplier of a broad range of innovative technologies for PC enthusiasts, home users and professionals. The company was first formed over a decade ago as a manufacturer and global supplier of state-of-the-art graphics add-in boards, for which it is now recognized as a premier AMD add-in graphics board partner for both consumer and professional products. The company's extensive product line has grown to include motherboards, mini PCs and Professional AV products.

Eurocom is adding MXM 3.0b and MXM 3.0a graphics modules to its line of available Graphics Processing products. The addition of the VGA cards in single and dual (SLI, CrossFire) configurations gives Eurocom customers a complete choice of video processor options to fit any requirement and configure into their new Eurocom system. Eurocom has been a leader in integrating MXM technology into systems since its creation, in fact, Eurocom introduced upgradeable / modular VGA in 1990, predating MXM specifications - in the 3300A and 3500 models.

Modular graphics solutions are ideal for high performance desktop replacement laptops and mobile workstations, embedded systems, SFF (Small Form Factor) PC and CUDA developers that require high performance GPUs. Eurocom offers a complete line of fully configurable Notebooks, Mobile Workstations and Mobile Servers; from VGA to storage, from RAM to Processor, nearly everything can be configured to the application and performance requirements of the individual user.

Innodisk, a designer and manufacturer of SSDs for commercial and industrial applications, announces a release of the industrial-embedded industry's first SATA device in accordance to SATA µSSD standards - nanoSSD.

Through the integration of a control chip, flash memory and peripheral power components into a single ball grid array (BGA) package, Innodisk has managed to reduce the size of the nanoSSD to approximately 1% the size of a 2.5" SSD. With dimensions of only 16 x 20 x 2 mm (WxLxH), a weight of only 1.5g, SATA III support, capacities ranging from 4 to 64 GB and both x86 and ARM compatibility, nanoSSD can be incorporated into a wide variety of applications where a small form-factor and high transfer rates are important, including industrial mobile devices, embedded systems, tablets, high-end smart phones and Ultrabooks.

Advantech, a global embedded platform manufacturer, today unveiled the new ASMB-822I server-grade motherboard powered by Intel Xeon processor E5-2600 family technology. This new technology comprises 64-bit multi-core processors, PCI Express Gen3 high speed communications, and DDR3 memory with total capacity up to 96GB. ASMB-822I is perfect designed for high performance demands such as NVR, DVR and also target to video wall, video conferencing, surveillance and other mission-critical applications.

"Advantech is committed to providing a full spectrum of embedded systems with advanced and intelligent built-in technology, from fanless and ruggedized to high-performance solutions," said Linda Tsai,Director of Advantech Embedded Systems Group. The ASMB-822I is an ATX server board equipped with LGA 2011 Intel Xeon processor E5-2600 series and Intel C602J series chipset. It supports six DDR3 registered DIMM slots for a 96 GB total capacity and dual GbE LANs using Intel controllers.

AMD today announced that the newly launched Gizmo board, a low-cost board geared toward x86-based embedded system development available from GizmoSphere, is powered by an AMD Embedded G-Series Accelerated Processing Unit (APU). Gizmo is a 4-inch by 4-inch x86 development board that can run a variety of operating systems including Android, Linux, RTOSes and Windows. AMD is a founding member of GizmoSphere, a not-for-profit organization whose collective goal is to drive and enable technology projects of interest to independent developers, with a focus on stimulating and encouraging innovation around multicore heterogeneous computing using APUs.

The Gizmo board includes the G-T40E dual-core processor running at 1.0 GHz, combined on a single die with AMD Radeon HD 6250 discrete-class graphics. The board provides a performance capacity of 52 gigaFLOPS (GFLOPS) at less than 10 watts. Custom high- and low-speed edge connectors enable a full range of functions. This unprecedented level of integration between serial and parallel processing offers a power-efficient foundation for high-performance multimedia content delivery across a broad range of embedded designs such as digital signage, x86 set-top box (xSTB), IP-TV, thin client, information kiosk, point-of-sale, casino gaming, media servers and industrial control systems.

Buffalo launched a new line of SSDs that incorporate MRAM (magnetic random access memory) caches. The caches provide increase tolerance to power loss, and momentarily hold data that's being transacted between the drive and the host, which buys the controller some time to prevent data loss, when the power goes down. Pictures suggest that Buffalo could have SSDs in both SATA and IDE flavors. So far, MRAM cache is the only distinctive feature of a new line of SSDs Buffalo is working on, which it will unveil a little later, at the Embedded Systems Expo (ESEC) 2012.

Today at Embedded Systems Conference East, AMD introduced the AMD Radeon E6460 discrete graphics processor as AMD's next generation entry-level embedded graphics processor, complementing the previously announced AMD Radeon E6760. With support for up to four simultaneous displays and more than double the 3D graphics performance of the ATI Radeon E2400 GPU1, the AMD Radeon E6460 GPU sets a new bar for features and performance in an entry-level embedded GPU. With five years of planned supply availability and with the graphics memory included in the same package, the AMD Radeon E6460 GPU delivers the longevity, small footprint, and ease of design demanded by embedded system designers.

"The AMD Radeon E6460 GPU provides the high value, small footprint, and long supply demanded by embedded customers," said Richard Jaenicke, director of Embedded Client Business for AMD. "With a footprint-compatible subset of the high-performance AMD E6760 GPU, the new AMD Radeon E6460 GPU enables broadly scalable graphics and multimedia performance in a single board design."

Today at Embedded Systems Conference Silicon Valley 2011, AMD introduced the AMD Radeon E6760 embedded discrete graphics processor. Available now, the AMD Radeon E6760 GPU is the first of its kind to offer embedded system designers the combination of OpenCL support along with support for six independent displays.

"The AMD Radeon E6760 GPU provides customers with superior business economics through long lifecycle management and product stability," said Richard Jaenicke, director of Embedded Client Business for AMD. "Embedded system designers faced with power and density constraints now have a solution that delivers the advanced 3D graphics and multimedia features they require in this performance-driven market."

AMD today announced immediate availability of the new AMD Embedded G-Series processor, the world's first and only Accelerated Processing Unit (APU) for embedded systems. The AMD Embedded G-Series, based on AMD Fusion technology, delivers a complete, full-featured embedded platform and incorporates the new low-power, x86 CPU based on the "Bobcat" core with a world-class DirectX 11-capable GPU and parallel processing engine on a single piece of silicon.

"AMD's commitment is to ensure the game-changing technologies we develop for consumers and the enterprise are also available for the vast and growing embedded market," said Patrick Patla, corporate vice president and general manager, Server and Embedded Division, AMD. "Today, we have a record number of embedded launch partners. They are using the unique advancements of the AMD Embedded G-Series APU to develop a brand new generation of highly differentiated, energy-efficient, small form-factor embedded systems that can deliver the vivid visual experience expected in our always-connected world."

At Embedded Systems Conference today, AMD announced two new complete platforms for the embedded market, the compact ASB2 platform and the high-performance AM3 platform, that offer myriad combinations of power and performance with up to 74 percent improvement in performance-per-watt over previous generations. AMD's new flexible embedded platforms consist of chipset and graphics solutions along with high-performance CPUs as low as 8W TDP for the ideal solution based on application requirements. System designers focusing on their next-generation products can see immediate benefits commonly associated with industry-standard x86 processors, including streamlined design and development, a large software ecosystem, and fast time-to-market.

"The barriers to widespread adoption of x86 in the broad embedded market have traditionally been a combination of power, price and the physical footprint of the silicon," said Buddy Broeker, director, Embedded Solutions Division, AMD. "AMD's embedded solutions have been steadily driving down those barriers while adding enterprise-class performance and features that may not have been readily available to designers in the past. Our commitment to the embedded market grows stronger as we look to a future introduction of AMD Fusion technology products into the embedded space."

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA AMOS-5000, a specially designed chassis kit for Em-ITX form factor boards such as the VIA EITX-3000, offering fast and easy assembly of a variety of fanless, robust IPC designs.

Built using only five sections the VIA AMOS-5000 has the VIA-developed Em-ITX at its heart, offering developers a wealth of advantages including rich and versatile I/O configurations through expansive dual I/O coastlines, coupled with a variety of expansion modules for wide variety of application specific I/O configurations and a flexible EMIO bus supporting a wide range of modern and legacy bus technologies. Systems build using the VIA AMOS-5000 are shock resistant and can withstand a wide range of temperatures.

AMD announced immediate availability of a new enterprise-class embedded platform based on the Quad-Core AMD Opteron processor and new AMD SR5690/SP5100 server chipset. Seven AMD Opteron processors in three power bands, in conjunction with the new low-power chipset, allow high-end embedded vendors to enable increased performance-per-watt for edge-of-network systems such as telecom/datacom, storage, and security servers, and routers and switches.

This comprehensive platform offers:

• increased performance enabled for virtualized and multithreaded embedded applications;
• enhanced NEBS-friendly thermal specification;
• single source for design and tight technology integration support among CPUs, chipsets and GPUs;
• compatibility between processor generations and 5 year component longevity to support long-life designs;
• a high-performance, low power chipset with PCIe 2.0, HyperTransport 3 technology and advanced AMD Virtualization (AMD-V) technology and AMD-P power management features.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the first expansion HD module for the VIA EPIA-P710, the VIA P710-HD. Featuring the powerful 4300E embedded graphics processor from S3 Graphics, this first Pico-I/O module for stackable Pico-ITXe boards delivers Hi-Def video playback and advanced graphics in an extremely low power, compact form factor.

With multiple display support including dual DVI and HDMI, the VIA P710-HD module opens up a new realm of possibilities to system integrators of multimedia intensive embedded applications. Sophisticated digital signage, arcade gaming, kiosk and POI applications can now take advantage of multiple digital display configurations and cutting edge Hi-Def playback of resolutions up to and beyond 1080p.

At the AMD Taiwan Embedded Forum this week, AMD announced a significant number of platform-stable, energy-efficient additions to its embedded roadmap. The high performance AMD Turion 64 X2 Dual-Core processors TL-56 and TL-62 can deliver the exceptional leading edge 64-bit application performance and low power requested by designers in the industrial control, digital signage and point-of-sale embedded markets, while the energy-efficient AMD Sempron processor 3700+ offers additional performance in a consistent and very low-power thermal envelope for value-based designs.