ASUS today announced its next-generation infrastructure solutions at SC24, unveiling an extensive server lineup and advanced cooling solutions, all designed to propel the future of AI. The product showcase will reveal how ASUS is working with NVIDIA and Ubitus/Ubilink to prove the immense computational power of supercomputers, using AI-powered avatar and robot demonstrations that leverage the newly-inaugurated data center. It is Taiwan's largest supercomputing facility, constructed by ASUS, and is also notable for offering flexible green-energy options to customers that desire them. As a total solution provider with a proven track record in pioneering AI supercomputing, ASUS continuously drives maximized value for customers.

To fuel digital transformation in enterprise through high-performance computing (HPC) and AI-driven architecture, ASUS provides a full line-up of server systems—ready for every scenario. ASUS AI POD, a complete rack solution equipped with NVIDIA GB200 NVL72 platform, integrates GPUs, CPUs and switches in seamless, high-speed direct communication, enhancing the training of trillion-parameter LLMs and enabling real-time inference. It features the NVIDIA GB200 Grace Blackwell Superchip and fifth-generation NVIDIA NVLink technology, while offering both liquid-to-air and liquid-to-liquid cooling options to maximize AI computing performance.

We know that NVIDIA's latest "Blackwell" GPUs are fast, but how much faster are they over the previous generation "Hopper"? Thanks to the latest MLPerf Training v4.1 results, NVIDIA's HGX B200 Blackwell platform has demonstrated massive performance gains, measuring up to 2.2x improvement per GPU compared to its HGX H200 Hopper. The latest results, verified by MLCommons, reveal impressive achievements in large language model (LLM) training. The Blackwell architecture, featuring HBM3e high-bandwidth memory and fifth-generation NVLink interconnect technology, achieved double the performance per GPU for GPT-3 pre-training and a 2.2x boost for Llama 2 70B fine-tuning compared to the previous Hopper generation. Each benchmark system incorporated eight Blackwell GPUs operating at a 1,000 W TDP, connected via NVLink Switch for scale-up.

The network infrastructure utilized NVIDIA ConnectX-7 SuperNICs and Quantum-2 InfiniBand switches, enabling high-speed node-to-node communication for distributed training workloads. While previous Hopper-based systems required 256 GPUs to optimize performance for the GPT-3 175B benchmark, Blackwell accomplished the same task with just 64 GPUs, leveraging its larger HBM3e memory capacity and bandwidth. One thing to look out for is the upcoming GB200 NVL72 system, which promises even more significant gains past the 2.2x. It features expanded NVLink domains, higher memory bandwidth, and tight integration with NVIDIA Grace CPUs, complemented by ConnectX-8 SuperNIC and Quantum-X800 switch technologies. With faster switching and better data movement with Grace-Blackwell integration, we could see even more software optimization from NVIDIA to push the performance envelope.

Today, Hewlett Packard Enterprise announces its new high performance computing (HPC) and artificial intelligence (AI) infrastructure portfolio that includes leadership-class HPE Cray Supercomputing EX solutions and two systems optimized for large language model (LLM) training, natural language processing (NLP) and multi-modal model training. The new supercomputing solutions are designed to help global customers fast-track scientific research and invention.

"Service providers and nations investing in sovereign AI initiatives are increasingly turning to high-performance computing as the critical backbone enabling large-scale AI training that accelerates discovery and innovation," said Trish Damkroger, senior vice president and general manager, HPC & AI Infrastructure Solutions at HPE. "Our customers turn to us to fast-track their AI system deployment to realize value faster and more efficiently by leveraging our world-leading HPC solutions and decades of experience in delivering, deploying and servicing fully-integrated systems."

Supermicro, Inc., a Total IT Solution Provider for AI, Cloud, Storage, and 5G/Edge, is accelerating the industry's transition to liquid-cooled data centers with the NVIDIA Blackwell platform to deliver a new paradigm of energy-efficiency for the rapidly heightened energy demand of new AI infrastructures. Supermicro's industry-leading end-to-end liquid-cooling solutions are powered by the NVIDIA GB200 NVL72 platform for exascale computing in a single rack and have started sampling to select customers for full-scale production in late Q4. In addition, the recently announced Supermicro X14 and H14 4U liquid-cooled systems and 10U air-cooled systems are production-ready for the NVIDIA HGX B200 8-GPU system.

"We're driving the future of sustainable AI computing, and our liquid-cooled AI solutions are rapidly being adopted by some of the most ambitious AI Infrastructure projects in the world with over 2000 liquid-cooled racks shipped since June 2024," said Charles Liang, president and CEO of Supermicro. "Supermicro's end-to-end liquid-cooling solution, with the NVIDIA Blackwell platform, unlocks the computational power, cost-effectiveness, and energy-efficiency of the next generation of GPUs, such as those that are part of the NVIDIA GB200 NVL72, an exascale computer contained in a single rack. Supermicro's extensive experience in deploying liquid-cooled AI infrastructure, along with comprehensive on-site services, management software, and global manufacturing capacity, provides customers a distinct advantage in transforming data centers with the most powerful and sustainable AI solutions."

Giga Computing, a subsidiary of GIGABYTE and an industry leader in generative AI servers and advanced cooling technologies, today announced new flagship GIGABYTE G593 series servers supporting direct liquid cooling (DLC) technology to advance green data centers using NVIDIA HGX H200 GPU. As DLC technology is becoming a necessity for many data centers, GIGABYTE continues to increase its product portfolio with new DLC solutions for GPU and CPU technologies, and for these new G593 servers the cold plates are made by CoolIT Systems.

G593 Series - Tailored Cooling
The GPU-centric G593 series is custom engineered to house an 8-GPU baseboard, and its design had foresight for both air and liquid cooling. The compact 5U chassis leads the industry in its readily scalable nature, fitting up to sixty-four GPUs in a single rack and supporting 100kW of IT hardware. This helps to consolidate the IT hardware, and in turn, decrease the data center footprint. The G593 series servers for DLC are in response to the rising customer demand for greater energy efficiency. Liquids have a higher thermal conductivity than air, so they can rapidly and effectively remove heat from hot components to maintain lower operating temperatures. And by relying on water and heat exchangers, the overall energy consumption of the data center is reduced.

ASUS today announced the latest marvel in the groundbreaking lineup of ASUS AI servers - ESC N8-E11, featuring the intensely powerful NVIDIA HGX H200 platform. With this AI titan, ASUS has secured its first industry deal, showcasing the exceptional performance, reliability and desirability of ESC N8-E11 with HGX H200, as well as the ability of ASUS to move first and fast in creating strong, beneficial partnerships with forward-thinking organizations seeking the world's most powerful AI solutions.

Shipments of the ESC N8-E11 with NVIDIA HGX H200 are scheduled to begin in early Q4 2024, marking a new milestone in the ongoing ASUS commitment to excellence. ASUS has been actively supporting clients by assisting in the development of cooling solutions to optimize overall PUE, guaranteeing that every ESC N8-E11 unit delivers top-tier efficiency and performance - ready to power the new era of AI.

Giga Computing, a subsidiary of GIGABYTE and an industry leader in generative AI servers and advanced cooling technologies, today added two new 8-GPU baseboard servers to the GIGABYTE G593 series that support the NVIDIA HGX H200, a GPU memory platform ideal for large AI datasets, as well as scientific simulations and other memory-intensive workloads.

G593 Series for Scale-up Computing in AI & HPC
With dedicated real estate for cooling GPUs, the G593 series achieves stable, demanding performance in its compact 5U chassis with high airflow for incredible compute density. Maintaining the same power requirements as the air-cooled NVIDIA HGX H100-based systems, the NVIDIA H200 Tensor Core GPU optimally pairs with the road-tested GIGABYTE G593 series server that is purpose-built for an 8-GPU baseboard. To alleviate the memory bandwidth constraints on AI, including AI inference, the NVIDIA H200 GPU offers a sizable increase in memory capacity and bandwidth compared to the NVIDIA H100 Tensor Core GPU. The H200 GPU has up to 141 GB of HBM3e memory and 4.8 TB/s of memory bandwidth, translating to a 1.7X increase in memory capacity and 1.4X increase in throughput.

The full-stack NVIDIA accelerated computing platform has once again demonstrated exceptional performance in the latest MLPerf Training v4.0 benchmarks. NVIDIA more than tripled the performance on the large language model (LLM) benchmark, based on GPT-3 175B, compared to the record-setting NVIDIA submission made last year. Using an AI supercomputer featuring 11,616 NVIDIA H100 Tensor Core GPUs connected with NVIDIA Quantum-2 InfiniBand networking, NVIDIA achieved this remarkable feat through larger scale - more than triple that of the 3,584 H100 GPU submission a year ago - and extensive full-stack engineering.

Thanks to the scalability of the NVIDIA AI platform, Eos can now train massive AI models like GPT-3 175B even faster, and this great AI performance translates into significant business opportunities. For example, in NVIDIA's recent earnings call, we described how LLM service providers can turn a single dollar invested into seven dollars in just four years running the Llama 3 70B model on NVIDIA HGX H200 servers. This return assumes an LLM service provider serving Llama 3 70B at $0.60/M tokens, with an HGX H200 server throughput of 24,000 tokens/second.

ASRock Rack Inc., the leading innovative server company, today is set to showcase a comprehensive range of servers for diverse AI workloads catering to scenarios from the edge, on-premises, and to the cloud at booth #1737 at SC 23 held at the Colorado Convention Center in Denver, USA. The event is from November 13th to 16th, and ASRock Rack will feature the following significant highlights:

At SC 23, ASRock Rack will demonstrate the NVIDIA-Qualified 2U4G-GENOA/M3 and 4U8G series GPU server solutions along with the NVIDIA H100 PCIe. The ASRock Rack 4U8G and 4U10G series GPU servers are able to accommodate eight to ten 400 W dual-slot GPU cards and 24 hot-swappable 2.5" drives, designed to deliver exceptional performance for demanding AI workloads deployed in the cloud environment. The 2U4G-GENOA/M3, tailored for lighter workloads, is powered by a single AMD EPYC 9004 series processor and is able to support four 400 W dual-slot GPUs while having additional PCIe and OCP NIC 3.0 slots for expansions.

Supermicro, Inc., a Total IT Solution Provider for AI, Cloud, Storage, and 5G/Edge, is expanding its AI reach with the upcoming support for the new NVIDIA HGX H200 built with H200 Tensor Core GPUs. Supermicro's industry leading AI platforms, including 8U and 4U Universal GPU Systems, are drop-in ready for the HGX H200 8-GPU, 4-GPU, and with nearly 2x capacity and 1.4x higher bandwidth HBM3e memory compared to the NVIDIA H100 Tensor Core GPU. In addition, the broadest portfolio of Supermicro NVIDIA MGX systems supports the upcoming NVIDIA Grace Hopper Superchip with HBM3e memory. With unprecedented performance, scalability, and reliability, Supermicro's rack scale AI solutions accelerate the performance of computationally intensive generative AI, large language Model (LLM) training, and HPC applications while meeting the evolving demands of growing model sizes. Using the building block architecture, Supermicro can quickly bring new technology to market, enabling customers to become more productive sooner.

Supermicro is also introducing the industry's highest density server with NVIDIA HGX H100 8-GPUs systems in a liquid cooled 4U system, utilizing the latest Supermicro liquid cooling solution. The industry's most compact high performance GPU server enables data center operators to reduce footprints and energy costs while offering the highest performance AI training capacity available in a single rack. With the highest density GPU systems, organizations can reduce their TCO by leveraging cutting-edge liquid cooling solutions.

GIGABYTE Technology, Giga Computing, a subsidiary of GIGABYTE and an industry leader in high-performance servers, server motherboards, and workstations, continues to be a leader in cooling IT hardware efficiently and in developing diverse server platforms for Arm and x86 processors, as well as AI accelerators. At SC23, GIGABYTE (booth #355) will showcase some standout platforms, including for the NVIDIA GH200 Grace Hopper Superchip and next-gen AMD Instinct APU. To better introduce its extensive lineup of servers, GIGABYTE will address the most important needs in supercomputing data centers, such as how to cool high-performance IT hardware efficiently and power AI that is capable of real-time analysis and fast time to results.

Advanced Cooling
For many data centers, it is becoming apparent that their cooling infrastructure must radically shift to keep pace with new IT hardware that continues to generate more heat and requires rapid heat transfer. Because of this, GIGABYTE has launched advanced cooling solutions that allow IT hardware to maintain ideal performance while being more energy-efficient and maintaining the same data center footprint. At SC23, its booth will have a single-phase immersion tank, the A1P0-EA0, which offers a one-stop immersion cooling solution. GIGABYTE is experienced in implementing immersion cooling with immersion-ready servers, immersion tanks, oil, tools, and services spanning the globe. Another cooling solution showcased at SC23 will be direct liquid cooling (DLC), and in particular, the new GIGABYTE cold plates and cooling modules for the NVIDIA Grace CPU Superchip, NVIDIA Grace Hopper Superchip, AMD EPYC 9004 processor, and 4th Gen Intel Xeon processor.

NVIDIA today announced it has supercharged the world's leading AI computing platform with the introduction of the NVIDIA HGX H200. Based on NVIDIA Hopper architecture, the platform features the NVIDIA H200 Tensor Core GPU with advanced memory to handle massive amounts of data for generative AI and high performance computing workloads.

The NVIDIA H200 is the first GPU to offer HBM3e - faster, larger memory to fuel the acceleration of generative AI and large language models, while advancing scientific computing for HPC workloads. With HBM3e, the NVIDIA H200 delivers 141 GB of memory at 4.8 terabytes per second, nearly double the capacity and 2.4x more bandwidth compared with its predecessor, the NVIDIA A100. H200-powered systems from the world's leading server manufacturers and cloud service providers are expected to begin shipping in the second quarter of 2024.