PowerColor teased its first Radeon RX Vega series graphics card, under its flagship Red Devil branding. The company could use this common board design for both RX Vega 64 and RX Vega 56 SKUs. It combines a custom-design, triple-slot, triple-fan cooling solution, with a semi-custom design PCB. The cooler is an upscale of the company's RX 580 Red Devil, with a massive 2.5-slot thick aluminum fin-stack heatsink, which draws heat from the "Vega 10" GPU and a base-plate conveying heat from the VRM MOSFETs surrounding it, ventilated by a trio of 100 mm fans.

PowerColor's PCB for this card is a variation of AMD's reference "Vega 10" board, in that it's slightly taller towards the front. The company went with two each of DisplayPort and HDMI connectors, instead of the standard three DP + one HDMI layout. The VRM is the same 12-phase setup from the reference-design PCB, with PowerColor sticking to International Rectifier IR6894 and IR6211DirectFETs, and IR3598 phase-doublers, while customizing the chokes. The PCB is enlarged height-wise to give easy access to the BIOS switch. Two inverted 8-pin PCIe power inputs are located toward the end. Given how heavily this board is based on the reference PCB, it remains to be seen if fan idle-power off is featured. PowerColor is expected to launch the RX Vega 64 Red Devil and RX Vega 56 Red Devil before Holiday.

Here are some of the first detailed pictures of XFX Radeon RX 480 Double Dissipation graphics card. The card combines a custom-design PCB with a meaty custom cooling solution by the company, to support factory-overclocked speeds and overclocking headroom further still. The cooling solution, from which the card derives its name, features two aluminium fin-stacks, to which heat drawn from a copper base is conveyed by four 6 mm-thick copper heat pipes, and ventilated by a pair of 90 mm spinners.

These fans can be detached from the cooler without needing any tools, and without even having to detach the cooler shroud. A back-plate finishes off the cooling solution. The PCB draws power from a single 8-pin PCIe power connector, and uses a 6-phase VRM with high-end International Rectifier DirectFETs to condition it for the GPU. The card features factory-overclocked speeds in excess of 1300 MHz. The card features 8 GB of memory. Display outputs include a DVI connector, besides three DisplayPort 1.4 and one HDMI 2.0b. XFX could launch the card later this week.

GIGABYTE TECHNOLOGY Co. Ltd., a leading manufacturer of motherboards and graphics cards is proud to announce today the addition of 4 new high performance motherboards to their comprehensive Intel X99 chipsets offering with the X99 Champion series. The new motherboards consist of the X99-Gaming 5P, X99-UD4P, X99-UD3P and the already famous X99-SOC Champion.

DDR4 memory modules are available at a stock frequency of 2133 MHz, but memory vendors encode XMP profiles which can automatically modify the frequency and timings of the supported memory modules to work in par with your CPU. With the X99 Champion Series, GIGABYTE is offering a tested and proven platform that ensures proper compatibility with profiles up to 3200 MHz, and exclusively 3400 MHz for the X99-SOC Champion.

GIGABYTE TECHNOLOGY Co. Ltd., a leading manufacturer of motherboards and graphics cards is hosting a press conference today to launch two new products, the GIGABYTE X99-SOC Champion motherboard as well as a new GIGABYTE BRIX compact PC built around the new 5th Gen Intel Core processors. Held at the Neopolitan Ballroom of the Caesars Palace in Las Vegas, USA, the press event also includes a live overclocking demonstration where the new motherboard will be put to the test by GIGABYTE's evangelist overclockers HiCookie, Sofos1990 and Dinos22. Currently holding the highest DDR4 memory frequency World Record, the GIGABYTE X99-SOC Champion will be overclocked on Liquid Nitrogen to see if a new world record can be achieved live at the event.

From January 6th until the 8th, GIGABYTE will be showcasing their latest hardware solutions at the Neopolitan Ballroom of the Caesars Palace including 10 custom made demo systems especially for CES by system builders such as Cyberpower, iBuypower, Origin PC, Maingear, XOTIC PC, Falcon NW and Digital Storm. A few case mods will also be on display from renowned case modders Richard Surroz, Bob Stewart and Larry Andersen.

Here are some of the key slides from AMD's press-deck (presentation) for reviewers, for the Radeon R9 295X2 dual-GPU graphics card, ahead of its April 8 launch. The slides confirm specifications that surfaced earlier this week, which describe the card as bearing the codename "Vesuvius," having two 28 nm "Hawaii" GPUs, and all 2,816 stream processors on the chips being enabled, next to 176 TMUs, 64 ROPs, and 512-bit wide GDDR5 memory interfaces. Two such chips are wired to a PLX PEX8747 PCI-Express 3.0 x48 bridge chip. There's a total of 8 GB of memory on board, 4 GB per GPU. Lastly, clock speeds are revealed. The GPUs are clocked as high as 1018 MHz, and memory at 5.00 GHz (GDDR5-effective). The total memory bandwidth of the card is hence 640 GB/s.

The Radeon R9 295X2 indeed looks like the card which was pictured earlier this week, by members of the ChipHell tech community. It features an air+liquid hybrid cooling solution, much like the ROG ARES II by ASUS. The cooling solution is co-developed by AMD and Asetek. It features a couple of pump-blocks cooling the GPUs, which are plumbed with a common coolant channel running through a single 120 mm radiator+reservoir unit. A 120 mm fan is included. A centrally located fan on the card ventilates heatsinks that cool the VRM, memory, and the PCIe bridge chip.

PowerColor may have been the first AMD add-in board vendor to launch a custom-design Radeon R9 290X graphics card with its R9 290X LCS, which is basically an AMD reference PCB with a factory-fitted EKWB FC-R9-290X water-block; but its air-cooled non-reference cards have been nowhere in sight, until now. PowerColor posted these pictures of the Radeon R9 290X PCS+, its premium factory-overclocked and air-cooled graphics card based on AMD's flagship GPU. The company's Radeon R9 290 (non-X) PCS+ is expected to look identical.

Pictures reveal the card's PCB to be largely based on AMD's reference design, perhaps with variations on the choice of components. PowerColor has a knack of splurging on expensive, high-quality components on its PCBs (think International Rectifier and Coilworks VRM components, Samsung and SK Hynix memory chips, etc.), and we expect a similar treatment for the R9 290X PCS+. The two-slot cooling solution featured on this card is making its debut with it. It features a network of aluminium fin stacks to which heat is fed by copper heat pipes, and which are ventilated by a trio of 80 mm fans. PowerColor didn't reveal clock speeds, launch date, or pricing.

Gigabyte showed off an early version of its upcoming high-end socket LGA2011 motherboard, the G1.Assassin 3, at IDF. Based on the same Intel X79 Express chipset as its predecessor, this board is built in the standard ATX form-factor. It draws power from a combination of 24-pin ATX and 8-pin EPS connectors. It uses a 9-phase VRM to condition power to the CPU socket, which uses PowIRstage driver-MOSFETs by International Rectifier. The CPU socket is wired to eight DDR3 DIMM slots, supporting up to 64 GB of memory, and four PCI-Express 3.0 x16 slots. A couple of PCI-Express 2.0 x1 slots complete the expansion area.

Storage connectivity on the G1.Assassin 3 includes four each of SATA 6 Gb/s and SATA 3 Gb/s ports. Network connectivity includes two gigabit Ethernet interfaces, from which one is driven by an Intel-made controller, and an add-on card with 802.11ac WLAN, and Bluetooth 4.0. A hyped up feature here is its Creative Sound Core3D audio, with a high SNR DAC, audiophile-grade OPAMP circuitry with user-replaceable amps (Gigabyte calls this AMP-UP). Six USB 3.0 ports, and a number of USB 2.0/1.1 ports make for the rest of it. Gigabyte didn't finalize heatsink designs for the VRM or PCH, and there's no word on when exactly the company plans to launch the thing.

MSI, world renowned graphics card and motherboard manufacturer, has officially announced the release of the GeForce GTX 780 LIGHTNING. This product uses the new exclusive Triple Force Architecture and is equipped with a Triple Level signals LED. The card, from the inside out, represents the next revolution thermal design. The combined power of the Twin BIOS and the card's Enhanced Power Design equip gamers and extreme overclockers with the best graphics card. This superior performance is accompanied by a 20-phase power design that can unlock the limitless potential of the graphics card. Also featuredis the patented GPU Reactor powered back plate design which filters power supply noise and improves overclocking stability.

The MSI GeForce GTX 780 LIGHTNING is built using Military Class 4 components that have passed rigorous certification testing in laboratories. With such powerful components, this graphics card is guaranteed to have an impressive service life and excellent overclocking stability. Additionally, the popular 3x3 OC Kits allow for gamers to effectively monitor the status of the graphics card. MSI products are renowned for leading the industry due to the company's innovative R&D, excellent performance, streamlined thermal design, and quality components and software. The MSI GeForce GTX 780 LIGHTNING is once again the most powerful graphics card.

Ahead of its launch, pictures of MSI's GeForce GTX 780 Lightning graphics cards were leaked to the web by HardwareZone (now redacted), and reposted by WCCFTech. Pictures reveal never before seen PCB and cooler designs. To begin with, MSI is using a brand new cooling solution called TriFrozr. It combines a large compound dual fin-stack heatsink, to which heat is fed by seven 8 mm-thick heat pipes, with an array of three fans, two larger 100 mm ones on the edges, and a smaller 70 mm one in the center. The fans feature independent control system, which lets you tweak speeds of individual fans, over software. An LED-lit badge doubles up as a GPU load indicator. A swanky back-plate lines the reverse side.

Under this elaborate cooling solution is a brute of a PCB. Drawing power from a pair of 8-pin PCIe power connectors, the custom-design PCB by MSI features a 20-phase digital PWM voltage regulation, which use a combination of high current chokes, International Rectifier PowIRstage, DirectFET chips, tantalum capacitors, and MSI's GPU Reactor module that cuts out electrical noise. The GPU is wired to 7 GT/s rated Elpida-branded memory chips, and three (that's right, three) GPU BIOS ROMs. One stores a failsafe reference BIOS, another factory-OC air BIOS, and one that primes the GPU for liquid-nitrogen cooling-assisted overclocking. MSI is expected to launch the GTX 780 Lightning on August 28, 2013, priced around $800.

ZOTAC launched its premium GeForce GTX 770 Extreme Edition SKU in the Greater China region. The SKU outranks AMP!, and offers a suite of enthusiast features, such as a strong VRM, and better air cooling. It's not unlike the GTX 680 Extreme Edition or GTX 670 Extreme Edition. To begin with, the GTX 770 Extreme Edition features a slightly updated Gamer Force cooler, with higher aluminum fin density for the GPU heatsink, and a chunkier metal heatsink to cool the VRM. A back-plate cools components on the reverse side of the PCB.

The GTX 770 Extreme Edition features the same exact PCB as its predecessor, featuring a 12-phase (8+3+1) VRM, which makes use of noise-free chokes, a combination of conductive polymer and tantalum capacitors, three proadlizers (multi-phase capacitors for power conditioning), and International Rectifier PowIRstage driver-MOSFETs. A combination of CHiL CHL8318 (8-phase) and CHL 8214-03 (4-phase) chips are used to run the VRM. The main heatsink uses a copper base (not vapor-chamber) to make contact with the GPU, from which five 8 mm-thick nickel-plated copper heat pipes sprout out, transporting heat to the far-reaches of the heatsink. A pair of 92 mm PWM-controlled fans ventilate the heatsink, which are held by a sporty aluminum shroud.

In addition to the G1.Sniper A85X, GIGABYTE also showed off what could go on to become an HTPC builder favorite, the F2A85XN-WiFi mini-ITX motherboard. The board draws power from conventional 24-pin ATX + 4-pin ATX connectors, and uses a 6-phase VRM to power the APU. Built with the Ultra Durable 4 Plus construction, the board uses high-grade PowIRstage driver-MOSFETs and VRM controllers, made by International Rectifier. The FM2 socket is wired to two DDR3 DIMM slots, supporting up to 32 GB of dual-channel DDR3-2133 MHz memory, and a PCI-Express 2.0 x16 slot. On the connectivity front, the F2A85XN-WiFi offers four SATA 6 Gb/s ports, four USB 3.0 ports, dual-link DVI and two HDMI display outputs, 8-channel HD audio, gigabit Ethernet, 802.11 b/g/n WiFi, Bluetooth 4.0, and a number of USB 2.0/1.1 ports.

At a media event held in its Taipei headquarters, GIGABYTE demonstrated its AMP-UP integrated audio solution that will feature on some of its upcoming motherboards. On that pretense, it even got to show of two of its top socket LGA1150 motherboards, built for Core "Haswell" processors, the G1.Sniper 5, and the G1.Sniper M5. Positioned in gamer-overclocker targeted G1.Killer series, the two boards are based on Intel Z87 Express chipset. The G1.Sniper 5 is the larger standard ATX motherboard; while the M5 is a compact micro-ATX offering. The pictures also confirm that socket LGA1150 retention module and bolt-spacing is identical to sockets LGA1155 and LGA1156.

The G1.Sniper 5 appears to feature a 16-phase VRM, which uses ferrite-core chokes, and the same International Rectifier PowIRstage components as Ultra Durable 5 motherboards from the previous generation. This time around, the CPU plays a greater role in voltage regulation. The driver-MOSFETs on the board are cooled by an active fan-heatsink, which also has a liquid channel running through it, so you could make it part of your CPU loop. Thankfully GIGABYTE didn't let its imagination run away with designs of the other heatsinks on the board, one of which cools the Z87 Express chipset, and the other we imagine, a PLX PEX8747 48-lane PCI-Express 3.0 bridge chip. This chip gets you 4-way SLI/CrossFireX support.

With NVIDIA clamping restrictions on graphics card makers' ability to make custom design PCBs for its flagship GeForce GTX TITAN GPU, the likes of GIGABYTE are opting for the next best thing - creating accessories that enthusiasts can mod their GTX TITAN graphics cards with, at the cost of product warranties. A little earlier this month, the company unveiled its WindForce 450W VGA cooler, which is capable of handling GTX TITAN. At a more recent event, it showed of G-Power, a supplementary voltage regulation module, which is similar in principle to EVGA EPower and ASUS Matrix PWM.

The device is a small PCB with high-capacity power leads on one-end, which need to be soldered on to the reference GeForce GTX TITAN PCB, and a combination of 24-pin ATX and 8-pin EPS connectors on the other. Between them is a 6+1 phase VRM, with components that appear similar to the ones used on GIGABYTE Ultra Durable 5 motherboards, consisting of 60A ferrite core chokes, International Rectifier PowIRstage IR3550 driver-MOSFETs, and International Rectifier IR3563A controller. The G-Power module stabilizes power on the GTX TITAN PCB, preventing voltage droop from breaking the overclock. There's no word on how GIGABYTE plans to sell these.

GIGABYTE TECHNOLOGY Co. Ltd., a leading manufacturer of motherboards and graphics cards, today announced the GIGABYTE Classic Challenge, its latest overclocking competition hosted on HWBOT.org. Open until August 15th 2012, the GIGABYTE Classic Contest combines two classic stages, great prizes and a small twist.

Overclockers are asked to compete on two classic benchmarks 3DMark 01 and Super Pi 32M with a GIGABYTE X79S-UP5 motherboard and a GIGABYTE X79-UP4 up for grabs. The twist? Simple. If one entrant has the raw talent to claim both stages, GIGABYTE will also award a bonus prize of a forthcoming GIGABYTE F2A85X-UP4.

ZOTAC seems to have a 2-pronged approach to the GeForce GTX 670, depending on the region it's being sold in. While it took advantage of the compact reference PCB by NVIDIA to come up with the space-saving GTX 670 TwinCooler (ZTGTX670-2GD5TCR001), it did the exact with the GTX 670 Extreme Edition. The card is based on the same exact design as the GTX 680 Extreme Edition, down to its lavish voltage regulation circuitry, with just the GTX 670 ASIC taking the place of the GTX 680.

The card ships with out of the box clock speeds of 1111 MHz (GPU base), 1202 MHz (GPU Boost), and 1652 MHz (memory actual), or 6.60 GHz (memory effective). It draws power from 6-pin and 8-pin PCIe power connectors, and conditions power using a 13-phase VRM that consists of noise-free chokes and PowIRstage DrMOS chips by International Rectifier. Power is further conditioned by a trio of multi-phase FPCAPs, and tantalum capacitors. Like the GTX 680 Extreme Edition, the card features the entire overclocker-friendly feature-set, including OC+ Module, dual-BIOS with LN2-friendly BIOS, voltage measurement points, temperature and phase loading LEDs.

It's good to see GIGABYTE back to doing high-end motherboards with overkill CPU power designs. Its latest creation, the Z77X-UP7, was shown to sections of the media, at a private exhibition, ahead of Computex. The Z77X-UP7 is the company's first motherboard to feature its Ultra Durable 5 motherboard construction technology, which is basically Ultra Durable 4 augmented with higher current 60A chokes, and International Rectifier PowIRStage IR3550 ICs (a highly potent driver-MOSFET implementation). The Z77X-UP7 is based on the Intel Z77 Express chipset, and supports Core "Ivy Bridge" and "Sandy Bridge" processors in the LGA1155 package.

GIGABYTE TECHNOLGY Co. Ltd., a leading manufacturer of motherboards and graphics cards, today introduced their latest Ultra Durable 5 technology, featuring a range of high current capable components including the industry's highest rated 60A IR3550 PowIRstage ICs that provide the best quality power delivery to the CPU for record-breaking performance, cool and efficient operation and extended motherboard lifespan.

GIGABYTE is yet again raising the bar of motherboard quality and durability with their Ultra Durable 5 technology, which includes high current capable components for the CPU power zone including the highest rated and awarded IR3550 PowIRstage ICs from International Rectifier, 2X Copper PCB and high current Ferrite Core Chokes rated up to 60A which together are able to deliver up to 60°C* cooler temperatures than traditional motherboards. Featured on a range of new motherboards based the Intel X79 and Z77 Express Chipsets, GIGABYTE Ultra Durable 5 technology is the next evolution in quality motherboard design.