MiTAC Computing Technology Corp., a subsidiary of MiTAC Holdings Corp. and a global leader in server design and manufacturing, will showcase its latest AI and HPC innovations at Supercomputing Asia 2025, taking place from March 11 at Booth #B10. The event highlights MiTAC's commitment to delivering cutting-edge technology with the introduction of the G4520G6 AI server and the TN85-B8261 HPC server—both engineered to meet the growing demands of artificial intelligence, machine learning, and high-performance computing (HPC) applications.

G4520G6 AI Server: Performance, Scalability, and Efficiency Redefined
The G4520G6AI server redefines computing performance with an advanced architecture tailored for intensive workloads. Key features include:

• Exceptional Compute Power- Supports dual Intel Xeon 6 Processors with TDP up to 350 W, delivering high-performance multicore processing for AI-driven applications.
• Enhanced Memory Performance- Equipped with 32 DDR5 DIMM slots (16 per CPU) and 8 memory channels, supporting up to 8,192 GB DDR5 RDIMM/3DS RDIMM at 6400 MT/s for superior memory bandwidth.

Netlist, Inc. today announced that it won a $118 million damages award against Samsung Electronics Co., LTD., Samsung Electronics America, Inc., and Samsung Semiconductor, Inc. (together "Samsung") in the United States District Court for the Eastern District of Texas. The award resulted from a jury trial which involved three Netlist patents: U.S. Patent Nos. 7,619,912, 11,093,417 and 10,268,608. The infringing products were all Samsung DDR4 RDIMMs and DDR4 LRDIMMs. Netlist filed the complaint against Samsung in August 2022.

The federal jury's unanimous verdict confirmed that all three Netlist patents had been infringed by Samsung, that none of the patents were invalid, that Samsung willfully infringed those patents, and that money damages were owed to Netlist for the infringement of all three patents.

Montage Technology, a leading data processing and interconnect IC company, today announced that it has taken the lead in the trial production of 1st-generation DDR5 Clock Driver (CKD) chips for next-generation client memory. This new product aims to enhance the speed and stability of memory data access to match the ever-increasing CPU operating speed and performance.

Previously, clock driver functionality was integrated into the Registering Clock Driver (RCD) chips used on server RDIMM or LRDIMM modules, not deployed to the PCs. In the DDR5 era, as data rates climb 6400 MT/s and above, the clock driver has emerged as an indispensable component for client memory.

At this year's Hot chips 33 conference, Samsung has presented its works on the upcoming DDR5 memory standard. The company has managed to achieve a lot of new developments, as the newer standard pairs with new technologies to deliver higher speeds and better capacity. The Korean company designed its DDR5 modules as 8-high (8H) stacked TSV (through silicon via) dies. In the previous DDR4 implementations, Samsung used 4-high (4H) stacked TSV dies, which are actually thicker than the latest 8-high implementations. To achieve the new thin design, Samsung has used thin wafer handling techniques, which resulted in a 40% reduction in gab between stacked dies. The new 8H DDR5 modules are only 1.0 mm thick, compared to the 1.2 mm of the older 4H modules.

When it comes to performance, Samsung expects the new DDR5 modules to deliver big. Running at 7.2 Gbps speeds, the Samsung-made RDIMM/LRDIMM modules can reach up to 512 GB in capacity. This is, of course, limited to the server/enterprise market. Regular consumers/PC users can expect to have UDIMMs with up to 64 GB of capacity. The aforementioned 7.2 Gbps speed is achieved at the specified 1.1 Volts of power, meaning that Samsung's implementation is very efficient. According to some estimations made by the company, the DDR5 crossover for the mainstream market is not expected before 2023/2024, meaning that there is still a lot of time for memory makers to refine their DDR5 products.

The leading global motherboard, manufacturer, ASRock, is proud to announce its Intel C621A powered workstation motherboards, the C621A WS, this motherboard is able to pair with the latest Xeon W-3300 processors, giving ultimate performance for almost every application such as content creating, rendering machine and high-end workstation.

The ASRock C621A WS is a platform solely built for workstation application from ground up, the 4 PCIe 4.0 x16, 3 PCIe 4.0 x8 on this motherboard supports up to 4 dual-slot GPU/FPGA cards, perfect for Deep learning workstation, Visual computing such as 3D design and creation. The motherboard has 8 DIMM slots running at 1 DIMM per channel mode giving ultimate stability and performance, supporting DDR4 RDIMM, LRDIMM, and Intel Optane Persistent Memory in order to maximize the system capability.

Today, AMD (NASDAQ: AMD) announced the full portfolio of AMD Ryzen 5000 Series Mobile Processors, bringing the highly-efficient and extremely powerful "Zen 3" core architecture to the laptop market. New AMD Ryzen 5000 Series Mobile Processors provide unprecedented levels of performance and incredible battery life for gamers, creators, and professionals. New laptops powered by Ryzen 5000 Series Mobile processors will be available from major PC manufacturers including ASUS, HP and Lenovo, starting in Q1 2021. Expanding its leadership client computing product portfolio featuring the "Zen 3" core, AMD also announced the AMD Ryzen PRO 5000 Series Mobile Processors, delivering enterprise-grade security and seamless manageability to commercial users. Throughout the course of 2021, AMD expects a broad portfolio of more than 150 consumer and commercial notebooks based on the Ryzen 5000 Series Mobile Processors.

"As the PC becomes an even more essential part of how we work, play and connect, users demand more performance, security and connectivity," said Saeid Moshkelani, senior vice president and general manager, Client business unit, AMD. "The new AMD Ryzen 5000 Series Desktop and Mobile Processors bring the best innovation AMD has to offer to consumers and professionals as we continue our commitment to delivering best-in-class experiences with instant responsiveness, incredible battery life and fantastic designs. With our PC partners, we are delivering top-quality performance and no-compromise solutions alongside our record-breaking growth in the notebook and desktop space in the previous year."

Micron Technology, Inc., today announced a comprehensive enablement program which will provide early access to technical resources, products and ecosystem partners. The Technology Enablement Program will aid in the design, development and qualification of next-generation computing platforms that use DDR5, the most technologically advanced DRAM available.

Today's news builds on Micron's January announcement of DDR5 RDIMM samples and brings the industry one step closer to unlocking the value in next-generation, data-centric applications. Companies joining Micron in the DDR5 Technology Enablement Program include Cadence, Montage, Rambus, Renesas and Synopsys.

Today, AMD announced the new AMD Ryzen Threadripper PRO Processor line-up, with up to 64 cores and unrivaled bandwidth built with enterprise-grade AMD PRO technologies. Designed for professional workstations from OEMs and system integrators, AMD Ryzen Threadripper PRO Processors uniquely offer full spectrum compute capabilities with unmatched core counts for multi-threaded workloads plus high frequency single core performance for lightly threaded workloads. This combination makes AMD Ryzen Threadripper PRO Processors the best choice for artists, architects, engineers and data scientists.

"AMD Ryzen Threadripper PRO Processors are purpose-built to set the new industry standard for professional workstation compute performance," said Saeid Moshkelani, senior vice president and general manager, AMD Client business unit. "The extreme performance, high core counts and bandwidth of AMD Ryzen Threadripper Processors are now available with AMD PRO technology features including seamless manageability and unique built-in data protection. Even the most demanding professional environment is addressed with the new AMD Ryzen Threadripper PRO line-up, from artists and creators developing breathtaking visual effects, to architects and engineers working with large datasets and complex visualizations, all brought to life on the most advanced professional workstation platform in the world.

Videocardz seems to have snagged some official AMD slides detailing their upcoming Threadripper PRO lineup. AMD is tiering its Threadripper CPU offerings between the Threadripper and Threadripper PRO via added functionality that AMD considers is better suited to the prospective buyers of a PRO-branded Threadripper: professional studios, designers, engineers and data scientists. AMD's positioning for these creatives or scientists is to offer a much improved platform throughput compared to Threadripper: the PRO version supports up to 128 PCIe 4.0 lanes (64 in non-PRO); up to 2 TB of ECC memory support (either in UDIMM (Unbuffered DIMM), RDIMM (Registered DIMM), LRDIMM (Load-Reduced DIMM) and 3DS (three-dimensional stacking) RDIMM vi an 8-channel configuration (4-channel in non-PRO); as well as professional-oriented tools and features such as Pro Security, Pro manageability, and PRO business ready support.

Four different CPUs will reportedly be offered in the Threadripper PRO lineup: the 64-core 3995WX is a relatively known quantity by now; likewise, the 3975WX will mirror consumer parts core counts (32 cores), both with reduced clocks by 100-200 MHz compared to their non-PRO counterparts. AMD seems to also be launching 12 and 16-core PRO Threadrippers in the form of the 3955WX (16-core) and 3945WX (12-core), both with boost clocks being set to 4.3 GHz.

Samsung Electronics, Ltd., has taken its leadership position in the memory market a step further today by announcing support of the Samsung PM1733 PCIe Gen4 Solid State Drive (SSD) and high density RDIMM and LRDIMM dynamic random access memory (DRAM) for the AMD EPYC 7002 Generation Processors. AMD launched the 2nd Gen AMD EPYC processor in San Francisco yesterday.

"AMD has listened to the needs of its customers in developing the 2nd Gen AMD EPYC processors and has worked closely with us to integrate the best of our cutting-edge memory and storage products," said Jinman Han, senior VP of Memory Product Planning, Samsung Electronics. "With these new datacenter processors, AMD is providing customers with a processor that enables a new standard for the modern datacenter."

Crucial, a leading global brand of memory and storage upgrades, today announced the immediate availability of 128GB DDR4 LRDIMMs, a new offering in its server memory product portfolio. The 128GB DDR4 LRDIMM is the highest density server memory module that Crucial has offered to date, and with speeds starting at 2666 MT/s, the new DDR4 server memory modules increase the installed memory capacity per server to help maximize CPU and server hardware capabilities.

Memory-dependent server applications like virtualization, in-memory database computing, and high-performance computing (HPC) require massive amounts of available RAM. These new server modules support a number of memory-intensive computing applications, such as Microsoft SQL, Oracle, Microsoft Azure, VMware VDI, Cloudera, Hortonworks and SAP HANA. Additionally, each module is 100 percent component- and module-tested to mission-critical server standards, ensuring quality from start to finish through a 34-stage manufacturing process and more than 100 tests and verifications. For qualified customers, the 128 GB LRDIMM server modules are also backed by the Crucial Reliance Program.

In a response to AMD's current uptake in the consumer, HEDT and server markets with its vertical slice of the Zen architecture, Intel has started rebranding their products and image, changing product names and placement in a bid to increase the "freshness" factor of its offerings. E5 and E7 Xeons are gone, with the introduction of a metallic naming scheme: Bronze, Silver, Gold and Platinum are now Intel's Xeon products, and Xeon-W takes the spot as Intel's workstation-oriented product stack. They do this by being - essentially - a conversion of Intel's Core i9 X299 family of processors towards the professional market with inclusion of professional-geared features. And as is usual with Intel, a new chipset - C422 - is needed in order for these to properly function.

The new Xeon-W product family will still make use of the LGA 2066 socket, bringing with them ECC and vPro support. The Xeon-W CPU family will feature 4 to 18 cores, support up to 512GB of ECC RDIMM/LRDIMM memory, support dual 512-bit FMAs, and peak clocks of 4 GHz base and 4.5 GHz Turbo. All the parts will support 48 PCIe 3.0 lanes from the processor,and CPUs in the Xeon-W stack are rated at 140W TDP: with exception of the quad cores, which come in at at 120W. Xeon-W processors only support Turbo Boost 2.0, instead of their Core i9 counterparts' Turbo 3.0.

QNAP Systems, Inc. today announced the release of the powerful Double Server TDS-16489U that integrates an application server and storage server into one chassis. Distinguishably powered by dual Intel Xeon E5 processors with up to 1TB RAM, the server-grade TDS-16489U supports Qtier Technology, 12Gb/s SAS and 10GbE/40GbE networks to provide unrivaled performance for Big Data computing and to assist enterprises in mission-critical tasks as a one-device solution for applications, storage and virtualization.

"The TDS-16489U resolves the difficulty of building virtualization environment infrastructures for businesses," said David Tsao, Product Manager of QNAP. "Its unrivaled power from its dual processors also facilitates Big Data computing to process the data deluge created by Internet of Things applications." With its server-grade hardware design, the TDS-16489U features two Intel Xeon E5-2600 v3 processors (with 4-core, 6-core and 8-core configurations), up to 1TB DDR4 2133MHz RDIMM/LRDIMM RAM (16 DIMM) and three independent SAS 12Gb/s controllers that deliver outstanding performance for data transmission and applications.

Crucial, a leading global brand of memory and storage upgrades, today announced the availability of Crucial DDR4 2400MT/s 8Gb-based RDIMM, LRDIMM and ECC UDIMM server modules. Engineered to enable higher density modules, 8Gb-based DDR4 enables increased performance, bandwidth and energy efficiency. The modules are available for immediate purchase through select global channel partners and at www.crucial.com.

Higher-density, 8Gb-based modules allow for greater channel bandwidth and channel density and are also up to 20 percent more energy efficient than 4Gb-based modules. Ultimately, these benefits provide more value per gigabit than current 4Gb-based offerings, making it easy to scale up server deployments in the future. Designed for Intel's next generation processor product families, Crucial's 8Gb-based server memory is extensively tested to mission-critical standards and is backed by a limited lifetime warranty.

Samsung Electronics Co., Ltd., announced today that it is mass producing the industry's first "through silicon via" (TSV) double data rate-4 (DDR4) memory in 128-gigabyte (GB) modules, for enterprise servers and data centers. Following Samsung's introduction of the world-first 3D TSV DDR4 DRAM (64GB) in 2014, the company's new TSV registered dual inline memory module (RDIMM) marks another breakthrough that opens the door for ultra-high capacity memory at the enterprise level. Samsung's new TSV DRAM module boasts the largest capacity and the highest energy efficiency of any DRAM modules today, while operating at high speed and demonstrating excellent reliability.

"We are pleased that volume production of our high speed, low-power 128GB TSV DRAM module will enable our global IT customers and partners to launch a new generation of enterprise solutions with dramatically improved efficiency and scalability for their investment," said Joo Sun Choi, executive vice president, Memory Sales and Marketing, Samsung Electronics. "We will continue to expand our technical cooperation with global leaders in servers, consumer electronics and emerging markets, where consumers can benefit from innovative technology that enhances their productivity and the overall user experience."

Crucial, a leading global brand of memory and storage upgrades, is now sampling Crucial DDR4 2400MT/s 8Gb-based RDIMM, LRDIMM, and ECC UDIMM server modules through its Technology Enablement Program. Engineered to enable higher density modules, 8Gb-based DDR4 memory allows for increased performance, bandwidth, and energy efficiency.

Higher density modules, when combined with the next DDR4 speed increase of 2400MT/s, create greater channel bandwidth and channel density, as well as increased energy efficiency. Ultimately, these benefits provide more value per gigabit than current 4Gb-based offerings. Taken together, the increase in density, bandwidth, and value deliver a lower total cost of ownership for users.

Crucial, a leading global brand of memory and storage upgrades, has expanded its DDR4 memory portfolio with LRDIMM and VLP RDIMM modules. Designed to enable next-generation enterprise environments with increased speed, bandwidth, and energy efficiency, Crucial DDR4 load reduced DIMMs (LRDIMMs) and very low profile registered DIMMS (VLP RDIMMs) are available for immediate purchase through select global channel partners.

By utilising a memory buffer chip that helps reduce the electrical load presented to the memory bus, Crucial DDR4 LRDIMMs allow for more DIMMs per channel and are up to 50 percent more energy efficient and deliver up to 50 percent more memory bandwidth than DDR3 LRDIMMs. Furthermore, by using less voltage and standby current, Crucial DDR4 LRDIMMs transmit power in a more efficient manner to the CPU, allowing for additional power savings and lower total cost of ownership.

Micron Technology, Inc., one of the world's leading providers of advanced semiconductor solutions, today announced the introduction of a monolithic 8 Gb DDR3 SDRAM component, enhancing its leadership position as a diverse memory solutions provider for enterprise applications such as data analytics. This new design is based on Micron's latest-generation 25 nm DRAM manufacturing process.

DDR3 is the mainstream DRAM technology for the enterprise market, and the addition of an 8 Gb monolithic component will enable cost-effective, high-capacity solutions optimized to support large-scale, data-intensive workloads.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, said today that it is accelerating its production ramp up of DDR4 memory modules to accommodate an anticipated strong market demand along with the approaching introduction of the new Intel Xeon processor E5-2600 v3 product family. DDR4 is the most advanced memory for server and high-performance computing applications.

"At Samsung, we are taking the lead in readying the DDR4 market to coincide with the introduction of the next-generation Intel Xeon processor E5-2600 v3 product family, and plan to contribute to creating a bigger market for DRAM in the second half of 2014," said Jim Elliott, corporate vice president, Memory Marketing, Samsung Semiconductor, Inc. "We will continue to introduce high-density DDR4 modules for global OEMs that will facilitate the launch of next-generation enterprise servers and will maximize IT investment efficiency."

Crucial, a leading global brand of memory and server memory, today announced the 64 GB Crucial DDR3L Load-Reduced DIMMs (LRDIMMs) for servers, which enable more DIMMs per channel for up to twice the installed memory capacity per server. Additionally, these modules offer up to a 35 percent increase in memory bandwidth per server compared to standard DIMMs, and eliminate the channel ranking limitation of standard DDR3 registered DIMMs. The Crucial DDR3L LRDIMMs is designed for IT professionals that manage high-end server environments with demanding workloads.

The 64 GB Crucial DDR3L LRDIMMs operates using 1.35V, unlike the 1.5V common in DDR3 RDIMMs, making the new module more energy-efficient and cost-effective, especially in large deployments. Since Crucial LRDIMMs transmit power in a more efficient manner to the CPU (via the data path buffer), they use less voltage, which allows for additional power savings. These new memory modules are also compatible with OEM servers and warranties, allowing users to upgrade their existing server infrastructures without having to purchase an entirely new system. Crucial LRDIMMs fully support the latest Intel Xeon processor E5 family.

Transcend Information, Inc., a worldwide leader in storage and multimedia products, today announced the arrival of its 32GB DDR3 Load-Reduced DIMM (LRDIMM) memory module. An important component of today's powerful servers, LRDIMMs use a specially designed buffer to minimize the load on the server memory bus, allowing administrators to maximize memory capacity, increase performance, and reduce the power consumption of their systems.

In standard RDIMM technology, the data bus connects directly to the multiple ranks of DRAM chips on the module, which increases electrical load and limits system speed as more modules are added. In contrast, Transcend's DDR3 Low Voltage LRDIMMs feature a full memory buffer chip on the module, which acts as a go-between for all signals sent from the host to the DRAM chips, reducing the electrical load on all interfaces. Compared to standard RDIMMs or UDIMMs, a system using Transcend LRDIMMs can support more modules per channel and higher maximum memory capacity without sacrificing speed.

Crucial, a leading global brand of memory and storage upgrades, today announced the immediate availability of Crucial Load-Reduced DIMM (LRDIMM) server memory in support of the new Intel Xeon processor E5 family.

The rise of data center virtualization, cloud computing, and transactional databases has put additional strain on enterprise servers, causing them to struggle to meet user demands. Crucial LRDIMM server memory supports higher memory densities than standard DDR3 RDIMMs, allowing the addition of more DIMMs per channel, and providing flexible, scalable memory that allows applications to perform more effectively. By reducing the electrical loads presented to the CPU, Crucial LRDIMMs deliver up to twice the installed memory capacity for Intel Xeon processor E5 family-based servers, and increase memory bandwidth by up to 35 percent over standard DDR3 RDIMM modules, helping improve overall data center performance and efficiency.

SMART Modular Technologies ("SMART Modular"), a leading independent manufacturer of memory modules and embedded flash products announces its 64GB DDR3 load-reduced DIMM (LRDIMM). SMART Modular's 64GB LRDIMM is optimized for high-end servers and will be launching in Q2'12 to serve scientific, engineering, and financial computing applications that require high memory capacity and performance. Specifically, this product targets next-generation Intel Sandy Bridge and Ivy Bridge server platforms for high-performance computing applications.

The new LRDIMM combines innovative module packaging technology leveraging off-the-shelf commodity DRAMs to provide the industry's highest density LRDIMM at the lowest possible cost. Highlighting SMART Modular's design expertise, the new 64GB LRDIMM utilizes a single JEDEC-compliant memory buffer chip, a dual PCB structure and a leading edge interconnect technology to provide maximum performance and density while achieving server-grade quality and reliability.

Inphi Corporation, a leading provider of high-speed analog semiconductor solutions for the communications and computing markets, today announced that load-reduced dual-inline memory modules (LRDIMMs), enabled by Inphi's Isolation Memory Buffer (iMB), have been fully validated and supported on the new AMD Opteron 6200 Series processors, formerly code-named "Interlagos." The validation provides memory vendors and systems designers the assurance that they can populate AMD Opteron 6200 Series-based systems with up to 768 GB of cost-effective memory for today's demanding enterprise and cloud-based applications in 2P servers.

The Inphi iMBGS02A passed several rigorous validation tests by AMD across process, voltage temperature and frequency. Now shipping in volume and fully compliant with the memory-buffer specification of the JEDEC Solid State Technology Association, the devices have now been verified for compliance on the AMD Opteron 6200 Series platform, for devices' interoperability.