Giga Computing, a subsidiary of GIGABYTE and an industry leader in generative AI servers and advanced cooling technologies, shows off at SC24 how the GIGABYTE enterprise portfolio provides solutions for all applications, from cloud computing to AI to enterprise IT, including energy-efficient liquid-cooling technologies. This portfolio is made more complete by long-term collaborations with leading technology companies and emerging industry leaders, which will be showcased at GIGABYTE booth #3123 at SC24 (Nov. 19-21) in Atlanta. The booth is sectioned to put the spotlight on strategic technology collaborations, as well as direct liquid cooling partners.

The GIGABYTE booth will showcase an array of NVIDIA platforms built to keep up with the diversity of workloads and degrees of demands in applications of AI & HPC hardware. For a rack-scale AI solution using the NVIDIA GB200 NVL72 design, GIGABYTE displays how seventy-two GPUs can be in one rack with eighteen GIGABYTE servers each housing two NVIDIA Grace CPUs and four NVIDIA Blackwell GPUs. Another platform at the GIGABYTE booth is the NVIDIA HGX H200 platform. GIGABYTE exhibits both its liquid-cooling G4L3-SD1 server and an air-cooled version, G593-SD1.

Today, Hewlett Packard Enterprise announces its new high performance computing (HPC) and artificial intelligence (AI) infrastructure portfolio that includes leadership-class HPE Cray Supercomputing EX solutions and two systems optimized for large language model (LLM) training, natural language processing (NLP) and multi-modal model training. The new supercomputing solutions are designed to help global customers fast-track scientific research and invention.

"Service providers and nations investing in sovereign AI initiatives are increasingly turning to high-performance computing as the critical backbone enabling large-scale AI training that accelerates discovery and innovation," said Trish Damkroger, senior vice president and general manager, HPC & AI Infrastructure Solutions at HPE. "Our customers turn to us to fast-track their AI system deployment to realize value faster and more efficiently by leveraging our world-leading HPC solutions and decades of experience in delivering, deploying and servicing fully-integrated systems."

GameMax, an emerging brand of PC gaming components, including gaming cases and power supply units, is thrilled to announce the new Infinity Pro gaming chassis. The chassis features a dual-chamber layout with a panoramic tempered glass design. The GameMax Infinity Pro is perfect for showcasing the beauty of internal components and RGB illumination, with tempered glass panels on the front, side, and top of the case. The GameMax Infinity Pro comes equipped with five 120 mm PWM ARGB fans and a fan and ARGB controller hub, providing sufficient cooling for high-end gaming configurations right out of the box. Additionally, the fan and ARGB controller hub include 81 built-in lighting effects and support motherboard RGB sync technologies when connected to the motherboard's RGB header.

The GameMax Infinity Pro gaming chassis also supports back-connector motherboards such as the ASUS BTF motherboards, GIGABYTE STEALTH motherboards, and MSI PROJECT ZERO motherboards. For cooling, the chassis supports up to 360 mm radiators for liquid cooling. The chassis supports a maximum of 8x 120 mm fans. The GameMax Infinity Pro gaming chassis is available in black and white models.

Asetek reported third-quarter revenue of $12.2 million compared with $20.5 million in the same period of 2023. Revenue for the first nine months was $37.1 million compared with $59.7 million in the same period of 2023. The change in both periods reflects fewer shipments of liquid cooling products, partly offset by an increase in shipments of SimSports products. Gross margin was 36% for the third quarter and 42% for the first nine months, compared with 46% and 45% in the respective periods of 2023. The change in gross margin reflects the write-off of certain inventory that was adversely affected by a supply chain quality issue that has since been rectified.

"Our SimSports business experiences strong traction with new acclaimed products, new strategically important distribution agreements and a clear pathway to millions of new simulation gamers in the console market. We are also taking action to stabilize the Liquid Cooling business and position for future growth with a lower cost base and a wider offering addressing the changing market preferences," says André S. Eriksen, the CEO of Asetek.

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About EZ-DIY Features - Motherboard, Liquid Cooling, PC Case
MSI has unveiled a new lineup of DIY-friendly products designed to simplify PC building for everyone, from beginners to experienced enthusiasts. The X870 (E) & Z890 motherboards come equipped with the EZ M.2 CLIP II, which enables quick, tool-free M.2 SSD installation, along with the EZ PCIe Release for easy and secure graphics card removal at the push of a button. The MAG CORELIQUID I series liquid cooling system features a universal UNI Bracket compatible with both Intel and AMD sockets. Its pre-installed fans simplify cable management to just one cable, while optional cable covers provide a clean and personalized look. Additionally, MSI's MAG PANO series PC cases offer tool-free panels on the front, side, and top, ensuring unrestricted access for adding side fans or radiators. MSI's user-friendly lineup aims to make PC building smoother, faster, and more enjoyable for everyone.

Supermicro, Inc., a Total IT Solution Provider for AI, Cloud, Storage, and 5G/Edge, is accelerating the industry's transition to liquid-cooled data centers with the NVIDIA Blackwell platform to deliver a new paradigm of energy-efficiency for the rapidly heightened energy demand of new AI infrastructures. Supermicro's industry-leading end-to-end liquid-cooling solutions are powered by the NVIDIA GB200 NVL72 platform for exascale computing in a single rack and have started sampling to select customers for full-scale production in late Q4. In addition, the recently announced Supermicro X14 and H14 4U liquid-cooled systems and 10U air-cooled systems are production-ready for the NVIDIA HGX B200 8-GPU system.

"We're driving the future of sustainable AI computing, and our liquid-cooled AI solutions are rapidly being adopted by some of the most ambitious AI Infrastructure projects in the world with over 2000 liquid-cooled racks shipped since June 2024," said Charles Liang, president and CEO of Supermicro. "Supermicro's end-to-end liquid-cooling solution, with the NVIDIA Blackwell platform, unlocks the computational power, cost-effectiveness, and energy-efficiency of the next generation of GPUs, such as those that are part of the NVIDIA GB200 NVL72, an exascale computer contained in a single rack. Supermicro's extensive experience in deploying liquid-cooled AI infrastructure, along with comprehensive on-site services, management software, and global manufacturing capacity, provides customers a distinct advantage in transforming data centers with the most powerful and sustainable AI solutions."

Flex today announced new reference platforms for liquid-cooled servers, rack, and power products that will enable customers to sustainably accelerate data center growth. These innovations build on Flex's ability to address technical challenges associated with power, heat generation, and scale to support artificial intelligence (AI) and high-performance computing (HPC) workloads.

"Flex delivers integrated data center IT and power infrastructure solutions that address the growing power and compute demands in the AI era," said Michael Hartung, president and chief commercial officer, Flex. "We are expanding our unique portfolio of advanced manufacturing capabilities, innovative products, and lifecycle services, enabling customers to deploy IT and power infrastructure at scale and drive AI data center expansion."

In close cooperation with hyperscalers and server OEMs, Rittal has developed a modular cooling distribution unit (CDU) that delivers a cooling capacity of over 1 MW. It will be the centerpiece exhibit at Rittal's booth A24 at 2024 OCP Global Summit. The CDU uses direct liquid cooling based on water - and is thus an example for new IT infrastructure technologies that are enablers for AI applications.

New technology, familiar handling?
"To put the technology into practice, it is not enough to simply provide the cooling capacity and integrate the solution into the facility - which also still poses challenges," says Lars Platzhoff, Head of Rittal's Business Unit Cooling Solutions: "Despite the new technology, the solutions must remain manageable by the data center team as part of the usual service. At best, this should be taken into account already at the design stage."

Hewlett Packard Enterprise announced the industry's first 100% fanless direct liquid cooling systems architecture to enhance the energy and cost efficiency of large-scale AI deployments. The company introduced the innovation at its AI Day, held for members of the financial community at one of its state-of-the-art AI systems manufacturing facilities. During the event, the company showcased its expertise and leadership in AI across enterprises, sovereign governments, service providers and model builders.

Industry's first 100% fanless direct liquid cooling system
While efficiency has improved in next-generation accelerators, power consumption is continuing to intensify with AI adoption, outstripping traditional cooling techniques.

GIGABYTE Technology a leader in innovative cooling solutions, proudly announces the launch of the AORUS WATERFORCE AIO cooler, meticulously engineered to meet the demanding cooling needs of Intel Socket LGA 1851 CPU. With significant changes in hotspot locations and thermal requirements across the new CPU lineup, ensuring optimal cooling performance across all model configurations has become imperative. The AORUS WATERFORCE AIO cooler is designed with three key features that significantly enhance cooling efficiency for Socket LGA 1851 CPU.

Optimal Mounting Pressure Design
In alignment with Intel Socket LGA 1851 (Arrow Lake-S) Thermal Design Guide, the new socket LGA 1851 requires increased mounting pressure for optimal thermal performance. The AORUS WATERFORCE X II series & non-X II series cooler provides maximum mounting pressure, ensuring a firm fit that enhances heat transfer from the CPU to the cooler.

Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, is announcing a complete liquid cooling solution that includes powerful Coolant Distribution Units (CDUs), cold plates, Coolant Distribution Manifolds (CDMs), cooling towers and end to end management software. This complete solution reduces ongoing power costs and Day 0 hardware acquisition and data center cooling infrastructure costs. The entire end-to-end data center scale liquid cooling solution is available directly from Supermicro.

"Supermicro continues to innovate, delivering full data center plug-and-play rack scale liquid cooling solutions," said Charles Liang, CEO and president of Supermicro. "Our complete liquid cooling solutions, including SuperCloud Composer for the entire life-cycle management of all components, are now cooling massive, state-of-the-art AI factories, reducing costs and improving performance. The combination of Supermicro deployment experience and delivering innovative technology is resulting in data center operators coming to Supermicro to meet their technical and financial goals for both the construction of greenfield sites and the modernization of existing data centers. Since Supermicro supplies all the components, the time to deployment and online are measured in weeks, not months."

Asetek announce the appointment of Maja Sand-Grimnitz as vice president (VP) Brand and Digital, and Henrik Lindskou-Mouritsen as VP Global Sales. They bring extensive experience from commercialization of gaming hardware and international sales to drive deployment of Asetek's acclaimed sim racing products and build on the leading position within Liquid Cooling.

"I am pleased to have both Henrik and Maja join Asetek, further strengthening our commercial focus and enabling increased efficiencies by consolidating the management team in Denmark," said André Sloth Eriksen the CEO of Asetek. "We are positioning for significant growth within SimSports and a changing Liquid Cooling market with more direct end-user dialogue over time and potential to capture material revenue synergies across our two business segments under a strong Asetek brand."

Small - but powerful! Alphacool presents new sizes of the popular Core reservoir. This should not be missing in any performance-orientated custom water cooling system in which CPU and graphics card(s) are cooled simultaneously. The reservoir is available in two sizes, both with and without a pump.

The chrome-plated brass G1/4' connections are a stylish and elegant element of the Core reservoir. The connections, which are embedded in the acrylic and fitted with an O-ring, are absolutely leak-proof and support the clear and functional look of the Alphacool Core Design series. Alphacool's Core reservoir is made of high-quality acrylic glass, which allows a clear view of the coolant. Brilliant lighting is made possible by the built-in, digitally addressable aRGB lighting.

Supermicro, Inc. a Total IT Solution Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge, today adds new maximum performance GPU, multi-node, and rackmount systems to the X14 portfolio, which are based on the Intel Xeon 6900 Series Processors with P-Cores (formerly codenamed Granite Rapids-AP). The new industry-leading selection of workload-optimized servers addresses the needs of modern data centers, enterprises, and service providers. Joining the efficiency-optimized X14 servers leveraging the Xeon 6700 Series Processors with E-cores launched in June 2024, today's additions bring maximum compute density and power to the Supermicro X14 lineup to create the industry's broadest range of optimized servers supporting a wide variety of workloads from demanding AI, HPC, media, and virtualization to energy-efficient edge, scale-out cloud-native, and microservices applications.

"Supermicro X14 systems have been completely re-engineered to support the latest technologies including next-generation CPUs, GPUs, highest bandwidth and lowest latency with MRDIMMs, PCIe 5.0, and EDSFF E1.S and E3.S storage," said Charles Liang, president and CEO of Supermicro. "Not only can we now offer more than 15 families, but we can also use these designs to create customized solutions with complete rack integration services and our in-house developed liquid cooling solutions."

Supermicro, Inc., a Total IT Solution Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge is announcing the all-new FlexTwin family of systems which has been designed to address the needs of scientists, researchers, governments, and enterprises undertaking the world's most complex and demanding computing tasks. Featuring flexible support for the latest CPU, memory, storage, power and cooling technologies, FlexTwin is purpose-built to support demanding HPC workloads including financial services, scientific research, and complex modeling. These systems are cost-optimized for performance per dollar and can be customized to suit specific HPC applications and customer requirements thanks to Supermicro's modular Building Block Solutions design.

"Supermicro's FlexTwin servers set a new standard of performance density for rack-scale deployments with up to 96 dual processor compute nodes in a standard 48U rack," said Charles Liang, president and CEO of Supermicro. "At Supermicro, we're able to offer a complete one-stop solution that includes servers, racks, networking, liquid cooling components, and liquid cooling towers, speeding up the time to deployment and resulting in higher quality and reliability across the entire infrastructure, enabling customers faster time to results. Up to 90% of the server generated heat is removed with the liquid cooling solution, saving significant amounts of energy and enabling higher compute performance."

Supermicro, Inc., a Total IT Solution Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge, is previewing new, completely re-designed X14 server platforms which will leverage next-generation technologies to maximize performance for compute-intensive workloads and applications. Building on the success of Supermicro's efficiency-optimized X14 servers that launched in June 2024, the new systems feature significant upgrades across the board, supporting a never-before-seen 256 performance cores (P-cores) in a single node, memory support up for MRDIMMs at 8800MT/s, and compatibility with next-generation SXM, OAM, and PCIe GPUs. This combination can drastically accelerate AI and compute as well as significantly reduce the time and cost of large-scale AI training, high-performance computing, and complex data analytics tasks. Approved customers can secure early access to complete, full-production systems via Supermicro's Early Ship Program or for remote testing with Supermicro JumpStart.

"We continue to add to our already comprehensive Data Center Building Block solutions with these new platforms, which will offer unprecedented performance, and new advanced features," said Charles Liang, president and CEO of Supermicro. "Supermicro is ready to deliver these high-performance solutions at rack-scale with the industry's most comprehensive direct-to-chip liquid cooled, total rack integration services, and a global manufacturing capacity of up to 5,000 racks per month including 1,350 liquid cooled racks. With our worldwide manufacturing capabilities, we can deliver fully optimized solutions which accelerate our time-to-delivery like never before, while also reducing TCO."

In the age of AI, computing power has become a vital component for driving innovation. For most industries, using professional-grade workstations as the computing engine enables efficient computing and infinite creativity. A workstation is a multi-purpose computer that supports high-performance computing in a distributed network setting. It excels at graphics processing and task parallelism, making it suitable for a wide range of AI applications as well as common visual design tasks.

For example, the workstation can fully meet the requirements for multi-task processing, such as 3D modeling, large-scale industrial drawing, advertising rendering output, non-linear video editing, file rendering production and acceleration, and so on. The computer can also perform effectively in a wide range of model loadings and professional software, as well as remote system maintenance and monitoring in unsupervised settings, which has the potential to revolutionize the application domain.

With the growing demand for high-speed computing, more effective cooling solutions for AI servers are gaining significant attention. TrendForce's latest report on AI servers reveals that NVIDIA is set to launch its next-generation Blackwell platform by the end of 2024. Major CSPs are expected to start building AI server data centers based on this new platform, potentially driving the penetration rate of liquid cooling solutions to 10%.

Air and liquid cooling systems to meet higher cooling demands
TrendForce reports that the NVIDIA Blackwell platform will officially launch in 2025, replacing the current Hopper platform and becoming the dominant solution for NVIDIA's high-end GPUs, accounting for nearly 83% of all high-end products. High-performance AI server models like the B200 and GB200 are designed for maximum efficiency, with individual GPUs consuming over 1,000 W. HGX models will house 8 GPUs each, while NVL models will support 36 or 72 GPUs per rack, significantly boosting the growth of the liquid cooling supply chain for AI servers.

After recent troubles, EK is certainly not going anywhere and it came to the Computex 2024 show in force, showing off several new products, including the whole new line of liquid cooling products, the EK Nexe. The brand-new product line is, according to EK, designed from scratch, and unlike standard custom loop products, the critical components of EK Nexe, water blocks and combo units, are injection molded, just like the rest of the AIO products. This should provide the best ratio between performance, design, and price, making the EK Nexe lineup both accessible and quite popular among both consumers and system integrators.

In order to make it as simple and accessible as possible, EK Nexe does not use standard threads and fittings, but rather push-in fittings that lock in place, creating an airtight seal and allowing tubes to rotate freely. The EK Nexe line also uses a modular approach, which means that the GPU water block will be using a universal cooling core or platform specific to certain GPUs and a heatsink that covers the entire PCB. The core will cover entire graphics card and cool both the GPU and the VRM while the heatsink, which is CNC-milled for every GPU model specifically, will handle other critical components on the graphics card PCB. Those two will be joined and offer a design similar to a water block with an acetal top.

GIGABYTE Technology, Giga Computing, a subsidiary of GIGABYTE and an industry leader in servers and industrial motherboards, today launched products supporting Intel Xeon 6 Processor (LGA 4710) with Efficient-cores in a single or dual socket configuration. GIGABYTE's new products span its entire enterprise portfolio from GPU servers to liquid cooling servers to motherboards. With Intel's new processor roadmap addressing a broad range of compute needs in the server market, Efficient-cores (E-cores) and Performance-cores (P-cores) have their unique advantages, and both are supported on this platform. E-cores are available today, with P-core products becoming available in the future. The solutions within have distinct advantages for cloud, networking and media, and data services workloads that value consistent performance, greater energy efficiency, and dense rack and core density.

GIGABYTE's enterprise portfolio for the Intel Xeon 6 processor spans GPU servers, direct liquid cooling (DLC) servers, multi-node servers, general purpose motherboards and servers, and edge servers. By releasing a wide range of servers, data centers can quickly integrate it to achieve dynamic goals such as in GIGA POD, a rack-scale supercomputing AI infrastructure by GIGABYTE. The new Xeon based servers by GIGABYTE are also highly compatible with cloud-native software stacks for portability and consistency in containerized applications in distributed systems.

In Win Development Inc. (InWin), a leading innovator in PC hardware is also a service provider for server and workstation system assembling. A wide range of exciting new products are launching for enthusiasts and PC builders. The InWin booth will demonstrate its AI hardware ecosystem at COMPUTEX 2024.

11th Generation InWin Signature Chassis
This year, InWin will launch its 11th generation signature PC chassis, "Infinite", taking a standard case and elevating it into an artistic, technical marvel! The main body features a mechanized aluminium structure, featuring the largest 180-degree curved glass available on a PC today. Seeing is believing, so witness at the InWin booth!

In addition to new PC cases, Phanteks brought several new cooling products to the Computex 2024 show, including a whole new NEXLINQ cooling system, Glacier EZ-Fit series of liquid cooling components and kits, as well as a rather interesting fan prototype that will hopefully find its way to the market.

The big part of the Phanteks showcase was the NEXLINQ, a set of cooling components, or an ecosystem as Phanteks likes to describe it, which includes the M25 G2 fans, Glacier One M25 G2 AIO, and a NEXLINQ Hub. The NEXLINQ and components will feature support for the whole new LINQ-6 connector that will be able to provide both power and D-RGB lighting to the fans.

When Palit launched its GeForce RTX 4080 SUPER custom-design graphics card lineup this January, it only included GamingPro OC and JetStream OC products, conspicuously lacking a high-end GameRock product that it had for the RTX 4080 and RTX 4090. It turns out that the company had big plans for the brand, and we'll hear all about them at Computex 2024, next month. Along the way, though, Palit gave us a delectable tease of what could very well be the RTX 4080 SUPER GameRock, and it features a hybrid cooling solution.

The card features a 4-slot custom design, with the signature molded acrylic pattern on the cooler shroud that's illuminated, and is designed to resemble ice. The shroud holds onto a trio of large fans, which seem to ventilate a large compound fin-stack heatsink underneath; until the teaser turns the card around to reveal liquid cooling fittings! The cooler features an air+liquid hybrid cooling solution. You can use the card with air cooling out of the box, or connect it to a DIY liquid cooling loop for superior cooling and overclocking headroom; and more importantly, reduced noise from its air cooling solution. Although we expect this card to definitely be an RTX 4080 SUPER product, it wouldn't surprise us if Palit extended the design to even the RTX 4090. We'll see when we run into them on June 4, stay tuned!

GIGABYTE Technology and Giga Computing, a subsidiary of GIGABYTE and an industry leader in enterprise solutions, will showcase their solutions at the GIGABYTE booth #1224 at NVIDIA GTC, a global AI developer conference running through March 21. This event will offer GIGABYTE the chance to connect with its valued partners and customers, and together explore what the future in computing holds.

The GIGABYTE booth will focus on GIGABYTE's enterprise products that demonstrate AI training and inference delivered by versatile computing platforms based on NVIDIA solutions, as well as direct liquid cooling (DLC) for improved compute density and energy efficiency. Also not to be missed at the NVIDIA booth is the MGX Pavilion, which features a rack of GIGABYTE servers for the NVIDIA GH200 Grace Hopper Superchip architecture.

During the 2024 SIEPR Economic Summit, NVIDIA CEO Jensen Huang acknowledged that the company's next-generation DGX systems, designed for AI and high-performance computing workloads, will require liquid cooling due to their immense power consumption. Huang also hinted that these new systems are set to be released in the near future. The revelation comes as no surprise, given the increasing power of GPUs needed to satisfy AI and machine learning applications. As computational requirements continue to grow, so does the need for more powerful hardware. However, with great power comes great heat generation, necessitating advanced cooling solutions to maintain optimal performance and system stability. Liquid cooling has long been a staple in high-end computing systems, offering superior thermal management compared to traditional air cooling methods.

By implementing liquid cooling in the upcoming DGX systems, NVIDIA aims to push the boundaries of performance while ensuring the hardware remains reliable and efficient. Although Huang did not provide a specific release date for the new DGX systems, his statement suggests that they are on the horizon. Whether the next generation of DGX systems uses the current NVIDIA H200 or the upcoming Blackwell B100 GPU as their primary accelerator, the performance will undoubtedly be delivered. As the AI and high-performance computing landscape continues to evolve, NVIDIA's position continues to strengthen, and liquid-cooled systems will certainly play a crucial role in shaping the future of these industries.