Bitspower, KRAMBU, and XFX have joined forces to bring advanced liquid-cooling solutions to AMD's cutting-edge RDNA 4.0 architecture. As AI workloads demand ever-increasing processing power, efficient thermal management is crucial to unlocking peak performance and long-term reliability. By integrating Bitspower's industry-leading cooling technology with KRAMBU's expertise in high-performance computing and XFX's GPU innovation, this partnership delivers a powerful, scalable solution for data centers and enterprise applications.

Designed for maximum efficiency, these liquid-cooled servers support up to 20 GPUs per system, significantly increasing computing density and accelerating AI, machine learning, and data analytics workloads. At the heart of these systems is AMD's Radeon RX 9070 XT, built on the 5 nm RDNA 4 Navi 48 architecture, which boasts 25% greater transistor density than NVIDIA's Blackwell GPUs—packing 53.9 billion transistors into a die smaller than GB203. By maintaining lower temperatures under heavy workloads, Bitspower's cooling solutions allow these high-density servers to operate at peak performance while reducing thermal throttling and energy consumption.

Giga Computing, a subsidiary of GIGABYTE Technology, has signed a Memorandum of Understanding (MoU) with SK Telecom and SK Enmove to collaborate on advancing AI Data Center (AIDC) and high-performance computing (HPC) while accelerating the adoption of liquid cooling technology in next-generation data centers.
This strategic partnership sets the stage to nurture and develop high-performance, energy-efficient, and sustainable data center solutions.

Driving AI and Cooling Technology Innovation Together
Performance AI servers, liquid cooling technologies, and modular AI clusters to support SK's various business units, including:

• SK Telecom: Strengthening AIDC infrastructure to support next-generation data centers
• SK Enmove: Advancing liquid cooling technologies to improve energy efficiency and sustainability in data centers

SoftBank Corp., ZutaCore and Hon Hai Technology Group ("Foxconn") today announced they implemented ZutaCore's two-phase DLC (Direct Liquid Cooling) technology in an AI server using NVIDIA accelerated computing, making it the world's first implementation of ZutaCore's two-phase DLC (Direct Liquid Cooling) technology using NVIDIA H200 GPUs. In addition, SoftBank designed and developed a rack-integrated solution that integrates each component of the server, including cooling equipment with two-phase DLC technology, on a rack scale, and conducted an operational demonstration and performance evaluation at its data center in February 2025. The demonstration results indicated the solution passed NVIDIA's temperature test (NVQual), thereby confirming the compatibility, stability and reliability of this rack-integrated solution. The solution also achieved pPUE (partial Power Usage Effectiveness) of 1.03 (actual measured value) per rack for cooling efficiency

With the spread and increased adoption of AI, demand for AI servers and other computing resources is expected to expand significantly, further increasing power consumption at data centers. At the same time, reducing power consumption from the perspective of reducing carbon dioxide (CO2) emissions has become a pressing issue worldwide, requiring data centers to become more efficient, consume less power, and introduce innovative heat removal solutions. Since May 2024, SoftBank has been collaborating with ZutaCore, a global leader in the development and business deployment of two-phase DLC technology, to develop solutions optimized for low power consumption at AI data centers.

EK, the premium liquid cooling gear manufacturer, is proud to introduce the EK-Quantum Vector³ FE RTX 5090 - Plexi, our high-performance water block designed exclusively for the NVIDIA GeForce RTX 5090 Founders Edition. The EK-Quantum Vector³ FE RTX 5090 is the first water block to support the NVIDIA RTX 5090 Founders Edition three-part PCB design, providing a high-performance, fully enclosed liquid-cooling solution for NVIDIA's most powerful gaming GPU yet. This stunning EK-Quantum Vector³ FE RTX 5090 water block is fully EK-Matrix7 compatible, featuring a signature CNC-machined backplate with a sleek, ribbed design, a custom acrylic top and backlit EK logo. Founders Edition never looked this good.

Unmatched Performance and Cooling Efficiency
The EK-Quantum Vector³ FE RTX 5090 water block delivers high-performance liquid cooling, premium aesthetics, and precision engineering for NVIDIA's flagship RTX 5090 Founders Edition. Inside, you'll find an expanded cooling system, improved pre-cut thermal pads, alongside a precision-engineered gasket system, ensuring optimal heat dissipation for the GPU core, VRAM, and power stages.

Senao Networks Inc. (SNI), a global leader in AI computing and networking solutions, will be exhibiting at 2025 Mobile World Congress (MWC) in Barcelona. At the event, SNI will showcase its latest AI-driven innovations, including AI Servers, AI Cameras, AIPCs, Cloud Solutions, and Titanium Power Supply, reinforcing its vision of "AI Everywhere."

Senao Networks continues to advance AI computing with new products designed to enhance security, efficiency, and connectivity.

Hewlett Packard Enterprise today announced eight new HPE ProLiant Compute Gen12 servers, the latest additions to a new generation of enterprise servers that introduce industry-first security capabilities, optimize performance for complex workloads and boost productivity with management features enhanced by artificial intelligence (AI). The new servers will feature upcoming Intel Xeon 6 processors for data center and edge environments.

"Our customers are tackling workloads that are overwhelmingly data-intensive and growing ever-more demanding," said Krista Satterthwaite, senior vice president and general manager, Compute at HPE. "The new HPE ProLiant Compute Gen12 servers give organizations - spanning public sector, enterprise and vertical industries like finance, healthcare and more - the horsepower and management insights they need to thrive while balancing their sustainability goals and managing costs. This is a modern enterprise platform engineered for the hybrid world, designed with innovative security and control capabilities to help companies prevail over the evolving threat landscape and performance challenges that their legacy hardware cannot address."

Bitspower is known more for its DIY liquid cooling gear for the PC enthusiast, and workstation market segments, but is looking to broaden its reach. At the 2025 International CES, the company showed off its first all-in-one liquid CPU coolers—or at least their boxes. The Bitspower Atlas series of AIO CLCs come in 240 mm and 360 mm size variants, with black and white color variants. The pump-block has a cubical shape with coolant fittings coming from the side, and an infinity reflection ornament on top. The coolers include two or three of Bitspower's Griffin series 120 mm ARGB fans. The cooler uses a copper cold-plate and an aluminium radiator to stay in the market segment.

Each of the Griffin 120 mm ARGB fans included with the Atlas series AIOs turns at speeds of up to 2,200 RPM, pushing up to 83.83 CFM of airflow, at 2.77 mm H₂O static pressure, and around 38 dBA of noise. The company didn't mention bearing type. These fans can also be had in packs of 3. Bitspower also showed off its liquid cooling loop for 2P workstations or servers, as well as its premium AIOs built around its 2U radiators and 60 mm industrial fans. Lastly, there was an assortment of Concept X and Summit series CPU water blocks. We've seen many of these blocks at last year's CES and Computex, so nothing new to report here.

Inno3D, a devoted NVIDIA partner showcased at CES 2025 its own implementations of NVIDIA GeForce RTX 50 Series GPUs powered by NVIDIA Blackwell architecture. Inno3D custom cooling solutions include the impressive iChill Frostbite liquid cooling and the huge iChill air cooling alternative complemented by the X3 and Twin X2 solutions. Before moving on we like to mention that all the graphics cards, even the RTX 5090 are powered by a single 12-pin connector.

Immediately our eyes observed the iChill Frostbite GeForce RTX 5090 dual-slot graphic cards with an impressive liquid cooling system, something enthusiasts looking for a compact yet high-performance system will surely desire. Next to it, even a blind man could not miss the huge iChill X3 RTX 5080, a 3.5-slot monster. The gargantuan proportions are due to the oversized cooling solution that relies on a combination of three fans (with the outer fans rotating in an anticlockwise direction to reduce turbulence and improve airflow), a huge vapor chamber complemented by a heatsink and a custom backplate that aid hot air extraction to protect the PCB from overheating.

ADATA brought some innovative storage products to the 2025 International CES. The XPG MARS 970 Storm is an M.2 NVMe Gen 5 SSD with a self-contained liquid cooling loop. Its construction involves a baseplate from which heat is conventionally transferred to a cylindrical heat dissipation surface—a sort of radiator, where a pair of tiny 20 mm fans push and pull air through, to keep the controller cool. Speaking of which, the drive is based on the Silicon Motion SM2508 flagship controller that's built on the TSMC 6 nm process. It comes in capacities of up to 8 TB. ADATA claims sequential transfer speeds of up to 14 GB/s reads, with up to 12 GB/s writes.

You can have this drive without this cooling solution (eg: if you have a nice one of your own from your motherboard). It's called the MARS 970 Blade. It can be used without a cooler, but performance will be lesser. ADATA hence advertises sequential speeds of up to 12 GB/s reads, with up to 10 GB/s writes. The MARS 970 Blade strangely only comes in capacities of up to 4 TB—there's no 8 TB variant.

MSI has gone all in with NVIDIA's freshly debuted GeForce RTX 50 "Blackwell" GPU series at CES 2025—an impressive number of custom models have been unveiled on the showroom floor. The TechPowerUp team has sifted through many of MSI's latest and greatest, but also noticed an intriguing set of placards positioned next to the tech firm's vast selection of physical products. The "exclusive" information at hand points to two in-progress GeForce RTX 5090 models—informally named as "Lightning" Special Editions. Company representatives have revealed that the engineering team is concocting a purpose-made PCB design for the two upcoming cards. This board supposedly sports enough differences to distinguish itself from NVIDIA's reference layout (as seen on their Founder's Edition)—industry experts reckon that the majority of AIBs will be utilizing Team Green's standard GeForce RTX 5090 PCB.

The printed graphic indicates that MSI's mysterious liquid cooled Special Edition GeForce RTX 32G will arrive with the "ultimate all-in-one (AIO) water cooling solution"—referred to as their "HydroCool System." A twin STORMFORCE fan configuration is teased alongside advanced airflow channels and a next-gen dual 120 mm AIO liquid cooling system. Custom-engineered water channels are advertised as being capable of flowing "directly through" the card's onboard memory. Dual front intakes and exhausts are said to assist greatly in cooling this Special Edition model, as well as neighboring PC components. Users can implement independent custom fan speed tunings; presumably via MSI software. It will be interesting to see how this in-the-works AIO-based model stacks up against the premium-tier "two-piece" MSI RTX 5090 SUPRIM LIQUID SOC.

HYTE, a leading manufacturer of cutting-edge PC components and peripherals, announced today at this year's Consumer Electronics Show (CES) that the THICC Q80 Trio, a 360 mm version of its renowned THICC Q60 all-in-one (AIO) liquid cooler, is now available for pre-order at the MSRP of $319.99. Set to launch in Q1 2025, this new cooler builds on HYTE's design and cooling innovations with increased performance capabilities thanks to its thicker size while offering more personalization options thanks to HYTE's flagship Nexus 2.0 software solution. To pre-order the THICC Q80 Trio, please visit: https://hyte.com/q80

"THICC"-ER PERFORMANCE GAINS
Designed to fit the HYTE Y70 and Y70 Touch Infinite cases down to the last millimeter while remaining compatible with a plethora of additional chassis, the THICC Q80 Trio is capable of even more performance thanks to its ginormous heat exchanger, which measures 360 mm long and 52 mm thick for maximum cooling capacity and efficiency. The THICC Q80 Trio also boasts a larger, second-generation copper cold plate with a revised liquid flow path that further enhances temperatures while improving socket compatibility.

The Cooling X Pro from Cooler Master is a case designed for the "cooling defined build," a high-end PC build where the primary focus is on high-performance liquid cooling of the CPU, GPU, and NVMe SSD. The case reimagines the layout of key components in the build, such as positioning the PSU toward the front, putting the CPU and VGA under a proprietary liquid cooling solution, and using a large, common square 360 mm x 360 mm radiator to dissipate heat from both. This is ventilated by four 180 mm fans.

Besides this unique cooling solution, the Cooling X Pro appears to feature an aluminium inner chassis similar to the MasterFrame Aluminium series that the company also showcased this year. The various panels aren't as modular, the one facing the left side is a curved tempered glass. The right probably features a coarse mesh panel to let the 360 mm x 360 mm radiator breathe.

GIGABYTE Technology, internationally renowned for its R&D capabilities and a leading innovator in server and data center solutions, continues to lead technological innovation during this critical period of AI and computing advancement. With its comprehensive AI product portfolio, GIGABYTE will showcase its complete range of AI computing solutions at CES 2025, from data center infrastructure to IoT applications and personal computing, demonstrating how its extensive product line enables digital transformation across all sectors in this AI-driven era.

Powering AI from the Cloud
With AI Large Language Models (LLMs) now routinely featuring parameters in the hundreds of billions to trillions, robust training environments (data centers) have become a critical requirement in the AI race. GIGABYTE offers three distinctive solutions for AI infrastructure.
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Alienware is reintroducing the iconic Area-51 back into the family, reanimated in desktop and laptop forms. Deep lore underpins Area-51, dating back to 1998. While the design, technology and gameplay have evolved significantly from iteration to iteration, one fact has remained the same: Area-51 represents the best that Alienware offers. Reclaiming its position as the ultimate gaming experience, the new Area-51 Desktop debut an arsenal of cutting-edge features -- including next-gen NVIDIA graphics - to power the next generation of AAA gameplay.

ALIENWARE AREA-51 DESKTOP
Area-51 Desktop makes a bold entrance to retake the throne as Alienware's flagship gaming PC. With this edition, we are returning to our roots with a machine that caters to the desires of PC gaming enthusiasts and longtime Alienware fans who have a deep appreciation for technology and a can-do attitude for manually customizing their build to their needs. It is an icon that honors the wishes of all gamers seeking unyielding performance and the ability to make serious upgrades for years to come.

With the new Core Distro Plate 280, Core Distro Plate 420 and Core Distro Plate 480, Alphacool presents the perfect addition for high-end water cooling projects. With its Core design, it is not only an absolute eye-catcher, but also a functional masterpiece that facilitates the construction and planning of complex water circuits and offers uncomplicated installation.

The Core Distro Plate 280 is available in two versions - with a pump connection on either the left or right side. This offers maximum flexibility for different casing configurations. The Core Distro Plate 420 and Core Distro Plate 480 come with a pump connection on the left-hand side and are ideal for larger builds.

Renowned for its groundbreaking innovations in computing technology, GIGABYTE Technology continues to spearhead advancements that redefine the industry. From January 7 to 10, 2025, GIGABYTE will participate in CES, showcasing its latest breakthroughs in high-performance computing and personal computing solutions. Under the theme "ACCEVOLUTION," GIGABYTE's booth will present a diverse range of cutting-edge technologies. Highlights include:

• Rack-scale cluster computing solution for large-scale data centers
• AI servers supporting next-generation "superchips"
• Advanced cooling technologies that optimize energy efficiency and performance
• Workstations tailored for smaller-scale workloads
• Mini-PCs, embedded systems, and in-vehicle platforms designed for endpoint deployment and commercial applications

Giga Computing, a subsidiary of GIGABYTE and an industry leader in generative AI servers and advanced cooling technologies, shows off at SC24 how the GIGABYTE enterprise portfolio provides solutions for all applications, from cloud computing to AI to enterprise IT, including energy-efficient liquid-cooling technologies. This portfolio is made more complete by long-term collaborations with leading technology companies and emerging industry leaders, which will be showcased at GIGABYTE booth #3123 at SC24 (Nov. 19-21) in Atlanta. The booth is sectioned to put the spotlight on strategic technology collaborations, as well as direct liquid cooling partners.

The GIGABYTE booth will showcase an array of NVIDIA platforms built to keep up with the diversity of workloads and degrees of demands in applications of AI & HPC hardware. For a rack-scale AI solution using the NVIDIA GB200 NVL72 design, GIGABYTE displays how seventy-two GPUs can be in one rack with eighteen GIGABYTE servers each housing two NVIDIA Grace CPUs and four NVIDIA Blackwell GPUs. Another platform at the GIGABYTE booth is the NVIDIA HGX H200 platform. GIGABYTE exhibits both its liquid-cooling G4L3-SD1 server and an air-cooled version, G593-SD1.

Today, Hewlett Packard Enterprise announces its new high performance computing (HPC) and artificial intelligence (AI) infrastructure portfolio that includes leadership-class HPE Cray Supercomputing EX solutions and two systems optimized for large language model (LLM) training, natural language processing (NLP) and multi-modal model training. The new supercomputing solutions are designed to help global customers fast-track scientific research and invention.

"Service providers and nations investing in sovereign AI initiatives are increasingly turning to high-performance computing as the critical backbone enabling large-scale AI training that accelerates discovery and innovation," said Trish Damkroger, senior vice president and general manager, HPC & AI Infrastructure Solutions at HPE. "Our customers turn to us to fast-track their AI system deployment to realize value faster and more efficiently by leveraging our world-leading HPC solutions and decades of experience in delivering, deploying and servicing fully-integrated systems."

GameMax, an emerging brand of PC gaming components, including gaming cases and power supply units, is thrilled to announce the new Infinity Pro gaming chassis. The chassis features a dual-chamber layout with a panoramic tempered glass design. The GameMax Infinity Pro is perfect for showcasing the beauty of internal components and RGB illumination, with tempered glass panels on the front, side, and top of the case. The GameMax Infinity Pro comes equipped with five 120 mm PWM ARGB fans and a fan and ARGB controller hub, providing sufficient cooling for high-end gaming configurations right out of the box. Additionally, the fan and ARGB controller hub include 81 built-in lighting effects and support motherboard RGB sync technologies when connected to the motherboard's RGB header.

The GameMax Infinity Pro gaming chassis also supports back-connector motherboards such as the ASUS BTF motherboards, GIGABYTE STEALTH motherboards, and MSI PROJECT ZERO motherboards. For cooling, the chassis supports up to 360 mm radiators for liquid cooling. The chassis supports a maximum of 8x 120 mm fans. The GameMax Infinity Pro gaming chassis is available in black and white models.

Asetek reported third-quarter revenue of $12.2 million compared with $20.5 million in the same period of 2023. Revenue for the first nine months was $37.1 million compared with $59.7 million in the same period of 2023. The change in both periods reflects fewer shipments of liquid cooling products, partly offset by an increase in shipments of SimSports products. Gross margin was 36% for the third quarter and 42% for the first nine months, compared with 46% and 45% in the respective periods of 2023. The change in gross margin reflects the write-off of certain inventory that was adversely affected by a supply chain quality issue that has since been rectified.

"Our SimSports business experiences strong traction with new acclaimed products, new strategically important distribution agreements and a clear pathway to millions of new simulation gamers in the console market. We are also taking action to stabilize the Liquid Cooling business and position for future growth with a lower cost base and a wider offering addressing the changing market preferences," says André S. Eriksen, the CEO of Asetek.

The holiday season is here! MSI's Ultra Connect to New ERA Steam Code Promotion is your gateway to free Steam codes with our latest, most powerful products. Don't miss out - join now and gear up for an unforgettable gaming holiday!

About EZ-DIY Features - Motherboard, Liquid Cooling, PC Case
MSI has unveiled a new lineup of DIY-friendly products designed to simplify PC building for everyone, from beginners to experienced enthusiasts. The X870 (E) & Z890 motherboards come equipped with the EZ M.2 CLIP II, which enables quick, tool-free M.2 SSD installation, along with the EZ PCIe Release for easy and secure graphics card removal at the push of a button. The MAG CORELIQUID I series liquid cooling system features a universal UNI Bracket compatible with both Intel and AMD sockets. Its pre-installed fans simplify cable management to just one cable, while optional cable covers provide a clean and personalized look. Additionally, MSI's MAG PANO series PC cases offer tool-free panels on the front, side, and top, ensuring unrestricted access for adding side fans or radiators. MSI's user-friendly lineup aims to make PC building smoother, faster, and more enjoyable for everyone.

Supermicro, Inc., a Total IT Solution Provider for AI, Cloud, Storage, and 5G/Edge, is accelerating the industry's transition to liquid-cooled data centers with the NVIDIA Blackwell platform to deliver a new paradigm of energy-efficiency for the rapidly heightened energy demand of new AI infrastructures. Supermicro's industry-leading end-to-end liquid-cooling solutions are powered by the NVIDIA GB200 NVL72 platform for exascale computing in a single rack and have started sampling to select customers for full-scale production in late Q4. In addition, the recently announced Supermicro X14 and H14 4U liquid-cooled systems and 10U air-cooled systems are production-ready for the NVIDIA HGX B200 8-GPU system.

"We're driving the future of sustainable AI computing, and our liquid-cooled AI solutions are rapidly being adopted by some of the most ambitious AI Infrastructure projects in the world with over 2000 liquid-cooled racks shipped since June 2024," said Charles Liang, president and CEO of Supermicro. "Supermicro's end-to-end liquid-cooling solution, with the NVIDIA Blackwell platform, unlocks the computational power, cost-effectiveness, and energy-efficiency of the next generation of GPUs, such as those that are part of the NVIDIA GB200 NVL72, an exascale computer contained in a single rack. Supermicro's extensive experience in deploying liquid-cooled AI infrastructure, along with comprehensive on-site services, management software, and global manufacturing capacity, provides customers a distinct advantage in transforming data centers with the most powerful and sustainable AI solutions."

Flex today announced new reference platforms for liquid-cooled servers, rack, and power products that will enable customers to sustainably accelerate data center growth. These innovations build on Flex's ability to address technical challenges associated with power, heat generation, and scale to support artificial intelligence (AI) and high-performance computing (HPC) workloads.

"Flex delivers integrated data center IT and power infrastructure solutions that address the growing power and compute demands in the AI era," said Michael Hartung, president and chief commercial officer, Flex. "We are expanding our unique portfolio of advanced manufacturing capabilities, innovative products, and lifecycle services, enabling customers to deploy IT and power infrastructure at scale and drive AI data center expansion."

In close cooperation with hyperscalers and server OEMs, Rittal has developed a modular cooling distribution unit (CDU) that delivers a cooling capacity of over 1 MW. It will be the centerpiece exhibit at Rittal's booth A24 at 2024 OCP Global Summit. The CDU uses direct liquid cooling based on water - and is thus an example for new IT infrastructure technologies that are enablers for AI applications.

New technology, familiar handling?
"To put the technology into practice, it is not enough to simply provide the cooling capacity and integrate the solution into the facility - which also still poses challenges," says Lars Platzhoff, Head of Rittal's Business Unit Cooling Solutions: "Despite the new technology, the solutions must remain manageable by the data center team as part of the usual service. At best, this should be taken into account already at the design stage."

Hewlett Packard Enterprise announced the industry's first 100% fanless direct liquid cooling systems architecture to enhance the energy and cost efficiency of large-scale AI deployments. The company introduced the innovation at its AI Day, held for members of the financial community at one of its state-of-the-art AI systems manufacturing facilities. During the event, the company showcased its expertise and leadership in AI across enterprises, sovereign governments, service providers and model builders.

Industry's first 100% fanless direct liquid cooling system
While efficiency has improved in next-generation accelerators, power consumption is continuing to intensify with AI adoption, outstripping traditional cooling techniques.