Bitspower is known more for its DIY liquid cooling gear for the PC enthusiast, and workstation market segments, but is looking to broaden its reach. At the 2025 International CES, the company showed off its first all-in-one liquid CPU coolers—or at least their boxes. The Bitspower Atlas series of AIO CLCs come in 240 mm and 360 mm size variants, with black and white color variants. The pump-block has a cubical shape with coolant fittings coming from the side, and an infinity reflection ornament on top. The coolers include two or three of Bitspower's Griffin series 120 mm ARGB fans. The cooler uses a copper cold-plate and an aluminium radiator to stay in the market segment.

Each of the Griffin 120 mm ARGB fans included with the Atlas series AIOs turns at speeds of up to 2,200 RPM, pushing up to 83.83 CFM of airflow, at 2.77 mm H₂O static pressure, and around 38 dBA of noise. The company didn't mention bearing type. These fans can also be had in packs of 3. Bitspower also showed off its liquid cooling loop for 2P workstations or servers, as well as its premium AIOs built around its 2U radiators and 60 mm industrial fans. Lastly, there was an assortment of Concept X and Summit series CPU water blocks. We've seen many of these blocks at last year's CES and Computex, so nothing new to report here.

Inno3D, a devoted NVIDIA partner showcased at CES 2025 its own implementations of NVIDIA GeForce RTX 50 Series GPUs powered by NVIDIA Blackwell architecture. Inno3D custom cooling solutions include the impressive iChill Frostbite liquid cooling and the huge iChill air cooling alternative complemented by the X3 and Twin X2 solutions. Before moving on we like to mention that all the graphics cards, even the RTX 5090 are powered by a single 12-pin connector.

Immediately our eyes observed the iChill Frostbite GeForce RTX 5090 dual-slot graphic cards with an impressive liquid cooling system, something enthusiasts looking for a compact yet high-performance system will surely desire. Next to it, even a blind man could not miss the huge iChill X3 RTX 5080, a 3.5-slot monster. The gargantuan proportions are due to the oversized cooling solution that relies on a combination of three fans (with the outer fans rotating in an anticlockwise direction to reduce turbulence and improve airflow), a huge vapor chamber complemented by a heatsink and a custom backplate that aid hot air extraction to protect the PCB from overheating.

ADATA brought some innovative storage products to the 2025 International CES. The XPG MARS 970 Storm is an M.2 NVMe Gen 5 SSD with a self-contained liquid cooling loop. Its construction involves a baseplate from which heat is conventionally transferred to a cylindrical heat dissipation surface—a sort of radiator, where a pair of tiny 20 mm fans push and pull air through, to keep the controller cool. Speaking of which, the drive is based on the Silicon Motion SM2508 flagship controller that's built on the TSMC 6 nm process. It comes in capacities of up to 8 TB. ADATA claims sequential transfer speeds of up to 14 GB/s reads, with up to 12 GB/s writes.

You can have this drive without this cooling solution (eg: if you have a nice one of your own from your motherboard). It's called the MARS 970 Blade. It can be used without a cooler, but performance will be lesser. ADATA hence advertises sequential speeds of up to 12 GB/s reads, with up to 10 GB/s writes. The MARS 970 Blade strangely only comes in capacities of up to 4 TB—there's no 8 TB variant.

MSI has gone all in with NVIDIA's freshly debuted GeForce RTX 50 "Blackwell" GPU series at CES 2025—an impressive number of custom models have been unveiled on the showroom floor. The TechPowerUp team has sifted through many of MSI's latest and greatest, but also noticed an intriguing set of placards positioned next to the tech firm's vast selection of physical products. The "exclusive" information at hand points to two in-progress GeForce RTX 5090 models—informally named as "Lightning" Special Editions. Company representatives have revealed that the engineering team is concocting a purpose-made PCB design for the two upcoming cards. This board supposedly sports enough differences to distinguish itself from NVIDIA's reference layout (as seen on their Founder's Edition)—industry experts reckon that the majority of AIBs will be utilizing Team Green's standard GeForce RTX 5090 PCB.

The printed graphic indicates that MSI's mysterious liquid cooled Special Edition GeForce RTX 32G will arrive with the "ultimate all-in-one (AIO) water cooling solution"—referred to as their "HydroCool System." A twin STORMFORCE fan configuration is teased alongside advanced airflow channels and a next-gen dual 120 mm AIO liquid cooling system. Custom-engineered water channels are advertised as being capable of flowing "directly through" the card's onboard memory. Dual front intakes and exhausts are said to assist greatly in cooling this Special Edition model, as well as neighboring PC components. Users can implement independent custom fan speed tunings; presumably via MSI software. It will be interesting to see how this in-the-works AIO-based model stacks up against the premium-tier "two-piece" MSI RTX 5090 SUPRIM LIQUID SOC.

HYTE, a leading manufacturer of cutting-edge PC components and peripherals, announced today at this year's Consumer Electronics Show (CES) that the THICC Q80 Trio, a 360 mm version of its renowned THICC Q60 all-in-one (AIO) liquid cooler, is now available for pre-order at the MSRP of $319.99. Set to launch in Q1 2025, this new cooler builds on HYTE's design and cooling innovations with increased performance capabilities thanks to its thicker size while offering more personalization options thanks to HYTE's flagship Nexus 2.0 software solution. To pre-order the THICC Q80 Trio, please visit: https://hyte.com/q80

"THICC"-ER PERFORMANCE GAINS
Designed to fit the HYTE Y70 and Y70 Touch Infinite cases down to the last millimeter while remaining compatible with a plethora of additional chassis, the THICC Q80 Trio is capable of even more performance thanks to its ginormous heat exchanger, which measures 360 mm long and 52 mm thick for maximum cooling capacity and efficiency. The THICC Q80 Trio also boasts a larger, second-generation copper cold plate with a revised liquid flow path that further enhances temperatures while improving socket compatibility.

The Cooling X Pro from Cooler Master is a case designed for the "cooling defined build," a high-end PC build where the primary focus is on high-performance liquid cooling of the CPU, GPU, and NVMe SSD. The case reimagines the layout of key components in the build, such as positioning the PSU toward the front, putting the CPU and VGA under a proprietary liquid cooling solution, and using a large, common square 360 mm x 360 mm radiator to dissipate heat from both. This is ventilated by four 180 mm fans.

Besides this unique cooling solution, the Cooling X Pro appears to feature an aluminium inner chassis similar to the MasterFrame Aluminium series that the company also showcased this year. The various panels aren't as modular, the one facing the left side is a curved tempered glass. The right probably features a coarse mesh panel to let the 360 mm x 360 mm radiator breathe.

GIGABYTE Technology, internationally renowned for its R&D capabilities and a leading innovator in server and data center solutions, continues to lead technological innovation during this critical period of AI and computing advancement. With its comprehensive AI product portfolio, GIGABYTE will showcase its complete range of AI computing solutions at CES 2025, from data center infrastructure to IoT applications and personal computing, demonstrating how its extensive product line enables digital transformation across all sectors in this AI-driven era.

Powering AI from the Cloud
With AI Large Language Models (LLMs) now routinely featuring parameters in the hundreds of billions to trillions, robust training environments (data centers) have become a critical requirement in the AI race. GIGABYTE offers three distinctive solutions for AI infrastructure.
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Alienware is reintroducing the iconic Area-51 back into the family, reanimated in desktop and laptop forms. Deep lore underpins Area-51, dating back to 1998. While the design, technology and gameplay have evolved significantly from iteration to iteration, one fact has remained the same: Area-51 represents the best that Alienware offers. Reclaiming its position as the ultimate gaming experience, the new Area-51 Desktop debut an arsenal of cutting-edge features -- including next-gen NVIDIA graphics - to power the next generation of AAA gameplay.

ALIENWARE AREA-51 DESKTOP
Area-51 Desktop makes a bold entrance to retake the throne as Alienware's flagship gaming PC. With this edition, we are returning to our roots with a machine that caters to the desires of PC gaming enthusiasts and longtime Alienware fans who have a deep appreciation for technology and a can-do attitude for manually customizing their build to their needs. It is an icon that honors the wishes of all gamers seeking unyielding performance and the ability to make serious upgrades for years to come.

With the new Core Distro Plate 280, Core Distro Plate 420 and Core Distro Plate 480, Alphacool presents the perfect addition for high-end water cooling projects. With its Core design, it is not only an absolute eye-catcher, but also a functional masterpiece that facilitates the construction and planning of complex water circuits and offers uncomplicated installation.

The Core Distro Plate 280 is available in two versions - with a pump connection on either the left or right side. This offers maximum flexibility for different casing configurations. The Core Distro Plate 420 and Core Distro Plate 480 come with a pump connection on the left-hand side and are ideal for larger builds.

Renowned for its groundbreaking innovations in computing technology, GIGABYTE Technology continues to spearhead advancements that redefine the industry. From January 7 to 10, 2025, GIGABYTE will participate in CES, showcasing its latest breakthroughs in high-performance computing and personal computing solutions. Under the theme "ACCEVOLUTION," GIGABYTE's booth will present a diverse range of cutting-edge technologies. Highlights include:

• Rack-scale cluster computing solution for large-scale data centers
• AI servers supporting next-generation "superchips"
• Advanced cooling technologies that optimize energy efficiency and performance
• Workstations tailored for smaller-scale workloads
• Mini-PCs, embedded systems, and in-vehicle platforms designed for endpoint deployment and commercial applications

Giga Computing, a subsidiary of GIGABYTE and an industry leader in generative AI servers and advanced cooling technologies, shows off at SC24 how the GIGABYTE enterprise portfolio provides solutions for all applications, from cloud computing to AI to enterprise IT, including energy-efficient liquid-cooling technologies. This portfolio is made more complete by long-term collaborations with leading technology companies and emerging industry leaders, which will be showcased at GIGABYTE booth #3123 at SC24 (Nov. 19-21) in Atlanta. The booth is sectioned to put the spotlight on strategic technology collaborations, as well as direct liquid cooling partners.

The GIGABYTE booth will showcase an array of NVIDIA platforms built to keep up with the diversity of workloads and degrees of demands in applications of AI & HPC hardware. For a rack-scale AI solution using the NVIDIA GB200 NVL72 design, GIGABYTE displays how seventy-two GPUs can be in one rack with eighteen GIGABYTE servers each housing two NVIDIA Grace CPUs and four NVIDIA Blackwell GPUs. Another platform at the GIGABYTE booth is the NVIDIA HGX H200 platform. GIGABYTE exhibits both its liquid-cooling G4L3-SD1 server and an air-cooled version, G593-SD1.

Today, Hewlett Packard Enterprise announces its new high performance computing (HPC) and artificial intelligence (AI) infrastructure portfolio that includes leadership-class HPE Cray Supercomputing EX solutions and two systems optimized for large language model (LLM) training, natural language processing (NLP) and multi-modal model training. The new supercomputing solutions are designed to help global customers fast-track scientific research and invention.

"Service providers and nations investing in sovereign AI initiatives are increasingly turning to high-performance computing as the critical backbone enabling large-scale AI training that accelerates discovery and innovation," said Trish Damkroger, senior vice president and general manager, HPC & AI Infrastructure Solutions at HPE. "Our customers turn to us to fast-track their AI system deployment to realize value faster and more efficiently by leveraging our world-leading HPC solutions and decades of experience in delivering, deploying and servicing fully-integrated systems."

GameMax, an emerging brand of PC gaming components, including gaming cases and power supply units, is thrilled to announce the new Infinity Pro gaming chassis. The chassis features a dual-chamber layout with a panoramic tempered glass design. The GameMax Infinity Pro is perfect for showcasing the beauty of internal components and RGB illumination, with tempered glass panels on the front, side, and top of the case. The GameMax Infinity Pro comes equipped with five 120 mm PWM ARGB fans and a fan and ARGB controller hub, providing sufficient cooling for high-end gaming configurations right out of the box. Additionally, the fan and ARGB controller hub include 81 built-in lighting effects and support motherboard RGB sync technologies when connected to the motherboard's RGB header.

The GameMax Infinity Pro gaming chassis also supports back-connector motherboards such as the ASUS BTF motherboards, GIGABYTE STEALTH motherboards, and MSI PROJECT ZERO motherboards. For cooling, the chassis supports up to 360 mm radiators for liquid cooling. The chassis supports a maximum of 8x 120 mm fans. The GameMax Infinity Pro gaming chassis is available in black and white models.

Asetek reported third-quarter revenue of $12.2 million compared with $20.5 million in the same period of 2023. Revenue for the first nine months was $37.1 million compared with $59.7 million in the same period of 2023. The change in both periods reflects fewer shipments of liquid cooling products, partly offset by an increase in shipments of SimSports products. Gross margin was 36% for the third quarter and 42% for the first nine months, compared with 46% and 45% in the respective periods of 2023. The change in gross margin reflects the write-off of certain inventory that was adversely affected by a supply chain quality issue that has since been rectified.

"Our SimSports business experiences strong traction with new acclaimed products, new strategically important distribution agreements and a clear pathway to millions of new simulation gamers in the console market. We are also taking action to stabilize the Liquid Cooling business and position for future growth with a lower cost base and a wider offering addressing the changing market preferences," says André S. Eriksen, the CEO of Asetek.

The holiday season is here! MSI's Ultra Connect to New ERA Steam Code Promotion is your gateway to free Steam codes with our latest, most powerful products. Don't miss out - join now and gear up for an unforgettable gaming holiday!

About EZ-DIY Features - Motherboard, Liquid Cooling, PC Case
MSI has unveiled a new lineup of DIY-friendly products designed to simplify PC building for everyone, from beginners to experienced enthusiasts. The X870 (E) & Z890 motherboards come equipped with the EZ M.2 CLIP II, which enables quick, tool-free M.2 SSD installation, along with the EZ PCIe Release for easy and secure graphics card removal at the push of a button. The MAG CORELIQUID I series liquid cooling system features a universal UNI Bracket compatible with both Intel and AMD sockets. Its pre-installed fans simplify cable management to just one cable, while optional cable covers provide a clean and personalized look. Additionally, MSI's MAG PANO series PC cases offer tool-free panels on the front, side, and top, ensuring unrestricted access for adding side fans or radiators. MSI's user-friendly lineup aims to make PC building smoother, faster, and more enjoyable for everyone.

Supermicro, Inc., a Total IT Solution Provider for AI, Cloud, Storage, and 5G/Edge, is accelerating the industry's transition to liquid-cooled data centers with the NVIDIA Blackwell platform to deliver a new paradigm of energy-efficiency for the rapidly heightened energy demand of new AI infrastructures. Supermicro's industry-leading end-to-end liquid-cooling solutions are powered by the NVIDIA GB200 NVL72 platform for exascale computing in a single rack and have started sampling to select customers for full-scale production in late Q4. In addition, the recently announced Supermicro X14 and H14 4U liquid-cooled systems and 10U air-cooled systems are production-ready for the NVIDIA HGX B200 8-GPU system.

"We're driving the future of sustainable AI computing, and our liquid-cooled AI solutions are rapidly being adopted by some of the most ambitious AI Infrastructure projects in the world with over 2000 liquid-cooled racks shipped since June 2024," said Charles Liang, president and CEO of Supermicro. "Supermicro's end-to-end liquid-cooling solution, with the NVIDIA Blackwell platform, unlocks the computational power, cost-effectiveness, and energy-efficiency of the next generation of GPUs, such as those that are part of the NVIDIA GB200 NVL72, an exascale computer contained in a single rack. Supermicro's extensive experience in deploying liquid-cooled AI infrastructure, along with comprehensive on-site services, management software, and global manufacturing capacity, provides customers a distinct advantage in transforming data centers with the most powerful and sustainable AI solutions."

Flex today announced new reference platforms for liquid-cooled servers, rack, and power products that will enable customers to sustainably accelerate data center growth. These innovations build on Flex's ability to address technical challenges associated with power, heat generation, and scale to support artificial intelligence (AI) and high-performance computing (HPC) workloads.

"Flex delivers integrated data center IT and power infrastructure solutions that address the growing power and compute demands in the AI era," said Michael Hartung, president and chief commercial officer, Flex. "We are expanding our unique portfolio of advanced manufacturing capabilities, innovative products, and lifecycle services, enabling customers to deploy IT and power infrastructure at scale and drive AI data center expansion."

In close cooperation with hyperscalers and server OEMs, Rittal has developed a modular cooling distribution unit (CDU) that delivers a cooling capacity of over 1 MW. It will be the centerpiece exhibit at Rittal's booth A24 at 2024 OCP Global Summit. The CDU uses direct liquid cooling based on water - and is thus an example for new IT infrastructure technologies that are enablers for AI applications.

New technology, familiar handling?
"To put the technology into practice, it is not enough to simply provide the cooling capacity and integrate the solution into the facility - which also still poses challenges," says Lars Platzhoff, Head of Rittal's Business Unit Cooling Solutions: "Despite the new technology, the solutions must remain manageable by the data center team as part of the usual service. At best, this should be taken into account already at the design stage."

Hewlett Packard Enterprise announced the industry's first 100% fanless direct liquid cooling systems architecture to enhance the energy and cost efficiency of large-scale AI deployments. The company introduced the innovation at its AI Day, held for members of the financial community at one of its state-of-the-art AI systems manufacturing facilities. During the event, the company showcased its expertise and leadership in AI across enterprises, sovereign governments, service providers and model builders.

Industry's first 100% fanless direct liquid cooling system
While efficiency has improved in next-generation accelerators, power consumption is continuing to intensify with AI adoption, outstripping traditional cooling techniques.

GIGABYTE Technology a leader in innovative cooling solutions, proudly announces the launch of the AORUS WATERFORCE AIO cooler, meticulously engineered to meet the demanding cooling needs of Intel Socket LGA 1851 CPU. With significant changes in hotspot locations and thermal requirements across the new CPU lineup, ensuring optimal cooling performance across all model configurations has become imperative. The AORUS WATERFORCE AIO cooler is designed with three key features that significantly enhance cooling efficiency for Socket LGA 1851 CPU.

Optimal Mounting Pressure Design
In alignment with Intel Socket LGA 1851 (Arrow Lake-S) Thermal Design Guide, the new socket LGA 1851 requires increased mounting pressure for optimal thermal performance. The AORUS WATERFORCE X II series & non-X II series cooler provides maximum mounting pressure, ensuring a firm fit that enhances heat transfer from the CPU to the cooler.

Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, is announcing a complete liquid cooling solution that includes powerful Coolant Distribution Units (CDUs), cold plates, Coolant Distribution Manifolds (CDMs), cooling towers and end to end management software. This complete solution reduces ongoing power costs and Day 0 hardware acquisition and data center cooling infrastructure costs. The entire end-to-end data center scale liquid cooling solution is available directly from Supermicro.

"Supermicro continues to innovate, delivering full data center plug-and-play rack scale liquid cooling solutions," said Charles Liang, CEO and president of Supermicro. "Our complete liquid cooling solutions, including SuperCloud Composer for the entire life-cycle management of all components, are now cooling massive, state-of-the-art AI factories, reducing costs and improving performance. The combination of Supermicro deployment experience and delivering innovative technology is resulting in data center operators coming to Supermicro to meet their technical and financial goals for both the construction of greenfield sites and the modernization of existing data centers. Since Supermicro supplies all the components, the time to deployment and online are measured in weeks, not months."

Asetek announce the appointment of Maja Sand-Grimnitz as vice president (VP) Brand and Digital, and Henrik Lindskou-Mouritsen as VP Global Sales. They bring extensive experience from commercialization of gaming hardware and international sales to drive deployment of Asetek's acclaimed sim racing products and build on the leading position within Liquid Cooling.

"I am pleased to have both Henrik and Maja join Asetek, further strengthening our commercial focus and enabling increased efficiencies by consolidating the management team in Denmark," said André Sloth Eriksen the CEO of Asetek. "We are positioning for significant growth within SimSports and a changing Liquid Cooling market with more direct end-user dialogue over time and potential to capture material revenue synergies across our two business segments under a strong Asetek brand."

Small - but powerful! Alphacool presents new sizes of the popular Core reservoir. This should not be missing in any performance-orientated custom water cooling system in which CPU and graphics card(s) are cooled simultaneously. The reservoir is available in two sizes, both with and without a pump.

The chrome-plated brass G1/4' connections are a stylish and elegant element of the Core reservoir. The connections, which are embedded in the acrylic and fitted with an O-ring, are absolutely leak-proof and support the clear and functional look of the Alphacool Core Design series. Alphacool's Core reservoir is made of high-quality acrylic glass, which allows a clear view of the coolant. Brilliant lighting is made possible by the built-in, digitally addressable aRGB lighting.

Supermicro, Inc. a Total IT Solution Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge, today adds new maximum performance GPU, multi-node, and rackmount systems to the X14 portfolio, which are based on the Intel Xeon 6900 Series Processors with P-Cores (formerly codenamed Granite Rapids-AP). The new industry-leading selection of workload-optimized servers addresses the needs of modern data centers, enterprises, and service providers. Joining the efficiency-optimized X14 servers leveraging the Xeon 6700 Series Processors with E-cores launched in June 2024, today's additions bring maximum compute density and power to the Supermicro X14 lineup to create the industry's broadest range of optimized servers supporting a wide variety of workloads from demanding AI, HPC, media, and virtualization to energy-efficient edge, scale-out cloud-native, and microservices applications.

"Supermicro X14 systems have been completely re-engineered to support the latest technologies including next-generation CPUs, GPUs, highest bandwidth and lowest latency with MRDIMMs, PCIe 5.0, and EDSFF E1.S and E3.S storage," said Charles Liang, president and CEO of Supermicro. "Not only can we now offer more than 15 families, but we can also use these designs to create customized solutions with complete rack integration services and our in-house developed liquid cooling solutions."

Supermicro, Inc., a Total IT Solution Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge is announcing the all-new FlexTwin family of systems which has been designed to address the needs of scientists, researchers, governments, and enterprises undertaking the world's most complex and demanding computing tasks. Featuring flexible support for the latest CPU, memory, storage, power and cooling technologies, FlexTwin is purpose-built to support demanding HPC workloads including financial services, scientific research, and complex modeling. These systems are cost-optimized for performance per dollar and can be customized to suit specific HPC applications and customer requirements thanks to Supermicro's modular Building Block Solutions design.

"Supermicro's FlexTwin servers set a new standard of performance density for rack-scale deployments with up to 96 dual processor compute nodes in a standard 48U rack," said Charles Liang, president and CEO of Supermicro. "At Supermicro, we're able to offer a complete one-stop solution that includes servers, racks, networking, liquid cooling components, and liquid cooling towers, speeding up the time to deployment and resulting in higher quality and reliability across the entire infrastructure, enabling customers faster time to results. Up to 90% of the server generated heat is removed with the liquid cooling solution, saving significant amounts of energy and enabling higher compute performance."