Imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, presents patterned structures obtained after exposure with the 0.55NA EUV scanner in the joint ASML-imec High NA EUV Lithography Lab in Veldhoven, the Netherlands. Random logic structures down to 9,5 nm (19 nm pitch), random vias with 30 nm center-to-center distance, 2D features at 22 nm pitch, and a DRAM specific lay out at P32nm were printed after single exposure, using materials and baseline processes that were optimized for High NA EUV by imec and its partners in the framework of imec's Advanced Patterning Program. With these results, imec confirms the readiness of the ecosystem to enable single exposure high-resolution High NA EUV Lithography.

Following the recent opening of the joint ASML-imec High NA EUV Lithography Lab in Veldhoven, the Netherlands, customers now have access to the (TWINSCAN EXE:5000) High NA EUV scanner to develop private High NA EUV use cases leveraging the customer's own design rules and lay outs.

Apple today announced M4, the latest chip delivering phenomenal performance to the all-new iPad Pro. Built using second-generation 3-nanometer technology, M4 is a system on a chip (SoC) that advances the industry-leading power efficiency of Apple silicon and enables the incredibly thin design of iPad Pro. It also features an entirely new display engine to drive the stunning precision, color, and brightness of the breakthrough Ultra Retina XDR display on iPad Pro. A new CPU has up to 10 cores, while the new 10-core GPU builds on the next-generation GPU architecture introduced in M3, and brings Dynamic Caching, hardware-accelerated ray tracing, and hardware-accelerated mesh shading to iPad for the first time. M4 has Apple's fastest Neural Engine ever, capable of up to 38 trillion operations per second, which is faster than the neural processing unit of any AI PC today. Combined with faster memory bandwidth, along with next-generation machine learning (ML) accelerators in the CPU, and a high-performance GPU, M4 makes the new iPad Pro an outrageously powerful device for artificial intelligence.

"The new iPad Pro with M4 is a great example of how building best-in-class custom silicon enables breakthrough products," said Johny Srouji, Apple's senior vice president of Hardware Technologies. "The power-efficient performance of M4, along with its new display engine, makes the thin design and game-changing display of iPad Pro possible, while fundamental improvements to the CPU, GPU, Neural Engine, and memory system make M4 extremely well suited for the latest applications leveraging AI. Altogether, this new chip makes iPad Pro the most powerful device of its kind."

Atom Computing announced it has created a 1,225-site atomic array, currently populated with 1,180 qubits, in its next-generation quantum computing platform. This is the first time a company has crossed the 1,000-qubit threshold for a universal gate-based system, planned for release next year. It marks an industry milestone toward fault-tolerant quantum computers capable of solving large-scale problems.

CEO Rob Hays said rapid scaling is a key benefit of Atom Computing's unique atomic array technology. "This order-of-magnitude leap - from 100 to 1,000-plus qubits within a generation - shows our atomic array systems are quickly gaining ground on more mature qubit modalities," Hays said. "Scaling to large numbers of qubits is critical for fault-tolerant quantum computing, which is why it has been our focus from the beginning. We are working closely with partners to explore near-term applications that can take advantage of these larger scale systems."

In response to the increasing demand for powerful computing that can be relied on in a wide range of even the most challenging installation environments, leading industrial computing manufacturer and solution provider, OnLogic (www.onlogic.com), has unveiled their Helix 401 fanless industrial computer. The compact device is designed for use in edge computing, industry 4.0, Internet of Things (IoT), and many other emerging applications and will make its public debut at Embedded World 2023.

"You may never see them, but industrial computers are everywhere, working diligently to power technology solutions of every shape and size. These systems need to be small and reliable while still being just as powerful as high-end desktop machines," says Mike Walsh, Senior Product Manager at OnLogic. "The Helix 401 balances size and performance while providing a wide range of configuration possibilities to help users tailor it to their specific application. It's small enough to fit in your hand, similar in size to Intel's popular NUC, but capable enough to drive advanced automation solutions and power the next great smart agriculture, building automation or energy management innovation."

Our first-quarter net sales came in at €3.5 billion which is at the high end of our guidance. The gross margin of 49.0%, is as guided. Our first-quarter net bookings came in at €7.0 billion, including €2.5 billion from 0.33 NA and 0.55 NA EUV systems as well as very strong DUV bookings, reflecting the continued high demand for advanced and mature nodes.

"We continue to see that the demand for our systems is higher than our current production capacity. We accommodate our customers through offering high-productivity upgrades and reducing cycle time in our factories, and we continue to offer a fast shipment process. In addition, we are actively working to significantly expand capacity together with our supply chain partners. In light of the demand and our plans to increase capacity, we expect to revisit our scenarios for 2025 and growth opportunities beyond. We plan to communicate updates in the second half of the year.

The output value of the world's top 10 foundries in 4Q21 reached US$29.55 billion, or 8.3% growth QoQ, according to TrendForce's research. This is due to the interaction of two major factors. One is limited growth in overall production capacity. At present, the shortage of certain components for TVs and laptops has eased but there are other peripheral materials derived from mature process such as PMIC, Wi-Fi, and MCU that are still in short supply, precipitating continued fully loaded foundry capacity. Second is rising average selling price (ASP). In the fourth quarter, more expensive wafers were produced in succession led by TSMC and foundries continued to adjust their product mix to increase ASP. In terms of changes in this quarter's top 10 ranking, Nexchip overtook incumbent DB Hitek to clinch 10th place.

TrendForce believes that the output value of the world's top ten foundries will maintain a growth trend in 1Q22 but appreciation in ASP will still be the primary driver of said growth. However, since there are fewer first quarter working days in the Greater China Area due to the Lunar New Year holiday and this is the time when some foundries schedule an annual maintenance period, 1Q22 growth rate will be down slightly compared to 4Q21.

In 2016, NVIDIA announced that the company is working on replacing its Fast Logic Controller processor codenamed Falcon with a new GPU System Processor (GSP) solution based on RISC-V Instruction Set Architecture (ISA). This novel RISC-V processor is codenamed NV-RISCV and has been used as GPU's controller core, coordinating everything in the massive pool of GPU cores. Today, NVIDIA has decided to open this NV-RISCV CPU to a broader spectrum of applications starting with 510.39 drivers. According to the NVIDIA documents, this is only available in the select GPUs for now, mainly data-centric Tesla accelerators.

NVIDIA DocumentsSome GPUs include a GPU System Processor (GSP) which can be used to offload GPU initialization and management tasks. This processor is driven by the firmware file /lib/firmware/nvidia/510.39.01/gsp.bin. A few select products currently use GSP by default, and more products will take advantage of GSP in future driver releases.
Offloading tasks which were traditionally performed by the driver on the CPU can improve performance due to lower latency access to GPU hardware internals.

Today, ASML Holding NV (ASML) has published its 2021 third-quarter results. "Our third-quarter net sales came in at €5.2 billion with a gross margin of 51.7%, both within our guidance. Our third-quarter net bookings came in at €6.2 billion, including €2.9 billion from EUV systems. The demand continues to be high. The ongoing digital transformation and current chip shortage fuel the need to increase our capacity to meet the current and expected future demand for Memory and for all Logic nodes. ASML expects fourth-quarter net sales between €4.9 billion and €5.2 billion with a gross margin between 51% and 52%. ASML expects R&D costs of around €670 million and SG&A costs of around €195 million. For the full year, we are on track to achieving growth approaching 35%," said ASML President and Chief Executive Officer Peter Wennink.

Scaling and manufacturing of ever shrinking semiconductor devices is becoming more challenging as smaller nodes are introduced. As we have approached 7 nanometers, economies of scale are becoming more influential than scales of manufacturing. For example, the development of the 7 nm node development cost more than 3 billion USD, while smaller nodes are expected to see that price cross the 5 billion USD mark. So given that we are approaching the limit where we can't squeeze more transistors in two-dimensional space without huge economical impact, we have to utilize another dimension in order to keep performance improvements coming.

AMD has filed a patent for cooling a 3D stacked memory with thermo-electric coolers - TECs, also known as Peltier devices. Being that TECs are made out of P-type and N-type semiconductors, they can easily be integrated into existing silicon manufacturing methods and controlled like a regular device. The process AMD has patented basically describes how to insert the TEC between memory and logic devices, where it draws heat from either logic or memory with each side being able to dissipate the heat. That effect is possible due to nature of TEC, where the direction of heat flow is changed inverting the voltage.