The global semiconductor manufacturing industry closed 2024 with strong fourth quarter results and solid year-on-year (YoY) growth across most of the key industry segments, SEMI announced today in its Q4 2024 publication of the Semiconductor Manufacturing Monitor (SMM) Report, prepared in partnership with TechInsights. The industry outlook is cautiously optimistic at the start of 2025 as seasonality and macroeconomic uncertainty may impede near-term growth despite momentum from strong investments related to AI applications.

After declining in the first half of 2024, electronics sales bounced back later in the year resulting in a 2% annual increase. Electronics sales grew 4% YoY in Q4 2024 and are expected to see a 1% YoY increase in Q1 2025 impacted by seasonality. Integrated circuit (IC) sales rose by 29% YoY in Q4 2024 and continued growth is expected in Q1 2025 with a 23% increase YoY as AI-fueled demand continues boosting shipments of high-performance computing (HPC) and datacenter memory chips.

ASE Technology Holding Co., Ltd., the leading provider of semiconductor assembly and testing services ("ATM") and the provider of electronic manufacturing services ("EMS"), today reported its unaudited net revenues of NT$162,264 million for 4Q24, up by 1.0% year-over-year and up by 1.3% sequentially. Net income attributable to shareholders of the parent for the quarter totaled NT9,312 million, down from NT$9,392 million in 4Q23 and down from NT$9,733 million in 3Q24. Basic earnings per share for the quarter were NT$2.15 (or US$0.134 per ADS), compared to NT$2.18 for 4Q23 and NT$2.25 for 3Q24. Diluted earnings per share for the quarter were NT$2.07 (or US$0.129 per ADS), compared to NT$2.13 for 4Q23 and NT$2.18 for 3Q24.

For the full year of 2024, the Company reported unaudited net revenues of NT$595,410 million and net income attributable to shareholders of the parent of NT$32,483 million. Basic earnings per share for the full year of 2024 were NT$7.52 (or US$0.470 per ADS). Diluted earnings per share for the full year of 2024 were NT$7.23 (or US$0.452 per ADS).

ASRock told PCMag it plans to move some of its production out of China. "We need time to shift the manufacturing of GPU cards and other products hit by the 10% tariff to different countries," they said. This week, the White House put a 10% tax on all Chinese imports to the US, this tax applies on top of any other taxes the US already had on certain Chinese goods. ASRock also said, "While we move from making things in China to making them elsewhere, we might take on some of the cost and raise prices a bit to show the higher costs." But they added, "It's not easy to raise prices because the market is still very competitive." ASRock also told PCMag that it already pays a 25% tax on its power supplies made in China. "For items like PSUs that already have an extra 25% tax, makers will keep doing what they've been doing," the company said.

If Trump administration doesn't follow through with his threats of huge tariffs against Taiwan, the PC gaming industry will primarily feel the effects on companies like ASRock and MSI (which makes its motherboards in Shenzhen, China). These are the component and peripheral makers that have part or all of their manufacturing processes in China. ASRock's announcement isn't a huge surprise, as we saw hints of this trend in late 2024 when PC Partner (second-biggest graphics card maker, producing PCBs for brands such as Inno3D and Zotac) moved its headquarters from China to Singapore. It will be no surprise if other top-tier brands such as GIGABYTE, MSI, and ASUS take similar actions sooner or later.

New technology from Chalmers University of Technology and the University of Gothenburg, Sweden, is helping the EU establish its own competitive computer manufacturing industry. Researchers have developed components critical for optimising on-chip memory, a key factor in enhancing the performance of next-generation computers.

The research leader, Professor Per Stenström, along with colleagues, has discovered new ways to make cache memory work smarter. A cache is a local memory that temporarily stores frequently accessed data, improving a computer's speed and performance. "Our solution enables computers to retrieve data significantly faster than before, as the cache can manage far more processing elements (PEs) than most existing systems. This makes it possible to meet the demands of tomorrow's powerful computers," says Per Stenström, Professor at the Department of Computer Science and Engineering at Chalmers University of Technology and the University of Gothenburg.

Mid-week—at the World Economic Forum in Davos—India's government announced that its native semiconductor industry will release its debut product at some point this year. A similar announcement was made at last year's event, but the reported 28 nm "Made in India" chip would eventually miss its (then) projected December 2024 launch date. Press outlets have focused on Ashwini Vaishnaw's latest prediction for 2025—the Union Minister believes that everything will align neatly for his nation's fledgling semiconductor industry. Additionally, industry stakeholders have expressed confidence in the Semicon India program (initiated back in 2021).

He stated: "Our first 'Made in India' chip will be rolled out this year, and now we are looking at the next phase, where we can get equipment manufacturers, material manufacturers and designers in India...For materials, from parts per million purity, we need to go to parts per billion purity levels. This requires huge transformative changes in the process and the industry is working to achieve this." Vaishnaw is chief of India's AI Mission—this program has set itself some ambitious goals for 2025 and beyond. A primary objective is the founding of a common compute facility that will make use of 10,000 GPUs. The Minister for Electronics and Information Technology outlined the country's next phase of AI industry development—the creation of an indigenous AI model, and homegrown AI chip designs.

Sony Japan's Recording Media department has announced the retirement of several physical media formats—most notably Blu-Ray Disc—in a very brief notice addressed to "valued customers." Mid-last year, the Japanese multinational conglomerate revealed that it would stop production of consumer-grade recordable Blu-ray discs (BD-RE and BD-R)—citing a decline in demand and the format's inability to meet "business goals." As pointed out by Tom's Hardware, today's announcement indicates (via machine translation) that both "regular and recorded" product lines are affected—the publication has reached out to Sony for comment/clarification.

Optical media enthusiasts/preservationists will, undoubtedly, be angered by this news—manufacturing activities will cease at some point next month. The corporation's message contains a lot of finality: "thank you for your continued patronage of Sony products. We will end production of all models of Blu-ray Disc media, MiniDiscs for recording, MD data for recording, and MiniDV cassettes as of February 2025. There will be no successor models. We would like to express our sincere gratitude to our many customers for their patronage to date."

Earlier this week, Taiwan experienced a magnitude 6.4 earthquake—this seismic event interrupted manufacturing activities at several TSMC chip-making facilities. As a precaution, foundry employees in both Central and Southern Taiwan were evacuated. Production resumed fairly quickly following inspections of crucial infrastructure—no major damage to facilities or equipment was noted. The latest reports suggest that a relatively minor number of TSMC wafers have been affected by the recent quake, while some recalibration of instrumentation is required to get things back on track.

Inside sources reckon that up to 20,000 wafers (possibly 10,000 at a minimum) could be scrapped—assessments are reportedly still underway, but a small proportion of client shipments could be disrupted. News articles point to this total being spread across three affected locations. Fab 18 is a key 3 nm production hub—situated in Taiwan's Southern Science Park, Tainan's Fab 14 specializes in 4 nm and 5 nm processes, and Fab 8 (Hsinchu) takes care of 200 nm. Industry experts believe that TSMC will bounce back quickly, and that the damaged wafer count represents a minor dent in the proverbial armor—on a good day, manufacturing output can reach up to 37,000 units.

Hua Hong Semiconductor (HHS) is China's second-largest chip manufacturer; trailing just behind its main rival: Semiconductor Manufacturing International Corporation (SMIC)—a recent recruitment drive has signalled the company's desire to advance further. Nikkei Asia believes that the recruitment of a former Intel executive—Bai Peng—will boost the development of logic chips, and in turn generate greater revenue. A late 2024 reshuffling of leadership positions produced a notable vacancy: company president—Bai Peng assumed this role, effective January 1. His career at Intel spanned three decades—by 2015 he became Team Blue's corporate vice president, although his tenure ended at some point in 2022 (according to a LinkedIn profile).

Industry watchdogs reckon that Hua Hong Semiconductor's freshly established chief will be tasked with advancing semiconductor production technologies. Peng's experience—being a former co-director of Logic Technology Development at the Intel Technology and Manufacturing Group—is cited as a crucial factor in diversifying the firm's product portfolio. HHS foundries produce a lot of 100+ nm-based designs—mostly in the fields of power semiconductors, analog chips, and embedded memory—but two locations are capable of churning out relatively complex silicon via a 40 nm process node. A new plant—based in Wuxi—is supposedly ready to push into sub-forty digits. The latest industry reports suggest that Peng and his colleagues will be focused on improving HSS's manufacturing processes—targeted advancements could open up new product lines: high-end enterprise and AI processors.

Intel Foundry has announced the onboarding of new defense industrial base (DIB) customers, Trusted Semiconductor Solutions and Reliable MicroSystems, as part of the third phase of the Rapid Assured Microelectronics Prototypes - Commercial (RAMP-C) efforts under the Trusted & Assured Microelectronics (T&AM) Program in the Office of the Under Secretary of Defense for Research and Engineering (OUSD (R&E)). The RAMP-C project, awarded through the Strategic & Spectrum Missions Advanced Resilient Trusted Systems (S²MARTS) Other Transaction Authority (OTA), allows DIB customers to take advantage of Intel Foundry's leading-edge Intel 18A process technology and advanced packaging for prototypes and high-volume manufacturing of commercial and DIB products for the U.S. Department of Defense (DoD).

"We are very excited to welcome Trusted Semiconductor Solutions and Reliable MicroSystems to the RAMP-C project we are engaged in with the DoD. The collaboration will drive cutting-edge, secure semiconductor solutions essential for our nation's security, economic growth and technological leadership. We are proud of the pivotal role Intel Foundry plays in supporting U.S. national defense and look forward to working closely with our newest DIB customers to enable their innovations with our leading-edge Intel 18A technology," said Kapil Wadhera, vice president of Intel Foundry and general manager of Aerospace, Defense and Government Business Group.

Today, the U.S. Department of Commerce has announced that CHIPS National Advanced Packaging Manufacturing Program (NAPMP) has finalized $1.4 billion in award funding to bolster U.S. leadership in advanced packaging and enable new technologies to be validated and transitioned at scale to U.S. manufacturing. These awards will help establish a self-sustaining, high-volume, domestic, advanced packaging industry where advanced node chips are both manufactured and packaged in the United States.

These awards include:

• A total of $300 million under the CHIPS NAPMP's first Notice of Funding Opportunity (NOFO) for advanced substrates and material research to Absolics Inc., Applied Materials Inc., and Arizona State University. This follows the previously announced intent to enter negotiations on November 21, 2024
• $1.1 billion to Natcast to operate the advanced packaging capabilities of the CHIPS for America NSTC Prototyping and NAPMP Advanced Packaging Piloting Facility (PPF). This follows the previously announced CHIPS R&D Facilities Model on July 12, 2024, and planned site selection for the PPF on January 6, 2025

MSI has provided a detailed look into its motherboard production facilities through a new interactive webpage. The company has outlined the 15-step manufacturing process that transforms bare circuit boards into complete motherboards. The process begins with solder paste printing, where a precise layer of conductive paste is applied to the bare PCB. This is followed by automated inspection using imaging systems to verify proper paste placement. High-speed machines then position electronic components onto the board before they move through reflow ovens that permanently bond the components. Multiple inspection stages are integrated throughout the assembly line, including automated optical systems that check both sides of the board. Specialized machines handle routing, component insertion, wave soldering, and alloy welding.

Each board undergoes circuit testing and receives mechanical components through automated screw-locking systems before final functional testing and molding. The complexity of modern motherboard manufacturing requires rigorous quality checks and final power tests before the motherboard leaves manufacturing facilities. For interested enthusiasts, MSI's new landing page is here. The manufacturing reveal accompanies MSI's launch of two new motherboard series—Z790 and B860. To celebrate this launch, MSI has announced promotional events running from January 20 to March 31, 2025, including Steam game codes with select product purchases. A new reward program offers points for product reviews and referrals.

Rapidus Corporation, a manufacturer of advanced logic semiconductors, today announced the delivery and installation of ASML's EUV lithography equipment at its Innovative Integration for Manufacturing (IIM-1) foundry, an advanced semiconductor development and manufacturing fab currently under construction in Chitose, Hokkaido. To commemorate the installation, a ceremony was held at Portom Hall in the New Chitose Airport.

This is a significant milestone for Japan's semiconductor industry, marking the first time that an EUV lithography tool will be used for mass production in the country. In addition to the EUV lithography machinery, Rapidus will install additional complementary advanced semiconductor manufacturing equipment, as well as full automated material handling systems in its IIM-1 foundry to optimize 2 nm generation gate-all-around (GAA) semiconductor manufacturing.

CoolIT Systems (CoolIT), the world's leader in liquid cooling systems for advanced computing, is continuing to invest in its manufacturing capabilities to support the surging demand for liquid cooling of AI systems. Along with a 25x capacity expansion in a new Calgary, Canada manufacturing facility, CoolIT recently hired Scott Hudson as Vice President of Quality to lead the company's development of world-class quality operations and systems.

"As the leader in direct liquid cooling for over two decades, our customers expect leading performance and reliability from CoolIT products," said CoolIT's COO Patrick McGinn. " Adding Scott as CoolIT's VP of Quality reinforces CoolIT's commitment to developing best-in-class quality standards for liquid cooling products." Scott joins CoolIT from Celestica, where he led the company's global quality strategy for all business segments across over 30 sites. His career spans three decades of quality leadership roles in the worldwide computer hardware industry, overseeing multi-site operations in North America, Asia and Europe.

The Biden-Harris Administration has given Micron Technology up to $6.165 billion in direct funds through the CHIPS Incentives Program to back the company's manufacturing growth. The money will allow Micron to execute its plan announced in October 2022 by investing about $100 billion into Clay, New York fab, and $25 billion into Idaho over 20 years aiming to boost the United States' advanced memory manufacturing from under 2% to around 10% by 2035. This large investment aims to make the U.S. economy stronger by creating a home supply of cutting-edge DRAM chips, moreover it is expected to create approximately 20,000 job across the U.S. Micron plans to spend about $50 billion before 2030 focusing on making more advanced memory semiconductor technology.

Also, the Department of Commerce has put pen to paper on a first draft of terms with Micron. This could lead to funding of up to $275 million to upgrade its Manassas, Virginia plant. The $2 billion investment project aims to bring Micron's 1-alpha technology back to U.S. The 1-alpha process was launched in 2021 and is used for the latest LPDDR5 DRAM chips. This would boost monthly wafer production and create over 400 factory jobs. At its busiest, the project could generate up to 2,700 jobs in the local area.

The Biden administration is set to announce new, targeted restrictions on China's semiconductor industry, focusing primarily on emerging chip manufacturing equipment companies rather than broad industry-wide limitations. According to Bloomberg, these new restrictions are supposed to take effect on Monday. The new rules will specifically target two manufacturing facilities owned by Semiconductor Manufacturing International Corp. (SMIC) and will add select companies to the US Entity List, restricting their access to American technology. However, most of Huawei's suppliers can continue their operations, suggesting a more mild strategy. The restrictions will focus on over 100 emerging Chinese semiconductor equipment manufacturers, many of which receive government funding. These companies are developing tools intended to replace those currently supplied by industry leaders such as ASML, Applied Materials, and Tokyo Electron.

The moderated approach comes after significant lobbying efforts from American semiconductor companies, who argued that stricter restrictions could disadvantage them against international competitors. Major firms like Applied Materials, KLA, and Lam Research voiced concerns about losing market share to companies in Japan and the Netherlands, where similar but less stringent export controls are in place. Notably, Japanese companies like SUMCO are already seeing the revenue impacts of Chinese independence. Lastly, the restrictions will have a limited effect on China's memory chip sector. The new measures will not directly affect ChangXin Memory Technologies (CXMT), a significant Chinese DRAM manufacturer capable of producing high-bandwidth memory for AI applications.

Worldwide silicon wafer shipments increased 5.9% quarter-over-quarter to 3,214 million square inches (MSI) in the third quarter of 2024 and registered 6.8% growth from the 3,010 million square inches recorded during the same quarter last year, the SEMI Silicon Manufacturers Group (SMG) reported in its quarterly analysis of the silicon wafer industry.

"The third quarter wafer shipment results continued the upward trend which started in the second quarter of this year," said Lee Chungwei (李崇偉), Chairman of SEMI SMG and Vice President and Chief Auditor at GlobalWafers. "Inventory levels have declined throughout the supply chain but generally remain high. Demand for advanced wafers used for AI continues to be strong. However, the silicon wafer demand for automotive and industrial uses continues to be muted, while the demand for silicon used for handset and other consumer products has seen some areas of improvement. As a result, 2025 is likely to continue upward trends, but total shipments are not yet expected to return to the peak levels of 2022."

Semiconductor Manufacturing International Corporation (SMIC), one of the leading semiconductor foundries in the world, today announced its consolidated results of operations for the three months ended September 30, 2024.

Third Quarter 2024 Highlights

• Revenue was $2,171.2 million in 3Q24, compared to $1,901.3 million in 2Q24, and $1,620.6 million in 3Q23.
• Gross profit was $444.2 million in 3Q24, compared to $265.1 million in 2Q24, and $321.6 million in 3Q23.
• Gross margin was 20.5% in 3Q24, compared to 13.9% in 2Q24 and 19.8% in 3Q23.

The American semiconductor landscape reached a significant milestone as TSMC's new Arizona manufacturing facility demonstrated remarkable production efficiency, exceeding its Taiwanese counterparts by 4% in yield rates. This achievement, revealed at a recent industry webinar by the company's US division chief, represents a major step forward in America's push to strengthen domestic chip manufacturing capabilities. Since initiating its 4 nm node production operations this spring, the Phoenix-based facility has demonstrated impressive technical proficiency, achieving production standards that match and surpass TSMC's established Taiwanese facilities. The project, backed by substantial federal support, including $11.6 billion in combined grants and loans plus significant tax incentives, aims to establish three cutting-edge manufacturing plants in Arizona.

The company's global leadership praised the facility's performance, noting its strategic importance in demonstrating TSMC's ability to maintain exceptional manufacturing standards across international locations. This success carries particular weight given the project's earlier hurdles, which included workforce challenges and timeline adjustments that shifted the entire production schedule by approximately one year. This development gains additional significance against industry-wide challenges, particularly as competitors like Intel and Samsung face operational and financial obstacles. The semiconductor giant's plans now extend to potential further expansion, with the Phoenix site capable of hosting up to six manufacturing facilities. Future growth prospects could be enhanced by proposed additional government initiatives supporting domestic chip production.

TSMC has reportedly initiated production of Apple's last-generation A16 Bionic processors at its newly constructed Fab 21 in Arizona. This development comes significantly earlier than anticipated, with the facility's full-scale production initially scheduled for 2025. According to insights from industry expert Tim Culpan, the Arizona plant is already churning out a modest but noteworthy quantity of A16 Bionic chips. These processors are being manufactured using TSMC's NP4 4 nm semiconductor node. Culpan also hinted at a substantial increase in production capacity once the second stage of Fab 21's initial phase becomes operational.

This early start serves a critical function for TSMC, allowing the company to calibrate its advanced equipment and refine its manufacturing processes thoroughly. Using the well-established A16 Bionic design, TSMC can ensure its new facility meets the exacting standards required for next-generation semiconductor production. The news aligns with recent industry buzz suggesting that Fab 21 is already achieving yield rates comparable to TSMC's long-established Taiwanese plants—a remarkable feat for a newly launched facility. While current output remains limited, this milestone marks a significant step in TSMC's expansion into US-based chip manufacturing. With more fabs on American soil, companies can push domestic manufacturing and ensure that geopolitics don't hinder the vital supply chain.

Texas Instruments (TI) (Nasdaq: TXN) and the U.S. Department of Commerce have signed a non-binding Preliminary Memorandum of Terms for up to $1.6 billion in proposed direct funding under the CHIPS and Science Act to support three 300 mm wafer fabs already under construction in Texas and Utah. In addition, TI expects to receive an estimated $6 billion to $8 billion from the U.S. Department of Treasury's Investment Tax Credit for qualified U.S. manufacturing investments. The proposed direct funding, coupled with the investment tax credit, would help TI provide a geopolitically dependable supply of essential analog and embedded processing semiconductors.

"The historic CHIPS Act is enabling more semiconductor manufacturing capacity in the U.S., making the semiconductor ecosystem stronger and more resilient," said Haviv Ilan, president and CEO of Texas Instruments. "Our investments further strengthen our competitive advantage in manufacturing and technology as we expand our 300 mm manufacturing operations in the U.S. With plans to grow our internal manufacturing to more than 95% by 2030, we're building geopolitically dependable, 300 mm capacity at scale to provide the analog and embedded processing chips our customers will need for years to come."

Kioxia Corporation, a world leader in memory solutions, today announced that the building construction of Fab2 (K2) of its industry-leading Kitakami Plant was completed in July. K2 is the second flash memory manufacturing facility at the Kitakami Plant in the Iwate Prefecture of Japan. As demand is recovering, the company will gradually make capital investments while closely monitoring flash memory market trends. Kioxia plans to start operation at K2 in the fall of Calendar Year 2025.

In addition, some administration and engineering departments will move into a new administration building located adjacent to K2 beginning in November 2024 to oversee the operation of K2. A portion of investment for K2 will be subsidized by the Japanese government according to the plan approved in February 2024.

SK hynix Inc. announced today that it has decided to invest about 9.4 trillion won in building the first fab and business facilities of the Yongin Semiconductor Cluster after the board resolution on the 26th. SK hynix designs to start construction of the 1st fab to be built in the Yongin cluster in March next year and complete it in May 2027, and have received an investment approval from the board of directors prior to it. The company will make every effort to build the fab to lay the foundation for the company's future growth and respond to the rapidly increasing demand for AI memory semiconductors.

The Yongin Cluster, which will be built on a 4.15 million square meter site in Wonsam-myeon, Yongin, Gyeonggi Province, is currently under site preparation and infrastructure construction. SK hynix has decided to build four state-of-the-art fabs that will produce next-generation semiconductors, and a semiconductor cooperation complex with more than 50 small local companies. After the construction of the 1st fab, the company aims to complete the remaining three fabs sequentially to grow the Yongin Cluster into a "Global AI semiconductor production base."

On June 5th, Vanguard and NXP announced plans to jointly establish VisionPower Semiconductor Manufacturing Company (VSMC) in Singapore to build a 12-inch wafer plant. TrendForce posits that this move reflects the trend of global supply chains shifting "Out of China, Out of Taiwan"(OOC/OOT), with Taiwanese companies accelerating their overseas expansion to improve regional capacity flexibility and competitiveness.

TrendForce noted that the semiconductor supply chain has been diversifying over the past two years to mitigate geopolitical and pandemic-related risks, forming two major segments: China's domestic supply chain and a non-China supply chain. Recent US tariff increases have accelerated this shift, leading to increased orders from American customers.

Asetek, innovator of gaming hardware for next-level immersive gaming experiences and the creator of the all-in-one (AIO) liquid cooler, today announced a strategic partnership with Fabric8labs, a leading innovator in metal 3D printing. This exclusive partnership with Fabric8Labs covers the commercial and consumer desktop markets and introduces a revolutionary advancement in liquid cooling technology, showcased in the AI Optimized Cold Plate. Leveraging Fabric8Labs' cutting-edge Electrochemical Additive Manufacturing (ECAM) technology, Asetek has developed a cold plate design that will redefine industry leading performance.

The partnership embodies a shared commitment to innovation that drives superior performance, high quality, and lasting reliability. The AI Optimized Cold Plate demonstrates a significant improvement over previous generations, highlighting the effectiveness of this collaboration. Fabric8Labs' unique 3D printing technology plays a pivotal role in this innovation. Their ECAM method allows for the creation of complex, high-resolution structures that significantly improve thermal capabilities through enhanced fluid dynamics. Also, by eliminating the need for post-processing, ECAM ensures the highest quality and integrity of each cold plate and is massively scalable to support high-volume production demands.

According to the latest report from Bloomberg, the US government under Joe Biden's administration has announced plans to provide Taiwan Semiconductor Manufacturing Company (TSMC) with a substantial financial support package worth $11.6 billion. The package is composed of $6.6 billion in grants and up to $5 billion in loans. This represents the most significant financial assistance approved under the CHIPS and Science Act, a key initiative to resurrect the US chip industry. The funding will aid TSMC in establishing three cutting-edge semiconductor production facilities in Arizona, with the company's total investment in the state expected to exceed an impressive $65 billion. TSMC's multi-phase Arizona project will commence with the construction of a fab module near its existing Fab 21 facility. Production using 4 nm and 5 nm process nodes is slated to begin by early 2025. The second phase, scheduled for 2028, will focus on even more advanced 2 nm and 3 nm technologies.

TSMC has kept details about the third facility's production timeline and process node under wraps. The company's massive investment in Arizona is expected to profoundly impact the local economy, creating 6,000 high-tech manufacturing jobs and over 20,000 construction positions. Moreover, $50 million has been earmarked for training local workers, which aligns with President Joe Biden's goal of bolstering domestic manufacturing and technological independence. However, TSMC's Arizona projects have encountered obstacles, including labor disputes and uncertainties regarding government support, resulting in delays for the second facility's production timeline. Additionally, reports suggest that at least one TSMC supplier has abandoned plans to set up operations in Arizona due to workforce-related challenges.