Thockfactory was a service that let users design and order custom keycap sets for mechanical keyboards, originally starting out as an enthusiast project in 2023. Despite officially launching in 2024, the service was shut down shortly after launch due to keycap quality issues and UI frustrations. Now, after examining user feedback, taking time to locate a new keycap supplier, and redesigning the online keycap configurator, Thockfactory 2.0 has been launched with a slew of upgrades and a laundry list of plans for the future of the business, according to the founder's Reddit post detailing the relaunch.

Thockfactory keycaps are all dye-sublimated PBT, meaning they won't offer shine-through capability, but they should last a good long while, thanks to the material's oil resistance. At the time of writing, Thockfactory only offers keycaps in Cherry profile, although uniform height and low-profile keycaps are planned for the future, with DSA and XDA profiles specifically mentioned as likely incoming additions. The configurator also offers pretty wide compatibility with a number of standard and not-so-standard layouts, including 100%, TKL, Alice, and 65%, which is always a hit with FPS gamers. In addition to the usual suspects, Thockfactory also offers support for stranger layouts, like unorthodox 40% keyboards, a number of ortholinear layouts, and FRL (F-row-less) options. The configurator also allows you to switch between ISO and ANSI, and there are a number of regional and language variants on offer. According to a Reddit comment by the company's founder, the keycaps are being manufactured by a trustworthy OEM that has a solid track record in the custom keycap space. According to the founder, the main draw of Thockfactory is that it offers more color options and greater flexibility than competitors.

Micron Technology, Inc. (Nasdaq: MU) and the Trump Administration today announced Micron's plans to expand its U.S. investments to approximately $150 billion in domestic memory manufacturing and $50 billion in R&D, creating an estimated 90,000 direct and indirect jobs. As part of today's announcement, Micron plans to invest an additional $30 billion beyond prior plans which includes building a second leading-edge memory fab in Boise, Idaho; expanding and modernizing its existing manufacturing facility in Manassas, Virginia; and bringing advanced packaging capabilities to the U.S. to enable long-term growth in High Bandwidth Memory (HBM), which is essential to the AI market. Additionally, Micron is announcing a planned $50 billion domestic R&D investment, reaffirming its long-term position as the global memory technology leader. As previously announced, Micron's investment includes its ongoing plans for a megafab in New York.

Micron's approximately $200 billion broader U.S. expansion vision includes two leading-edge high-volume fabs in Idaho, up to four leading-edge high-volume fabs in New York, the expansion and modernization of its existing manufacturing fab in Virginia, advanced HBM packaging capabilities and R&D to drive American innovation and technology leadership. These investments are designed to allow Micron to meet expected market demand, maintain share and support Micron's goal of producing 40% of its DRAM in the U.S. The co-location of these two Idaho fabs with Micron's Idaho R&D operations will drive economies of scale and faster time to market for leading-edge products, including HBM.

According to the Financial Times, new restrictions—affecting the supply of Electronic Design Automation (EDA) software suites to Chinese companies—will cause major disruption within the domestic chip design industry. The US government's latest trade amendments are expected to impact Xiaomi and its freshly launched flagship XRING mobile chip family; the first iteration is a compelling first-party effort. Unlike many Chinese tech firms, the popular smartphone specialist can access pretty advanced TSMC node processes. Xiaomi's CEO—Lei Jun—announced his team's 3 nm design during pre-launch preview events.

Days later, closer analysis indicated a selection of TSMC's "N3E" node process. Digital Chat Station—a noted smartphone industry expert—summarized an uncertain future: "under this ban (of EDA tools), XRING chips will not be breaking through a 2 nm barrier, and can only revolve around the (current 'N3E') 3 nm node for a long time. XRING O1 will also be the only time in recent years that it can be on par with current-gen (proprietary) Apple, Qualcomm, and MediaTek mobile chipsets." Crucially, EDA software plays an important role in creating Gate All Around Field Effect Transistor (GAAFET) structures. TSMC's upcoming 2 nm node process is a GAA product. Tom's Hardware believes that several big Chinese tech players, including Huawei, are in the process of developing in-house EDA tools. Not long after unveiling their XRING flagship, Xiaomi outlined an extended Qualcomm chip deal.

Earlier today, GlobalFoundries announced a boosted $16 billion investment. This cash injection will further drive the expansion of current North American chip production facilities. Specifically, an extra $3 billion will be spent on supporting advanced research and development projects. The multinational corporation's leadership outlined key R&D goals: packaging innovation, silicon photonics, and next-generation gallium nitride technologies. An additional $1 billion "capital spending boost" will bolster upgrades of the firm's New York and Vermont foundry sites. AMD, Apple, General Motors, NXP Semiconductors, Qualcomm and SpaceX were listed as notable partners—collectively, they are engaged in elevating the domestic semiconductor industry.

Top brass did not detail a firm upgrade timeline, but Tim Breen—the GlobalFoundries CEO—provided a short explanation (via Reuters): "the reason we're not sort of being super clear about exactly what's spent by when is because obviously some of this is demand-driven. We see a very strong demand, but it takes time to convert (demand) into specific ramps and project timing. And what you don't want to do is shoot too far ahead or fall too far behind." As part of the original $12 billion outlay, GlobalFoundries revealed intentions for its Malta, New York site. Around mid-January (2025), the company unveiled blueprints for an advanced packaging and photonics center—destined for construction at their Saratoga County-based chip manufacturing hub. GlobalFoundries is best known for its decidedly mature product portfolio—around late March/early April, the firm's executive team denied that they were considering a merger with UMC. This speculative deal could lead to a greater international footprint of foundries; mostly tasked with pumping out 28 nm (and larger) wafers.

At the tail end of Q1'25, industry whispers suggested that TSMC's premier facilities had completed cutting/leading-edge 2 nm (N2) trial production runs. By early April, company insiders alluded to a confident push into preparations for a futuristic 1.4 nm node at the "P2" Baoshan Plant. This is a very distant prospect; watchdogs envision a 2028 release window. According to expert predictions, cross-facility 2 nm wafer mass production phases are expected to start by the end of this year. Foundry staff seem to be actively pursuing an improvement in yields; earlier guesstimates indicated the crossing of a 70% milestone—good enough for full-blown manufacturing runs.

Fresher musings point to staffers and advanced equipment achieving and stepping just beyond an impressive 90% mark, albeit with silicon intended for "memory products." As of mid-May, Samsung's competing "SF2" product—allegedly—remains in testing phases. South Korean insider news reports posit 2 nm GAA trial yields passing 40%—a significant development for the megacorp's foundry business. Roughly a month ago, (in public) TSMC leadership spoke about an unprecedented demand for 2 nm wafers. Due to rumors of greater than anticipated charges for important TSMC clients, Samsung Semi's top brass is supposedly trying to woo the likes of NVIDIA and Qualcomm.

The Nintendo Switch 2 hybrid console is due to launch globally next Wednesday (June 4). The highly anticipated next-gen handheld is powered by a custom NVIDIA processor. To the surprise of many industry watchdogs, both parties have semi-recently disclosed a couple of technical details regarding their fruitful hardware collaboration. Historically, Nintendo has guarded many aspects of its past generation hardware. Throughout the 2020s, data miners and leakers have unearthed plenty of pre-release information—leading to theories about the Switch 2 chipset's origins. During the Switch 1 era, TSMC was the chosen manufacturing partner. NVIDIA's off-the-shelf Tegra X1 mobile SoC powered the first wave of Nintendo Switch (2017) devices, in 20 nm form. A 2019 revision resulted in Switch Lite and (refreshed) Switch models being equipped with a more efficient 16 nm solution, also present within 2023's premium OLED variant.

Since then, Switch 2's alleged NVIDIA Tegra T239 SoC was linked to a Samsung 8 nm node process. Earlier this month, extremely brave Chinese leakers produced "full die shot" evidence of South Korean foundry origins. Bloomberg insider news articles have implied that Samsung Semi's mature 8 nm FinFET node is better suited—rather than an equivalent TSMC product—for the Switch 2's custom NVIDIA chipset. Unnamed sources have mentioned critical factors; namely stable production and process compatibility. Industry moles reckon that Samsung leadership is actively and aggressively pushing for a longer Switch 2 chipset production deal. Renewed terms could include a future die shrink; pre-launch analysis indicates a sizeable 207 mm² footprint. Beyond foundry biz negotiations, additional murmurs suggest company executives dangling an OLED panel supply agreement. Industry experts have viewed Samsung's key entry—into the gaming console chip market—as a seismic development. A DigiTimes article dives into a so-called "tripartite cooperation"—involving Nintendo, NVIDIA, and the South Korean semiconductor giant. The Samsung Foundry has floundered and struggled in recent times, but is keen to catch up with its arch rival. Fresh rumors have AMD and Sony considering Samsung's chip making channels; possibly with futuristic PlayStation hardware in mind.

The rising profile of ChangXin Memory Technologies (CXMT) has supposedly attracted international scrutiny as-of-late. Despite dealing in commercial memory product lines—currently DDR5, DDR4, LPDDR5 and LPDDR4X—the Chinese manufacturer could be stepping up its game in the near future. According to a fresh DigiTimes Asia news report, the nation's "top DRAM supplier" could be freeing up production capacity—in favor of enterprise-grade third-gen High-Bandwidth Memory (HBM3). Industry moles believe that a major sacrifice will be made; namely CXMT's DDR4 line. Despite an alleged early 2025 ramping up of related activities, the firm's factories could refocus on new endeavors by mid-2026. Additionally, insiders reckon that company leadership is shifting commercial priorities: "by year-end 2025, DDR5 is expected to make up more than 60% of CXMT's output, alongside LPDDR4/5."

The move into more advanced memory technologies is reportedly the result of government instruction. DigiTimes outlined a new strategy: "as CXMT scales up, it's also shifting rapidly to DDR5. The company only began mass-producing DDR4 in late 2024, yet it's already expected to issue an end-of-life (EOL) notice by the third quarter of 2025. The speed of this pivot and retooling has surprised many across the industry. Industry sources say the sudden shift is policy-driven, as Beijing pushes key chipmakers to accelerate alignment with national goals, especially around AI and cloud infrastructure." Murmurs of CXMT's forthcoming exit from DDR4 production have spread across local chip making businesses; causing a sudden doubling of Nanya-branded 8 Gb DDR4 chip prices in China. The manufacturer's early journey into DDR5 territories looked promising on paper—around January 2025—but the latest DigiTimes report disclosed inside track info regarding troubled quality and yield issues. In particular, initial samples have reportedly exhibited unstable performance when crossing a 60°C (140°F) threshold.

As previously promised, Dr. Rick Tsai took to the Computex 2025 stage earlier today. The MediaTek CEO's keynote speech included a teaser for next-gen. Currently, the fabless chip design firm's best offerings are manufactured at TSMC foundries—utilizing 3 nm node processes. According to inside track knowledge, the forthcoming Dimensity 9500 mobile chipset will be based on "N3P." During today's important presentation, Tsai announced his company's next major leap—with "2 nm silicon innovation." According to a presentation slide, a tape-out phase is anticipated by this September. Industry experts reckon that a futuristic flagship—perhaps "Dimensity 9600"—SoC will benefit from this generational jump. Finalized products could arrive around late 2026; with MediaTek reportedly being on TSMC's 2 nm (N2) mass production order books. Officially, MediaTek's shift from 3 nm into 2 nm is expected to improve chip performance—with an estimated 15% uplift—while reducing power consumption (by ~25%).

AMD has announced a definitive agreement to sell ZT Systems' data center infrastructure manufacturing business to Sanmina for $3 billion in cash and stock, which includes a contingent payment of up to $450 million. This announcement follows earlier reports from April that AMD was looking to divest the facility it had acquired as part of its $4.9 billion purchase of ZT in March 2025. The deal set to wrap up around late 2025 shows AMD's plan to steer clear of making products that compete with its customers. At the same time, AMD will keep ZT Systems' design and customer support teams to speed up the rollout of AMD AI systems for cloud clients. Sanmina will also become a top choice for introducing new products in AMD's cloud rack and large-scale AI solutions. "By combining the deep experience of our AI systems design team with our new preferred NPI partnership with Sanmina, we expect to strengthen our U.S-based manufacturing capabilities for rack and cluster-scale AI systems and accelerate quality and time-to-market for our cloud customers," said Forrest Norrod, executive vice president and general manager, Data Center Solutions business unit at AMD.

The sale drew a lot of interest from different manufacturers, with early reports showing that Taiwanese OEM makers Compal and Wiwynn were the top choices, along with U.S. electronics firm Jabil. Inventec and Pegatron decided not to take part. Sanmina, the final buyer, is a U.S.-based company that provides integrated manufacturing solutions to the global Electronic Manufacturing Services field. Jure Sola, Chairman and CEO of Sanmina Corporation, said that ZT Systems' skills in liquid cooling, its manufacturing ability, and its know-how in cloud and AI setup will add to Sanmina's worldwide range and vertical integration skills. "Together, we will be better able to deliver a competitive advantage to our customers with solutions for the entire product lifecycle. We look forward to our ongoing partnership with AMD as we work together to set the standard for quality and flexibility to benefit the entire AI ecosystem." said Jure Sola, Chairman and CEO of Sanmina Corporation.

According to a Financial Times (FT) news article, the US Government's Bureau of Industry and Security (BIS) is considering an implementation of additional "export blacklist" entries. Roughly two months ago, a significant update affected the export trade of around eighty Chinese business "entities." Despite a recent "cooling off" of elevated tariff-related activities, significant political tensions still exist between the two powerhouse nations. According to five of FT's unnamed insiders, ChangXin Memory Technologies (CXMT)—a rising star within China's growing memory manufacturing industry—is a potential candidate for "banishment." Semiconductor Manufacturing International Corp (SMIC), and Yangtze Memory Technologies Co. are (allegedly) already categorized as blacklisted organizations.

Apparently, the nation's most prominent chipmaker and memory module producer (respectively) have managed to sidestep certain restrictions, via offshoot avenues. FT believes that the US administration is actively investigating several of these subsidiaries. CXMT seems to be an independent body, with no military connections—specializing in commercial DDR5 and DDR4 products—but its rising profile has attracted international attention. Around March 2024, Bloomberg heard rumors about the US BIS department's "weighing up" of sanctions, with CXMT in mind. The relatively young DRAM manufacturer (established back in 2016) still trails behind South Korean and Western competitors, in terms of technological advancements—but its initial DDR5 efforts have (supposedly) impressed local evaluators and early adopters.

We wanted to give you a quick update on the estimated shipping schedule for our upcoming CRKD Gibson Les Paul Guitar Controller. Over the past few weeks, we've run into some inbound component delays with our manufacturing partner—largely due to ongoing uncertainty around international tariffs and broader supply chain challenges. As a result, we're making a slight adjustment to our estimated shipping windows to finalize production and better navigate the current logistics environment.

While we've taken steps to mitigate the impact of tariffs, a portion of these costs must be passed on. All U.S. pre-orders placed before June 1 will be honored at their original price. International pricing remains unchanged at this time. All pre-orders placed before June 1 on crkd.gg—U.S. and international—will also receive a complimentary CRKD Gradient Guitar Strap and Collector's Pin.

Taiwanese electronics manufacturer Wistron announced on Friday that its new U.S. manufacturing facilities for NVIDIA will be ready next year, confirming they're in discussions with other potential customers as well, Reuters reports. Wistron CEO Jeff Lin made his first public statement since NVIDIA's announcement, saying, "All our progress will follow the customer's lead," and confirmed their timeline aligns with NVIDIA's expectations. The facilities will partly support NVIDIA's ambitious plan to build AI servers worth up to $500 billion in the U.S. over the next four years. NVIDIA revealed in April its strategy to establish supercomputer manufacturing plants in Texas, collaborating with Foxconn in Houston and Wistron in Dallas, with both locations expected to increase production within 12-15 months. Recently Wistron's board has approved a $500 million investment in its new U.S. subsidiary.

The facilities will focus on producing high-performance computing and AI-related products, though Lin declined to name the other companies they're in talks with. When asked about U.S. restrictions on advanced chip exports to China, Lin noted that demand outside China remains robust. "We expect to grow alongside our customers... As for developments in the Middle East, most of them are essentially our indirect customers," he added. This comes as the UAE and U.S. signed an agreement this week to build the largest AI campus outside America, potentially involving the purchase of 500,000 of NVIDIA's most advanced AI chips yearly starting in 2025. Wistron also mentioned it's considering moving notebook production in Mexico in an attempt to avoid tariffs under the United States-Mexico-Canada trade agreement.

A month ago, Sony increased its PlayStation 5 home console prices for EMEA and ANZ regions—affecting customers in Europe, Middle East, Africa, Australia and New Zealand. At the time, industry experts surmised that company leadership was considering a similar strategy for a primary market: North America. Instead of freshly implemented 25% upward hikes for certain products/packages, reports suggested a 30% climb—for the North American market. Weeks later, company leadership has discussed this hot topic. During yesterday's (projected) earnings call with investors, top brass confirmed their consideration of "passing along" additional costs to consumers—in response to a reported/anticipated 100 billion yen (~$680 million) impact from US tariffs. They outlined a stockpile of PS5 consoles; enough units have been accumulated for roughly three months of supply—unaffected by adjusted conditions, in the States.

Despite this provision, Hiroki Totoki—Sony's president/CEO—is open to exploring alternative production avenues, in the face of looming extra charges. When asked about this matter, he replied with: "hardware can of course be produced locally, I think that would be an efficient strategy. PS5 is being manufactured in many areas, whether it is going to be manufactured in the US or not—it needs to be considered going forward." In efforts to navigate a trying situation, Nintendo has juggled its geographic manufacturing footprint—recent-ish developments have shifted away from a complete reliance on Chinese facilities. Industry insiders reckon that the bulk of US-bound Switch 2 units will be Vietnamese-made. Like Sony, Nintendo's executive team has publicly disclosed thoughts about future price hikes—maybe following the launch of its much-anticipated "next-gen" hybrid console. Earlier this month, Microsoft upped modern Xbox portfolio price tags—affecting customers across the world.

Pioneer has quietly confirmed that it has ended production of internal and external Blu-ray optical disc drives (ODDs), for computers. Rumors about the cessation of manufacturing activities emerged earlier this month; with a small number of Japanese news outlets publishing reports. Days later, an official company statement turned up in a low-key manner—via the brand's Japanese web portal. As of late April, shares of the Pioneer Digital Design and Manufacturing (PDDM) subsidiary were transferred to Shanxi Lightchain Technology Industrial Development Co., Ltd. Pioneer's optical disc-related businesses is now owned by the giant (Chinese) Shanxi Group. Commenting on shifting market conditions, a Pioneer Japan representative stated: "while we are moving forward with selection and concentration, centered on our car electronics business, we have come to the decision that it is preferable to advance the optical disc business with a new partner, rather than remaining within our group."

The Pioneer IT Japan webstore is due to close on May 30; as disclosed in a mid-April bulletin. In addition, NotebookCheck highlighted the complete lack of optical drive stock for North American webshop customers. At the time of writing, Pioneer's official Amazon.com presence still offers a small selection of portable slimline models. A chunkier external premium option—the BDR-X13U-S BDXL Blu-ray recorder—was launched only six months ago, so the firm's sudden change of heart is quite surprising. What Hi-Fi? noted that Pioneer's AV/home cinema division has not released any new 4K Blu-ray player products since 2019. Three months ago, Sony shuttered its last optical media factory, in Japan—signalling an end of an era. The vast majority of consumers have turned their backs on physical formats; instead favoring digital/streaming channels. In a refreshing (early 2025) PR piece, Verbatim and I-O DATA expressed their (joint) commitment to producing high-quality optical discs.

South Korean semiconductor insiders and analysts believe that Samsung's Foundry business is catching up with a main rival. Earlier this month, TSMC leadership openly discussed an unprecedented demand for 2 nm wafer products. Industry moles believe that the Taiwan's top chipmaker is still ahead of contenders in nearby nations. As a result of an alleged leading and comfortable position, TSMC is reportedly upgrading its state-of-the-art facilities with brand-new equipment—indicating a push into 1.4 nm fields. According to a fresh Chosun Biz news article, Samsung engineers are in the process of narrowing the gap between their 2 nm Gate-All-Around (GAA)—also known as SF2—manufacturing node process and TSMC's equivalent technology.

Last month, leaks suggested SF2 trial yields passing the ~40% mark—in comparison, a ~60% figure was uttered by TSMC insiders. Chosun Biz's sources claim that the South Korean foundry team is close to getting their "2 nm process performance evaluation" into a crucial final stage. Yesterday's report posits that NVIDIA and Qualcomm are in the equation; these VIP clients are purportedly considering SF2 as a "second channel" option. Chosun Biz reckons that Team Green is sizing up Samsung Foundry flagship tech for next-gen commercial and enterprise GPUs. Meanwhile, the San Diego-based smartphone processor specialist could be eyeing up SF2 (for a future AP). The latest inside track info points to 2 nm GAA trial production runs breaking beyond aforementioned (approximate) 40% yield rates. TSMC 2 nm wafer charges are reportedly greater than expected, so big industry players are allegedly investigating "cheaper" non-Taiwanese production avenues.

Just over a year ago, reports suggested that ASML was considering a potential expansion of its presence at the Brainport Industries Campus (BIC)—nearby to Eindhoven Airport. A "2.5 billion Euro" investment—courtesy of the Dutch government—was floated, alongside an estimated creation of ~20,000 new roles. The Veldhoven-headquartered EUVL photolithography equipment specialist seems to be in a comfortable position, but growing demand for top-level ASML gear has warranted an apparent acceleration of new facility plans. According to local news articles, company and Eindhoven municipality representatives have presented an adjusted timeline—a "northern part" of the BIC campus could welcome new recruits in 2028. Last year's target proposed a further out inauguration; possibly in 2030 or thereafter.

Stijn Steenbakkers—the Alderman for Brainport—outlined the sheer scale of the company's futuristic and uncharacteristically huge footprint: "over the past year, we have worked intensively on the first elaboration of the plans, resulting in the preliminary design of the urban development plan (VOSP) that is now available. Our future, prosperity and well-being are not self-evident. With the current economic developments in the world, it is not a question of whether we should invest in our strategic autonomy. This is of vital importance! By making the expansion of ASML at BIC Noord (North) possible, we dare to opt for the new economy: sustainable, focused on high-tech, innovation and offering solutions for major global social issues...The important points in the VOSP are: approximately 20,000 jobs, approximately 428,000 m² gross floor area for production, and support functions such as offices." Steenbakkers and ASML reps will present their proposals to Eindhoven city councillors in September; transportation and other local infrastructure considerations will be taken into account.

NEO Semiconductor, a leading developer of innovative technologies for 3D NAND flash memory and 3D DRAM, announced today the latest advancement in its groundbreaking 3D X-DRAM technology family—the industry-first 1T1C- and 3T0C-based 3D X-DRAM cell, a transformative solution designed to deliver unprecedented density, power efficiency, and scalability for the most demanding data applications.

Built on a 3D NAND-like architecture and with proof-of-concept test chips expected in 2026, the new 1T1C and 3T0C designs combine the performance of DRAM with the manufacturability of NAND, enabling cost-effective, high-yield production with densities up to 512 Gb—a 10x improvement over conventional DRAM.
"With the introduction of the 1T1C and 3T0C 3D X-DRAM, we are redefining what's possible in memory technology," said Andy Hsu, Founder & CEO of NEO Semiconductor. "This innovation pushes past the scaling limitations of today's DRAM and positions NEO as a frontrunner in next-generation memory."

Despite recent whispers of TSMC losing a key 4 nm node process customer, industry analysts reckon that Taiwan's premier foundry business will remain in a comfortable leading position for the foreseeable future. "Optimistic" expert opinion points to "revenue growth for supply chain players," driven by the rapid progress of the firm's 2 nm manufacturing prowess. Naturally, their cutting-edge manufacturing capabilities—supposedly bolstered by GAAFET—are being tracked with keen interest. According to a fairly fresh Ctee Taiwan news piece, the usual big players are reportedly queued up and present within factory order books. The likes of Apple, NVIDIA, AMD, Qualcomm, MediaTek and Broadcom are mentioned. Mid-way through last month, Team Red officially announced a big collaborative milestone: "(our) next-generation AMD EPYC processor—codenamed "Venice"—is the first HPC product in the industry to be taped out and brought up on the TSMC advanced 2 nm (N2) process technology."

Ctee's report cites recent statements by C. C. Wei. Apparently, the TSMC CEO has stressed (on multiple occasions) that there is "unprecedented" demand for his company's 2 nm production pipelines—far exceeding previous levels for 3 nm. In addition, TSMC reps—who are currently touring the States; hosting technology symposiums—have revealed 2 nm (N2) defect density trends. Ctee outlined these intriguing details: "(N2's) defect density (D0) performance is comparable to that of the 5 nm family, and even surpasses the 7 nm and 3 nm processes of the same period, making it one of the most technologically mature advanced nodes." Wei's foundry team seems to be well ahead of main competition; insiders reckon that alleged equipment upgrades signal a push into 1.4 nm territories. Crucially, mass production of 2 nm (N2) wafers is expected to begin later this year—a cross-facility push was uttered by industry moles.

Taiwan's electronics manufacturing services (EMS) providers are accelerating their North American production plans in response to tariff threats, but component shortages and capacity constraints at US chip plants could hamper the AI server market for years, according to industry sources.

"Since Trump's election, Taiwanese manufacturers have been strategically expanding their US presence," said Yen Chou, an analyst at DIGITIMES Research. "Most server manufacturers are concentrating in Texas, with Foxconn's FII already operating there and planning expansions."

The vast majority of High Bandwidth Memory (HBM) new stories—so far, in 2025—have involved or alluded to new-generation SK hynix and Micron products. As mentioned in recently published Samsung Electronics Q1 financial papers, company engineers are still working on "upcoming enhanced HBM3E products." Late last month, a neighbor/main rival publicly showcased their groundbreaking HBM4 memory solution—indicating a market leading development position. Samsung has officially roadmapped a futuristic "sixth-generation" HBM4 technology, but their immediate focus seems to be a targeted sales expansion of incoming "enhanced HBM3E 12H" products. Previously, the firm's Memory Business has lost HBM3 ground—within AI GPU/accelerator market segments—to key competitors.

Industry insiders believe that company leadership will attempt to regain lost market shares in a post-2025 world. As reported by South Korean news outlets, Kim Jae-joon (VP of Samsung's memory department) stated—during a recent earnings call, with analysts—that his team is: "already collaborating with multiple customers on custom versions based on both HBM4 and the enhanced HBM4E." The initiation of commercial shipments is anticipated at some point in 2026, hinging on mass production starting by the second half of this year. The boss notified listeners about development "running on schedule." A Hankyung article alleges that Samsung HBM4 evaluation samples have been sent out to "NVIDIA, Broadcom, and Google." Wccftech posits a positive early outlook: "Samsung will use its own 4 nm process from the foundry division and utilize the 10 nm 6th-generation 1c DRAM, which is known as one of the highest-end in the market. On paper, (their) HBM4 solution will be on par with competing models (from SK hynix), but we will have to wait and see."

Intel has only released two Arc Xe2 "Battlemage" desktop models: the B580 12 GB and B570 10 GB graphics cards. So far, these lower priced options have been warmly welcomed by reviewers and buyers alike—but gaming GPU enthusiasts are still actively clamoring for more potent second-gen "Battlemage" variants. The collective status of theorized "B750, B770, and (fancifully) B780" SKUs is frustratingly unclear. Intel has not generated any official new product noise since the launch of their B570 design, earlier this year—recent big announcements have focused on next-gen "AI PC" processor lines. A series of vague leaks have indicated cancelations and then revivals of speculated mid-to-high-end Arc Xe2 discrete cards.

As of late, a larger "BMG-G31" GPU identifier has appeared in shipping manifests—a previous leak pointed to "prototype" units being moved between company facilities. Yesterday, Haze2K1 shared another extract from NBD inventory documents—crucially, they believe that these items are heading to a crucial manufacturing plant in Vietnam. This location is/was tasked with the assembling of first-party B570 and B580 Limited Edition products. Fresh conjecture suggests that "B7XX" Limited Edition cards are in the pipeline, but current circumstances are still hazy. VideoCardz reckons that a "Developer Edition" 24 GB model is still in active development, but this rumored workstation/productivity-oriented card could be based on Intel's readily available "BMG-G21" GPU die.

As disclosed in a new press release—issued by the US Commerce Department—TSMC's North American operation has started another expansion. Last month, Taiwan's leading chip foundry committed a substantial $100 billion investment—eventually leading to a greater production footprint in Phoenix, Arizona. Reports suggest that ground has already been broken, in a low-key manner—as of yesterday (April 29)—at a planned third location, only hours after TSMC's receiving of permits—aka a "thumbs up" from the US government. According to local news outlets, key administrative representatives were in attendance to witness the initiation of construction work. TSMC's third plant is destined to pump out cutting-edge products via a 2 nm (N2) process technology, with Apple, NVIDIA and AMD confirmed as "front of the queue" customers. Despite recent fanfare and celebrations, industry analysts reckon that it will take up to a decade for the foundry's North American operation to solidify a dependable supply chain. In the interim, certain elements will require shipping to overseas locations—for packaging and finalization purposes.

Today at Intel Foundry Direct Connect, the company will share progress on multiple generations of its core process and advanced packaging technologies. The company will also announce new ecosystem programs and partnerships, and welcome industry leaders to discuss how a systems foundry approach enables collaboration with partners and unlocks innovation for customers.

Intel CEO Lip-Bu Tan will open the event by discussing Intel Foundry's progress and priorities as the company drives the next phase of its foundry strategy. Naga Chandrasekaran, Intel Foundry chief technology and operations officer, and Kevin O'Buckley, general manager of Foundry Services, will also deliver keynotes during the morning session, sharing process and advanced packaging news while highlighting Intel Foundry's globally diverse manufacturing and supply chain.

As revealed during a recent Q1 earnings call, Intel leadership mentioned that "external clients are getting their ASICs designs tested." The company's foundry business is working towards the finalization of its much discussed 18A node process, with alleged trial samples receiving an "impressive performance rating." According to Ctee Taiwan, Team Blue's foundry service has submitted test subjects to the likes of NVIDIA, Broadcom and Faraday Technology. The latter organization has (reportedly) disclosed that the 18A platform tape-out was completed last October—since then, received samples have been "successfully connected." Industry moles believe that NVIDIA and Broadcom are in the middle of conducting manufacturing tests. Additional whispers suggest the delivery of 18A prototypes chez IBM and several other unnamed partner companies. Insiders have indicated impressive/good "verification results." Contrary to reports from other sources, Ctee has picked up on insider chatter about Intel's next-gen Nova Lake compute tile design being "not entirely outsourced." Further conjecture points to Team Blue becoming increasingly confident in its own manufacturing techniques.

AMD is said to be gearing up to sell its AI server assembly facility in the U.S., and it's drawing a lot of interest from Taiwanese OEM manufacturers and others. Bloomberg reports that Compal and Wiwynn are leading the charge in the bidding, with U.S. electronics company Jabil also in the mix. Interestingly, Inventec and Pegatron, who were once contenders, have pulled out. AMD is looking to speed up the sale process, asking for bids on a short timeline and aiming to finalize the deal by the end of the quarter, with a price range of $3-4 billion. This potential sale comes just months after AMD acquired the facility as part of its $4.9 billion purchase of ZT in March, which included the assembly plant and about 1,500 employees.

Industry experts suggest that AMD's decision to sell is a strategic move to avoid competing with its own clients in manufacturing. Meanwhile, the top bidders seem ready to expand their U.S. manufacturing capabilities. Compal is exploring North American expansion for server production, with Texas emerging as the prime location candidate due to its robust power infrastructure. Meanwhile, Wiwynn has already secured a foothold in the region, having announced the acquisition of a Texas factory in February specifically to establish server manufacturing operations.