Intel Corporation today announced that Shlomit Weiss, senior vice president and co-general manager (GM) of the Design Engineering Group (DEG), will replace senior vice president Sunil Shenoy, who will retire at the end of the year. Weiss will lead the company's design, development, validation and manufacturing support of intellectual properties (IPs) and system-on-chips (SoCs), reporting directly to Intel CEO Pat Gelsinger and joining the company's executive leadership team.

"The design engineering organization plays a central role in our ability to deliver leadership products in every category in which we compete. It requires a leader with deep technical expertise and passion for engineering excellence, and Shlomit has that in spades," Gelsinger said. "With more than three decades of experience in semiconductor and SoC design engineering and management, Shlomit is known for her focus on quality and predictable execution, which are critical focus areas as we advance our IDM 2.0 strategy."

Micron Technology, Inc. (NASDAQ: MU), one of the world's largest semiconductor companies and the only U.S.-based manufacturer of memory, today announced plans to invest approximately $15 billion through the end of the decade to construct a new fab for leading-edge memory manufacturing in Boise, Idaho. This will be the first new memory manufacturing fab built in the U.S. in 20 years, ensuring domestic supply of leading-edge memory required for market segments like automotive and data center, fueled by accelerating adoption of artificial intelligence and 5G.

This is the first of Micron's multiple planned U.S. investments following the passage of the CHIPS and Science Act, and represents the largest private investment ever made in Idaho. Co-locating the new manufacturing fab with Micron's R&D center at the company's headquarters will enhance operational efficiency, accelerate technology deployment and improve time to market.

Micron Technology, Inc., one of the world's largest semiconductor companies and the only U.S.-based manufacturer of memory, today announced its plans to invest $40 billion through the end of the decade to build leading-edge memory manufacturing in multiple phases in the U.S. With the anticipated grants and credits made possible by the CHIPS and Science Act, this investment will enable the world's most advanced memory manufacturing in America. Micron expects to begin production in the second half of the decade, ramping overall supply in line with industry demand trends.

Micron's planned investment, the largest in memory manufacturing in U.S. history, will ultimately create up to 40,000 new American jobs including approximately 5,000 highly paid technical and operational roles at Micron. The Micron investment will also enrich surrounding communities by bolstering education, workforce training, transportation and several other services. Micron is finalizing its specific U.S. expansion plans and will share additional details in the coming weeks.

Skullcandy, the #1 selling brand in Stereo Headphones and True Wireless Earbuds under $100, announced today its limited-edition Transparency Series, designed to create visibility around environmental impact, while progressing an overarching commitment to carbon reduction. The series is available exclusively at Skullcandy.com with a portion of proceeds helping fund the critical climate advocacy of Protect Our Winters.

Skullcandy has partnered with EcoChain to assess, minimize and publish associated carbon emissions, setting the bar for future carbon reduction. A partnership with TerraPass has enabled Skullcandy to invest in certified carbon-capture programs to offset impacts, resulting in a net-zero footprint for products in the Transparency Series.

Micron Technology, Inc. (NASDAQ: MU) commends and thanks the Biden Administration for their leadership and the bipartisan work of Congress for passing the "Chips and Science" legislation. This is a big step towards securing the future of semiconductor manufacturing in the United States and advancing American innovation and competitiveness for years to come.

This legislation will bring leading-edge semiconductor manufacturing to the U.S., creating tens of thousands of jobs and tens of billions of dollars of new investments - transforming U.S. semiconductor innovation and supply chain resilience.

Valve, handlers of the world's most popular digital games store and manufacturers of the Steam Deck, have announced that they've been able to more than double weekly production of the handheld console. Due to the production "picking up", as Valve says it, the company expects to double the number of handhelds shipped each week. This is especially good news for users that were expecting to receive their devices in the 3Q - shipments for these particular orders will begin on June 30th.

Valve doesn't make it clear what exactly was bottlenecking production. Manufacturing and logistics have been showing signs of normalization following a couple of years with snag after snag due to the COVID-19 pandemic and the recent war in Ukraine. Overwhelming demand for graphics chips across the product spectrum may have pushed Valve to accept a smaller pie of AMD chips than the company would like to, and might be one of the reasons the company was forced to extend deliveries of pre-orders for the device.

According to TrendForce, Taiwan is crucial to the global semiconductor supply chain, accounting for a 26% market share of semiconductor revenue in 2021, ranking second in the world. Its IC design and packaging & testing industries also account for a 27% and 20% global market share, ranking second and first in the world, respectively. Firmly in the pole position, Taiwan accounts for 64% of the foundry market. In addition to TSMC possessing the most advanced process technology at this stage, foundries including UMC, Vanguard, and PSMC also have their own process advantages. Under the looming shadow of chip shortages caused by the pandemic and geopolitical turmoil in the past two years, various governments have quickly awakened to the fact that localization of chip manufacturing is necessary to avoid being cut off from chip acquisition due to logistics difficulties or cross-border shipment bans. Taiwanese companies have ridden this wave to become partners that governments around the world are eager to invite to set up factories in various locales.

Kioxia Corporation and Western Digital Corp. (NASDAQ: WDC) have finalized a formal agreement to jointly invest in the first phase of the Fab 7 (Y7) manufacturing facility at Kioxia's industry-leading Yokkaichi Plant in the Mie Prefecture of Japan. With construction of the first phase of Y7 completed, the joint-venture investment will enable initial production output beginning in the fall of this year. This marks another important milestone in the 20-year strategic joint-venture partnership between the two companies.

"We are very pleased to further deepen our strategic partnership with Western Digital through this joint investment in Y7," said Nobuo Hayasaka, President and CEO of Kioxia. "The rapid digitization of societies underpins accelerating use of memory products. We will continue to leverage our technological partnership and economies of scale to develop and produce cutting-edge semiconductor products and achieve organic corporate growth."

Yesterday, NVIDIA announced its next-generation Hopper architecture designed for data center applications and workloads. There is always a question of availability, as the previous period showed everyone that the supply chain is overbooked and semiconductors are in very high demand. During the Q&A press session today, NVIDIA's CEO, Jensen Huang, tried to answer as many questions as possible. However, an exciting topic arose regarding the potential collaboration with Intel. As a part of Intel's IDM 2.0 strategy, the company plans to offer its chip manufacturing capabilities to the third-party companies willing to make efforts and port their designs to Intel's semiconductor nodes. NVIDIA, one of the largest TSMC customers, could be a new Intel customer. Below, we compiled a few quotes that highlight Jensen Huang's opinions, taking the quotes from Tom's Hardware.

NVIDIA CEO Jensen HuangOur strategy is to expand our supply base with diversity and redundancy at every single layer. At the chip layer, at the substrate layer, the system layer, at every single layer. We've diversified the number of nodes, we've diversified the number of foundries, and Intel is an excellent partner of ours[…]. They're interested in us using their foundries, and we're very interested in exploring it. [...] I am encouraged by the work that is done at Intel, I think this is a direction they have to go, and we're interested in looking at their process technology. Our relationship with Intel is quite long; we work with them across a whole lot of different areas, every single PC, every single laptop, every single PC, supercomputer, we collaborate. [...] We have been working closely with Intel, sharing with them our roadmap long before we share it with the public, for years. Intel has known our secrets for years. AMD has known our secrets for years. We are sophisticated and mature enough to realize that we have to collaborate.[...] We share roadmaps, of course, under confidentiality and a very selective channel of communications. The industry has just learned how to work in that way.

There have been several announcements of new semiconductor fabs being built all over the world, but those fabs might end up being empty shells, all because of a single company. ASML or Advanced Semiconductor Materials Lithography if you prefer, is a Dutch company that produces various types of photolithography machines that are used to produce semiconductors. They're the world leader in their field and their machines are used by the likes of Intel and TSMC to do the physical etching of the silicon wafers that semiconductors are produced from. Now a warning from ASML's CEO, Peter Wennink has arrived, stating that the company can't keep up with demand.

The company isn't expecting to fulfil orders for at least the next couple of years, despite expecting to ship more machines this year than last year and more machines next year than this year. As each of these machines are largely custom made for its customers and hand built, due to the low production volumes, it takes a lot of time to construct each of these huge machines. Wennink said that the company "really needs to step up our capacity significantly more than 50 per cent. That will take time."

After months of rumors and speculations, it looks like we are finally going to receive official information from Intel regarding the exact country the company plans to do semiconductor R&D and manufacturing in within Europe. Today, the company published its media alert post, showing that we are finally going to receive exact information tomorrow. As we have previously reported, the current round of suggestions led to Intel building a fab inside Germany; however, it still remains to be confirmed. Once the information is out, we are going to report on it and finally see where team blue is headed next. You can find the announcement below.

As part of its IDM 2.0 strategy, Intel is committed to investing in research and development (R&D) capabilities and manufacturing capacity to meet the surging demand for advanced semiconductors and to build a more resilient, globally balanced supply chain.

Join a webcast with CEO Pat Gelsinger where he will share details of Intel's latest plans for in semiconductor R&D and manufacturing in Europe.

When: 6 a.m. PDT (2 p.m. CET), Tuesday, March 15
Where: Watch live on the Intel Newsroom.
Event Replay: A video replay will be available on the Intel Newsroom following the webcast.

A major power-outage affected regions of Taiwan with semiconductor manufacturing bases, earlier this morning (March 3, 2022). A malfunction with a power-station caused a sudden drop in power-generation, triggering power-grid failures, and resulting in blackouts lasting around 90 minutes. This may not seem like much, but for a semiconductor manufacturing facility with limited power back-up and time-critical and power-critical processes, 90 minutes is an eternity.

Taiwan News reports that a Taipower plant in Kaohsiung suffered a malfunction with steam leaks in the turbine room, triggering an emergency shutdown. This caused a 10.5 MW drop in supply. Such sudden supply-demand changes can cause AC frequency to fall out of the safe range, and transmission equipment in switch-yards are designed to automatically trip (to protect end-user equipment). A cascading power outage was seen in Wenshan District, Neihu District, Da'an District, and Xinyi District. In New Taipei City, Yonghe District, Banqiao District, and New Taipei Industrial Park. Various semiconductor-manufacturing companies are yet to report how this power-loss affected them.Update 07:02 UTC: In the wake of this power-outage, major semiconductor companies put out their initial assessments of how this affected them.

Intel, along with Advanced Semiconductor Engineering Inc. (ASE), AMD, Arm, Google Cloud, Meta, Microsoft Corp., Qualcomm Inc., Samsung and Taiwan Semiconductor Manufacturing Co., have announced the establishment of an industry consortium to promote an open die-to-die interconnect standard called Universal Chiplet Interconnect Express (UCIe). Building on its work on the open Advanced Interface Bus (AIB), Intel developed the UCIe standard and donated it to the group of founding members as an open specification that defines the interconnect between chiplets within a package, enabling an open chiplet ecosystem and ubiquitous interconnect at the package level.

"Integrating multiple chiplets in a package to deliver product innovation across market segments is the future of the semiconductor industry and a pillar of Intel's IDM 2.0 strategy," said Sandra Rivera, executive vice president and general manager of the Datacenter and Artificial Intelligence Group at Intel. "Critical to this future is an open chiplet ecosystem with key industry partners working together under the UCIe Consortium toward a common goal of transforming the way the industry delivers new products and continues to deliver on the promise of Moore's Law."

Intel Corporation today announced that Christoph Schell has been appointed executive vice president and chief commercial officer to lead the Sales, Marketing and Communications Group (SMG), starting March 14. Schell will succeed Michelle Johnston Holthaus, who will take on a new role as general manager of Intel's Client Computing Group (CCG).

"Christoph has an exceptional track record of driving innovative and disruptive go-to-market strategies around the globe. He brings expertise in understanding business segments, verticals and the solutions and services customers want," said Pat Gelsinger, Intel CEO. "We are harnessing our core strengths as an advantage to grow in our traditional markets and accelerate our entry into new ones. I'm confident Christoph is the right leader to take on this critical role and guide the talented SMG organization to achieve our growing ambitions."

Schell joins Intel from HP Inc., where he was most recently chief commercial officer. With his go-to-market team, he led customer and partner success, category management and customer support globally. During his 25 years with the company, Schell held various senior management roles across the globe, including president of 3D Printing & Digital Manufacturing. Prior to rejoining HP in 2014, Schell served as executive vice president of Growth Markets for Philips, where he led the lighting business across Asia Pacific, Japan, Africa, Russia, India, Central Asia and the Middle East. He started his career in his family's distribution and industrial solutions company and worked in brand management at Procter & Gamble.

From 2020 to 2025, the compound annual growth rate (CAGR) of 12-inch equivalent wafer capacity at the world's top ten foundries will be approximately 10% with the majority of these companies focusing on 12-inch capacity expansion, which will see a CAGR of approximately 13.2%, according to TrendForce's research. In terms of 8-inch wafers, due to factors such as difficult to obtain equipment and whether capacity expansion is cost-effective, most fabs can only expand production slightly by means of capacity optimization, equating to a CAGR of only 3.3%. In terms of demand, the products primarily derived from 8-inch wafers, PMIC and Power Discrete, are driven by demand for electric vehicles, 5G smartphones, and servers. Stocking momentum has not fallen off, resulting in a serious shortage of 8-inch wafer production capacity that has festered since 2H19. Therefore, in order to mitigate competition for 8-inch capacity, a trend of shifting certain products to 12-inch production has gradually emerged. However, if shortages in overall 8-inch capacity is to be effectively alleviated, it is still necessary to wait for a large number of mainstream products to migrate to 12-inch production. The timeframe for this migration is estimated to be close to 2H23 into 2024.

Razer's CEO, Min-Liang Tan, has said in a Tweet that the company's flagship laptop model will receive a price increase due to increased component costs. According to previous reports, the whole supply chain is seeing an increasing amount of pressure in the form of demand and supply's inability to satisfy it. Manufacturing costs have also risen, resulting in more expensive products that consumers end up buying. For a while now, graphics cards have been very hard to obtain, and their selling price is way higher than their launch MSRP target.

According to the Razer CEO, as they reviewed the company lineup of laptops, it appears that their Razer Blade model for 2022 will receive a significant price bump. This is the result of "significant increases in component costs etc.," which means that the end product will absorb those increases. We are left to wonder if all high-performance laptop makers like MSI, ASUS, GIGABYTE, etc., will follow Razer and their decision to increase the price point.

TSMC (TWSE: 2330, NYSE: TSM) and Sony Semiconductor Solutions Corporation ("SSS") today jointly announced that TSMC will establish a subsidiary, Japan Advanced Semiconductor Manufacturing, Inc. ("JASM"), in Kumamoto, Japan to provide foundry service with initial technology of 22/28-nanometer processes to address strong global market demand for specialty technologies, with SSS participating as a minority shareholder.

Construction of JASM's fab in Japan is scheduled to begin in the 2022 calendar year with production targeted to begin by the end of 2024. The fab is expected to directly create about 1,500 high-tech professional jobs and to have a monthly production capacity of 45,000 12-inch wafers. The initial capital expenditure is estimated to be approximately US$7 billion with strong support from the Japanese government.

Under definitive agreements reached between TSMC and SSS, SSS plans to make an equity investment in JASM of approximately US $0.5 billion, which will represent a less than 20% equity stake in JASM. The closing of the transaction between TSMC and SSS is subject to customary closing conditions.

Micron Technology, Inc. (Nasdaq: MU), the only U.S.-based manufacturer of memory and one of the world's largest semiconductor manufacturers, today announced that it intends to invest more than $150 billion globally over the next decade in leading-edge memory manufacturing and research and development (R&D), including potential U.S. fab expansion. Micron's investment will address increasing demand for memory that is essential to all computing.

Memory and storage are a growing portion of the global semiconductor industry, and today represent approximately 30% of the semiconductor market. Secular growth drivers like 5G and AI will expand usage of memory and storage across the data center and the intelligent edge, and in areas like automotive and a diversity of user devices.

Digi-Key Electronics, which offers the world's largest selection of electronic components in stock for immediate shipment, announced that it is launching a new 3D Printing and Additive Manufacturing tool, powered by Jabil Inc. Through this new tool, Digi-Key customers can upload design files, receive instant quotes and have custom 3D products and items shipped directly to their door from Jabil. Featuring a seamless upload and "add to cart" experience for users, this new additive manufacturing tool provides fast turnaround times and free shipping to customers in the U.S.

"We are very excited to launch our new 3D Printing and Additive Manufacturing service in order to give electrical, mechanical and industrial engineers the ability to easily create custom 3D products for manufacturing purposes," said Missy Hall, senior director, new market development, at Digi-Key. "This introduction is a flagship option of Digi-Key's additive manufacturing services portfolio, and we look forward to continuing to expand our offerings to include many suppliers to serve the needs of the additive manufacturing market."

Intel's struggles with semiconductor manufacturing have been known for a very long time. Starting from its 10 nm design IP to the latest 7 nm delays, we have seen the company struggle to deliver its semiconductor nodes on time. On the other hand, Intel's competing companies are using 3rd party foundries to manufacture their designs and not worry about the yields of semiconductor nodes. Most of the time, that 3rd party company is Taiwan Semiconductor Manufacturing Company (TSMC). Today, thanks to some reporting from Nikkei Asia, we are learning that Intel is tapping TSMC's capacities to manufacture some of the company's future processors.

Citing sources familiar with the matter, Nikkei notes that: "Intel, America's biggest chipmaker, is working with TSMC on at least two 3-nm projects to design central processing units for notebooks and data center servers in an attempt to regain market share it has lost to Advanced Micro Devices and Nvidia over the past few years. Mass production of these chips is expected to begin by the end of 2022 at the earliest." This means that we could expect to see some of the TSMC manufactured Intel processors by the year 2023/2024.

Robert Bosch GmbH, commonly known as just Bosch, has today unveiled the results of the company's biggest investment ever. On Monday, the company has unveiled its one billion Euro manufacturing facility, which roughly translates to 1.2 billion US Dollars. The manufacturing plant is located in Dresden, Germany, and it aims to supply the leading self-driving automobile companies with chips that are in great demand. As the main goal for the plant is to manufacture chips for the automotive industry, this new 7,200 m² Dresden facility is supposed to provide car makers with Application-Specific Integrated Circuits (ASICs) for power management and tasks such as triggering the automatic braking system of cars.

The one billion Euro facility was funded partly by the funds coming from the European Union investment scheme, which donated as much as 200 million Euros ($243 million). The goal of the plan is to start with the manufacturing of chips for power tools as early as July and start production of automotive chips in September. All of the chips will be manufactured on 300 mm wafers, which offers a major improvement in quantity compared to 200 and 150 mm wafers currently used by Bosch. The opening of this facility will surely help with the global chip shortages, which have even hit the automotive sector.

Intel CEO Pat Gelsinger, speaking at the company's 2021 Computex Opening Keynote address stated that the explosive demand for chips caused by recent inflections of technology, accelerated by the COVID-19 pandemic, has resulted in demand outstripping supply by such extent, that it could "still take a couple of years for the ecosystem to address the shortages."

Gelsinger detailed how the world of information technology is at its biggest crossroads ever, with the emergence of Cloud, 5G, AI, and smarter edge computing changing the way people work, learn, and interact. This has caused a huge growth in the demand for semiconductors straining technology supply chains around the world. Gelsinger stated that his company is working with partners across the technology ecosystem to increase output to meet demand. He detailed how Intel has nearly doubled its own chip wafer manufacturing capacity over the past four years. "But while the industry has taken steps to address near-term constraints, it could still take a couple of years for the ecosystem to address chip shortages of foundry capacity, substrate, and components.

TAITRA (Taiwan External Trade and Development Council) announced today that NVIDIA will be delivering a keynote, entitled "The Transformational Power of Accelerated Computing, from Gaming to the Enterprise Data Center" at COMPUTEX 2021 Hybrid. Jeff Fisher, Senior Vice President of NVIDIA's GeForce Business Unit, will present on June 1 at 1:00 pm Taiwan time on the massive opportunities that GeForce PC gaming represents for the Taiwan ecosystem.

Manuvir Das, Head of Enterprise Computing at NVIDIA, will then address "The Coming Democratization of AI." He will share three shifts driving this trend and explain how enterprises that embrace them can thrive in the coming years.

The South Korean government, along with 153 Korean companies, has unveiled an ambitious plan to invest USD $450 billion over the next decade, to make its semiconductor manufacturing industry globally competitive, as China and the U.S. are executing similar national plans of their own, which threaten to blunt South Korea's competitiveness in the industry. Leading the effort will be Samsung Electronics and SK Hynix.

Samsung will be spending over $151 billion through 2030 in expanding its manufacturing facilities, while SK Hynix will spend $97 billion to expand its existing facilities; in addition to $106 billion planned to build four new fabs in the Yongin. Both Samsung and SK Hynix are predominantly memory companies, manufacturing DRAM and NAND flash products. This means that while Korea is globally competitive in semiconductor manufacturing overall, it is relying mainly on memory dies, and not logic dies (chips such as ASICs, CPUs, GPUs, SoCs, FPGAs, etc). The two could put in efforts to change this, so their foundry capacity attracts fabless logic IC companies away from Taiwan's TSMC, which specializes in logic over memory.

Since lobbying is both legal and regulated in the US (an attempt to bring attempts of influencing political power by corporations under legal boundaries, as opposed to being done in the dark), it feels like it was only a matter of time before big tech attempted to join under one banner. As such, the Semiconductors in America Coalition (SIAC) has now been put together, and boasts of 64 members including Microsoft, Apple, TSMC, Intel, AMD, NVIDIA, Arm, and Samsung. It seems that all of these companies - which are often at odds with one another when it comes to competing for consumers' choice and money - have found enough similarities to get organized in an attempt to nudge political power in their favor.

SIAC said in a press release that its mission is to "advance federal policies that promote semiconductor manufacturing and research in the U.S. to strengthen America's economy, national security, and critical infrastructure." The first announcement from the SIAC following its foundation was its intention to support the CHIPS for America Act. The Act (supported by The Semiconductor Industry Association (SIA) and President Joe Biden) has already been approved by the House and the Senate as part of the National Defense Authorization Act for 2021 but has not yet been funded. It seems that SIAC's first mission is to get the government to open up its $50 billion-deep pockets.