Going back to the start of this year, TSMC's trial run of a cutting-edge 2 nm (N2) node process was reportedly progressing beyond initial expectations. According to industry moles, two flagship fabrication facilities are "optimistically" tipped to pump out 80,000 units per month (by the end of 2025). This cross-facility total figure was linked to TSMC's Baoshan—located near the Northern Taiwanese city of Hsinchu—and Kaohsiung (in the South) plants. The latest regional reports suggest that the aforementioned trial phase was a resounding success, with pleasing results pointing to an "ahead of schedule" transfer to mass production phases. Insiders previously heard about the Kaohsiung production hub's schedule; with mass production set to start by early 2026—according to fresh rumors, revised calendars have a kick-off window repositioned somewhere in late 2025. Apparently a special "2 nm plant expansion ceremony" took place in that location, earlier today.

A noted semiconductor business analyst—Ming-Chi Kuo—reckons that recent 2 nm pilot yields have progressed well over the 60% mark, meaning that the involved foundry teams are more than ready to move onto kicking things into high gear. Taiwan's Economic News Daily anticipates significant financial gains, due to TSMC N2 products already being in high demand: "the quarterly revenue in the second half of the year is expected to reach one trillion yuan (~US$30.1 billion) for the first time, and it is poised to challenge the goal of earning twice the share capital in a quarter and rewrite the record for a single quarter." The local publication claims that TSMC Baoshan's "first batch of production capacity" is fully reserved for Apple, while Kaohsiung will take care of orders for other (i.e. less) important customers.

AMD today announced the completion of its acquisition of ZT Systems, a leading provider of AI and general-purpose compute infrastructure for the world's largest hyperscale providers. The acquisition will enable a new class of end-to-end AI solutions based on the combination of AMD CPU, GPU and networking silicon, open-source AMD ROCm software and rack-scale systems capabilities. It will also accelerate the design and deployment of AMD-powered AI infrastructure at scale optimized for the cloud.

AMD expects the transaction to be accretive on a non-GAAP basis by the end of 2025. The world-class design teams will join the AMD Data Center Solutions business unit led by AMD Executive Vice President Forrest Norrod. AMD is actively engaged with multiple potential strategic partners to acquire ZT Systems' industry-leading U.S.-based data center infrastructure manufacturing business in 2025.

According to a report produced by semiconductor industry analysts at Kiwoom Securities—a South Korean financial services firm—Semiconductor Manufacturing International Corporation (SMIC) is expected to complete the development of a 5 nm process at some point in 2025. Jukanlosreve summarized this projection in a recent social media post. SMIC is often considered to be China's flagship foundry business; the partially state-owned organization seems to heavily involved in the production of (rumored) next-gen Huawei Ascend 910 AI accelerators. SMIC foundry employees have reportedly struggled to break beyond a 7 nm manufacturing barrier, due to lack of readily accessible cutting-edge EUV equipment. As covered on TechPowerUp last month, leading lights within China's semiconductor industry are (allegedly) developing lithography solutions for cutting-edge 5 nm and 3 nm wafer production.

Huawei is reportedly evaluating an in-house developed laser-induced discharge plasma (LDP)-based machine, but finalized equipment will not be ready until 2026—at least for mass production purposes. Jukanlosreve's short interpretation of Kiwoom's report reads as follows: (SMIC) achieved mass production of the 7 nm (N+2) process without EUV and completed the development of the 5 nm process to support the mass production of the Huawei Ascend 910C. The cost of SMIC's 5 nm process is 40-50% higher than TSMC's, and its yield is roughly one-third." The nation's foundries are reliant on older ASML equipment, thus are unable to produce products that can compete with the advanced (volume and quality) output of "global" TSMC and Samsung chip manufacturing facilities. The fresh unveiling of SiCarrier's Color Mountain series has signalled a promising new era for China's foundry industry.

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SiCarrier, a Huawei-backed Chinese semiconductor tool manufacturer, has launched a comprehensive suite of semiconductor manufacturing tools at this year's Semicon China. These tools are strategically essential to China's semiconductor self-sufficiency and a major step towards competitive nodes from the mainland. The new lineup spans multiple categories: optical inspection, deposition, etch, metrology, and electrical performance testing. Until now, Chinese chipmakers often depended on older-generation foreign equipment, but SiCarrier's new lineup promises domestic alternatives tailored to modern manufacturing processes. The tools address every stage of semiconductor fabrication, from inspecting microscopic defects to etching intricate circuits.

For quality control, SiCarrier's Color Mountain series functions like a high-powered microscope, using intense lighting and advanced imaging algorithms to examine both sides of silicon wafers for flaws as small as dust particles. Complementing this, the Sky Mountain series ensures the perfect alignment of circuit layers, which need perfect stacking, using diffraction-based measurements (analyzing light patterns) and direct image comparisons. The New Mountain suite combines specialized tools to analyze materials at the atomic level. One standout is the atomic force microscope (AFM), which maps surface topography with a nanoscale "finger," while X-ray techniques (XPS, XRD, XRF) act like forensic tools, revealing the chemical composition, crystal structure, and elemental makeup.

Earlier in the week, Apple specialist press outlets picked up on a noted industry analyst's technological forecast for a future iPhone processor design. Jeff Pu—of GF Industries, Hong Kong—predicted that the next-generation A20 SoC would be produced via a TSMC 3 nm (N3P) nodes process. Despite rumors of Apple gaining front row seats at the "2 nm ballgame," the partnership between fabless chip designer and foundry could potentially revisit already covered ground. The A19 chipset was previously linked to N3P (by insiders), with Pu expressing the belief that A20 would utilize the same fundamental lithographic underpinnings; albeit enhanced with TSMC's Chip on Wafer on Substrate (CoWoS) packaging technology (for AI improvements).

This morning, MacRumors followed up on their initial news article—they reported that "wires were crossed" at GF Industries, regarding projections for the (2026) iPhone 18 generation. The publication received direct feedback from the man of the hour: "Jeff Pu (lead Apple analyst) has since clarified that he believes the A20 chip will be manufactured with the N2 process, so the information about the chip using the N3P process should be disregarded. Earlier reports had said the A20 chip would be 2 nm, so rumors align again. This is ultimately good news, as it means the A20 chip should have more substantial performance and power efficiency improvements over the A19 chip." Cutting-edge smartphone processor enthusiasts expressed much disappointment when A20 was (regressively) linked to N3P; the latest revisement should instill some joy. According to industry moles, TSMC is making good progress with its cutting-edge 2 nm node process—mass production is expected to start at some point within the second half of 2025.

Over a year ago, industry watchdogs posited that Apple was patiently waiting in line at the front of TSMC's 2 Nanometer GAA "VVIP queue." The securing of cutting-edge manufacturing processes seems to be a consistent priority for the Cupertino, California-headquartered fabless chip designer. Current generation Apple chipsets—at best—utilize TSMC 3 nm (N3E) wafers. Up until very recently, many insiders believed that the projected late 2026 launch of A20 SoC-powered iPhone 18 smartphones would signal a transition to the Taiwanese foundry's advanced 2 nm (N2) node process. Officially, TSMC has roadmapped the start of 2 nm mass production around the second half of 2025.

According to Jeff Pu—a Hong Kong-based analyst at GF Securities—the speculated A20 (2026) chipset could stick with N3P. Leaks suggest that aspects of Apple's next in line "A19" and "A19 Pro" mobile SoCs could be produced via a 3 nm TSMC process. MacRumors has picked up on additional inside track whispers; about Apple M5 processors (for next-gen iPad Pro models) being based on N3P—"likely due to increased wafer costs." Pu reckons that Apple's engineering team has provisioned a major generational improvement with A20's AI capabilities, courtesy of TSMC's Chip on Wafer on Substrate (CoWoS) packaging technology. This significant upgrade is touted to tighten integration between the chip's processor, unified memory, and Neural Engine segments. Revised insider forecasts have positioned A21 chip designs as natural candidates for a shift into 2 nm GAA territories.

According to The Korea Economic Daily, an unlikely alliance—involving Samsung Electronics and Palantir Technologies—was formed at the end of last year. Late last week, insiders posited that the South Korean megacorporation's Foundry business was going through troubled times. It is not clear whether the assistance provided by Palantir's AI-infused suite has produced pleasing results chez Samsung's flagship production hubs, but insiders reckon that utilization of the software started just before Christmas. Local media outlets view this unusual pairing as a "gamble"—reportedly, the new-ish initiative has targeted an improved "semiconductor yield (ratio of good products in total production), quality, and productivity."

The Samsung Foundry appears to be going "all-in" with its 2 nm GAA node process; industry moles picked up on signals transmitted by an alleged special "task force (TF)." This elite team is reportedly entrusted with a challenging two-pronged goal; get 2 nm GAA over the finish line by late 2025, alongside the (connected) finalization of a much-rumored "Exynos 2600" mobile chipset. The Korea Economic Daily news article mentions the expansion of a "Samsung DS Division AI Center" back in December (2025), but falls short of labelling this department as the aforementioned "special task force." Despite a previous reluctance to share sensitive data with external companies, the latest report suggests a significant change in strategy. Further details were disclosed: "(Samsung's) collaboration with Palantir is handled by the DS Division AI Center...The AI Center is an organization that merged the DS Division Innovation Center and SAIT (formerly Samsung Advanced Institute of Technology) AI Center, and is developing DS Division-specific technologies using AI, advancing development software, building AI platforms, and controlling and advancing facilities and infrastructure." Around late February, industry inside trackers predicted continued "smooth" progress with the 2 nm GAA node. Samsung Foundry's fully upgraded "S2" mass production line is expected to come online by Q4 2025.

Supermicro, Inc., a Total IT Solution Provider for AI, Cloud, Storage, and 5G/Edge, is pushing forward with a major expansion, announcing plans for a third campus in Silicon Valley. The first building will be over 300,000 square feet, yet the third campus is expected to be nearly 3 million square feet when completed. With the mayor's support, this expansion strengthens Supermicro's position as an industry leader, accelerating liquid-cooled and Data Center Building Block Solutions for data centers and customers while creating new jobs and opportunities for local talent. Supermicro is the leading IT manufacturer headquartered in the USA.

"We are thrilled to grow our footprint in Silicon Valley," said Charles Liang, president and CEO of Supermicro. "As AI factories become more prevalent, liquid-cooled data centers are critical to meet these increasing customer demands. We anticipate that up to 30% of new data centers will adopt liquid cooling solutions. Today, Supermicro can deliver 5,000 air-cooled or 2,000 liquid-cooled racks per month to support substantial orders. This expansion is a major step forward in our vision for innovation, investment in workforce, quality, Time-to-Deployment (TTD), Time-to-Online (TTO) service, and technological advancement."

Samsung's foundry operation has experienced many setbacks over the past six months, according to a steady feed of insider reports. Last November, industry moles leaked details of an apparent abandonment of the company's 3 nm Gate-All-Around (GAA) process. Significant yield problems prompted an alleged shift into 2 nm territories, with a next-gen flagship Exynos mobile processor linked to this cutting-edge node. According to a mid-week Chosun Daily article, Samsung and its main rival—TSMC—are in a race to establish decent yields of 2 nm wafers, ahead of predicted "late 2025" mass production kick-offs. The publication's inside track points to the Taiwanese foundry making the most progress (with an estimated 60%), but watchdogs warn that it is too early to bet against the South Korean competitor.

Despite murmurs of current 20 - 30% yields, the Samsung's Hwaseong facility is touted to make "smooth" progress over the coming months. Chosun's sources believe that Samsung engineers struggled to get 3 nm GAA "up to snuff," spending around three years on development endeavors (in vain). In comparison, the making of 2 nm GAA is reported to be less bumpy. A fully upgraded "S3" foundry line is expected to come online by the fourth quarter of this year. An unnamed insider commented on rumors of better than anticipated forward motion chez Samsung Electronics: "there are positive aspects to this as it has shown technological improvements, such as the recent increase in the yield of its 4 nm process by up to 80%." Recent-ish reports suggest that foundry teams have dealt with budget cuts, as well as mounting pressure from company leadership to hit deadlines.

On Feb. 28, 2025, Naga Chandrasekaran, executive vice president, chief global operations officer and general manager of Intel Foundry Manufacturing, sent a message to Intel employees in Ohio updating them on the latest planned construction completion dates for Ohio One Mod 1 and Mod 2 that are under construction in New Albany, Licking County, Ohio. I continue to be impressed by the progress you are driving on our Ohio One campus. We have come a long way since construction began, and I am grateful for all that you've accomplished to lay the groundwork for our future as we make Ohio one of the world's leading hubs of advanced semiconductor manufacturing.

Last quarter, we achieved our "go vertical" milestone when the "basement" level of the fab was completed - and work on the above-ground structure is now underway. The campus has been transformed in ways that bring Ohio's natural beauty to the site. You are also doing so much beyond our campus to support Ohioans in our neighborhood and across the state by creating education and workforce development initiatives, building local business partnerships, and volunteering and investing in the community. I am proud of the impact you are making.

Earlier in the year, we heard about TSMC being ahead of the game with its speculated trial production run of cutting-edge 2 nm (N2) silicon. Taiwan's premier foundry company is reportedly prepping its Baoshan and Kaohsiung plants for full-on manufacturing of next-gen chips. The latest insider whispers propose that TSMC is making "rapid" progress on the 2 nm (N2) front, as company engineers have moved onto an "intensive" trial production phase. Taiwan's Economic Daily News has picked up on compelling projections from industry moles; the Hsinchu Baoshan facility's current monthly production capacity is (allegedly) around 5000 to 10,000 2 nm wafers. The other 2 nm-specialist site—Kaohsiung—has reportedly moved into a small-scale appraisal phase.

TSMC declined to comment on recently leaked data points, but they released a general statement (to UDN), emphasizing that: "(our) 2 nm process technology is progressing well and will go into mass production as scheduled in the second half of this year." The Baoshan plant could ramp up to 25,000 2 nm wafers per month, once it moves into a mass production phase. Combined with the same estimated output from its sister site (Kaohsiung), insiders reckon that the combined total could reach 50,000 units per month. Following a predicted successful "second phase" transition, TSMC's most advanced facilities have a "chance" to pump out 80,000 2 nm parts (combined total). The latest murmurs suggest that this milestone could be achieved by the end of 2025. Industry watchdogs believe that Apple will have first access dibs on TSMC's upcoming cutting-edge offerings.

The global semiconductor manufacturing industry closed 2024 with strong fourth quarter results and solid year-on-year (YoY) growth across most of the key industry segments, SEMI announced today in its Q4 2024 publication of the Semiconductor Manufacturing Monitor (SMM) Report, prepared in partnership with TechInsights. The industry outlook is cautiously optimistic at the start of 2025 as seasonality and macroeconomic uncertainty may impede near-term growth despite momentum from strong investments related to AI applications.

After declining in the first half of 2024, electronics sales bounced back later in the year resulting in a 2% annual increase. Electronics sales grew 4% YoY in Q4 2024 and are expected to see a 1% YoY increase in Q1 2025 impacted by seasonality. Integrated circuit (IC) sales rose by 29% YoY in Q4 2024 and continued growth is expected in Q1 2025 with a 23% increase YoY as AI-fueled demand continues boosting shipments of high-performance computing (HPC) and datacenter memory chips.

ASE Technology Holding Co., Ltd., the leading provider of semiconductor assembly and testing services ("ATM") and the provider of electronic manufacturing services ("EMS"), today reported its unaudited net revenues of NT$162,264 million for 4Q24, up by 1.0% year-over-year and up by 1.3% sequentially. Net income attributable to shareholders of the parent for the quarter totaled NT9,312 million, down from NT$9,392 million in 4Q23 and down from NT$9,733 million in 3Q24. Basic earnings per share for the quarter were NT$2.15 (or US$0.134 per ADS), compared to NT$2.18 for 4Q23 and NT$2.25 for 3Q24. Diluted earnings per share for the quarter were NT$2.07 (or US$0.129 per ADS), compared to NT$2.13 for 4Q23 and NT$2.18 for 3Q24.

For the full year of 2024, the Company reported unaudited net revenues of NT$595,410 million and net income attributable to shareholders of the parent of NT$32,483 million. Basic earnings per share for the full year of 2024 were NT$7.52 (or US$0.470 per ADS). Diluted earnings per share for the full year of 2024 were NT$7.23 (or US$0.452 per ADS).

ASRock told PCMag it plans to move some of its production out of China. "We need time to shift the manufacturing of GPU cards and other products hit by the 10% tariff to different countries," they said. This week, the White House put a 10% tax on all Chinese imports to the US, this tax applies on top of any other taxes the US already had on certain Chinese goods. ASRock also said, "While we move from making things in China to making them elsewhere, we might take on some of the cost and raise prices a bit to show the higher costs." But they added, "It's not easy to raise prices because the market is still very competitive." ASRock also told PCMag that it already pays a 25% tax on its power supplies made in China. "For items like PSUs that already have an extra 25% tax, makers will keep doing what they've been doing," the company said.

If Trump administration doesn't follow through with his threats of huge tariffs against Taiwan, the PC gaming industry will primarily feel the effects on companies like ASRock and MSI (which makes its motherboards in Shenzhen, China). These are the component and peripheral makers that have part or all of their manufacturing processes in China. ASRock's announcement isn't a huge surprise, as we saw hints of this trend in late 2024 when PC Partner (second-biggest graphics card maker, producing PCBs for brands such as Inno3D and Zotac) moved its headquarters from China to Singapore. It will be no surprise if other top-tier brands such as GIGABYTE, MSI, and ASUS take similar actions sooner or later.

New technology from Chalmers University of Technology and the University of Gothenburg, Sweden, is helping the EU establish its own competitive computer manufacturing industry. Researchers have developed components critical for optimising on-chip memory, a key factor in enhancing the performance of next-generation computers.

The research leader, Professor Per Stenström, along with colleagues, has discovered new ways to make cache memory work smarter. A cache is a local memory that temporarily stores frequently accessed data, improving a computer's speed and performance. "Our solution enables computers to retrieve data significantly faster than before, as the cache can manage far more processing elements (PEs) than most existing systems. This makes it possible to meet the demands of tomorrow's powerful computers," says Per Stenström, Professor at the Department of Computer Science and Engineering at Chalmers University of Technology and the University of Gothenburg.

Mid-week—at the World Economic Forum in Davos—India's government announced that its native semiconductor industry will release its debut product at some point this year. A similar announcement was made at last year's event, but the reported 28 nm "Made in India" chip would eventually miss its (then) projected December 2024 launch date. Press outlets have focused on Ashwini Vaishnaw's latest prediction for 2025—the Union Minister believes that everything will align neatly for his nation's fledgling semiconductor industry. Additionally, industry stakeholders have expressed confidence in the Semicon India program (initiated back in 2021).

He stated: "Our first 'Made in India' chip will be rolled out this year, and now we are looking at the next phase, where we can get equipment manufacturers, material manufacturers and designers in India...For materials, from parts per million purity, we need to go to parts per billion purity levels. This requires huge transformative changes in the process and the industry is working to achieve this." Vaishnaw is chief of India's AI Mission—this program has set itself some ambitious goals for 2025 and beyond. A primary objective is the founding of a common compute facility that will make use of 10,000 GPUs. The Minister for Electronics and Information Technology outlined the country's next phase of AI industry development—the creation of an indigenous AI model, and homegrown AI chip designs.

Sony Japan's Recording Media department has announced the retirement of several physical media formats—most notably Blu-Ray Disc—in a very brief notice addressed to "valued customers." Mid-last year, the Japanese multinational conglomerate revealed that it would stop production of consumer-grade recordable Blu-ray discs (BD-RE and BD-R)—citing a decline in demand and the format's inability to meet "business goals." As pointed out by Tom's Hardware, today's announcement indicates (via machine translation) that both "regular and recorded" product lines are affected—the publication has reached out to Sony for comment/clarification.

Optical media enthusiasts/preservationists will, undoubtedly, be angered by this news—manufacturing activities will cease at some point next month. The corporation's message contains a lot of finality: "thank you for your continued patronage of Sony products. We will end production of all models of Blu-ray Disc media, MiniDiscs for recording, MD data for recording, and MiniDV cassettes as of February 2025. There will be no successor models. We would like to express our sincere gratitude to our many customers for their patronage to date."

Earlier this week, Taiwan experienced a magnitude 6.4 earthquake—this seismic event interrupted manufacturing activities at several TSMC chip-making facilities. As a precaution, foundry employees in both Central and Southern Taiwan were evacuated. Production resumed fairly quickly following inspections of crucial infrastructure—no major damage to facilities or equipment was noted. The latest reports suggest that a relatively minor number of TSMC wafers have been affected by the recent quake, while some recalibration of instrumentation is required to get things back on track.

Inside sources reckon that up to 20,000 wafers (possibly 10,000 at a minimum) could be scrapped—assessments are reportedly still underway, but a small proportion of client shipments could be disrupted. News articles point to this total being spread across three affected locations. Fab 18 is a key 3 nm production hub—situated in Taiwan's Southern Science Park, Tainan's Fab 14 specializes in 4 nm and 5 nm processes, and Fab 8 (Hsinchu) takes care of 200 nm. Industry experts believe that TSMC will bounce back quickly, and that the damaged wafer count represents a minor dent in the proverbial armor—on a good day, manufacturing output can reach up to 37,000 units.

Hua Hong Semiconductor (HHS) is China's second-largest chip manufacturer; trailing just behind its main rival: Semiconductor Manufacturing International Corporation (SMIC)—a recent recruitment drive has signalled the company's desire to advance further. Nikkei Asia believes that the recruitment of a former Intel executive—Bai Peng—will boost the development of logic chips, and in turn generate greater revenue. A late 2024 reshuffling of leadership positions produced a notable vacancy: company president—Bai Peng assumed this role, effective January 1. His career at Intel spanned three decades—by 2015 he became Team Blue's corporate vice president, although his tenure ended at some point in 2022 (according to a LinkedIn profile).

Industry watchdogs reckon that Hua Hong Semiconductor's freshly established chief will be tasked with advancing semiconductor production technologies. Peng's experience—being a former co-director of Logic Technology Development at the Intel Technology and Manufacturing Group—is cited as a crucial factor in diversifying the firm's product portfolio. HHS foundries produce a lot of 100+ nm-based designs—mostly in the fields of power semiconductors, analog chips, and embedded memory—but two locations are capable of churning out relatively complex silicon via a 40 nm process node. A new plant—based in Wuxi—is supposedly ready to push into sub-forty digits. The latest industry reports suggest that Peng and his colleagues will be focused on improving HSS's manufacturing processes—targeted advancements could open up new product lines: high-end enterprise and AI processors.

Intel Foundry has announced the onboarding of new defense industrial base (DIB) customers, Trusted Semiconductor Solutions and Reliable MicroSystems, as part of the third phase of the Rapid Assured Microelectronics Prototypes - Commercial (RAMP-C) efforts under the Trusted & Assured Microelectronics (T&AM) Program in the Office of the Under Secretary of Defense for Research and Engineering (OUSD (R&E)). The RAMP-C project, awarded through the Strategic & Spectrum Missions Advanced Resilient Trusted Systems (S²MARTS) Other Transaction Authority (OTA), allows DIB customers to take advantage of Intel Foundry's leading-edge Intel 18A process technology and advanced packaging for prototypes and high-volume manufacturing of commercial and DIB products for the U.S. Department of Defense (DoD).

"We are very excited to welcome Trusted Semiconductor Solutions and Reliable MicroSystems to the RAMP-C project we are engaged in with the DoD. The collaboration will drive cutting-edge, secure semiconductor solutions essential for our nation's security, economic growth and technological leadership. We are proud of the pivotal role Intel Foundry plays in supporting U.S. national defense and look forward to working closely with our newest DIB customers to enable their innovations with our leading-edge Intel 18A technology," said Kapil Wadhera, vice president of Intel Foundry and general manager of Aerospace, Defense and Government Business Group.

Today, the U.S. Department of Commerce has announced that CHIPS National Advanced Packaging Manufacturing Program (NAPMP) has finalized $1.4 billion in award funding to bolster U.S. leadership in advanced packaging and enable new technologies to be validated and transitioned at scale to U.S. manufacturing. These awards will help establish a self-sustaining, high-volume, domestic, advanced packaging industry where advanced node chips are both manufactured and packaged in the United States.

These awards include:

• A total of $300 million under the CHIPS NAPMP's first Notice of Funding Opportunity (NOFO) for advanced substrates and material research to Absolics Inc., Applied Materials Inc., and Arizona State University. This follows the previously announced intent to enter negotiations on November 21, 2024
• $1.1 billion to Natcast to operate the advanced packaging capabilities of the CHIPS for America NSTC Prototyping and NAPMP Advanced Packaging Piloting Facility (PPF). This follows the previously announced CHIPS R&D Facilities Model on July 12, 2024, and planned site selection for the PPF on January 6, 2025

MSI has provided a detailed look into its motherboard production facilities through a new interactive webpage. The company has outlined the 15-step manufacturing process that transforms bare circuit boards into complete motherboards. The process begins with solder paste printing, where a precise layer of conductive paste is applied to the bare PCB. This is followed by automated inspection using imaging systems to verify proper paste placement. High-speed machines then position electronic components onto the board before they move through reflow ovens that permanently bond the components. Multiple inspection stages are integrated throughout the assembly line, including automated optical systems that check both sides of the board. Specialized machines handle routing, component insertion, wave soldering, and alloy welding.

Each board undergoes circuit testing and receives mechanical components through automated screw-locking systems before final functional testing and molding. The complexity of modern motherboard manufacturing requires rigorous quality checks and final power tests before the motherboard leaves manufacturing facilities. For interested enthusiasts, MSI's new landing page is here. The manufacturing reveal accompanies MSI's launch of two new motherboard series—Z790 and B860. To celebrate this launch, MSI has announced promotional events running from January 20 to March 31, 2025, including Steam game codes with select product purchases. A new reward program offers points for product reviews and referrals.

Rapidus Corporation, a manufacturer of advanced logic semiconductors, today announced the delivery and installation of ASML's EUV lithography equipment at its Innovative Integration for Manufacturing (IIM-1) foundry, an advanced semiconductor development and manufacturing fab currently under construction in Chitose, Hokkaido. To commemorate the installation, a ceremony was held at Portom Hall in the New Chitose Airport.

This is a significant milestone for Japan's semiconductor industry, marking the first time that an EUV lithography tool will be used for mass production in the country. In addition to the EUV lithography machinery, Rapidus will install additional complementary advanced semiconductor manufacturing equipment, as well as full automated material handling systems in its IIM-1 foundry to optimize 2 nm generation gate-all-around (GAA) semiconductor manufacturing.

CoolIT Systems (CoolIT), the world's leader in liquid cooling systems for advanced computing, is continuing to invest in its manufacturing capabilities to support the surging demand for liquid cooling of AI systems. Along with a 25x capacity expansion in a new Calgary, Canada manufacturing facility, CoolIT recently hired Scott Hudson as Vice President of Quality to lead the company's development of world-class quality operations and systems.

"As the leader in direct liquid cooling for over two decades, our customers expect leading performance and reliability from CoolIT products," said CoolIT's COO Patrick McGinn. " Adding Scott as CoolIT's VP of Quality reinforces CoolIT's commitment to developing best-in-class quality standards for liquid cooling products." Scott joins CoolIT from Celestica, where he led the company's global quality strategy for all business segments across over 30 sites. His career spans three decades of quality leadership roles in the worldwide computer hardware industry, overseeing multi-site operations in North America, Asia and Europe.