Micron Technology, Inc., one of the world's largest semiconductor companies and the only U.S.-based manufacturer of memory, will today celebrate the start of construction on the nation's first new memory manufacturing fab in 20 years. Company executives will join Idaho Governor Brad Little, Boise Mayor Lauren McLean, other community partners and team members to mark the milestone with a ceremonial concrete pour at Micron's Boise headquarters on the 45th anniversary of the company's founding.

Just over a year ago, Micron announced its plans to invest approximately $15 billion through the end of the decade to construct a new fab for leading-edge memory manufacturing, to be co-located with the company's R&D epicenter in its hometown of Boise. Through the lifespan of the project, Micron will directly infuse $15.3 billion into the Idaho economy and directly spend $13.0 billion with Idaho businesses. The project will create over 17,000 new Idaho jobs, including 2,000 Micron direct jobs, furthering the need for a diverse, highly skilled workforce.

The U.S. Department of Defense (DoD) has awarded GlobalFoundries (Nasdaq: GFS) (GF) a new 10-year contract for a supply of securely manufactured, U.S.-made semiconductors for use across a wide range of critical aerospace and defense applications.

With an initial award of $17.3 million this month and an overall 10-year spending ceiling of $3.1 billion, the new contract provides the DoD and its contractors with access to GF's semiconductor technologies manufactured at its U.S. facilities. These GF facilities are DoD-accredited to the highest security level, Trusted Supplier Category 1A, which implements proven stringent security measures to protect sensitive information and manufacture chips with the highest levels of integrity to ensure they are uncompromised.

According to TechNews.tw, TSMC could postpone its 2 nm semiconductor manufacturing node for 2026. If the rumors about TSMC's delayed 2 nm production schedule are accurate, the implications could reverberate throughout the semiconductor industry. TSMC's alleged hesitancy could be driven by multiple factors, including the architectural shift from FinFET to Gate-All-Around (GAA) and potential challenges related to scaling down to 2 nm. The company is a crucial player in this space, and a delay could offer opportunities for competitors like Samsung, which has already transitioned to GAA transistor architecture for its 3 nm chips. Given the massive demand for advanced nodes due to the rise of AI, IoT, and other next-gen technologies, it is surprising to hear "sluggish" demand reports.

However, it's also possible that it's too early for customers to make firm commitments for 2025 and beyond. TSMC has dismissed these rumors, stating that construction is progressing according to plan, which includes having 2 nm pilot run in 2024, and mass production in the second half of 2025.. Despite this, any delay in TSMC's roadmap could serve as a catalyst for shifts in market dynamics. Companies that rely heavily on TSMC's advanced nodes might need to reassess their timelines and strategies. Moreover, if Samsung can capitalize on this opportunity, it could somewhat level the playing field. As of now, though, it's essential to approach these rumors with caution until more concrete information becomes available.

According to the latest report from Nikkei, HP, the world's second-largest PC manufacturer after Lenovo, is making strategic shifts in its laptop production bases. In a move that reflects broader trends among tech giants, HP is collaborating with various Electronic Manufacturing Service (EMS) providers to move a significant part of its laptop production out of China to other countries such as Thailand, Mexico, and eventually Vietnam. For 2023 alone, the production outside of China is expected to range from a few million units up to 5 million, a noteworthy figure given HP's total global PC shipments of 55.2 million units. Commercial notebooks are slated for production in Mexico, catering to HP's primary market, North America, with consumer laptops made in Thailand. Additionally, a shift to Vietnam is on the horizon for 2024. Thailand's mature PC supplier ecosystem is anticipated to facilitate a smoother transition for HP.

HP's reconfiguration of manufacturing locations aligns with similar initiatives by other tech giants. Dell, for example, is also reducing its reliance on Chinese-made chips and aims to manufacture at least 20% of its laptops in Vietnam this year. Apple has likewise commenced MacBook production in the same country. Several factors are driving these relocations, with rising manufacturing costs in China, including labor recruitment challenges and increased labor costs, being key among them. Geopolitical tensions between the U.S. and China also weigh in on these decisions, especially since the U.S. is a crucial market for both HP and Dell. Despite the diversification, HP reaffirms its commitment to continue operations in China, particularly in Chongqing, a significant laptop production hub since 2008.

ASML's CEO, Peter Wennink, has announced that his team will be shipping out the first pilot tool (a high-NA EUV system) in its next product line before the end of this year. Reuters reports that supply chain problems have caused hold-ups along the way, but the Dutch multinational corporation is confident in delivering its next-gen opening salvo—these high numerical aperture EUV machines are large enough to warrant transportation via truck, and their per unit cost is over €300 million (~$322 million). The most demanding of chipmakers will be snapping up ASML's behemoth apparatuses in order to produce improved (i.e. smaller) chips over the next ten years.

Wennink spoke to Reuters at an industry event (that took place in Eindhoven): "A few suppliers had some difficulties in actually ramping up and also giving us the right level of technological quality, so that led to some delay. But in fact the first shipment is still this year." The CEO expects to see a growth in revenue thanks to burgeoning interest in AI-oriented silicon—new manufacturing facilities in Arizona and Taiwan are primed to adopt high-NA EUV machines in 2024. Key clients will be experimenting with these new machines (EXE:5200), before a full push into commercial production—logic chip makers have demanded that they get priority access over memory manufacturers. Intel has made declarations, in the recent past, that its foundries are first in line to receive ASML's latest and greatest tools.

With sequential IC sales declines beginning to moderate, the global semiconductor industry appears to be nearing the end of a downcycle and is expected to begin to recover in 2024, SEMI, in partnership with TechInsights, reported in the Semiconductor Manufacturing Monitor. In Q3 2023, electronics sales are projected to post healthy quarter-on-quarter growth of 10%, while memory IC sales are expected to log double-digit growth for the first time since the downturn started in Q3 2022. Logic IC sales are predicted to remain stable and improve as demand gradually recovers.

Headwinds will continue for the semiconductor manufacturing sector in the second half of the year, SEMI and TechInsights reported. Drawdowns of high inventory at integrated device manufacturer (IDM) and fabless companies will continue to suppress fab utilization rates to much lower levels than those in the first half of 2023. The weakness is projected to extend declines in capital equipment billings and silicon shipments for the rest of the year despite stable results in the first half of 2023.

TSMC (TWSE: 2330, NYSE: TSM), Robert Bosch GmbH, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), and NXP Semiconductors N.V. (NASDAQ: NXPI) today announced a plan to jointly invest in European Semiconductor Manufacturing Company (ESMC) GmbH, in Dresden, Germany to provide advanced semiconductor manufacturing services. ESMC marks a significant step towards construction of a 300 mm fab to support the future capacity needs of the fast-growing automotive and industrial sectors, with the final investment decision pending confirmation of the level of public funding for this project. The project is planned under the framework of the European Chips Act.

The planned fab is expected to have a monthly production capacity of 40,000 300 mm (12-inch) wafers on TSMC's 28/22 nanometer planar CMOS and 16/12 nanometer FinFET process technology, further strengthening Europe's semiconductor manufacturing ecosystem with advanced FinFET transistor technology and creating about 2,000 direct high-tech professional jobs. ESMC aims to begin construction of the fab in the second half of 2024 with production targeted to begin by the end of 2027.

The Financial Times believes that Apple is running into major production issues related to its Vision Pro mixed reality headset—insider sources claim that the mega-sized multinational technology company is adjusting internal sales goals for the $3499 AR/VR "spatial computer." Leadership had set an ambitious internal target of 1 million units sold in 2024, but the complexity of the system's design has apparently caused major setbacks for manufacturing partners. Apple is reported to have signed up with Luxshare, a Chinese contract manufacturer, to assemble Vision Pro headsets—insiders within both organizations reckon that only 400,000 units will be ready for sale throughout 2024. This number seems to be fairly optimistic given that Trendforce predicted that a mere 200,000 would be shipped next year.

FT gathered information from two other sources placed within the Chinese supply chain—they claim that Apple and Luxshare could encounter major component shortages in 2024, resulting in a production shortfall—with an estimated 130,000 to 150,000 finalized units. The article points out that the most complex (and costly) aspect of the headset lies in its micro-OLED display setup, that also includes outward facing lenses. TSMC and Sony are reported to be the suppliers of these parts (as featured on the prototypes), but Apple is allegedly not satisfied with low production numbers, and not enough batches are "free of defects." A cheaper version of the Vision Pro is apparently now on the backburner, since Apple is unlikely to recoup—factoring in R&D expenses—within the first year of the intial product's launch.

Universal Display Corporation (UDC) and PPG today officially opened a new state-of-the-art organic light-emitting diode (OLED) manufacturing facility in Shannon, Ireland. This County Clare site is expected to double the production capacity and further diversify the worldwide manufacturing footprint for UDC's energy-efficient phosphorescent OLED emissive materials for the growing OLED market. UDC's initial investment of 10 million euros, and subsequent multimillion-euro expenditures and multiyear, multiphase expansions of the site are expected to have a significant positive economic impact on the region.

PPG produces UDC's highly-efficient, high-performing UniversalPHOLED materials. There are currently 50 people working at the new production site, and the headcount is expected to increase up to 100 as further investments roll out. The high-tech roles at the Shannon facility include engineering and operational disciplines, supply chain roles, synthetic chemists, and analytical technicians.

Micron Technology, Inc. announced today it will be introducing extreme ultraviolet (EUV) technology to Japan, tapping this sophisticated patterning technology to manufacture its next generation of DRAM, the 1-gamma (1γ) node. Micron will be the first semiconductor company to bring EUV technology to Japan for production, with its Hiroshima fab playing a critical role in the company's development of the 1-gamma node. Micron expects to invest up to 500 billion yen in 1-gamma process technology over the next few years, with close support from the Japanese government, to enable the next wave of end-to-end technology innovation such as rapidly emerging generative artificial intelligence (AI) applications.

With each successive advancement in process technology to scale memory cells and advance performance, Micron enables increased memory density, improvement in power efficiency and lower cost per bit, helping to unlock new opportunities for digitization, sustainability and green transformation, and automation. The introduction of 1-gamma follows the development of Micron's 1-beta (1β), the industry's most advanced DRAM node today, which Micron mass produces in its Hiroshima fab. Micron continues to make progress on its EUV integration plans and expects to ramp EUV into production on the 1-gamma node in Taiwan and Japan from 2025 onwards.

Foxconn has commited to $500 million of investments into new operations within Telangana, a southern state located in India. The region's IT minister, K. T. Rama Rao, broke the news earlier today and declared that the Taiwanese multinational electronics contract manufacturer will be building new factory facilities - with the first example breaking ground in Kongara Kalan (a village to the south of Hyderabad) this morning.

The minister estimates that the "first phase" of new Foxconn manufacturing plants will help generate 25,000 "direct jobs" across the state of Telangana. Reuters has previously reported that Foxconn has been granted a new contract for the manufacture of next generation AirPods - Apple is a key client for the company, and executives have pushed for a shift in production locations due to problems encountered in China. Foxconn's move into India is observed as a strategic decision - facilities are less likely to get shutdown (due to health restrictions) and the country is not getting hit with advanced semiconductor sanctions.

Semiconductor Manufacturing International Corporation (SEHK: 00981; SSE STAR MARKET: 688981) ("SMIC", the "Company" or "we"), one of the leading semiconductor foundries in the world, today announced its consolidated results of operations for the three months ended March 31, 2023.

According to the international financial reporting standards, in the first quarter, the Company's revenue slightly beat guidance, gross margin was close to the high end of our guided range; in the second quarter, the Company expects the capacity utilization rate and shipments will perform better than first quarter. Revenue is expected to increase by 5% to 7% sequentially, with a decline in blended ASP due to the impact of changes in product mix; gross margin is expected to be between 19% and 21%.

According to the South China Morning Post (SCMP) sources, Yangtze Memory Technologies Corp (YMTC) has been plotting to manufacture its advanced 3D NAND flash using locally sourced equipment. As the source notes, YMTC has placed big orders from local equipment makers in a secret project codenamed Wudangshan, named after the Taoist mountain in the company's home province of Hubei. Last year, YTMC announced significant progress towards creating 200+ layer 3D NAND flash before other 3D NAND makers like Micron and SK Hynix. Called X3-9070, the chip is a 232-layer 3D NAND based on the company's advanced Xtacking 3.0 architecture.

As the SCMP finds, YTMC has placed big orders at Beijing-based Naura Technology Group, maker of etching tools and competitor to Lam Research, to manufacture its advanced flash memory. Additionally, YTMC has reportedly asked all its tool suppliers to remove all logos and other marks from equipment to avoid additional US sanctions holding the development back. This significant order block comes after the state invested 7 billion US Dollars into YTMC to boost its production capacity, and we see the company utilizing those resources right away. However, few industry analysts have identified a few "choke points" in YTMC's path to independent manufacturing, as there are still no viable domestic alternatives to US-based tool makers in areas such as metrology tools, where KLA is the dominant player, and lithography tools, where ASML, Nikon, and Canon, are noteworthy. The Wuhan-based Wudangshan project remains secret about dealing with those choke points in the future.

The European Union yesterday (April 18) has announced a substantial investment of $47 billion (€43 billion) as part of its already established plan to support native semiconductor industries. The European Parliament and EU member states have agreed upon new measures to boost the supply of semiconductors in Europe, as the bloc navigates a solution to reduce its dependency on manufacturers located in Asian territories. Thierry Breton, Commissioner for Internal Market of the European Union, released his own statement about the agreement: "We have a deal on EU Chips Act! In a geopolitical context of de-risking, Europe is taking its destiny into its own hands. By mastering the most advanced semiconductors, EU will become an industrial powerhouse in markets of the future."

China and Taiwan are currently the dominant nations in the field of manufacture and export of semiconductor products. The European Union is also playing catch-up with North America, where the United States Chips and Science Act has been effect since last summer - around $280 billion in new funding will be meted out over time to boost domestic research and development, as well as manufacturing of semiconductors in the USA. Governing bodies around the world are shoring up domestic silicon-based manufacturing efforts in order to reduce reliance on products sourced from Asia - where supply chain issues and manufacturing delays have caused global shortages of essential electronic goods.

Two of NVIDIA's providers of Outsourced Semiconductor Assembly and Test (OSAT) services are of the opinion that Team Green is happy to stay the course with its Ada Lovelace GPU production schedule. The backend providers Siliconware Precision Industries (SPIL) and King Yuan Electronics (KYEC) have not been given any new instructions with regard to shifts (up or down) in component assembly output. It is theorized that NVIDIA is aiming to clear any stock backlogs of graphics card models featuring previous generation architecture - namely the second gen GeForce RTX 30-series, built on Ampere.

The retail demand for the newly released GeForce RTX 4070 cards has been mild, to say the least - with plenty of inventory remaining on the shelves in the States. Critical reception of the midweight GeForce RTX GPU has also been middling - many have advised that budget conscience buyers should potentially look elsewhere. The market for discrete graphics card is in a fairly healthy state at the moment, with major production issues and fractured supply chains becoming lesser concerns for electronics manufacturers. NVIDIA has the advantage of being a market leader, and seems to be quite content with proceedings - but their analysts are very likely keeping an eye on the RTX 4070 sales figures. Its products are out and readily available - no need to change direction too sharply.

Silicon manufacturers in South Korea and Taiwan have questioned the requirements outlined in the United States Chips and Science Act - South Korean President Yoon Suk Yeol spoke on Thursday March 30, and said that there was a growing concern within companies Samsung Electronics Corporation and SK Hynix Inc. with regard to criteria for new U.S. semiconductor subsidies. Excess profit sharing is one area of contention, as the U.S. government will expect dividends to be paid under special conditions. The companies are also reluctant to meet the requirements of submitting detailed information about fab capacity and yield estimates. Leaders are pointing to the potential sensitive nature of exposing too much confidential corporate strategy to bodies in the USA, and sources within Samsung and SK Hynix are worried that budgetary planning information will be revealed in minute detail.

The CHIPS Act grants a $52 billion pool of research and manufacturing funds, and subsidies would be sourced from it. SK Hynix's parent group is considering an application in order to gain access to funding via the CHIPS Act, the SK Group has formed plans to invest $15 billion of its own money into the U.S. chip manufacturing sector - a North American location for an advanced chip packaging plant is being decided upon. Samsung has invested a substantial $25 billion into its Texas operation, so is eligible to receive U.S. government subsidies as well.

On Monday 27 March U.S. President Joe Biden invoked the Defense Production Act in order to form a budget of $50 million, to be spent on domestic and Canadian production of printed circuit boards (aka PCBs). This move was deemed as important to matters of national defense, and technology has been cited as key part of North American security efforts. In a memo issued that day, Biden stated that without presidential action under the act: "United States industry cannot reasonably be expected to provide the capability for the needed industrial resource, material, or critical technology item in a timely manner."

PCBs form the basis of vital components that are integrated into military-purpose missiles and radars, in addition to electronics utilized for energy distribution and the nation's healthcare. The President continues to outline the importance of the Defense Production Act: "I find that action to expand the domestic production capability for printed circuit boards and advanced packaging is necessary to avert an industrial resource or critical technology item shortfall that would severely impair national defense capability."

NVIDIA today announced a breakthrough that brings accelerated computing to the field of computational lithography, enabling semiconductor leaders like ASML, TSMC and Synopsys to accelerate the design and manufacturing of next-generation chips, just as current production processes are nearing the limits of what physics makes possible.

The new NVIDIA cuLitho software library for computational lithography is being integrated by TSMC, the world's leading foundry, as well as electronic design automation leader Synopsys into their software, manufacturing processes and systems for the latest-generation NVIDIA Hopper architecture GPUs. Equipment maker ASML is working closely with NVIDIA on GPUs and cuLitho, and is planning to integrate support for GPUs into all of its computational lithography software products.

Samsung Electronics has announced ambitious long term plans to expand its operation in South Korea. The company is set to invest around $230 billion in new fabrication facilities, with five locations marked for development in Yongin, a city located within the Seoul Capital Area. The five new factories with mixed foundry and memory manufacturing purposes, will form part of the South Korean government's intentions to assemble a mega semiconductor hub in the region.

South Korea's Ministry of Trade, Industry and Energy (MOTIE) on Wednesday revealed its intent to invest $422 billion by 2026 to boost production of six core technologies: semiconductors, electric vehicle batteries, autonomous vehicles, robots and displays. The government provided a breakdown of the total budget, and $260 billion has been allocated for the country's chip space to develop system semiconductors into the year 2026.

Intel Foundry Services, the in-house semiconductor foundry of Intel, announced that its 2 nm-class Intel 20A and 1.8 nm-class Intel 18A foundry nodes have completed development, and are on course for mass-producing chips on their roadmap dates. Chips are expected to begin mass-production on the Intel 20A node in the first half of 2024, while those on the Intel 18A node are expected to begin in the second half of 2024. The completion of the development phase means that Intel has finalized the specifications and performance/power targets of the nodes, the tools and software required to make the chips, and can now begin ordering them to build the nodes. Intel has been testing these nodes through 2022, and with the specs being finalized, chip-designers can accordingly wrap up development of their products to align with what these nodes have to offer.

Intel 20A (or 20-angstrom, or 2 nm) node introduces gates-all-around (GAA) RibbonFET transistors with PowerVIAs (an interconnect innovation that contributes to transistor densities). The Intel 20A node is claimed to offer a 15% performance/Watt gain over its predecessor, the Intel 3 node (FinFET EUV, 3 nm-class), which by itself offers an 18% performance/Watt gain over Intel 4 (20% perf/Watt gain over the current Intel 7 node), the node that is entering mass-production very soon. The Intel 18A node is a further refinement of Intel 20A, and introduces a design improvement to the RibbonFET that increases transistor density at scale, and a claimed 10% performance/Watt improvement over Intel 20A.

The Biden-Harris Administration through the U.S. Department of Commerce's National Institute of Standards and Technology today launched the first CHIPS for America funding opportunity for manufacturing incentives to restore U.S. leadership in semiconductor manufacturing, support good-paying jobs across the semiconductor supply chain, and advance U.S. economic and national security.

As part of the bipartisan CHIPS and Science Act, the Department of Commerce is overseeing $50 billion to revitalize the U.S. semiconductor industry, including $39 billion in semiconductor incentives. The first funding opportunity seeks applications for projects to construct, expand, or modernize commercial facilities for the production of leading-edge, current-generation, and mature-node semiconductors. This includes both front-end wafer fabrication and back-end packaging. The Department will also be releasing a funding opportunity for semiconductor materials and equipment facilities in the late spring, and one for research and development facilities in the fall.

Rugged embedded computer brand, Cincoze, knows that HMI is the most common application of industrial panel PCs. In addition to visualizing equipment-related data, HMI can also monitor and control machinery equipment, which is helpful for the on-site manager to get an accurate picture of the process status.

The newly launched open frame panel PC is the latest addition to the Cincoze Display Computing - CRYSTAL product line. Whether an industrial panel PC for factory use, a sunlight-readable panel PC for outdoor use, or an open frame panel PC for integration into advanced equipment, customers now have more options for selecting a suitable panel PC for their HMI application. The core technology behind Cincoze panel PCs is CDS (Convertible Display System, Pat. M482908), a modular panel PC system consisting of a computer module and display module that enables convenient on-site maintenance and flexibility for future upgrades.

ASUS today announced the opening of its first AI-enabled smart factory. The facility is powered by a variety of AIoT technologies, including a 3D Digital Twin system, an augmented reality (AR) platform, autonomous mobile robots (AMR) for in-factory logistics, as well as an AI-driven defect inspection system. All of this will help achieve ASUS Industry 4.0 goals, increasing manufacturing efficiency and improving ESG outcomes.

Albert Chang, ASUS Corporate Vice President and Co-Head of the AIoT Business Group, explained the importance of the new factory:
"In 2018, our Chairman Jonney Shih started ASUS on a new journey to become a company that transforms and evolves, trusts in radical truth and transparency, embraces idea meritocracy, and fosters collective wisdom. The opening of our first AI-enabled smart factory is a significant milestone in our company transformation and showcases our solid integrated capabilities, from software to hardware, that we offer to our clients and suppliers."

We have discovered an issue with our all-in-one watercooler Lumen. Following user reports of an increase in CPU temperatures, an investigation was started to determine the potential cause. Our findings conclude that the soldering material used in the aluminium radiator, as well as impurities introduced during manufacturing, may cause a reaction with the chemical composition of the cooling fluid. Over time this may lead to sediment build-up in the circulating liquid getting caught in the fins of the CPU block, causing an increase in temperatures as a result of the blockage.

Although Lumen units that are not currently causing temperature issues are safe for continued use, the experience of our users is our main priority. We have therefore decided to halt all Lumen sales globally, until we are satisfied that the quality standards we and our users expect are fully met. In order to address the issue, our teams will be working on a new version with an updated radiator and a new liquid formula, produced following revised processes and guidelines for assembly. With our currently estimated timeline, we are hoping to have new units available as replacements for Lumen owners, as well as substitutes for stock at distributors and resellers; in about six weeks. A web form for users to request a replacement can be found on our dedicated website, which also provides ongoing updates, timeline and further information. Ticket holders will also receive updates via e-mail. We sincerely apologize for the inconvenience.

The US Department of Commerce is in the process of increasing the stranglehold in tech exports directed to Chinese shores. The move is being made through the delivery of letters to US-based technology companies - namely KLA Corp, Lam Research Corp and Applied Materials Inc. - ordering them to stop the export of machines and equipment that can be used for sub-14 nm manufacturing. The move by the Department of Commerce only has validity for the companies that have been served by such a letter - at least until the Department codifies its newest regulations.

This means that only sellers with approved export licenses can keep doing business with Beijing, thus limiting the US companies China can work with as it aims to achieve at least a degree of self-sufficiency in the latest chipmaking tech. Perhaps the decision has come too late, however, as China's mainstay silicon manufacturing, SMIC, already manufactures chips at the 14 nm process (chips that have been deployed in China's Tinahu Light supercomputer already) and has even showcased manufacturing capability in the 7 nm field. It pays to remember that the US already had applied similar restrictions on equipment experts to China for the better part of two years - which apparently did little to stem China's capability to create increasingly denser semiconductor designs.