Monday, February 24th 2025
TSMC 2 nm Wafer Output Projected to Reach 80,000 Units Per Month, by End of 2025
Earlier in the year, we heard about TSMC being ahead of the game with its speculated trial production run of cutting-edge 2 nm (N2) silicon. Taiwan's premier foundry company is reportedly prepping its Baoshan and Kaohsiung plants for full-on manufacturing of next-gen chips. The latest insider whispers propose that TSMC is making "rapid" progress on the 2 nm (N2) front, as company engineers have moved onto an "intensive" trial production phase. Taiwan's Economic Daily News has picked up on compelling projections from industry moles; the Hsinchu Baoshan facility's current monthly production capacity is (allegedly) around 5000 to 10,000 2 nm wafers. The other 2 nm-specialist site—Kaohsiung—has reportedly moved into a small-scale appraisal phase.
TSMC declined to comment on recently leaked data points, but they released a general statement (to UDN), emphasizing that: "(our) 2 nm process technology is progressing well and will go into mass production as scheduled in the second half of this year." The Baoshan plant could ramp up to 25,000 2 nm wafers per month, once it moves into a mass production phase. Combined with the same estimated output from its sister site (Kaohsiung), insiders reckon that the combined total could reach 50,000 units per month. Following a predicted successful "second phase" transition, TSMC's most advanced facilities have a "chance" to pump out 80,000 2 nm parts (combined total). The latest murmurs suggest that this milestone could be achieved by the end of 2025. Industry watchdogs believe that Apple will have first access dibs on TSMC's upcoming cutting-edge offerings.
Sources:
Economic Daily News, Jukanlosreve Tweet, Wccftech
TSMC declined to comment on recently leaked data points, but they released a general statement (to UDN), emphasizing that: "(our) 2 nm process technology is progressing well and will go into mass production as scheduled in the second half of this year." The Baoshan plant could ramp up to 25,000 2 nm wafers per month, once it moves into a mass production phase. Combined with the same estimated output from its sister site (Kaohsiung), insiders reckon that the combined total could reach 50,000 units per month. Following a predicted successful "second phase" transition, TSMC's most advanced facilities have a "chance" to pump out 80,000 2 nm parts (combined total). The latest murmurs suggest that this milestone could be achieved by the end of 2025. Industry watchdogs believe that Apple will have first access dibs on TSMC's upcoming cutting-edge offerings.
15 Comments on TSMC 2 nm Wafer Output Projected to Reach 80,000 Units Per Month, by End of 2025
and I kinda remember reading apple not moving to 2nm right away.
However, the high $30K wafer cost deters potential customers, including Apple and Nvidia. For some reason, I believe Zen 6 could use 2nm for the dense cores(Zen6C), given the incredibly small size of the CCDs and AMD's commitment to "always using the best node for the EPYC line moving forward." The Appetite For Datacenter Compute Is Ravenous
Americans don't need to know what a nm is or what a angstrom is. It's all marketing fluff at this point anyway. The only thing that matters is benchmarks of the software you care about and what price you are getting it at.
As for prices, people say '30k per wafer' right now, but I would imagine by the time most large chips are made on them (probably a good 3-4, if not 6 years from now) it will be closer to current pricing.
So yeah, double at launch (for mostly Apple), but just like 3nm has dropped (to ~20k) it'll probably be current 4/5nm prices before most use it for stuff consumers buy; same will probably be the case with 2nm.
That's why all these nanometer designations for nodes are off by so much. They're actually nano INCHES!