Microsoft's gaming division faced an uncertain future back in 2021, according to an article published by The Information mid-week. The long-form piece mainly focuses on Xbox's current predicaments, but the wider gaming press picked up on surprising allegations from days past. The story goes that Satya Nadella, Microsoft CEO's, presided over two paths: either keep Xbox Game Studios going, or mothball the whole operation. History shows us that he kept his company's gaming department alive—a series of acquisitions (during and since 2021) have expanded development and publishing operations—but Xbox's journey has been rocky in the ensuing years. Investors and industry analysts believe that Microsoft's $68.7 billion takeover of Activision/Blizzard/King—back in 2023—has not boosted overall revenues to expected levels.

Insider Gaming has managed to make contact with a Microsoft spokesperson—extracted comments have been published in an "exclusive" report. The brand ambassador insisted that Nadella remains resolute about his company being "all in on gaming"—the CEO never entertained the notion of Microsoft winding down "its games business entirely." Industry experts have also criticized Xbox's Game Pass business model—many believe that the service's reach has faltered. The spokesperson commented on these opinions—proposing that engagement on Xbox platforms is "at an all-time high," helped in part by the recent launch of Call of Duty: Black Ops 6. Additionally, Microsoft believes that its audience count is in a healthy spot, with: "well over 500 million monthly players and over the last year, we've seen consistent growth in monthly users on cloud".

Unannounced AMD Threadripper 9000 "Shimada Peak" processor SKUs have once again appeared on leaked shipping manifests—a 96-core variant was uncovered under similar circumstances last summer. The latest discovery—courtesy of reliable investigator Everest/Olrak_29 combing through info published on NBD—reveals a Zen 5-based product stack that lists 16, 32, 64 and 96-core models. Until now, industry watchdogs have not spotted evidence of 32-core and 64-core SKUs—alongside prior leaks that only mentioned 16-core and 96-core parts.

Team Red has not officially announced that it is working on a follow-up to its current generation Zen 4-equipped Threadripper 7000 "Storm Peak" CPU series, but tipsters believe that fundamental similarities—based on leaked core counts and specifications—position "Shimada Peak" as the logical/inevitable successor. Speculation points to all the leaked Threadripper 9000 HEDT processors having a TDP rating of 350 W. Industry insiders propose that the highest-end variant—sporting 96 cores and 192 threads—will contain 12 CCDs (eight cores per CCD), 32 MB L3 cache (per CCD), and a lone I/O die. Wccftech theorizes that the 32-core model will be specced with four CCDs, while "the 64-core variant will come with eight CCDs." Insiders have whispered about a possible "later in 2025" launch window for "Shimada Peak."

TSMC is reportedly making decent progress with its advanced 2 nm (N2) node—industry news pieces from earlier this month pointed to the initiation of production lines across three fabrication sites. Taiwan's Economic Daily News has kept close tabs on these trial runs—insiders have indicated that TSMC's Kaohsiung plant is capable of matching the Baoshan location's targeted manufacturing output (5000 wafers per month, 60 percent yield). Reports suggest that the Kaohsiung 2 nm trial production will start up later this month—much earlier than anticipated.

The Taiwanese chip foundry giant is taking on the challenge of meeting "greater than expected" demand for its new generation 2 nm product—TSMC chairman C.C. Wei has previously stated that its latest and greatest is more popular (pre-launch) with customers than older 3 nm lines. Apple is rumored to be first in line—not a big surprise since TSMC has (supposedly) rolled out the VVIP red carpet for them in recent times. The Economic Daily News article also mentions Qualcomm and MediaTek being next in the queue for N2. TSMC's best foundries are expected to initiate mass production by the end of 2025.

It looks like Sony is joining Xbox in the development of a standalone handheld gaming console to compete with the likes of the Nintendo Switch and Valve Steam Deck. According to a Bloomberg's insider sources, a Sony gaming handheld is already in development, and would be designed with Sony PlayStation 5 games in mind. Unlike the PlayStation Portal, the future gaming console wouldn't be dependent on game streaming and would, instead, run games locally, meaning it would likely need significantly more powerful hardware than the Portal has. This would be Sony's first true foray into the portable gaming console market since the likes of the PS Vita, which is largely considered to be a commercial disappointment.

Sony isn't the first of the console giants looking into creating its own gaming handheld after Nintendo's Switch. Obviously, Valve, traditionally more of a software company, already has the immensely popular Steam Deck, but we also recently reported that Microsoft is in the early stages of developing its own handheld gaming console. Details on the future Sony gaming handheld are scant, and there has been no official word from Sony about the console. That said, it wouldn't be surprising to see it equipped with an AMD APU, similar to the likes of the Steam Deck and the PS5, since Sony already has history and a commercial relationship with AMD hardware.

Steam is highly valued by many gamers, not only for being a fairly inexpensive, easy way to buy and manage games, but also because it provides statistics on player count and play times, via tools like SteamDB, which are a neat way for gamers to see how the community is participating in games before buying them. According to a post on the FandomPulse Substack, however, Ubisoft has taken issue with Valve's player statistics.

The Substack post quotes Ubisoft insiders who claim that the game developer and "other companies" want Valve to disable or restrict the APIs used by tools like SteamDB and Steam Charts as a direct response to the disappointing performance of Star Wars Outlaws. This news also comes ahead of the early 2025 launch of Assassin's Creed Shadows, which has already caused significant apprehension as a result of game previews. The claims also mention that Ubisoft seeks to control the narrative of its games and potentially present a rosier image to its investors. If Ubisoft has its way, the gaming industry would lose even more transparency, since tools like SteamDB are often used by game journalists to evaluate the popularity and commercial success of games.

Speculated lower-end Intel second generation Arc GPUs popped up via SiSoftware Sandra database entries around mid-March—evaluation samples are likely in the hands of trusted hardware partners. Yesterday, momomo_us happened upon another interesting shipping manifest, following a series of AMD-related leaks. The latest list reveals five "Battlemage" products—three utilizing the BMG-21 GPU, and the remaining two being based on the BMG-10 design. These identifiers have appeared in older leaks, although the latter has been viewed in place sight—chez Intel Malaysia's Failure Analysis Lab.

Previous leaks suggest that these second generation Arc models (Xe2) reside within a "High-Performance Graphics" (HPG) discrete GPU family—the Xe2-HPG BMG-10 range is likely targeting an "enthusiast" market segment, while the Xe2-HPG BMG-21 tier is rumored to offer mid-tier performance. Intel staffers have expressed confidence about a possible late 2024 launch window. Back in January, Tom "TAP" Petersen revealed that the Arc hardware team had already moved onto third-gen "Celestial" GPU endeavors: "I'd say about 30% of our engineers are working on Battlemage, mostly on the software side because our hardware team is on the next thing." The first-gen deck has not been cleared fully it seems—the Alchemist family could be joined by two new variants in the near future.

A CPU-Z screenshot has been shared by YuuKi_AnS—the image contains details about an alleged next-gen Intel Xeon Scalable processor engineering sample (ES). The hardware tipster noted in (yesterday's post) that an error had occurred in the application's identification of this chunk of prototype silicon. CPU-Z v2.09 has recognized the basics—an Intel Granite Rapids-SP processor that is specced with 80 cores, 2.5 GHz max frequency, a whopping 672 MB of L3 cache, and a max. TDP rating of 350 W. The counting of 320 threads seems to be CPU-Z's big mistake here—previous Granite Rapids-related leaks have not revealed Team Blue's Hyper-Threading technology producing such impressive numbers.

The alleged prototype status of this Xeon chip is very apparent in CPU-Z's tracking of single and multi-core performance—the benchmark results are really off the mark, when compared to finalized current-gen scores (produced by rival silicon). Team Blue's next-gen Xeon series is likely positioned to catch up with AMD EPYC's deployment of large core counts—"Granite Rapids" has been linked to the Intel 3 foundry node, reports from last month suggest that XCC-type processors could be configured with "counts going up to 56-core/112-threads." Micron is prepping next-gen "Tall Form Factor" memory modules, designed with future enterprise processor platforms in mind—including Intel's Xeon Scalable "Granite Rapids" family. Industry watchdogs posit that Team Blue will be launching this series in the coming months.

Shipping manifests appear to be great sources of pre-release information—only a few hours ago, the existence of prototype AMD "Strix Point" and "Fire Range" mobile processors was highlighted by hardware sleuth harukaze5719. A related leak has appeared online fairly quickly after the discovery of laptop-oriented "Zen 5" chips. momomo_us joined in on the fun, with their exposure of speculated desktop silicon. Two brand-new AMD OPN codes have been linked to the upcoming "Granite Ridge" series of AM5 processors.

100-000001404-01 is likely an eight-core/ sixteen-thread "Zen 5" Ryzen CPU with a 170 W TDP—a stepping designation, B0, indicates engineering sample status. The other listing, 100-000001290-21, seems to be an A0-type engineering sample—leaked info suggests that this a six-core/twelve-thread (105 W TDP) next-gen mainstream desktop processor. AMD is likely nearing the finish line with its Ryzen 9000-series—a new generation of chipsets, including X870E, is reportedly in the pipeline. Additionally, VideoCardz posits that a refresh of 700-series boards could be on the cards. "Granite Range" CPUs are expected to retain the current-gen 6 nm client I/O die (cIOD), as sported by "Raphael" Ryzen 7000-series desktop processors.

The Taiwanese Ministry of Economic Affairs (MOEA) managed to herd government representatives and leading Information and Communication Technology (ICT) industry figures together for an important meeting, according to DigiTimes Asia. The report suggests that the main topic of discussion focused on an anticipated growth of Taiwan's ICT industry—current market trends were analyzed, revealing that the nation absolutely dominates in the AI server segment. The MOEA has (allegedly) determined that Taiwan has shipped 90% of global AI server equipment—DigiTimes claims (based on insider info) that: "American brand vendors are expected to source their AI servers from Taiwanese partners." North American customers could be (presently) 100% reliant on supplies of Taiwanese-produced equipment—a scenario that potentially complicates ongoing international tensions.

The report posits that involved parties have formed plans to seize opportunities within an evergrowing global demand for AI hardware—a 90% market dominance is clearly not enough for some very ambitious industry bosses—although manufacturers will need to jump over several (rising) cost hurdles. Key components for AI servers are reported to be much higher than vanilla server parts—DigiTimes believes that AI processor/accelerator chips are priced close to ten times higher than general purpose server CPUs. Similar price hikes have reportedly affected AI adjacent component supply chains—notably cooling, power supplies and passive parts. Taiwanese manufacturers have spread operations around the world, but industry watchdogs (largely) believe that the best stuff gets produced on home ground—global expansions are underway, perhaps inching closer to better balanced supply conditions.

There has been plenty of leaked activity on the Xbox front lately—late last month a couple of extra details emerged regarding the oft-rumored physical media-less Xbox Series S refresh. Exputer's exclusive follow-up piece included a set of very low resolution shots—an insider managed to capture an apparent "white-colored Xbox Series X that features a digital-only format" out in an unknown environment/context. The images were sent via email according to the Exputer report. As expected, the less than adequate photos showcase a white device that shares the existing black Xbox Series X's overall design language, albeit minus a slot for optical media.

Exputer believes that: "peripherals and ports remain pretty much the same," when analyzing the unit's rear section. Many folks were expecting Microsoft to roll out the cylindrical "Project Brooklin" design (leaked in FTC court case documentation), but reports from last month indicated that the refresh would recycle the standard elongated cube aesthetic. Exputer has reiterated a rumored price point of "$50 to $100" below the standard Xbox Series X MSRP of $499. Internal upgrades are speculated to include an improved heatsink and a modernized wireless network card.

Samsung debuted its Mach-1 generation of AI processors during a recent shareholder meeting—the South Korean megacorp anticipates an early 2025 launch window. Their application-specific integrated circuit (ASIC) design is expected to "excel in edge computing applications," with a focus on low power and efficiency-oriented operating environments. Naver Corporation was a key NVIDIA high-end AI customer in South Korea (and Japan), but the leading search platform firm and creator of HyperCLOVA X LLM (reportedly) deliberated on an adoption alternative hardware last October. The Korea Economic Daily believes that Naver's relationship with Samsung is set to grow, courtesy of a proposed $752 million investment: "the world's top memory chipmaker, will supply its next-generation Mach-1 artificial intelligence chips to Naver Corp. by the end of this year."

Reports from last December indicated that the two companies were deep into the process of co-designing power-efficient AI accelerators—Naver's main goal is to finalize a product that will offer eight times more energy efficiency than NVIDIA's H100 AI accelerator. Naver's alleged bulk order—of roughly 150,000 to 200,000 Samsung Mach-1 AI chips—appears to be a stopgap. Industry insiders reckon that Samsung's first-gen AI accelerator is much cheaper when compared to NVIDIA H100 GPU price points—a per-unit figure of $3756 is mentioned in the KED Global article. Samsung is speculated to be shopping its fledgling AI tech to Microsoft and Meta.

Hey Xbox Insiders! We have a new Xbox Update Preview releasing to the Alpha Skip-Ahead ring today. It's important we note that some updates made to these preview OS builds include background improvements that ensure a quality and stable build for Xbox consoles. We will continue to post these release notes, even when the noticeable changes to the UI are minimal or behind the scenes, so you're aware when updates are coming to your device. Details can be found below!

New Features and Experiences
We have exciting news! Alpha Skip-Ahead users can expect something new coming to their Xbox Update Preview.

Xbox Cloud Gaming (Beta)
Xbox Insiders can preview Mouse and Keyboard support while playing via cloud gaming on supported browsers (Edge and Chrome) and the Xbox App on Windows PCs for users enrolled in the PC Gaming Preview. Note: Users on browser will need to enable Preview features on their browser to gain access to the feature. This is done by clicking on your profile picture at xbox.com/play and then select Settings and then enable "Preview features."

The recent PlayStation 5 Pro specification leak has caused quite a stir—even games development studios were surprised by some of these details. Chris Dring (Head of GamesIndustry.biz) attended last week's GDC industry event, where he met many developers who "did not understand the point" of Sony's upcoming mid-generation console refresh. The most hardcore segment of the current PS5 userbase will likely enthusiastically embrace a more powerful variant, but Dring's observations indicate that development studios are not expressing as much excitement—over a refreshed model—as the gaming community. This topic was discussed during yesterday's GamesIndustry.biz Microcast—industry figures believe that the base PlayStation 5 model's full potential remains untapped.

This mirrors a debate over a possible upgraded Xbox Series variant—gaming fans have complained about restrictive 30 FPS performance, even on the more potent Series X console; but experts believe that developers need to spend more time optimizing their software or produce "truly next-gen" experiences. Dring's sources expressed doubt about the PS5 Pro's predicted ability to "grow the market" or "move the needle"—ultimately, Sony will make some more money and gain headline coverage post-launch. The refreshed variant is expected to reach retail later this year, but industry watchdogs reckon that momentum will be lost due to the absence of a system-selling title around launch time. Grand Theft Auto VI would be the ideal "killer app," but insider murmurs posit a delay into 2026.

NVIDIA completed its last round of GeForce NVIDIA RTX 40-series GPU refreshes at the very end of January—new evidence suggests that another wave is scheduled for imminent release. MEGAsizeGPU has acquired and shared a tabulated list of new Ada Lovelace GPU variants—the trusted leaker's post presents a timetable that was supposed to kick off within the second half of this month. First up is the GeForce RTX 4070 GPU, with a current designation of AD104-251—the leaked table suggests that a new variant, AD103-175-KX, is due very soon (or overdue). Wccftech pointed out that the new ID was previously linked to NVIDIA's GeForce RTX 4070 SUPER SKU. Moving into April, next up is the GeForce RTX 4060 Ti—jumping from the current AD106-351 die to a new unit; AD104-150-KX. The third adjustment (allegedly) affects the GeForce RTX 4060—going from AD107-400 to AD106-255, also timetabled for next month. MEGAsizeGPU reckons that Team Green will be swapping chips, but not rolling out broadly adjusted specifications—a best case scenario could include higher CUDA, RT, and Tensor core counts. According to VideoCardz, the new die designations have popped up in freshly released official driver notes—it is inferred that the variants are getting an "under the radar" launch treatment.

The "iVRy VR" community-backed project has slowly chipped away at unlocking the PlayStation VR2's full potential—Sony's $550 (MSRP) virtual reality headset is locked into the PlayStation 5 ecosystem, but many gamers have requested that it become compatible with PC platforms. iVRy's progress on this front could be surpassed by first-party efforts—a month ago, Sony indicated that it was exploring new avenues: "we're pleased to share that we are currently testing the ability for PS VR2 players to access additional games on PC to offer even more game variety in addition to the PS VR2 titles available through PS5. We hope to make this support available in 2024, so stay tuned for more updates." Reports suggest that Sony's second generation product has not met sales expectations—insiders posit that company leadership has requested a pause of production. An entry into the PC market could boost the PS VR2's popularity, but it will face plenty of competition within an already "niche" segment.

iVRy has monitored Sony's progress with great interest—the former's social media account has disclosed the discovery of a new development milestone: "(their) latest firmware update enables PC access! This means it's no longer necessary to use driver/hardware workarounds to make it work on Windows. Still to be confirmed whether this update enables NVIDIA use, but all indications are that Sony's 'PC games' plans involve direct connection." The iVRy VR project has—so far—managed to (successfully) connect the PS VR2 to AMD GPU-based systems. Sony is expected to produce an official means of hooking up their headset to PCs. iVRy discussed this provision in their follow-up post: "a 'VirtualLink' adapter of some kind is still required due to PS VR2 hardware design. If Sony does intend to make 'official' PC drivers, they would need to provide this adapter to end-users."

ITHome has highlighted several third-party protective cases listings for 12.9-inch iPad Air and Pro 2024 models—the Amazon product pages state that these accessories "will be on the shelves on March 26." The publication believes that this date could align with an official Apple unveiling—Mark Gurman, a Bloomberg reporter, predicted a planned announcement "around the end of March or April" in a recent "Power On" newsletter. MacRumors has tracked relevant activity on Weibo—based on claims made by Instant Digital (a well known Chinese leaker) they reckon that a possible March 26 presentation could be used to introduce: "pre-order availability, with shipping dates to follow."

We last heard about the rumored 2024 lineup of iPad Pro and Air models sporting some "revised physical dimensions." It was speculated that an upgrade to OLED panels has granted slimmer profiles—these possess fewer layers when compared to custom mini-LED parts on current generation premium tablets. LG is reported to be contracted for mass manufacturing of upcoming 13-inch iPad OLED tech, while Samsung (allegedly) takes care of 11-inch panels. With the launch of their M3 chipset-equipped MacBook Air 2024 range out of the way, Apple can concentrate on its next wave of new generation portable products.

Yesterday, South Korea's National Radio Research Agency certified a brand new and very mysterious Xbox Development Kit—naturally, the "Xbox News for Koreans" social media account took credit for this intriguing discovery: "this means that you can use the device in Korea. It is likely to be distributed to game developers in Korea soon." The model's serial code—2089—does not correspond to any of Microsoft's current Xbox Series (X|S) development kits. The tipster shared a short history lesson: "Xbox Series X|S dev kit consoles were certified by the National Radio Research Agency on June 10-11, 2020. The release of the Xbox Series X|S console in Korea was on November 10, 2020." By referencing the current generation's five-month gap—between registration and release of finalized retail units—it is speculated that something new could be arriving around August time.

Industry experts reckon that the leaked devkit is not linked to a rumored "All-Digital" White Xbox Series X Refresh—the latter likely contains unchanged basic hardware designs. Windows Central posited that an Xbox handheld is another possibility—leaked product roadmaps (of 2022 vintage) revealed that Microsoft was considering a move into portable gaming segments. A month ago, Xbox leadership discussed the platform's future—Sarah Bond stated: "there's some exciting stuff coming out in hardware that we're going to share this holiday, and we're also invested in the next generation roadmap...and what we're really focused on there, is delivering the largest technical leap you will have ever seen in a hardware generation." Many media outlets believed that an Xbox Series "Pro" model was teased during the special Official Xbox Videocast.

Insider Gaming's Tom Henderson believes that Sony PlayStation leadership will tighten up development conditions, following recent leaks pertaining to the technological underpinnings of the heavily rumored "PS5 Pro" home console. An IGN report and another Henderson-authored article posit that last week's revelations are "legit," according to their respective networks of industry moles. Apparently top secret information was extracted from a technical document—reports suggest that Sony sent this paper to its third-party development partners, alongside a new batch of development kits.

Industry experts think that (slated) repercussions could affect smaller development houses—Henderson tweeted: "as expected, Sony has launched an internal investigation into the leaked documents on Trinity as it leaked during a third-party rollout...Not sure on the implications yet as I don't think they can catch one individual, but Sony could reduce its third-party developer pool for new tech as a result." Rumors of a "mid-gen hardware refresh" have been swirling for almost a year and a half, but PlayStation bosses seem to be rattled into action (this week). Microsoft maintained a cool exterior following the leak of next-gen Xbox details, but that information emerged from unredacted court documents. Phil Spencer and his colleagues claim that future Xbox product roadmaps are in constant flux.

The International Data Corporation (IDC) has been tracking sales of Sony's PlayStation VR2 virtual reality headset since launch time (February 2023)—a new report claims that a backlog of unsold units has accumulated. Bloomberg's analysis of IDC data reveals that PS VR2 sales have consistently declined each quarter, despite promising early numbers—the publication alleges that Sony Group Corporation has paused production of its ($550 MSRP) PS VR2 headset: "until it clears a backlog of unsold units, according to people familiar with its plans, adding to doubts about the appeal of virtual reality gadgets." Anonymous industry moles reckon that manufacturing facilities have pumped out over two million examples since launch time. Sony is unlikely to admit, publicly, that it is having a tough time shifting its second generation virtual reality headset—Bloomberg's network of insiders believe that "stocks of the device are building up."

The lack of AAA content, developed exclusively for the PS VR2's ecosystem, is cited as big stumbling block—Bloomberg (alongside numerous publications) reckons that sales have suffered due to an absence of system-selling titles. Horizon: Call of the Mountain (2023) was an impactful launch title, but the headset's software portfolio contains a lot of "novelty" items, casual experiences and glorified tech demos (according to community feedback). Late last month, Sony admitted that it was exploring options beyond the VR2's normal mode of operation (PS5 acting as host): "We're pleased to share that we are currently testing the ability for PS VR2 players to access additional games on PC to offer even more game variety in addition to the PS VR2 titles available through PS5. We hope to make this support available in 2024, so stay tuned for more updates." This surprising announcement arrived mere days before the firing of (around) 900 PlayStation employees. Company leadership revealed that Firesprite's headcount would be reduced. This VR-oriented studio collaborated with Guerrilla Games on the development of Horizon: Call of the Mountain. Sony's London Studio will be closed down—its team had previously worked on PlayStation VR Worlds (2016) and Blood & Truth (2019)—compatible with Sony's first generation headset.

TSMC is experiencing unprecedented demand from AI chip customers—unnamed parties have (fancifully) requested the construction of entirely new fabrication facilities. Taiwan's leading semiconductor contract manufacturer seems to concentrating on "sensible" expansions, mainly in the area of CoWoS packaging output—according to an Economic Daily report, company leadership and local government were negotiating over the construction of four new advanced packaging plants. Insiders propose that plans have been revised—an investment in excess of 500 billion yuan ($16 billion) will enable the founding of six new CoWoS-focused facilities. TSMC is expected to make an official announcement next month—industry moles reckon that construction work will start in April. Two (of the six total) advanced packaging plants could become fully operational before the conclusion of 2024.

Lately, TSMC has initiated an ambitious recruitment drive—targeting around 6000 new workers. A touring entity is tasked with the attraction of "talents with high enthusiasm for semiconductors." The majority of new recruits are likely heading to new or expanded Taiwan-based facilities. The Economic Daily report proposes that Chiayi City's technological hub will play host to TSMC's new CoWoS packaging plants. A DigiTimes Asia news piece (from January) posited that TSMC leadership anticipates CoWoS output reaching 44,000 units by the end of 2024. This predicted tally could grow, thanks to the (rumored) activation of additional factories. CoWoS packaging is considered to be a vital aspect of AI accelerators—insiders believe that TSMC's latest investment will boost production of NVIDIA H100 GPUs. The combined output of six new CoWoS plants will assist greatly in the creation of next-gen B100 chips.

Jensen Huang's opening GTC 2024 keynote is scheduled to happen tomorrow afternoon (13:00 Pacific time)—many industry experts believe that the NVIDIA boss will take the stage and formally introduce his company's B100 "Blackwell" GPU architecture. An enlightened few have been treated to preview (AI and HPC) units—including Dell's CEO, Jeff Clarke—but pre-introduction leaks have not flowed out. Team Green is likely enforcing strict conditions upon a fortunate selection of trusted evaluators, within a pool of ecosystem partners and customers.

Today, a brave soul has broken that silence—tech tipster, AGF/XpeaGPU, fears repercussions from the leather-jacketed one. They revealed a handful of technical details, a day prior to Team Green's highly anticipated unveiling: "I don't want to spoil NVIDIA B100 launch tomorrow, but this thing is a monster. 2 dies on (TSMC) CoWoS-L, 8x8-Hi HBM3E stacks for 192 GB of memory." They also crystal balled an inevitable follow-up card: "one year later, B200 goes with 12-Hi stacks and will offer a beefy 288 GB. And the performance! It's... oh no Jensen is there... me run away!" Reuters has also joined in on the fun, with some predictions and insider information: "NVIDIA is unlikely to give specific pricing, but the B100 is likely to cost more than its predecessor, which sells for upwards of $20,000." Enterprise products are expected to arrive first—possibly later this year—followed by gaming variants, maybe months later.

Samsung Electronics is all set to discuss the future of AI, alongside Jensen Huang, at NVIDIA's upcoming GTC 2024 conference. South Korean insiders have leaked the company's intentions, only days before the event's March 18 kickoff time. Their recently unveiled 36 GB HBM3E 12H DRAM product is expected to be the main focus of official presentations—additionally, a new storage subscription service is marked down for a possible live introduction. An overall "Redefining AI Infrastructure" presentation could include—according to BusinessKorea—a planned launch of: "petabyte (PB)-level SSD solution, dubbed 'PBSSD,' along with a subscription service in the US market within the second quarter (of 2024) to address the era of ultra-high-capacity data."

A Samsung statement—likely sourced from leaked material—summarized this business model: "the subscription service will help reduce initial investment costs in storage infrastructure for our customers and cut down on maintenance expenses." Under agreed upon conditions, customers are not required to purchasing ultra-high-capacity SSD solutions outright: "enterprises using the service can flexibly utilize SSD storage without the need to build separate infrastructure, while simultaneously receiving various services from Samsung Electronics related to storage management, security, and upgrades." A special session—"The Value of Storage as a Service for AI/ML and Data Analysis"—is alleged to be on the company's GTC schedule.

Industry insiders reckon that Samsung Electronics is transitioning to molded underfill (MR-MUF) production techniques—rival memory manufacturer, SK Hynix, champions this chip making technology. A Reuters exclusive has cited claims made by five industry moles—they believe that Samsung is reacting to underwhelming HBM production yields. The publication proposes that: "one of the reasons Samsung has fallen behind (competing producers) is its decision to stick with chip making technology called non-conductive film (NCF) that causes some production issues, while Hynix switched to the mass reflow molded underfill (MR-MUF) method to address NCF's weakness." The report suggests that Samsung is in the process of ordering new MUF-related equipment.

One anonymous source stated: "Samsung had to do something to ramp up its HBM (production) yields... adopting MUF technique is a little bit of swallow-your-pride type thing for (them), because it ended up following the technique first used by SK Hynix." Reuters managed to extract a response from the giant South Korean multinational—a company spokesperson stated: "we are carrying out our HBM3E product business as planned." They indicated that NCF technology remains in place as an "optimal solution." Post-publication, another official response was issued: "rumors that Samsung will apply MR-MUF to its HBM production are not true." Insiders propose a long testing phase—Samsung is rumored to be sourcing MUF materials, but mass production is not expected to start this year. Three insiders allege that Samsung is planning to "use both NCF and MUF techniques" for a new-generation HBM chip.

Rumors from last week pointed to a possible $3.5 billion government defense-related investment—Intel was linked to this very lucrative semiconductor supply contract. Insiders posited that the US Department of Commerce was readying a rough $1 billion investment, while the Pentagon prepared around $2.5 billion. The latter has scrapped those plans, according to anonymous sources—Bloomberg believes that this: "move threatens to limit the total amount that Intel has been expecting to get in federal funding, setting up a contentious situation." The publication's moles have requested complete anonymity, due to the secretive nature of policy negotiations.

The US Department of Commerce deliberates over the nation's CHIPS Act—this fund could be utilized to "make up for the shortfall," following the Pentagon's reported last minute course change. The Department of Commerce could be forced to foot the entire bill—of $3.5 billion—if Intel's services are secured. Negotiations over a so-called "Secure Enclave" project have been ongoing since last year, according to insiders. It is possible that the "fast-moving" military spending bill set off alarms at the Pentagon—the Department of Defense's reasonings were not revealed by Bloomberg's investigation. Several media outlets have requested official comments from the two arms of government. Yesterday, Intel shares fell by 3%—as reported Investopedia—with the market reacting to rumors of cancelled plans.

SK Hynix believes that it leads the industry with the development and production of High Bandwidth Memory (HBM) solutions, but rival memory manufacturers are working hard on equivalent fifth generation packages. NVIDIA was expected to select SK Hynix as the main supplier of HBM3E parts for utilization on H200 "Hopper" AI GPUs, but a surprise announcement was issued by Micron's press team last month. The American firm revealed that HBM3E volume production had commenced: ""(our) 24 GB 8H HBM3E will be part of NVIDIA H200 Tensor Core GPUs, which will begin shipping in the second calendar quarter of 2024. This milestone positions Micron at the forefront of the industry, empowering artificial intelligence (AI) solutions with HBM3E's industry-leading performance and energy efficiency."

According to a Korea JoongAng Daily report, this boast has reportedly "shocked" the likes of SK Hynix and Samsung Electronics. They believe that Micron's: "announcement was a revolt from an underdog, as the US company barely held 10 percent of the global market last year." The article also points out some behind-the-scenes legal wrangling: "the cutthroat competition became more evident when the Seoul court sided with SK Hynix on Thursday (March 7) by granting a non-compete injunction to prevent its former researcher, who specialized in HBM, from working at Micron. He would be fined 10 million won for each day in violation." SK Hynix is likely pinning its next-gen AI GPU hopes on a 12-layer DRAM stacked HBM3E product—industry insiders posit that evaluation samples were submitted to NVIDIA last month. The outlook for these units is said to be very positive—mass production could start as early as this month.