Job listings posted by Respawn Entertainment last summer indicated that their Star Wars Jedi: Survivor development team had moved onto an unsurprising project—the ideal candidate(s) would help: "create an incredible Star Wars experience for our players in a fun, third-person action-adventure setting." Games industry watchers believe that a third Star Wars Jedi title is in the works, given that the franchise has—so far—generated a large paying audience. Insider Gaming's Tom Henderson reckons that another Star Wars IP has been bestowed upon Electronic Art's action specialist studio—the report posits that this rumored project is in an early stage of development. Veteran developers at Respawn Entertainment have a long history of producing blockbuster first-person shooter titles, although Apex Legends signaled a slight change in course. Their deviation into third-person with 2019's Jedi: Fallen Order also surprised a segment of longtime Respawn fans.

It is possible that the Electronic Arts and Lucasfilm Games partnership has incubated a new first-person title semi-connected to a popular Star Wars television series IP—Henderson has gathered a few tidbits: "according to sources, the game will see the player take control of a Mandalorian bounty hunter (unclear who) set during the time when the Galactic Empire is dominating across the galaxy. It's your job, as a bounty hunter to capture bounties dead or alive for cash rewards." Rumor mill wires were crossed when it was claimed that a former Apex Legend director was heading up development on the unannounced "Mandalorian" project, but an Insider Gaming update reveals that the former Respawn member was involved in development of a cancelled Apex title.

ARM's in-progress fifth generation "Blackhawk" Cortex design is allegedly going through a troubled phase of development, according to Chinese insider sources. A Revegnus (@Tech_Reve) social media post highlights ongoing issues: "It's reported that the Cortex X5 architecture is underperforming compared to expectations. It's speculated that the high-frequency power consumption has surged explosively. Therefore, if performance is reduced for lower power consumption, the Geekbench 6 multi-core score of Dimensity 9400 may not achieve a score of 9,400 points." A recent Moor Insights & Strategy analysis piece proposed that "Blackhawk" would become "the most powerful option available at launch" later this year—mobile chipsets leveraging ARM's Cortex-X5 design are touted to face tough next-gen competition from Qualcomm and Apple corners.

Revegnus pulled in a rival SoC: "While Snapdragon 8 Gen 4 is seen to have minor issues, there is no evidence to support this claim. There might be a problem with low-frequency power consumption not showing clear superiority over ARM's middle cores." Qualcomm's next flagship model is performing admirably according to insiders—an engineering sample managed to score 10,628 points in alleged Geekbench 6 multi-core gauntlets. Late last month prototype clocks were leaked—Digital Chat Station claimed that a Snapdragon 8 Gen 4 High-Performance "Big" core was capable of reaching 4.0 GHz. Prior to the latest news, MediaTek's Dimensity 9400 SoC was observed achieving ~10,000 multi-core Geekbench 6 scores—leaked CPU cluster details present a single "Big" Cortex-X5 unit operating alongside three Cortex-X4 cores.

Serkan Toto, CEO of Tokyo-based games consultancy Kantan Games was interviewed by CNBC earlier this week—he was invited on-air to provide expert commentary on Sony's freshly revised sales and revenue forecast for PlayStation 5 products. He believes that great forward momentum is best achieved with refreshed hardware, and a well timed launch coinciding with the release of AAA/blockbuster games titles. Last autumn's rollout of slimmer PlayStation 5 consoles was not particularly exciting—with no major bump up in specs or attractive pricing. The development of an inevitable "Pro" variant has circulated around rumor mills for more than a year.

Sony Computer Entertainment (SCE) and AMD are believed to co-operating on a very potent hardware redesign—reports from late last year posited that a semi-custom "Viola" SoC is in the pipeline. A more expensive RDNA 3-upgraded refresh could attract an additional segment of hardcore gamers, but another industry analyst reckons that Sony is unlikely to implement a standard model price cut later this year (based on past trends). George Jijiashvili, senior principal analyst at Omdia, stated: "A scenario where Sony launches a PS5 Pro, but still experiences declining year-on-year hardware sales is very much within the realms of possibility." Serkan Toto (of Kantan Games consultancy) expressed a more optimistic view: "There seems to be a broad consensus in the game industry that Sony is indeed preparing a launch of a PS5 Pro in the second half of 2024...And Sony will want to make sure to have a great piece of hardware ready when GTA VI hits in 2025, a launch that will be a shot in the arm for the entire gaming industry."

Pat Gelsinger—CEO of Intel Corporation—happily revealed late last month, during an earnings call: "Clearwater Forest, our first Intel 18A part for servers has already gone into fab and Panther Lake for clients will be heading into Fab shortly." The former is positioned as the natural successor to Team Blue's many-times-delayed Xeon "Sierra Forest" (all E-Core) processor family. Intel's second generation E-core Xeon "Clearwater Forest" design is expected to launch in 2025, with a deployment of "Darkmont" efficiency-oriented cores. Official product roadmaps and patch notes have revealed basic "Clearwater Forest" information, but we have not seen many leaks. Bionic_Squash has a history of releasing strictly internal Intel presentation slides—Meteor Lake (MTL-S) desktop SKUs were uncovered last April.

Their latest discovery does not include any photo or documented evidence—Bionic_Squash's concise social media post stated: "Clearwater Forest uses 3D stacking with hybrid bonding." This claim points to the possible deployment of Foveros Direct advanced packaging—this technology was expected to be ready at some point within the second half of 2023, although a mid-December technology showcase implied that things were behind schedule. The fanciest "Clearwater Forest" Xeon processors could arrive with a maximum total of 288 E-core count (and 288 threads)—according to Wccftech analysis: "The CPU package is going to consist of a base tile on top of the interposer which is connected through a high-speed I/O, EMIB, and the cores will be sitting on the topmost layer...Foveros Direct technology will allow direct copper-to-copper bonding, enabling low resistance interconnects and around 10-micron bump pitches. Intel itself states that Foveros Direct will blur the boundary between where the wafer ends and the package begins."

The mysterious Zen 6 "Morpheus" processor architecture was leaked accidentally by an AMD engineer's LinkedIn profile—news outlets picked up on this information last April. Naturally, Team Red's next priority is Zen 5—the latest reports suggest that two different chiplet designs are penciled in for mass production within the second quarter of 2024. Last September, insiders claimed that a proposed EPYC 9006 "Venice" CPU series was based on the sixth-gen microarchitecture. Everest/Olrak_29 has revealed various bits of speculative material regarding futuristic "Ryzen Client" processor designs since the start of 2024.

The latest postings to social media posit that AMD has selected an RDNA 5-based integrated graphics solution (possibly occupying a tile), thus "skipping RDNA 4" on their "Medusa" lineup of Ryzen Client processors. Leaked Microsoft documents revealed that its Xbox hardware design division was considering RDNA 5 for next-gen console specs. Medusa's CPU aspect is allegedly populated by Zen 6 "Morpheus" cores—as claimed in a January tweet. A new package design was also riffed on at the time: "Yes, I have teased this before...Medusa will use 2.5D interconnect with a much higher bandwidth," instead of a "traditional" multi-die design. Industry speculation has AMD's Zen 6 client architecture linked to a loose 2025/2026 launch window.

Japan's Jiji news agency has cottoned onto a major computer memory industry rumble—a Friday Reuters report suggests that Kioxia has offered an olive branch to SK Hynix, perhaps in a renewed push to get its proposed (and once rejected) merger with Western Digital over the finishing line. The South Korean memory manufacturing juggernaut took great issue with the suggested formation of a mighty Japanese-American 3D NAND memory chip conglomerate—SK Hynix's opposition reportedly placed great pressure on Western Digital (WD), and discussions with Kioxia ended last October.

Kioxia is seemingly eager to resume talks with WD, but requires a thumbs up from SK Hynix—according to Jiji's insider source(s), the Tokyo-headquartered manufacturer is prepared to offer its South Korean rival a nice non-volatile memory production deal. Kioxia's best Japanese 3D NAND fabrication facilities could play host to SK Hynix designs, although it is too early to tell whether this bid has been accepted. The Yokkaichi and Kitakami plants are set to receive a 150 billion yen Government subsidy—Kioxia and WD's joint venture is expected to move into cutting-edge semiconductor production. The Japanese government is hoping to secure its native operations in times of industry flux.

Murmurings of a delayed Nintendo "Switch 2" release schedule appeared online earlier this week—Brazilian games journalist, Pedro Henrique Lutti Lippe, made claims during an "OX do Controle" videocast—based on insider information. Additionally, he broke the bad news on social media: "Nobody wants to hear this, but this one is pretty intense. After consulting five sources from three different continents, all echoing basically the same thing, we can reveal (that) the launch of the Switch's successor should only happen in 2025." Several global news outlets have performed their own investigations, following up on OX do Controle's declaration.

Eurogamer reached out to its network of "trusty" insiders—their Friday evening update stated that: "(we) can now corroborate the earlier reports/whispers that the Switch 2, once destined for release later in 2024, is now set for Q1 2025...The console's launch moving into early next year—but still within the coming financial year—is designed to ensure Switch 2's launch line-up features as many titles as possible, Eurogamer understands." Video Games Chronicle's Andy Robinson has similarly checked in with his pool of industry spies: "VGC has heard from multiple sources who said Nintendo has told publishers its next console will now launch in Q1 2025. According to the sources, third-party game companies were recently briefed on an internal delay in Nintendo's next-gen launch timing, from late 2024 to early the following year. One publishing source suggested the delay was so that Nintendo could prepare stronger first-party software for the console. It's possible the next-gen Nintendo console will now follow a similar timeline to the Switch, which was released in March but announced the previous year."

Intel's 14th Generation "Raptor Lake Refresh" processor series debuted in "enthusiast" SKU form last October—Team Blue's official product unveiling was less than surprising, since multiple SKUs and specifications had been leaked throughout mid-to-late 2023. The true top-of-the-pile Intel Core i9-14900KS SKU was first linked to a possible announcement at January's CES trade show, but did not appear in any of last year's leaked product lists. Team Blue proceeded to introduce its 14th Gen "mainstream" 65 W SKUs to the crowd in Las Vegas, but the leaked Core i9-14900KS model did not pop up, contrary to tipster claims—Intel had a history of presenting "KS" variants during January showcases.

Industry experts reckon that the current Raptor Lake Refresh flagship—Core i9 14900K—is getting some extra time in the spotlight, before its inevitable dethroning courtesy of a "Special Edition" sibling. BenchLife has reached out to its cadre of insiders, following yesterday's reports of a "gargantuan 409 W maximum package power draw." The alleged top dog 14th Gen Core part is perhaps only a month away from launch, as leaked by industry moles: "According to our reliable sources, Intel plans to launch the Intel Core i9 in mid-March 2024. 14900KS is a limited edition processor with a clock speed of 6.2 GHz, but we cannot confirm whether it will be sold to a specific system vendor or a specific channel."

Apple CEO, Tim Cook, discussed planned generative AI software features during an early February earnings call: "As we look ahead, we will continue to invest in these and other technologies that will shape the future. That includes artificial intelligence, where we continue to spend a tremendous amount of time and effort, and we're excited to share the details of our ongoing work in that space later this year." His "prepared" statement did not provide any specific insights into involved technologies, but many iPhone experts believe that the upcoming release of iOS 18 could be "the biggest update" in Apple mobile operating system history. The American multinational technology giant is seemingly taking a relaxed approach with internal artificial intelligence developments—rival smartphone maker, Samsung, has already jumped into the on-the-go AI deep end with its recently launched Galaxy S24 series. Qualcomm's Snapdragon 8 Gen 3 (for Galaxy) chipset is ready to take on all sorts of artificial intelligence-augmented tasks, while a next-gen ARM Cortex-X "Blackhawk" unit (leveraging "great" LLM performance) is in the pipeline for a late 2024 rollout.

Taiwan's Economic Daily News has reached out to insider contacts, albeit on the hardware side of things—their sources reckon that Apple is working on next generation processors that sport "significantly upgraded Neural Engine performance with additional cores." Tipsters believe that plans for 2024 include an effort to "significantly strengthen the AI computing power of the (existing) M3 and A17 processors," while the true "new generation" M4 and Bionic A18 chipsets will be augmented with greater AI computing core counts. Taiwan's top foundry is reportedly in the mix: "Apple has strengthened the AI computing performance of mobile devices and greatly increased the computing power of its own processors, which has simultaneously increased its wafer investment in TSMC. According to industry sources, Apple's wafer production volume for TSMC's 3 nm enhanced version process this year is expected to increase by more than 50% compared with last year, making it firmly the largest customer of TSMC."

Intel is aiming to get its $20 billion fabrication location—in New Albany, Ohio—up and running by 2025, but the advanced manufacturing facility is facing another round of setbacks. According to a WCMH NBC4 local news report (covering the Colombus, Ohio area), a planned "oversized equipment" reshuffle has been delayed—the shifting of heavy machinery was supposed to start last weekend. Extreme weather conditions (flooding) have been cited as major factor, as well as the complicated nature of transporting "overweight and oversized" loads to Team Blue's 1000-acre site. Workers are set to resume efforts this weekend—starting no later than February 17. Tom's Hardware has kept tabs on the Ohio fab's progress: "The project to move the equipment is expected to last over nine months, meaning this phase of Intel's construction could be done near the end of 2024. There isn't a firm indication of how much work remains to be done at the site after the equipment is delivered." TPU previously covered the leading-edge location's indefinitely postponed groundbreaking ceremony—CHIPS Act subsidies were not delivered in an expected timely manner back in 2022.

A couple of media outlets (Tom's Hardware, Network World, etc.) have received an official statement regarding the slippage of events in New Albany: "While we will not meet the aggressive 2025 production goal that we anticipated when we first announced the selection of Ohio in January, 2022, construction has been underway since breaking ground in late 2022 and our construction has been proceeding on schedule. Typical construction timelines for semiconductor manufacturing facilities are 3-5 years from groundbreaking, depending on a range of factors...We remain fully committed to the project and are continuing to make progress on the construction of the factory and supporting facilities this year. As we said in our January 2022 site-selection announcement, the scope and pace of Intel's expansion in Ohio may depend on various conditions." Industry insiders believe that an "opening ceremony" could occur around late 2026, or even early 2027.

Various news outlets have been keeping tabs on OpenAI's CEO—Sam Altman—the AI technology evangelist was reported to be pursuing an ambitious proprietary AI chip project in early 2024. Inside sources pointed to late-January negotiations with important investment personnel in the Middle East—many believe that OpenAI leadership is exploring the idea of establishing its own network of semiconductor production plants. Late last week, The Wall Street Journal followed up on last month's AI industry rumors: "(Altman) has another great ambition: raising trillions of dollars to reshape the global semiconductor industry. The OpenAI chief executive officer is in talks with investors including the United Arab Emirates government to raise funds for a wildly ambitious tech initiative that would boost the world's chip-building capacity, expand its ability to power AI." One anonymous insider reckons that "the project could require raising as much as $5 trillion to $7 trillion."

TSMC is reportedly in the equation—Altman allegedly conducted talks with top brass last month—their expertise in cutting edge fabrication techniques would be of great value, although it is somewhat futile to reveal too many industry secrets given the sheer scale of OpenAI's (reported) aggressive expansion plans. The Wall Street Journal (WSJ) suggests that the embryonic venture is far more "open" than previously reported—a collaborative venture could be established once funding is secured, although Altman & Co. face "significant obstacles" en route. WSJ proposes that the somewhat OpenAI-centric fabrication network is best founded by a joint partnership—involving multiple investors, contract chip manufacturers (perhaps TSMC), and energy/power providers. OpenAI appears to be the "primary buyer" of resultant fabricated AI chips, with manufacturing services also offered to other clients. The scale of such an endeavor is put into perspective by WSJ's analysis (via inside sources): "Such a sum of investment would dwarf the current size of the global semiconductor industry. Global sales of chips were $527 billion last year and are expected to rise to $1 trillion annually by 2030. Global sales of semiconductor manufacturing equipment—the costly machinery needed to run chip factories—last year were $100 billion, according to an estimate by the industry group SEMI."

Attention is now turning to the late February Mobile World Congress (WWC) 2024 trade show—following journos recovering from their recent CES gauntlet-esque ordeals. An exclusive Windows Report piece proposes that Lenovo representatives will be heading to Barcelona with a very special next generation laptop in hand. The publication has a outed a number of upcoming portable devices, two weeks prior to Lenovo's intended showcase (February 26 - 29)—we witnessed a similar occurrence last year with WinFuture leaking Microsoft's September Surface refreshes. Six notebook refreshes (ThinkPad and ThinkBook) are mentioned in the latest report, as well as Gen 2 version of Lenovo's ThinkVision M14T portable monitor.

The alleged headliner seems to be a concept model, that slides into the company's ThinkBook range—Windows Report has leaked heavily watermarked images, but little in the way of technical specifications: "Lenovo's transparent laptop features a bezel-less design, with the display being completely see-through. The deck also seems completely transparent, with the main components being housed in and under the chin, which is the area that's not transparent. There's also a non-transparent slim frame that surrounds the entire deck, probably housing the ports." An anonymous source reckons that the transparent OLED ThinkBook runs on Windows 11, and Lenovo's tried and trusted design language is very apparent (when in use).

DigiTimes Asia has reached out to insiders at fabrication toolmakers in an effort to delve deeper into claims made by industry analysts at the start of 2024—both SemiAnalysis and China Renaissance have proposed that TSMC is unlikely to adopt High-NA EUV production techniques within a five year period. The latest news article explores a non-upgrade approach for the next couple of years: "TSMC has not placed orders for high-numerical aperture (High-NA) extreme ultraviolet (EUV) tools and is unlikely to use the technology in 2 nm and 1.4 nm (A14) process manufacturing." Intel Foundry Services (IFS) will be one of the first semiconductor manufacturers to go online with ASML's latest and greatest machinery, although no firm timeframes have been confirmed. Team Blue's Taiwanese rival (and occasional business partner) is seemingly happy with its existing infrastructure, but industry watchdogs propose that cost considerations are key factors behind TSMC's cautious planning for the next decade.

The DigiTimes insider sources believe that TSMC will not budge until at least 2029, possibly coinciding with a 1 nm production node—analysts at China Renaissance reckon that High-NA EUV machines could be delivered in the future when facilities are readied for an "A10" codenamed process. TSMC published a very ambitious "transistor count" product timeline in early January (see below)—the first "1 nm" products are supposedly targeted for a 2030 rollout, but this schedule could change due to unforeseen circumstances. Intel is expected to "phase in" its fanciest ASML gear collection once the 18A process becomes old hat—Tom's Hardware thinks that 2026 - 2027 is a feasible timeframe.

Semiconductor Manufacturing International Corp (SMIC) is preparing new semiconductor production lines at its Shanghai facilities according to a fresh Reuters report—China's largest contract chip maker is linked to next generation Huawei SoC designs, possibly 5 nm-based Kirin models. SMIC's newest Shanghai wafer fabrication site was an expensive endeavor—involving a $8.8 billion investment—but their flagship lines face a very challenging scenario with new phases of mass production. Huawei, a key customer, is expected to "upgrade" to a 5 nm process for new chip designs—their current flagship, Kirin 9000S, is based on a SMIC 7 nm node. Reuter's industry sources believe that the foundry's current stable of "U.S. and Dutch-made equipment" will be deployed to "produce 5-nanometer chips."

Revised trade rulings have prevented ASML shipping advanced DUV machinery to mainland China manufacturing sites—SMIC workers have reportedly already repurposed the existing inventory of lithography equipment for next-gen pursuits. Burn Lin (ex-TSMC), a renowned "chip guru," believes that it is possible to mass produce 5 nm product on slightly antiquated gear (previously used for 7 nm)—but the main caveats being increased expense and low yields. According to a DigiTimes Asia report, mass production of a 5 nm SoC on SMIC's existing DUV lithography would require four-fold patterning in a best case scenario.

An MSI "Ruan Mei" special edition GeForce RTX 4090 SUPRIM X model has been teased by hongxing2020 on social media—it is not clear whether this is an intentional leak, given the formal office setting photographed in the background. Seemingly finalized retail packaging, heavily updated shroud plus backplate designs, and bundled poster and mousepad merchandise are emblazoned with a 5-star rated Honkai: Star Rail character. As noted by VideoCardz, the web link displayed on MSI's accompanying poster would indicate that the special green and gold special SUPRIM X model is destined for the Chinese PC hardware market—where miHoYo's Honkai games franchise is super popular.

The MSI GeForce RTX 4090 SUPRIM X "Ruan Mei" special edition's packaging does not make a distinction between the onboard GPU being a US sanction-compliant NVIDIA GeForce RTX 4090 D variant, or the original + uncompromised AD102-300-A1. Perhaps it is safe to assume that a first quarter 2024 launch model will sport ever so slightly downgraded internals—MSI has already prepared their standard silver range-topping GeForce RTX 4090 D SUPRIM X model for the region. A small batch of Ruan Mei limited editions could arrive at a later date, once the the standard card has cleared the way.

AMD's December 2023 launch of new Instinct series accelerators has generated a lot of tech news buzz and excitement within the financial world, but not many folks are privy to Team Red's MSRP for the CDNA 3.0 powered MI300X and MI300A models. A Citi report has pulled back the curtain, albeit with "projected" figures—an inside source claims that Microsoft has purchased the Instinct MI300X 192 GB model for ~$10,000 a piece. North American enterprise customers appear to have taken delivery of the latest MI300 products around mid-January time—inevitably, top secret information has leaked out to news investigators. SeekingAlpha's article (based on Citi's findings) alleges that the Microsoft data center division is AMD's top buyer of MI300X hardware—GPT-4 is reportedly up and running on these brand new accelerators.

The leakers claim that businesses further down the (AI and HPC) food chain are having to shell out $15,000 per MI300X unit, but this is a bargain when compared to NVIDIA's closest competing package—the venerable H100 SXM5 80 GB professional card. Team Green, similarly, does not reveal its enterprise pricing to the wider public—Tom's Hardware has kept tabs on H100 insider info and market leaks: "over the recent quarters, we have seen NVIDIA's H100 80 GB HBM2E add-in-card available for $30,000, $40,000, and even much more at eBay. Meanwhile, the more powerful H100 80 GB SXM with 80 GB of HBM3 memory tends to cost more than an H100 80 GB AIB." Citi's projection has Team Green charging up to four times more for its H100 product, when compared to Team Red MI300X pricing. NVIDIA's dominant AI GPU market position could be challenged by cheaper yet still very performant alternatives—additionally chip shortages have caused Jensen & Co. to step outside their comfort zone. Tom's Hardware reached out to AMD for comment on the Citi pricing claims—a company representative declined this invitation.

Qualcomm and its smartphone manufacturer partners are reported to be in a rush to get the Snapdragon 8 Gen 4 chipset released later this year—Digital Chat Station believes that a pioneering mobile device could enter a mass production phase around September of this year. Prototype devices are allegedly up and running—the tipster's insider sources have alluded to engineering samples being capable of reaching 4.0 GHz clocks on a high-powered Big Core (Nuvia's Oryon or Phoenix). Qualcomm's Snapdragon 8 Gen 3 SoC was revealed last October, and working hardware is slowly trickling out via retail avenues in early 2024—Digital Chat Station does not provide any reasoning behind the race to get the successor across the finish line within the same year.

An unnamed smartphone manufacturer is said to have outfitted a "dual-curved screen" model with a Snapdragon 8 Gen 4 chipset—Wccftech's report suggests that Xiaomi usually gets first dibs on cutting edge Qualcomm processor tech. The Nuvia engineering team has likely got their custom Oryon cores running to more than satisfactory levels—the article points out that: "a previous Geekbench 6 single-core and multi-core leak revealed that the (3 nm) Snapdragon 8 Gen 4 competes with Apple's M3 and is 46 percent faster than the Snapdragon 8 Gen 3 in multi-threaded workloads." Qualcomm is facing fierce flagship chip competition in 2024—MediaTek's Dimensity 9400 SoC could arrive at a cheaper price point, while offering comparable performance and efficiency.

Insider Gaming's Tom Henderson has managed to glean information from a recent Sledgehammer Games "Town Hall" meeting—his source(s) allege that the Activision subsidiary is set for some major restructuring. Last week, Microsoft announced widespread cuts across its Xbox and Activision Blizzard departments—according to Henderson's investigations: "30% of Sledgehammer Games staff have lost their jobs." An earlier version of his report outlines a return to a "Work From Home" model for the rest of 2024, given that the studio is allegedly vacating their current space (located in Foster City, California). He suggested that this is a temporary measure: "until a new office is found near its current location. It's expected that employees will be working from home until the end of 2024."

Insider Gaming claims that it sources have leaked Activision's future plans for their highly prized Call of Duty franchise—despite layoffs and adjusted work conditions, the company's top brass are sticking with a regular release schedule: It's a move that comes at an interesting time for Sledgehammer Games, as it it was also announced during the Town Hall that the studio would be the main developer for Activision's 2027 Call of Duty title. Infinity Ward will be heading Call of Duty 2026, understood to be in the Modern Warfare universe. Call of Duty 2025 is currently planned to be a semi-futuristic Black Ops 2 sequel under the codename Saturn."

Japan's PC_Focus social media account has shared some slightly damning insider information regarding the performance of Dragon's Dogma 2 on current generation consoles. Capcom's much anticipated action role player is scheduled for a March 22 multiplatform launch—encompassing versions for PC, PlayStation 5, Xbox Series X and Series S. The upcoming sequel leverages the company's proprietary RE Engine (Reach for the Moon Engine)—contrary to widespread misinformation, "RE" does not stand for Resident Evil. A "Japanese insider" familiar with pre-release builds has relayed information to PC_Focus about Dragon's Dogma 2 running at "30 FPS on consoles." An IGN Japan weekend report is also cited—the publication confirms that the game "features only 1 save slot," with "auto and manual sharing the same slot."

Dragon's Dogma 2 Steam profile provides system requirements for PC platforms in "Minimum" and "Recommended" categories—as noted by Wccftech, both sheets list estimated performance for 30 FPS: "(for) minimum specs, the Steam page lists an AMD Ryzen 5 3600 CPU, which on paper, is roughly equivalent to the CPU inside the PlayStation 5 and Xbox Series." Capcom has not divulged any official details regarding Dragon's Dogma 2's visual modes for games consoles—be it "Quality" or "Performance." We hope to see some clarification pop up in pre-release material leading up to the game's late March launch.

A Taiwan Economic Daily news article proposes that a couple of high profile clients are considering TSMC's 2 nanometer process—Apple is widely believed to be the first customer to join the foundry's queue for cutting edge services. The report posits that Intel is also signed up on the Taiwanese firm's 2 nm reservation list—TSMC is expected to start production in 2025—insiders reckon that Team Blue's "Nova Lake" CPU family is the prime candidate here. Its CPU tile is alleged to utilize TSMC 2 nm node. Intel's recent "Core" processor roadmaps do not display any technologies beyond 2025—many believe that "Nova Lake" is pencilled in for a loose 2026 launch window, perhaps within the second half of the year.

The existence of "Nova Lake" was revealed late last year by HWiNFO patch notes—a short entry mentioned preliminary support for the family's integrated GPU. Intel is engaged in hyping up of its own foundry's 20A and 18A processes, but remain reliant on TSMC plants for various bits of silicon. Industry tipsters reckon that aspects of "Lunar Lake" CPUs are based on the Taiwanese foundry's N3B node. Team Blue Corporation and United Microelectronics Corporation (UMC) announced a new development partnership last week, but initial offerings will arrive on a relatively passé "12-nanometer semiconductor process platform." TSMC's very advanced foundry services seem to be unmatched at this juncture.

Digital Chat Station has seemingly received insider information regarding the performance of Qualcomm's Snapdragon 8 Gen 4 mobile chipset—their source reports that a probable engineering sample is already exceeding its predecessor's Big core (Cortex-X4) maximum limit of 3.3 GHz. The rumor mill has Nuvia's custom Oryon cores linked to the next generation mobile processor, although some experts think that the Phoenix design was selected for Gen 4. Qualcomm's Snapdragon X Elite notebook SoC was unveiled last October—this ARM-based solution is set to deliver "a dramatic leap in innovation for computing" thanks to Nuvia's custom Oryon technology. Kedar Kondap, Senior Vice President & General Manager of Compute & Gaming stated that the Snapdragon X Elite offers: "super-charged performance that will delight consumers with incredible power efficiency and take their creativity and productivity to the next level."

Digital Chat Station's brief assessment of the prototype Snapdragon 8 Gen 4's Big core prowess is also glowing: "4.0 GHz is no longer a dream" on smartphones. Past reports have Qualcomm signed up with TSMC for an unspecified 3 nm production process—next generation silicon will benefit greatly in terms of power efficiency, with custom Oryon or Phoenix cores (allegedly) achieving greater clock speeds thanks to some extra headroom. As mentioned above, the previous-gen Kryo Prime core—using TSMC's advanced 4 nm node—is factory restricted to 3.3 GHz. Tipsters reckon that efficiency cores are not part of the Snapdragon 8 Gen 4 design, due to the innate benefits of 3 nm—according to Digital Chat Station, MediaTek is taking similar steps with its upcoming Dimensity 9400 SoC.

Earlier today, Bloomberg published a report that covers expert analysis of the Nintendo Switch successor's alleged display credentials. The media outlet cites claims made by Hiroshi Hayase—Research Manager (of Small Medium Displays) at Omdia. The analyst proposes that Nintendo's hardware design team has selected an eight inch LCD screen for their "Switch 2" games console, he also believes that the launch model is due at some point this year. Hayase-san has gleaned information from supply chain insiders—the Switch successor could double shipments of entertainment-oriented "small displays." Sharp Corporation is believed to be Nintendo's main supplier, according to interpretations of deliberately vague company statements.

Nintendo's 2017 launch model sported a 6.2-inch LCD display, a more portable Lite version arrived in 2019 with a 5.5-inch display, and a larger 7-inch OLED iteration was released back in 2021. Gaming communities have long speculated about an abandoned "Switch Pro" model—many believe that the project was dropped due to ongoing supply chain problems during lockdown periods. The Switch OLED (plus its modernized dock station) is believed to be an interim gap fill. Nintendo has revealed little about their next generation gaming console, but development partners have been making some noise lately. According to a 4Gamer.net interview article, workers at Japanese studios (CAPCOM, Koei Tecmo, and Spike Chunsoft) have expressed major excitement about the upcoming model's prospects. GDC's 2024 State of the Game Industry report revealed that 240 respondents have admitted that they are actively working on Switch 2 games software.

LaminiAI appeared to be one of the first customers to receive an initial shipment of AMD's Instinct MI300X accelerators, as disclosed by their CEO posting about functioning hardware on social media late last week. A recent Taiwan Economic Daily article states that the "MI300X is rumored to have begun supply"—we are not sure about why they have adopted a semi-secretive tone in their news piece, but a couple of anonymous sources are cited. A person familiar with supply chains in Taiwan divulged that: "(they have) been receiving AMD MI300X chips one after another...due to the huge shortage of NVIDIA AI chips, the arrival of new AMD products is really a timely rainfall." Favorable industry analysis (from earlier this month) has placed Team Red in a position of strength, due to growing interest in their very performant flagship AI accelerator.

The secrecy seems to lie in Team Red's negotiation strategies in Taiwan—the news piece alleges that big manufacturers in the region have been courted. AMD has been aggressive in a push to: "cooperate and seize AI business opportunities, with GIGABYTE taking the lead and attracting the most attention. Not only was GIGABYTE the first to obtain a partnership with AMD's MI300A chip, which had previously been mass-produced, but GIGABYTE was also one of the few Taiwanese manufacturers included in AMD's first batch of MI300X partners." GIGABYTE is expected to release two new "G593" product lines of server hardware later this year, based on combinations of AMD's Instinct MI300X accelerator and EPYC 9004 series processors.

A DigiTimes Asia report posits that TSMC is preparing another VVIP foundry lane for Apple Inc.—insiders claim that the Taiwanese foundry giant is in the process of expanding production capacity into next generation 2 nm nanometer fields. This expensive and time consuming endeavor is only made possible with the reassurance of big customers being added to the foundry's order books. TSMC's 2 nm-class N2, N2P, and N2X process technologies are due in 2025 and beyond (according to recent presentation slides)—these advanced packages are set to drop with all sorts of innovations: nanosheet gate-all-around (GAA) transistors, backside power delivery, and super-high-performance metal-insulator-metal (SHPMIM). According to a DigiTimes source "Apple is widely believed to be the initial client to utilize the (next-gen) process."

Apple and NVIDIA were reported to be ahead of many important clients in the queue for TSMC's 3 nm process nodes, so it is not surprising to see old patterns repeat (according to industry rumors) again. Apple is expected to update its next generation iPhones, iPad, and Mac laptop product lines with more advanced Bionic and M-series chipsets in 2025. Last year's roster included a rollout of 3 nm TSMC silicon across Apple A17 Pro and M3 ARM-based processors.

MediaTek revealed its (now current generation) flagship Dimensity 9300 flagship mobile processor last November, but we are already hearing about its successor's foundation. Digital Chat Station published some early insights on their Weibo micro-blog—the tipster appears to have an inside track at MediaTek's system-on-chip R&D department. The imaginatively named "Dimensity 9400" chipset is reportedly earmarked for mass production chez TSMC, with the foundry's second generation 3 Nm process being the favored node—this information aligns with official announcements as well as industry rumors from last autumn. MediaTek's Dimensity 9300 sports a "one-of-a-kind All Big Core design," with no provision for puny efficiency units—built on TSMC's third generation 4 nm process with four ARM Cortex-X4 cores (going up to 3.25 GHz) and four Cortex-A720 cores (maximum 2.0 GHz).

Digital Chat Station reckons that the 9300's All Big Core configuration will carryover to its next generation sibling, albeit with some major upgrades. MediaTek hardware engineers are alleged to have selected ARM's latest and greatest CPU and Mali GPU designs—the Cortex-X5 core could be a prime candidate in the first category. The rumor mill has the next batch of flagship Exynos SoCs utilizing ARM's fifth generation design. Digital Chat Station proposes that more smartphone manufacturers could adopt a top-flight Dimensity 2024 chip, if its performance can match the closest rivals. Industry experts posit both MediaTek and Qualcomm choosing TSMC's N3E process for their upcoming flagship chipsets—this node apparently "offers improved cost-effectiveness and superior yields" when compared to the first generation N3B process (as ordered by Apple for its latest M and B-series SoCs). Dimensity 9400 is expected to take on Snapdragon 8 Gen 4—this could be a tough fight, given that Qualcomm's offering is set to debut with custom Oryon cores.