A DigiTimes Asia report posits that TSMC is preparing another VVIP foundry lane for Apple Inc.—insiders claim that the Taiwanese foundry giant is in the process of expanding production capacity into next generation 2 nm nanometer fields. This expensive and time consuming endeavor is only made possible with the reassurance of big customers being added to the foundry's order books. TSMC's 2 nm-class N2, N2P, and N2X process technologies are due in 2025 and beyond (according to recent presentation slides)—these advanced packages are set to drop with all sorts of innovations: nanosheet gate-all-around (GAA) transistors, backside power delivery, and super-high-performance metal-insulator-metal (SHPMIM). According to a DigiTimes source "Apple is widely believed to be the initial client to utilize the (next-gen) process."

Apple and NVIDIA were reported to be ahead of many important clients in the queue for TSMC's 3 nm process nodes, so it is not surprising to see old patterns repeat (according to industry rumors) again. Apple is expected to update its next generation iPhones, iPad, and Mac laptop product lines with more advanced Bionic and M-series chipsets in 2025. Last year's roster included a rollout of 3 nm TSMC silicon across Apple A17 Pro and M3 ARM-based processors.