PowerColor's Radeon RX 9070 XT Hellhound model is a known property—in terms of its visual presentation—due to a public unveiling at CES 2025, as well as renders appearing online via official product pages. The Taiwanese manufacturer has decided to update its custom graphics card designs for AMD's incoming RDNA 4 generation—for example; the flagship Red Devil family is also refreshed for 2025. So far, PowerColor has showcased "standard black" Red Devil, Hellhound and Reaper designs. Rumors of additional Spectral White variants were circulating online earlier in the week.

Chinese market-exclusive PowerColor Radeon RX 7650 GRE Reaper models were launched very recently, complete with a Spectral White option. Following this official launch, VideoCardz picked up on inside track information; pointing to possible pale variants of forthcoming RDNA 4-based Red Devil cards. Days later, another PowerColor leak has unearthed an unannounced Spectral White SKU, albeit in Hellhound flavor. This product family usually offers a nice balance of high-end features and favorable pricing; we hope to see concrete details tomorrow. The leaked Hellhound card seems to feature an almost all-white aesthetic; extending to its PCB design and I/O bracket. No major surprises were disclosed in VideoCardz's report, but they noted a potential absence of RGB lighting zones. Previous-gen Hellhounds sport "fixed-color" schemes; enabling blue or purple lighting.

Earlier in the year, we heard about TSMC being ahead of the game with its speculated trial production run of cutting-edge 2 nm (N2) silicon. Taiwan's premier foundry company is reportedly prepping its Baoshan and Kaohsiung plants for full-on manufacturing of next-gen chips. The latest insider whispers propose that TSMC is making "rapid" progress on the 2 nm (N2) front, as company engineers have moved onto an "intensive" trial production phase. Taiwan's Economic Daily News has picked up on compelling projections from industry moles; the Hsinchu Baoshan facility's current monthly production capacity is (allegedly) around 5000 to 10,000 2 nm wafers. The other 2 nm-specialist site—Kaohsiung—has reportedly moved into a small-scale appraisal phase.

TSMC declined to comment on recently leaked data points, but they released a general statement (to UDN), emphasizing that: "(our) 2 nm process technology is progressing well and will go into mass production as scheduled in the second half of this year." The Baoshan plant could ramp up to 25,000 2 nm wafers per month, once it moves into a mass production phase. Combined with the same estimated output from its sister site (Kaohsiung), insiders reckon that the combined total could reach 50,000 units per month. Following a predicted successful "second phase" transition, TSMC's most advanced facilities have a "chance" to pump out 80,000 2 nm parts (combined total). The latest murmurs suggest that this milestone could be achieved by the end of 2025. Industry watchdogs believe that Apple will have first access dibs on TSMC's upcoming cutting-edge offerings.

Press outlets have spotted two new B650M motherboard models on ASRock's product site; the B650M Pro X3D and B650M Pro X3D WiFi (6E). According to the manufacturer's descriptions, both are advertised as: "optimized for AMD Ryzen X3D processors, delivering superior stability, compatibility, and enhanced performance, making it ideal for gaming and creating." The "Pro X3D" SKUs have not launched at retail, so pricing information is not available at the time of writing. ASRock could publish a dedicated press release in the near future, but we are looking at a very quiet reveal. Curiously, the Taiwan-based motherboard and graphics card specialist has seemingly "downcycled" its fairly new B850M Pro "Race Sport" RS board design.

VideoCardz's coverage of the Pro X3D series includes a handy image comparison tool. When lined up against each other (visually), the B650M Pro X3D and B850M Pro RS designs are nigh identical. Two of the images (below) show a minor difference in printed-on model names. As expected, the ASRock website comparison tool reveals only minor disparities between respective specification sheets. The standard B850M Pro RS variant is currently on sale for $148 (normally $180). The B650M Pro X3D (non-WiFi 6E) equivalent could arrive at retail with a slightly lower price point. ASRock has signalled that its "Pro X3D" mainboard series will only be available within certain regions. According to VideoCardz, a comprehensive global rollout is not planned.

Yesterday, Nintendo's Hong Kong office announced the establishment of a new subsidiary company in Taiwan—specifically, in Taipei City. Their official statement mostly outlines upcoming improved service benefits for local customers. The House of Mario has relied on contracted partners to take care of smaller regional markets. Evidently, their Taiwanese audience has relied on a third party company for over a decade. An older subsidiary—Nintendo Phuten—was shuttered back in 2014. The successor is chaired by Hiroyuki Matsumoto—on February 18, the new company representative delivered a message: "Thank you for your long-term support and love, I would like to express my sincere thanks. In order to further strengthen the business foundation in the Taiwan market and improve the service quality of customers, the company will establish a new local legal person 'Taiwan Nintendo Co., Ltd.' as one of the subsidiaries of Nintendo Co., Ltd. Starting from April 1, 2025, we will officially transfer our business in Taiwan to 'Taiwan Nintendo Co., Ltd.', and adhere to the business philosophy of Nintendo Group to continue to promote business development." As reported by Nintendo Life, the veteran video game house has made serious inroads in the region—Taiwanese fans were greeted by a larger than expected (current-gen) Switch console showcase at Taipei Game Show's 2024 edition.

On a surface level, Nintendo's reestablished operation in Taiwan seems to be a customer-focused initiative. Certain gaming news outlets have disclosed more elaborate theories; based on reported problematic market conditions in China. The Chinese Nintendo eShop will be phased out by mid-May 2026, likely in reaction to the government's introduction of new rules that: "limit the encouragement of spending in online games and battle video game addiction among young people." Coincidentally, Shuntaro Furukawa (Nintendo's President) recently new announced "contingency plans"—with a manufacturing model that will become less reliant on Chinese factories. The company chief discussed revised strategies in an interview with Reuters: "Nintendo Switch is not only manufactured in China, but in places such as Vietnam and Cambodia as well. We are predicting various geopolitical risks and establishing ways to respond...While we anticipate a certain impact, the influence on this year's financial results is expected to be minimal. We will continue to observe the trends, and thoroughly consider how to respond."

Sparkle, a notable Intel GPU board partner, introduced its dual-fan GUARDIAN custom design late last year. The Taiwan-based manufacturer's Arc B570 GUARDIAN 10 GB model launched mid-way through January—on day one, TechPowerUp's W1zzard awarded this particular card with "Highly Recommended" and "Great Value" badges. In a December leak, Sparkle's roadmap revealed Sparkle's plans for an upcoming Arc B580 GUARDIAN 12 GB SKU. A launch window was not denoted, but the new card would seemingly arrive after the early 2025 release of Sparkle's B580 TITAN Luna OC model. VideoCardz and its network of observers have detected a new listing on the official Sparkle website; signalling the B580 GUARDIAN's arrival.

Sparkle's Arc B580 GUARDIAN graphics card seems to be available for purchase in the United Kingdom, at the time of writing. CCL Computers and AWD IT have units in-stock at their respective warehouses, ready for immediate shipping. Both e-tailers have priced their offerings at £289.99 (including VAT), AWD has kindly knocked off £10 from their original demand of £299.99. Overclockers UK has a pre-order listing, coming in at a very reasonable £274.00 (incl. VAT). The Sparkle Arc B580 GUARDIAN 12 GB model conforms to Intel reference specifications, so global costs of ownership are likely sticking close to baseline MSRP.

ASE Technology Holding Co., Ltd., the leading provider of semiconductor assembly and testing services ("ATM") and the provider of electronic manufacturing services ("EMS"), today reported its unaudited net revenues of NT$162,264 million for 4Q24, up by 1.0% year-over-year and up by 1.3% sequentially. Net income attributable to shareholders of the parent for the quarter totaled NT9,312 million, down from NT$9,392 million in 4Q23 and down from NT$9,733 million in 3Q24. Basic earnings per share for the quarter were NT$2.15 (or US$0.134 per ADS), compared to NT$2.18 for 4Q23 and NT$2.25 for 3Q24. Diluted earnings per share for the quarter were NT$2.07 (or US$0.129 per ADS), compared to NT$2.13 for 4Q23 and NT$2.18 for 3Q24.

For the full year of 2024, the Company reported unaudited net revenues of NT$595,410 million and net income attributable to shareholders of the parent of NT$32,483 million. Basic earnings per share for the full year of 2024 were NT$7.52 (or US$0.470 per ADS). Diluted earnings per share for the full year of 2024 were NT$7.23 (or US$0.452 per ADS).

China's dominance in semiconductor equipment procurement is expected to face its first setback since 2021, with spending projected to decrease from $41 billion to $38 billion in 2025, according to semiconductor research firm TechInsights. This 6% decline marks a significant shift for the world's largest buyer of wafer fabrication equipment, whose purchases represented 40% of global sales in 2024. The downturn reflects mounting pressures from both market dynamics and geopolitical constraints. US export controls targeting advanced semiconductor capabilities have intensified while domestic chipmakers grapple with overcapacity in mature node segments. SMIC, China's leading foundry, has already signaled concerns about oversupply risks in this sector, where Chinese manufacturers have rapidly expanded their market share against Taiwanese competitors.

Despite these headwinds, Chinese equipment manufacturers have notably advanced domestic capability development. Naura Technology Group has emerged as the seventh-largest global equipment manufacturer, while AMEC continues to expand its international presence. However, critical gaps persist in China's semiconductor equipment ecosystem, particularly in lithography systems, where dependence on foreign suppliers like ASML remains high. TechInsights data reveals that Chinese companies supplied only 17% of testing tools and 10% of domestic assembly equipment in 2023. The spending reduction comes after a period of aggressive stockpiling prompted by US sanctions to limit Beijing's access to advanced chipmaking capabilities, especially those applicable to artificial intelligence and military applications. However, Chinese manufacturers have demonstrated resilience, with SMIC and Huawei successfully producing advanced chips through alternative, albeit more costly, manufacturing methods.

In a world where most of us work, communicate, play, explore, and make purchases online nearly every day, cybersecurity is more important than ever. Yet it's also a world where it's increasingly hard to know who to trust. Perhaps you've seen recent news reports that call into question the security practices of companies that you might rely on for the network for your home or small business. At ASUS, we're working to show you that not every networking company has the same level of commitment to cybersecurity. Recently, we joined FIRST, a longstanding and renowned organization that brings together a variety of computer security incident response teams from around the world. Our membership in FIRST enables us to take enterprise-level experience, security protocols, and incident response tactics and integrate them into the consumer market.

35 years of coordinating responses against cyberattacks
When you're the victim of a cyberattack, your priority is to re-secure your own hardware, data, and account access. But the incident response teams dedicated to cybersecurity have to take a larger view. What vulnerability made the cyberattack possible? What other systems could be affected? How quickly can a fix be deployed, and how might this fix affect other vital systems and functions? Answering these questions in today's connected world requires not just on-the-ground incident response teams, but international communication and coordination between these groups. Since 1990, this layer of coordination has been provided by FIRST—the Forum of Incident Response and Security Teams. Consisting of members from government agencies, educational institutions, military divisions, and the private sector, FIRST works to ensure a safe internet for everyone by creating channels for incident response and security teams across the globe to work together.

Transreflective LCD, or TCLD displays are far from commonly available. As the name suggests, these panels can combine the advantages of both reflective, as well as backlit technologies. E-Ink displays, which are also reflective, have their own set of advantages for workloads with primarily static elements. However, E-Ink displays have always suffered with motion, owing to their low refresh rate. This is where traditional displays reign supreme, and transreflective screens allow for the best of both worlds, depending on the workload.

The Hybri monitor by the Taiwanese brand HANNspree is one such offering, and sports a 1080p 23.8-inch panel with a refresh rate of 75 Hz. This allows for perfectly smooth videos and motion, unlike the vast majority of E-Ink displays. HANNspree claims that the monitor's power draw plummets by around 80% when the backlight is turned off, which is to be expected. When switched on, the backlight provides 50 nits of brightness, and the monitor should work fine without it when ambient light is above 1000 lx. The 4-in-1 adjustable stand allows for swivel, tilt, height, adjustments and pivot functionality. Overall, at a price of $899, the Hybri TLCD monitor should be a decent choice for coding, writing, and office use, especially for those folks who care about reducing eye strain over long workdays. The monitor is already available in Taiwan, with no word on an EU/US release yet.

Earlier this week, Taiwan experienced a magnitude 6.4 earthquake—this seismic event interrupted manufacturing activities at several TSMC chip-making facilities. As a precaution, foundry employees in both Central and Southern Taiwan were evacuated. Production resumed fairly quickly following inspections of crucial infrastructure—no major damage to facilities or equipment was noted. The latest reports suggest that a relatively minor number of TSMC wafers have been affected by the recent quake, while some recalibration of instrumentation is required to get things back on track.

Inside sources reckon that up to 20,000 wafers (possibly 10,000 at a minimum) could be scrapped—assessments are reportedly still underway, but a small proportion of client shipments could be disrupted. News articles point to this total being spread across three affected locations. Fab 18 is a key 3 nm production hub—situated in Taiwan's Southern Science Park, Tainan's Fab 14 specializes in 4 nm and 5 nm processes, and Fab 8 (Hsinchu) takes care of 200 nm. Industry experts believe that TSMC will bounce back quickly, and that the damaged wafer count represents a minor dent in the proverbial armor—on a good day, manufacturing output can reach up to 37,000 units.

HTC Corp. and Google LLC announced today a definitive agreement under which HTC will receive US$250 million in cash from Google, and certain HTC employees from its XR team will join Google. As part of the transaction, Google will receive a non-exclusive license for HTC's XR intellectual property (IP). Following this agreement, HTC and Google will explore future collaboration opportunities.

This agreement reinforces HTC's strategy of continued development around the XR ecosystem, enabling a more streamlined product portfolio with a focus on platforms, greater operational efficiency and financial flexibility. HTC's commitment to delivering innovative VIVE XR solutions such as the VIVE Focus Vision remains unchanged, with existing product lines and solutions to be supported and developed without interruption.

Sparkle's Arc B580 TITAN Luna OC graphics card model—featuring an all-white design—was discovered via leaked renders around mid-December. By that point in time, the Taiwanese company had already sent Intel Arc B580 "Battlemage" GPU-based products to market—most notably in the form of its Arc B580 TITAN OC SKU, bearing a signature blue design. W1zzard—TechPowerUp's resident evaluator of GPUs—honored this particular model with two awards: "Highly Recommended" and "Great Value." We expect the newly announced "Luna" (almost all-white) counterpart to perform nigh identically—Sparkle has simply rolled out a different color option for customers who favor pale-tinted PC builds.

The inclusion of a differently shaded I/O ruins the overall effect, but snow-white enthusiasts will be happy to discover that Sparkle has produced a white PCB design for its TITAN Luna lineup. Similarly, certain Chinese brands have consistently delivered many white-hued boards. Western PC gaming hardware enthusiasts have often admired the (more recognized) PowerColor Hellhound "Spectral White" aesthetic. A limited edition GPU holder will be bundled in the Arc B580 TITAN Luna OC's retail package—unfortunately, Sparkle has seemingly settled on including this all-blue accessory.

In the early hours of Tuesday, a magnitude 6.4 earthquake struck near a remote mountainous region roughly 24 miles southeast of Chiayi in Taiwan, causing temporary operational halts at multiple TSMC facilities. The tremor occurred at 12:17 AM local time and was felt in Tainan, home to four of TSMC's manufacturing sites. Workers in both Central and Southern Taiwan were evacuated as a precaution, following standard company protocols designed to ensure employee safety. TSMC initiated thorough structural inspections immediately after the quake. According to company representatives, all crucial infrastructure, such as water supply and power systems, remained fully functional. With no significant damage detected during safety assessments, TSMC has gradually restarted its production lines, minimizing any long-term impact on its global client base.

Despite the relatively brief disruption, the incident exposes the fragility of the semiconductor manufacturing process. Taiwan's frequent seismic activity has the potential to affect the complex manufacturing processes crucial for producing silicon. Given the company's massive consumption of chemicals and silicon ingots, any significant production setbacks at TSMC can resonate through global supply chains. To reduce these geographical and nature-inspired risks, TSMC is investing heavily in new manufacturing facilities elsewhere, notably in Arizona. Although these sites are expected to enhance the company's resilience, they will only account for around 10% of TSMC's total production capacity. Additionally, as TSMC doesn't plan to bring state-of-the-art production to other sites, the company must implement safety features against earthquake protection in its Taiwan facilities to continue production. A minor manufacturing hiccup can equate to billions of losses across the supply chain.

Transcend Information Inc. (Transcend), a leading global manufacturer of memory storage solutions, introduces the ETD410T, a new U.2 enterprise solid-state drive (eSSD) designed for high-performance computing environments. Tailored to meet the stringent demands of enterprise users for ultra-fast data transfer and reliability, the ETD410T adopts the PCIe Gen 4 x4 high-speed interface and U.2 15 mm form factor, featuring a DRAM cache for exceptional performance and robust data protection. It is an ideal solution for data centers and enterprise applications.

Durable and Stable for High-Frequency Workloads
The Transcend ETD410T is a professional solution optimized for read-intensive workloads. Compliant with JESD219 standards, it offers a durability of up to 7,000 Program/Erase (P/E) cycles to withstand frequent use over long periods. With Quality of Service (QoS) consistently maintained between 99.9% and 99.99%, it delivers stable and reliable operation even in demanding enterprise environments, ensuring consistent and dependable data access.

C.C. Wei, TSMC CEO and Chairman, has shared his latest views regarding his company's North American manufacturing center—Reuters cornered him for comment during a mid-week appearance at a National Taiwan University-held event. The Taiwanese government has recently lowered its "silicon shield"—following much (reported) deliberation over "legal restrictions on transferring leading-edge process technology overseas." This relaxation of rules has TSMC considering a new set of investments for operations outside of Taiwan—with an expansion into advanced node process manufacturing. Currently, 2 nm (N2) is a home turf-speciality—industry experts estimate an expenditure of $28-30 (USD) billion to bring this production technology over to the States. TSMC's CEO has described additional challenges—on top of (and impacting) finances—local bureaucracy is a big one.

Wei stated: "every step requires a permit, and after the permit is approved, it takes at least twice as long as in Taiwan." According Reuters, he reckons that it would be difficult for their North American sites to access the latest technologies ahead of teams in Taiwan. He detailed his company's recruitment of several experts—tasked with talking to local government; about regulatory issues. This was not a cheap undertaking: "we ended up establishing 18,000 rules, which cost us $35 million." TSMC's Arizona production hub will (eventually) consist of three large factories—despite long-term teething problems, Fab 21 is reported to be churning out the first wave of "Made in America" product for a very important client: Apple. Wei expressed positives views when asked about the USA site's prospects—during an earnings conference (Jan 16)—he believes that it will eventually produce the "same quality of chips as in Taiwan," through a "smooth ramp-up process."

Samsung's native foundry operations have wrestled with the 3 nm Gate-All-Around (GAA) process—these problems have persisted since the first reports of "missed production targets" emerged late last year—online speculators floated a very disappointing yield figure: only 20%. Last December, industry moles proposed that the South Korean technology giant had devised plans to form an Exynos-centric "multi-channel partnership" with rival chipmakers. Speculation pointed to TSMC being the only valid ally. Semiconductor industry tipster—Jukanlosreve—believes that negotiations have taken place, and the answer was a firm "no." TSMC's most advanced node process order books are likely filled up with more important customers—industry watchdogs reckon that Apple usually gets first dibs.

Taiwan's top semiconductor manufacturer leads the market with its cutting-edge lithography techniques. Insiders believe that Samsung was impressed by TSMC's 2 nm trial production runs achieving (rumored) 60% yields. The higher-end Exynos chipsets are normally produced with the best node process available, but missed manufacturing goals have caused Samsung to drop in-house tech. In the recent past, Qualcomm's most powerful Snapdragon mobile chipsets have been deployed on flagship Galaxy S smartphones. Jukanlosreve believes that TSMC rejected Samsung's proposed Exynos deal due to a fear of revealing too many "trade secrets." Potentially, the South Koreans could have learned a thing or two about improving yields—courtesy of TSMC's expert knowledge.

PowerColor has updated its website with a Radeon RX 9070 XT Red Devil product page—this is the first example of an RX 9000 series model being officially listed alongside their existing selection of (exclusively) AMD GPU-based graphics cards. The Taiwanese brand has not published any technical specifications—Team Red RDNA 4 NDAs are likely still in effect—but a pleasing number of Radeon RX 9070 XT Red Devil promotional images have been uploaded. A limited edition package (with alleged bundled extras) seems to be in the pipeline—VideoCardz has provided visual evidence of a fancy container (see below).

Teaser images appeared online at the start of this year—close-ups of glowing signature red parts were accompanied by an ominous message: "every edge shines like a gem. Every second burns like fire. If power was in your hands, how would you use it?" Days later, TechPowerUp inspected a fully unveiled Red Devil demonstration sample at CES 2025—new Hellhound and Reaper designs were also within reach. PowerColor's freshly uploaded images reveal one major difference—VideoCardz adeptly points out the presence of two 8-pin power connectors on the promos, while the CES example possessed three physical inputs. They theorize that renders of PowerColor's Radeon RX 9070 (non-XT) Red Devil model have appeared on the XT's product page. Beyond discrepancies in connector counts, the overall design matches that of the Las Vegas showcase model.

The latest news reports suggest that Apple is currently verifying the quality of TSMC Arizona-made chips—the process has reached a "final test stage" with samples from an initial batch being compared to "Made in Taiwan" product. TSMC's native foundries—utilizing the latest cutting-edge technologies—are accustomed to pumping out plenty of high-quality and advanced chips. Nikkei Asia believes that an approval—if USA-made silicon passes muster—will result in commercial mass-produced chips being delivered as soon as Q1 2025. This would be a significant victory for TSMC's relatively new Arizona fab—reported teething problems have caused delays and budgets to balloon. Apple could be the first of TSMC's customers to send products to market that have Arizona-manufactured silicon onboard.

Taiwan's chip-making industry is facing an uncertain future due to regional political tensions—in reaction, the nation's government has started shifting its stance on guarding TSMC's most advanced production processes. Leading-edge process technologies could be heading overseas, with new investments being considered at the Arizona campus. TSMC and Amkor are working on setting up advanced packaging and test facilities at the Peoria location, so current logistics are not ideal—US-made product has to be sent to an Amkor packaging facility in Taiwan. TSMC USA's future looks quite promising—AMD and NVIDIA are reportedly the next in line to receive locally produced samples for verification. Industry moles reckon that Team Green's advanced "Blackwell" AI GPUs could be produced in Peoria—based on alleged partnership negotiations from late last year.

Last November, Taiwan's National Science and Technology Council indicated that it was considering a relaxation of "legal restrictions on transferring leading-edge process technology overseas." TSMC is the nation's most prized chip foundry, but new manufacturing operations are spreading across the globe. The very best node processes—currently TSMC's advanced 2 nm (N2)—have been restricted to home turf, yet global tensions have prompted the Taiwanese government to reconsider its guarded approach. A freshly published Taipei Times report has focused on an important announcement made at a recent government press conference. Taiwan's Minister of Economic Affairs of Taiwan, J.W. Kuo, stated that TSMC is now allowed to manufacture 2 nm chips on foreign soil—according to him, the foundry behemoth is "cautiously" evaluating an investment of roughly $28 to 30 (USD) billion into 2-nanometer production facilities Stateside.

His colleagues have worked hard—in the past—on preserving the country's "Silicon Shield," but fresh adjustments are sweeping in. Kuo commented: "those were old-time rules. Times have changed." TSMC's—allegedly costly—North American hub is reportedly marked down for a "by 2030" push into 2 nm process territories. Taiwan's Economic Affairs minister continued with his reasonings: "Private businesses should make their own business decisions based on their own technological progress...The basic principle is that businesses can make profits from their overseas investments. TSMC is building factories in the US with the aim of serving its US customers, as 60 percent of the world's chip-designing companies are based in the US." He also downplayed concerns regarding possible upcoming shifts in US trade policy making—Taiwan's "strong technological capabilities" are expected to weather the storm. Newly implemented US trade tariffs are expected to have only a "minor impact."

TSMC is reportedly making decent progress with its advanced 2 nm (N2) node—industry news pieces from earlier this month pointed to the initiation of production lines across three fabrication sites. Taiwan's Economic Daily News has kept close tabs on these trial runs—insiders have indicated that TSMC's Kaohsiung plant is capable of matching the Baoshan location's targeted manufacturing output (5000 wafers per month, 60 percent yield). Reports suggest that the Kaohsiung 2 nm trial production will start up later this month—much earlier than anticipated.

The Taiwanese chip foundry giant is taking on the challenge of meeting "greater than expected" demand for its new generation 2 nm product—TSMC chairman C.C. Wei has previously stated that its latest and greatest is more popular (pre-launch) with customers than older 3 nm lines. Apple is rumored to be first in line—not a big surprise since TSMC has (supposedly) rolled out the VVIP red carpet for them in recent times. The Economic Daily News article also mentions Qualcomm and MediaTek being next in the queue for N2. TSMC's best foundries are expected to initiate mass production by the end of 2025.

TSMC is making progress with its most advanced 2 nm (N2) node, a recent report from MoneyDJ quoting industry sources indicates that the company is setting up a test production line at the Hsinchu Baoshan fab (Fab 20) in Taiwan. In the early stages, TSMC aims for small monthly outputs with about 3,000-3,500 wafers. However, the company has big plans to combine production from two factories in Hsinchu and Kaohsiung, TSMC expects to deliver more than 50,000 wafers monthly by the end of 2025 and by the end of 2026 projecting a production of around 125,000 wafers per month. Breaking it down by location, the Hsinchu factory should reach 20,000-25,000 wafers monthly by late 2025, growing to about 60,000-65,000 by early 2027. Meanwhile, the Kaohsiung factory is expected to produce 25,000-30,000 wafers monthly by late 2025, also increasing to 60,000-65,000 by early 2027.

TSMC's chairman C.C. Wei says there's more demand for these 2 nm chips than there was for the 3 nm. This increased "appetite" for 2 nm chips is likely due to the significant improvements this technology brings: it uses 24-35% less power, can run 15% faster at the same power level, and can fit 15% more transistors in the same space compared to the 3 nm chips. Apple will be the first company to use these chips, followed by other major tech companies like MediaTek, Qualcomm, Intel, NVIDIA, AMD, and Broadcom.

TSMC's new semiconductor manufacturing facility in Phoenix, Arizona, will face production costs approximately 30% higher than its Taiwan-based operations when it begins mass production in early 2025. The increased expenses stem from higher tariffs and transportation costs associated with importing necessary materials from Taiwan. The Arizona facility will start producing 10,000 12-inch wafers monthly using a 4 nm node, with plans to double output to 20,000 wafers at full capacity. Four major technology companies—Apple, NVIDIA, AMD, and Qualcomm—have committed to purchasing chips from the plant for their AI and high-performance computing needs. The 445-hectare facility highlights ongoing challenges in America's semiconductor industry. Despite the aim to strengthen domestic chip manufacturing, the plant must import materials from Taiwan to maintain production quality, revealing gaps in the US semiconductor supply chain.

This overseas dependency drives up operational costs significantly. While TSMC's investment marks an essential step in rebuilding domestic capacity, the substantial cost difference between US and Taiwanese production raises questions about long-term viability. TSMC has already begun trial production at the site and plans to expand operations with additional phases. The company's Phase 2 facility is completed, and equipment is being installed, while future expansions aim to produce 2 nm chips by 2028. However, unless the cost gap narrows, the higher production expenses could impact the plant's competitiveness in the global semiconductor market, even competing with its own Taiwanese facilities, where customers could decide to use Taiwanese fabs due to lower costs. Meanwhile, TSMC continues to expand its Taiwan operations, with plans to build new 2 nm facilities in Kaohsiung's Science Park starting next year.

The U.S. Department of Commerce will award GlobalWafers America and MEMC, LLC, U.S. subsidiaries of Taiwan-based GlobalWafers Co., Ltd., up to $406 million in direct funding under the CHIPS Incentives Program's Funding Opportunity for Commercial Fabrication Facilities.

The award will support planned investments of $4 billion in advanced semiconductor wafer manufacturing facilities in Sherman, Texas and St. Peters, Missouri. The Department will disburse the funds based on GWA's and MEMC's completion of project milestones over a multi-year timeframe.

TSMC is reportedly negotiating with NVIDIA to manufacture advanced "Blackwell" GPUs in its Arizona facility. First reported by Reuters, this partnership could mark another major shift in AI chip production toward US soil. The discussion centers around TSMC's Fab 21 in Phoenix, Arizona, specializing in 4 nm and 5 nm chip production. NVIDIA's Blackwell GPUs utilize TSMC's 4NP process technology, making the Arizona facility a technically viable production site. However, the proposed arrangement faces several logistical challenges. A key issue is the absence of advanced packaging facilities in the United States. There is Amkor that planned to do advanced packaging, but it's only scheduled to begin packaging in 2027. TSMC's sophisticated CoWoS packaging technology is currently available only in Taiwan. This means that chips manufactured in Arizona would need to be shipped back to Taiwan for final assembly, potentially increasing production costs.

While alternative solutions exist, such as redesigning the chips to use Intel's packaging technology or focusing on gaming GPU production in Arizona, these options present their own complications. Intel's packaging methods would likely increase costs, and the current absence of graphics card manufacturing infrastructure in the US makes domestic gaming GPU production less practical. Both TSMC and NVIDIA have declined to comment on the ongoing negotiations, as this is confidential information unknown to the public. Interestingly, TSMC's Arizona facility has already attracted a few more US firms for domestic manufacturing, like Apple, rumored to manufacture its A16 Bionic chip and AMD with high-performance designs, likely either EPYC or Instinct MI chips.

Taiwanese political officials have agreed to discuss transferring TSMC's advanced 2 nm chip technology to allied democratic nations, but only after establishing the main mass production launch in late 2025 in Taiwan. This new stance comes amid growing international pressure and recent comments from upcoming US president Donald Trump about semiconductor manufacturing. The announcement by National Science and Technology Council Minister Cheng-Wen Wu marks a notable departure from earlier statements by Economic Affairs Minister J.W. Kuo, who had previously emphasized legal restrictions on transferring leading-edge process technology overseas. Interestingly, these different positions aren't so different from one point: timeline of node deployments. As TSMC produces latest nodes in Taiwan, overseas production will lag by a generation or two.

TSMC plans to implement its 2 nm technology in US facilities by 2030. The company's Arizona facility, Fab 21, will begin with less advanced N4 and N5 processes in early 2025 and progress to 3 nm technology by 2028. However, this timeline could face pressure for acceleration, mainly if new trade policies are implemented. Industry analyst Dan Nystedt points out significant challenges in transferring advanced chip production. Integrating research and development with manufacturing processes in Taiwan provides crucial advantages for initial production ramps, making simultaneous mass production launches in multiple locations technically challenging. Simply put, there aren't enough capable engineers, scientists, and factory workers capable of doing what TSMC accomplishes in Taiwan.