MacBook Air aficionados, at least most of them, have been longing for an OLED-equipped variant for quite a while now. OLED displays, especially the tandem-style units that Apple ships with its iPad Pros, have undeniable advantages over tradition LCDs, such as a near-infinite contrast ratio, near-instant response times, and excellent color reproduction. The fear of panel burn-in does exist, although as OLED technology progresses, such fears continue to subside. That said, for those who are holding out for it, the grapevine indicates they will have to hold their horses for a while longer.

A recent report by The Elec has stated that the MacBook Air, which was previously expected to get the OLED treatment sometime in 2027, has now been delayed by another two years. As such, the MacBook Air is now not expected to boast an OLED display before 2029 at the earliest. The Elec claims that the primary cause behind the delay is the lackluster sales boost brought by the OLED upgrade to the iPad Pro lineup, which fell short of what Apple anticipated. That said, the MacBook Air will utilize "Oxide TFT" technology for its LCDs starting 2027, allowing for improved color accuracy, energy efficiency, and contrast. MacBook Pros have already utilized the technology since 2022, and are still expected to boast OLED panels by 2026.

In 2018, Kingdom Come: Deliverance's celebrated score played a crucial role in supporting Warhorse's unique vision for immersive RPG gaming. Composer Jan Valta returns for the sequel with an expanded, handcrafted score that delicately blends authenticity with the tastes of a modern world. This gentle approach matters. The medieval music of Henry's world was dominated by the spoken word, with the instruments assuming more of a background role. Time signatures ebbed and flowed with far more fluidity than modern mainstream ears are accustomed to - a story-focused form of jazz, if you like. "It didn't always go in four beats or four bars, and then another four bars," Jan explains. "In medieval times the music was led by the lyrics. It was led by the text which was usually sacred. It came from God, or from the Apostles, or from Jesus. The music was tamed by the lyrics."

Music to Your Ears
Jan instead prefers to view his final touches of authenticity as "seasoning", designed to elevate a more traditionally structured soundtrack. The score exists first and foremost to serve the narrative beats that drive Henry's adventure forwards, in other words, rather than authenticity for authenticity's sake. "Daniel Vávra (creative director) and I quickly came to a common ground, which was a symphonic soundtrack: film-like music, which is then spiced or seasoned with medieval times," he says.

SK hynix has sped up its HBM4 development plans, according to a report from ZDNet. The company wants to start shipping HBM4 samples to NVIDIA this June, which is earlier than the original timeline. SK hynix hopes to start supplying products by the end of Q3 2025, this push likely aims to get a head start in the next-gen HBM market. To meet this sped-up schedule, SK hynix has set up a special HBM4 development team to supply NVIDIA. Industry sources indicated on January 15th that SK Hynix plans to deliver its first customer samples of HBM4 in early June this year. The company hit a big milestone when it wrapped up the HBM4 tapeout in Q4 2024, the last design step.

HBM4 marks the sixth iteration of high-bandwidth memory tech using stacked DRAM architecture. It comes after HBM3E, the current fifth-gen version, with large-scale production likely to kick off in late 2025 at the earliest. HBM4 boasts a big leap forward doubling data transfer ability with 2,048 I/O channels up from its forerunner. NVIDIA planned to use 12-layer stacked HBM4 in its 2026 "Rubin" line of powerful GPUs. However, NVIDIA has moved up its timeline for "Rubin" aiming to launch in late 2025.

At Xbox, we're continuing to improve how we design, build, distribute, and use our products to reduce our environmental impact and help us reach Microsoft's goal of being a zero waste, carbon negative, and water positive company by 2030. Finding ways to reduce the environmental footprint of gaming not only helps the environment but also creates benefits for our collective community of players.

We've heard from players that they want more options for support when their Xbox consoles need repair. Today, we're expanding our repairability program, giving players even more options to get their Xbox Series X|S console options—the Xbox Series S—1 TB in Robot White, Xbox Series X—1 TB Digital Edition in Robot White, and Xbox Series X—2 TB Galaxy Black Special Edition—fixed should they ever need to, while also reducing and preventing waste.

MSI has provided a detailed look into its motherboard production facilities through a new interactive webpage. The company has outlined the 15-step manufacturing process that transforms bare circuit boards into complete motherboards. The process begins with solder paste printing, where a precise layer of conductive paste is applied to the bare PCB. This is followed by automated inspection using imaging systems to verify proper paste placement. High-speed machines then position electronic components onto the board before they move through reflow ovens that permanently bond the components. Multiple inspection stages are integrated throughout the assembly line, including automated optical systems that check both sides of the board. Specialized machines handle routing, component insertion, wave soldering, and alloy welding.

Each board undergoes circuit testing and receives mechanical components through automated screw-locking systems before final functional testing and molding. The complexity of modern motherboard manufacturing requires rigorous quality checks and final power tests before the motherboard leaves manufacturing facilities. For interested enthusiasts, MSI's new landing page is here. The manufacturing reveal accompanies MSI's launch of two new motherboard series—Z790 and B860. To celebrate this launch, MSI has announced promotional events running from January 20 to March 31, 2025, including Steam game codes with select product purchases. A new reward program offers points for product reviews and referrals.

Samsung Display will begin mass production of the world's first rollable OLED screen for laptops starting in April 2025. Samsung Display announced its rollable screen for the Lenovo ThinkBook Plus G6 Rollable laptop at CES 2025 in Las Vegas, Nevada, U.S., Lenovo also showcased the laptop and announced its plans to globally launch in June.

The ThinkBook Plus G6 Rollable laptop features a screen underneath the keypad, where the screen expands vertically by almost 50%, offering a unique mobile computing experience. When rolled in, the screen supports a 5:4 aspect ratio on a 14-inch display. When rolled out, the aspect ratio shifts to 8:9 on a 16.7-inch display, providing an enhanced view for efficient multitasking.

OneOdio has unveiled its latest professional-grade headphones, the Studio Max 1, at CES 2025. Known for creating affordable high-quality audio gear, OneOdio collaborated with Italian DJ Arianna to design the new flagship model, targeting DJs and audio professionals. The Studio Max 1 introduces WiLL+ Connection Technology, enabling ultra-low latency of just 20 ms, ideal for real-time audio monitoring and performance. Combined with LDAC and Dual Hi-Res certification, the headphones deliver studio-quality sound reproduction, meeting the demands of professionals in studio and live environments. A standout feature is the flexibility of four operational modes: Wireless DJ, Bluetooth, Wired Monitoring, and Wired DJ.

This versatility allows users to seamlessly adapt the headphones to different performance and work scenarios. DJ Arianna, who showcased the headphones at major European events, highlighted their adaptability and praised their performance in dynamic environments. The headphones also boast a 120-hour battery life, ensuring extended use during long sessions. For noisy settings, Dual-Mic ENC Noise Reduction technology enhances clarity, making the Studio Max 1 an interesting choice for DJs and sound engineers.

TSMC is making progress with its most advanced 2 nm (N2) node, a recent report from MoneyDJ quoting industry sources indicates that the company is setting up a test production line at the Hsinchu Baoshan fab (Fab 20) in Taiwan. In the early stages, TSMC aims for small monthly outputs with about 3,000-3,500 wafers. However, the company has big plans to combine production from two factories in Hsinchu and Kaohsiung, TSMC expects to deliver more than 50,000 wafers monthly by the end of 2025 and by the end of 2026 projecting a production of around 125,000 wafers per month. Breaking it down by location, the Hsinchu factory should reach 20,000-25,000 wafers monthly by late 2025, growing to about 60,000-65,000 by early 2027. Meanwhile, the Kaohsiung factory is expected to produce 25,000-30,000 wafers monthly by late 2025, also increasing to 60,000-65,000 by early 2027.

TSMC's chairman C.C. Wei says there's more demand for these 2 nm chips than there was for the 3 nm. This increased "appetite" for 2 nm chips is likely due to the significant improvements this technology brings: it uses 24-35% less power, can run 15% faster at the same power level, and can fit 15% more transistors in the same space compared to the 3 nm chips. Apple will be the first company to use these chips, followed by other major tech companies like MediaTek, Qualcomm, Intel, NVIDIA, AMD, and Broadcom.

TSMC's new semiconductor manufacturing facility in Phoenix, Arizona, will face production costs approximately 30% higher than its Taiwan-based operations when it begins mass production in early 2025. The increased expenses stem from higher tariffs and transportation costs associated with importing necessary materials from Taiwan. The Arizona facility will start producing 10,000 12-inch wafers monthly using a 4 nm node, with plans to double output to 20,000 wafers at full capacity. Four major technology companies—Apple, NVIDIA, AMD, and Qualcomm—have committed to purchasing chips from the plant for their AI and high-performance computing needs. The 445-hectare facility highlights ongoing challenges in America's semiconductor industry. Despite the aim to strengthen domestic chip manufacturing, the plant must import materials from Taiwan to maintain production quality, revealing gaps in the US semiconductor supply chain.

This overseas dependency drives up operational costs significantly. While TSMC's investment marks an essential step in rebuilding domestic capacity, the substantial cost difference between US and Taiwanese production raises questions about long-term viability. TSMC has already begun trial production at the site and plans to expand operations with additional phases. The company's Phase 2 facility is completed, and equipment is being installed, while future expansions aim to produce 2 nm chips by 2028. However, unless the cost gap narrows, the higher production expenses could impact the plant's competitiveness in the global semiconductor market, even competing with its own Taiwanese facilities, where customers could decide to use Taiwanese fabs due to lower costs. Meanwhile, TSMC continues to expand its Taiwan operations, with plans to build new 2 nm facilities in Kaohsiung's Science Park starting next year.

NVIDIA and AMD have launched an acceleration of their next-generation GPU production and shipping schedules, racing to beat impending Trump administration tariffs that could inflate prices by up to 60%. The companies are prioritizing delivery to US warehouses before January 20, when the new trade measures are supposed to take effect. This aggressive timeline represents a significant departure from traditional GPU rollout strategies, which typically maintain controlled production rates during initial manufacturing phases. The urgent push aims to protect both consumer prices and profit margins, with manufacturers breaking from their usual conservative supply approach to ensure maximum inventory reaches American shores before the tariff deadline. NVIDIA is boosting shipments of its next-gen GeForce RTX 50 series, while AMD is busy with Radeon RX 9000 series.

The impact of these tariffs could reshape the GPU market prices, with flagship products like NVIDIA's GeForce RTX 5090 potentially seeing price increases from the rumored $1,799 to approximately $2,500. Following similar moves by Microsoft, Dell, and HP, this strategic rush to beat tariff implementation shows the technology sector's response to evolving trade policies. These price hikes could trigger a surge in the secondary GPU market as consumers seek more affordable options. While manufacturers work to shield customers from immediate price impacts through pre-tariff stockpiling, the long-term outlook for GPU pricing and availability remains uncertain as the industry adapts to these new trade dynamics. Increasing the prices dramatically will result in a rapid fall in demand, so the supply chain is working overtime to assess and address the potential tariff issue.

Silicon Box, a global leader in advanced semiconductor packaging and system integration, welcomes the European Commission's approval of approximately €1.3 billion for its new manufacturing facility in Italy. The project, representing a total investment of €3.2 billion, will create 1,600 high-skilled jobs and establish Europe's most advanced semiconductor packaging facilities.

The investment supports the EU's strategic goal to produce 20% of the world's semiconductors by 2030 and marks Silicon Box's first expansion beyond Singapore. With its proprietary large format panel-level process lines, the factory can scale up the packaging of chips 6 to 8 times more than traditional wafer-level packaging.

Rapidus Corporation, a manufacturer of advanced logic semiconductors, today announced the delivery and installation of ASML's EUV lithography equipment at its Innovative Integration for Manufacturing (IIM-1) foundry, an advanced semiconductor development and manufacturing fab currently under construction in Chitose, Hokkaido. To commemorate the installation, a ceremony was held at Portom Hall in the New Chitose Airport.

This is a significant milestone for Japan's semiconductor industry, marking the first time that an EUV lithography tool will be used for mass production in the country. In addition to the EUV lithography machinery, Rapidus will install additional complementary advanced semiconductor manufacturing equipment, as well as full automated material handling systems in its IIM-1 foundry to optimize 2 nm generation gate-all-around (GAA) semiconductor manufacturing.

The pilot line for "Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems" (APECS) marks a major leap forward in strengthening Europe's semiconductor manufacturing capabilities and chiplet innovation as part of the EU Chips Act. By providing large industry players, SMEs, and start-ups with a facilitated access to cutting-edge technology, the APECS pilot line will establish a strong foundation for resilient and robust European semiconductor supply chains. Within APECS, the institutes collaborating in the Research Fab Microelectronics Germany (FMD) will work closely with European partners, to make a significant contribution to the European Union's goals of increasing technological resilience, strengthening cross-border collaboration and enhancing its global competitiveness in semiconductor technologies. APECS is co-funded by the Chips Joint Undertaking and national funding authorities of Austria, Belgium, Finland, France, Germany, Greece, Portugal, Spain, through the "Chips for Europe" initiative. The overall funding for APECS amounts to €730 million over 4.5 years.

Europe is home to a vibrant ecosystem of (hidden) champions, from traditional enterprises in vertical markets, to SMEs and start-ups the competitive advantages of which lie in superior semiconductor-based solutions. Nevertheless, many of these companies are currently confronted with limited access to advanced semiconductor technologies, while at the same time these technologies are increasingly becoming the most important factor for innovation and market growth.

The Biden-Harris Administration has given Micron Technology up to $6.165 billion in direct funds through the CHIPS Incentives Program to back the company's manufacturing growth. The money will allow Micron to execute its plan announced in October 2022 by investing about $100 billion into Clay, New York fab, and $25 billion into Idaho over 20 years aiming to boost the United States' advanced memory manufacturing from under 2% to around 10% by 2035. This large investment aims to make the U.S. economy stronger by creating a home supply of cutting-edge DRAM chips, moreover it is expected to create approximately 20,000 job across the U.S. Micron plans to spend about $50 billion before 2030 focusing on making more advanced memory semiconductor technology.

Also, the Department of Commerce has put pen to paper on a first draft of terms with Micron. This could lead to funding of up to $275 million to upgrade its Manassas, Virginia plant. The $2 billion investment project aims to bring Micron's 1-alpha technology back to U.S. The 1-alpha process was launched in 2021 and is used for the latest LPDDR5 DRAM chips. This would boost monthly wafer production and create over 400 factory jobs. At its busiest, the project could generate up to 2,700 jobs in the local area.

Chinese giant TCL has officially begun mass production of inkjet-printed OLED displays. The company's subsidiary, TCL CSOT, is leading this initiative with its first product: a 21.6-inch 4K UHD panel designed for professional monitors. The new display boasts a 204 pixels per inch density and coverage of 99% of the DCI-P3 color space. With a maximum brightness of 350 cd/m², the panel is suited for professional applications, with TCL CSOT targeting the medical sector. Additionally, the firm advertises more than 1,000,000:1 contrast ratio. Using the leftovers from JOLED's closure, a Japanese venture that previously attempted similar technology but filed for bankruptcy in 2023, TCL's approach utilizes Gen 5.5 glass substrates measuring 1,300 × 1,500 mm. Notably, it incorporates other materials from the former Japanese pioneer.

Printed OLED technology promises more cost-effective display production compared to traditional methods. Unlike traditional evaporation methods in OLED production that use shadow masks and waste significant amounts of material, inkjet OLED printing allows for precise deposition of organic materials directly onto substrates. This maskless process not only reduces material waste but also minimizes contamination risks, which is crucial given OLEDs' sensitivity to environmental factors. The choice of starting with medical monitors mirrors JOLED's initial strategy from 2017, when they launched a similar 21.6-inch 4K panel for the same market segment. TCL has already announced plans to expand its printed OLED lineup in 2025 with additional display sizes. The success of this venture could potentially revolutionize OLED display manufacturing, making high-quality screens more accessible across various market segments, and we hope, one day, the enthusiast segment. TCL's consumer brand carrying these printed displays will be named APEX.

Japan has proposed a $65 billion (or more) plan to strengthen the semiconductor and AI industries in the country through grants and financial support by fiscal year 2030. The government plans to present this proposal at the next parliamentary session. The draft includes support for mass production of next-generation chips, focusing on AI chipmakers such as Rapidus, the government estimates an economic impact of about 160 trillion yen from this investment. Rapidus plans to start mass production of advanced chips in Hokkaido from 2027 and will work with IBM and Belgian research organization Imec.

According to the report from Reuters, Prime Minister Shigeru Ishiba said the government would not issue deficit-financing bonds to fund the support plan, although specific financial details are not yet known. The new initiative builds on last year's 2 trillion yen investment in the chip industry, and it is part of a broader economic package. Expected to be approved by the Cabinet on November 22, the plan calls for combined public and private investment in the semiconductor industry of more than 50 trillion yen over the next decade.

MultiDimension Technology Co., Ltd. (MDT), a global leader in magnetic sensors specializing in Tunneling Magnetoresistance (TMR) technology, introduces its groundbreaking TMR2615/ TMR2617 series at Electronica and SPS. These cutting-edge TMR sensors are poised to revolutionize gaming experience with exceptional performance and innovative features.

Game-Changing Technology for Consumer Electronics
TMR2615/TMR2617 are powered by MDT's proprietary TMR technology, integrated with a programmable ASIC offering factory-preset tailored to user-defined parametric targets. This ensures high consistency and optimal performance across large-scale production, addressing diverse demands for thumbsticks and trigger keys in gaming controllers.

Intel has plans to expands its chip packaging and testing operations in Chengdu, China. The company will put $300 million into Intel Products (Chengdu), as stated in a WeChat post by Chengdu's Reform and Development Commission, and reported by TrendForce. Intel announced its Chengdu plant in August 2003 as a semiconductor chip packaging and testing facility in the Chengdu Hi-Tech West Zone. The first phase began in February 2004 with the construction of a chipset factory, which was completed and put into production by the end of 2005. The second phase commenced in August 2005 and was completed in October 2006. By 2007, the packaging and testing facility was fully operational, handling Intel's most advanced processors.

Since its launch in 2003, Intel's Chengdu plant has handled over half of the packaging and testing for Intel's laptop processors. Even with rising US-China tensions, China remains Intel's biggest market making up 27 percent of its total income last year. The announced expansion will increase the packaging and testing ability of server chips and will add a new "customer solutions center." This center aims to make the supply chain more effective, give more support to Chinese customers, and speed up response times. Intel's Chengdu site plays a key role in the company's global supply chain, benefiting from the area's "favorable" business climate, CEO Patrick Gelsinger said during his visit last year.

TrendForce's latest investigations reveal that the combined market share of the top five SSD module makers in the retail sector has surged from 59% in 2022 to 72% in 2023, reinforcing a trend of larger companies expanding their dominance. These major players are leveraging their scale to negotiate more favorable prices for NAND Flash, boosting their competitive edge and ensuring they have sufficient resources to stock up in preparation for market shifts.

TrendForce reports that shipments of branded SSDs in the retail market reached 180 million units in 2023, marking a YoY growth of 3.7%. Reflecting on the SSD market for that year, it appeared that many PCs purchased during the pandemic had entered their typical replacement cycle.

Global shipments of silicon wafers are projected to decline 2% in 2024 to 12,174 million square inches (MSI) with a strong rebound of 10% delayed until 2025 to reach 13,328 MSI as wafer demand continues to recover from the downcycle, SEMI reported today in its annual silicon shipment forecast.

Strong silicon wafer shipment growth is expected to continue through 2027 to meet increasing demand related to AI and advanced processing, driving improved fab utilization rate for global semiconductor production capacity. Moreover, new applications in advanced packaging and high-bandwidth memory (HBM) production, which require additional wafers, are contributing to the rising need for silicon wafers. Such applications include temporary or permanent carrier wafers, interposers, device separation into chiplets, and memory/logic array separation.

TrendForce's latest findings reveal that NAND Flash products have been impacted by weaker-than-expected seasonal demand in the second half of 2024, leading to a decline in wafer contract prices in Q3. This downward trend is projected to deepen, with prices expected to drop by more than 10% in Q4.

Enterprise SSDs are the only segment likely to see modest price growth—supported by stable order momentum—with contract prices forecast to rise by 0-5% in Q4. However, PC SSDs and UFS will see more cautious procurement strategies from buyers, as weaker-than-expected sales of end products drive buyers to adopt a conservative approach. As a result, TrendForce projects overall NAND Flash contract prices will decline by 3-8% in Q4.

TSMC announced that its revenue for September 2024 reached NT$251.87 billion (US$7.80 billion), representing a 39% increase compared to the same month last year. The cumulative revenue for the first three quarters of 2024 climbed to NT$2,025.85 billion (US$62.72 billion), showing a 32% year-over-year growth. The company's third-quarter revenue amounted to NT$759.7 billion (US$23.52 billion), exceeding TSMC's own guidance of NT$706.6 billion to NT$731.5 billion (US$22.4 billion to US$23.2 billion). TSMC will report full third-quarter earnings on Oct. 17.

A report from Data Center Dynamics quotes sources saying that, due to increasing demand from NVIDIA and others, TSMC has been forced to change its CoWoS capacity expansion plan several times. In response, TSMC is building two more fabs, named P4 and P5, in Kaohsiung, Taiwan, raising the company's total number of facilities in the region to five. Four months ago, the company announced that it would build a third 2 nm fab at Nanzih Technology Industrial Park in Kaohsiung. The company's P1 fab, which started in August 2022, is expected to begin mass production next year, while P2 and P3 are still in the construction phase. TSMC's CoWoS monthly capacity is expected to reach more than 40,000 wafers by the end of 2024, 65,000 wafers in 2025, and at least 80,000 wafers in 2026.

Samsung Electronics is speeding up its work on 2 nm production facilities, industry sources say. The company has started to install advanced equipment at its "S3" foundry line in Hwaseong to set up a 2 nm production line. This line aims to produce 7,000 wafers each month by the first quarter of next year. Also, Samsung plans to create a 1.4 nm production line at its "S5" foundry in Pyeongtaek Plant 2 by the second quarter of next year. This line has a goal to make 2,000 to 3,000 wafers each month. By the end of next year, Samsung will change all the remaining 3 nm production lines at "S3" to 2 nm.

As we reported earlier, Samsung has pushed back the start date for its Tyler, Texas foundry. The plant set to open by late 2024, won't install equipment until after 2026. Also, Samsung has changed its plans for the Pyeongtaek Fab 4 foundry line. Because of lower demand, it will now make DRAM instead, moreover, at Pyeongtaek Fab 3, which has a 4 nm line, Samsung has cut back production. These changes are part of Samsung's plan to make 2 nm chips next year and 1.4 nm chips by 2027. The company wants to catch up with its rival TSMC, right now, Samsung has 11.5% of the global foundry market in Q2, while TSMC leads with 62.3%. An industry expert stressed how crucial this is saying, "With the delay in 3 nm Exynos production and other issues, getting the 2 nm process right could make or break Samsung Foundry". The struggle for Samsung is real, with the company's top management, led by DS Division Vice Chairman Jeon Young-hyun, having recently issued a public apology for the division's underwhelming performance.

TSMC and Samsung are reportedly in talks with the United Arab Emirates (UAE) to establish chip factories in the Gulf nation. As reported by the Wall Street Journal, this "desert dream" aligns with the UAE's ambitious plans to diversify its economy beyond oil and become a key player in the AI sector by building chips for AI domestically. The UAE and neighboring Saudi Arabia plan to leverage their oil wealth to invest in cutting-edge manufacturing, with AI emerging as a primary focus due to its high computational demands. Successful implementation of chip factories could significantly boost the region's AI capabilities and impact the global semiconductor supply chain. However, the project faces substantial challenges. Previous attempts to establish semiconductor manufacturing in the Gulf, such as the GlobalFoundries initiative over a decade ago, have yet to progress beyond initial planning.

The current proposal faces even greater obstacles, with estimated costs exceeding $100 billion for a state-of-the-art facility and necessary infrastructure. Geopolitical concerns add another layer of complexity. Recent US export restrictions of certain chips to the Gulf region may complicate the transfer of advanced manufacturing processes to the UAE. Despite these hurdles, the potential benefits are significant. For the UAE, success would represent a major step towards economic diversification and technological leadership. TSMC and Samsung could gain a strategic presence in a region eager for technological advancement. TSMC noted that the company focuses on current expansion projects in the US, Japan, and Germany, while Samsung declined to comment.

The Biden-Harris Administration announced today that Intel Corporation has been awarded up to $3 billion in direct funding under the CHIPS and Science Act for the Secure Enclave program. The program is designed to expand the trusted manufacturing of leading-edge semiconductors for the U.S. government.

The Secure Enclave program builds on previous projects between Intel and the Department of Defense (DoD) such as Rapid Assured Microelectronics Prototypes - Commercial (RAMP-C) and State-of-the-Art Heterogeneous Integration Prototype (SHIP). As the only American company that both designs and manufactures leading-edge logic chips, Intel will help secure the domestic chip supply chain and collaborate with the DoD to help enhance the resilience of U.S. technological systems by advancing secure, cutting-edge solutions.