A significant legal challenge has emerged for Intel's leadership as shareholders aim for the company's representation of its foundry business performance. LR Trust has filed a lawsuit against former CEO Pat Gelsinger and current co-CEO David Zinsner, seeking to return substantial executive compensation amid allegations of misleading statements and financial mismanagement. The lawsuit centers on Intel Foundry Services (IFS), a division that was once positioned as a crucial growth engine for Team Blue. The Intel Foundry, as it is now called, is here referred as Intel Foundry Services, which was its older name back in 2023. According to court documents, LR Trust claims that while Intel's leadership painted an optimistic picture of IFS's trajectory, the division struggled to attract major clients and accumulated significant losses. Gelsinger's $207 million compensation package is at the heart of the dispute, where shareholders now demand that these funds should be returned to the company.

The legal action also targets additional compensation received by Zinsner, arguing that executive rewards were secured through misrepresenting the company's financial health. The allegations point to a troubled 2023, during which Intel's chip production unit reportedly lost $7 billion. These challenges extended into 2024, as increased investments in new fab facilities further strained the company's finances. The lawsuit alleges that executives issued "materially false and misleading" statements regarding cost savings and revenue potential, ultimately driving shareholder value to the very bottom. LR Trust's legal filing accuses Intel's leadership of breaching its financial duties through inadequate internal controls and inaccurate financial disclosures. Beyond seeking the return of executive compensation, the lawsuit pursues damages and legal cost reimbursement, with any recovered funds potentially being returned to Intel's coffers. Intel has yet to respond formally to these allegations. This is just another lawsuit in line as Intel already has several other lawsuits going on, with one recent from August.

Today at the IEEE International Electron Devices Meeting (IEDM) 2024, Intel Foundry unveiled new breakthroughs to help drive the semiconductor industry forward into the next decade and beyond. Intel Foundry showcased new material advancements that help improve interconnections within a chip, resulting in up to 25% capacitance by using subtractive ruthenium. Intel Foundry also was first to report a 100x throughput improvement using a heterogeneous integration solution for advanced packaging to enable ultra-fast chip-to-chip assembly. And to further drive gate-all-around (GAA) scaling, Intel Foundry demonstrated work with silicon RibbonFET CMOS and with gate oxide module for scaled 2D FETs for improved device performance.

"Intel Foundry continues to help define and shape the roadmap for the semiconductor industry. Our latest breakthroughs underscore the company's commitment to delivering cutting-edge technology developed in the U.S., positioning us well to help balance the global supply chain and restore domestic manufacturing and technology leadership with the support of the U.S. CHIPS Act," says Sanjay Natarajan, Intel senior vice president and general manager of Intel Foundry Technology Research.

A few days ago, we published a report about Intel's 18A yields being at an abysmal 10%. This sparked quite a lot of discussion among the tech community, as well as responses from industry analysts and Intel's now ex-CEO Pat Gelsinger. Today, we are diving into known information about Intel's 18A node and checking out what the yields of possible products could be, using tools such as Die Yield Calculator from SemiAnalysis. First, we know that the defect rate of the 18A node is 0.4 defects per cm². This information is from August, and up-to-date defect rates could be much lower, especially since semiconductor nodes tend to evolve even when they are production-ready. To measure yields, manufacturers use various yield models based on the information they have, like the aforementioned 0.4 defect density. Expressed in defects per square centimeter (def/cm²), it measures manufacturing process quality by quantifying the average number of defects present in each unit area of a semiconductor wafer.

Measuring yields is a complex task. Manufacturers design some smaller chips for mobile and some bigger chips for HPC tasks. Thus, these two would have different yields, as bigger chips require more silicon area and are more prone to defects. Smaller mobile chips occupy less silicon area, and defects occurring on the wafer often yield more usable chips than wasted silicon. Stating that a node only yields x% of usable chips is only one side of the story, as the size of the test production chip is not known. For example, NVIDIA's H100 die is measuring at 814 mm²—a size that is pushing modern manufacturing to its limits. The size of a modern photomask, the actual pattern mask used in printing the design of a chip to silicon wafer, is only 858 mm² (26x33 mm). Thus, that is the limit before exceeding the mask and needing a redesign. At that size, nodes are yielding much less usable chips than something like a 100 mm² mobile chip, where defects don't wreak havoc on the yield curve.

Intel's Foundry business is the company's current pain point and probably the reason why the company board of directors forced out ex-CEO Pat Gelsinger. However, the new interim co-CEO, David Zinsner, confirmed that the foundry plan would remain the same. At the UBS technology conference, Zinsner indicated that the company's core strategy remains unchanged and reiterated the forecasts shared in October, highlighting optimism about growth in its PC and server segments. This is a healthy sign that Intel will not lose its foundry subsidiary, which, even though difficult to operate, could be Intel's silver lining with growth opportunities ahead.

Yesterday, we covered the choice of Lip-Bu Tan as Intel's next CEO. However, the new co-CEO, Zinsner, stated, "I'm not in the process, but I'm guessing that the CEO will have some capability around foundry as well as on the product side." A new CEO would be left with a lot of work that, apparently, no one so far can finish. There are speculations that Intel's 18A node is yielding 10% of usable silicon, while Intel's head of foundry business, Naga Chandrasekaran, has noted that 18A node is going through evolution phases to improve final yields and remain profitable, noting that "there's nothing fundamentally challenging on this node now. It is about going through the remaining yield challenges, defect density challenges."

Intel Corporation today announced that Eric Meurice, former president, chief executive officer and chairman of ASML Holding N.V., and Steve Sanghi, chairman and interim chief executive officer of Microchip Technology Inc., have been appointed to Intel's board of directors, effective immediately. Both will serve as independent directors.

"Eric and Steve are highly respected leaders in the semiconductor industry whose deep technical expertise, executive experience and operational rigor make them great additions to the Intel board," said Frank D. Yeary, interim executive chair of the Intel board. "As successful CEOs with proven track records of creating shareholder value, they will bring valuable perspectives to the board as the company delivers on its priorities for customers in Intel Products and Intel Foundry, while driving greater efficiency and improving profitability."

Samsung Electronics today announced new leadership for the next phase of the Company's growth and to strengthen its future competitiveness, focusing on the semiconductor business.

Young Hyun Jun, Vice Chairman and Head of Device Solutions (DS) Division, was named CEO and will also become the Head of Memory Business and Samsung Advanced Institute of Technology. Jinman Han was promoted to President and will become the Head of Foundry Business, while Seok Woo Nam will become Chief Technology Officer of Foundry Business, a newly-created position.

According to Taiwanese media Commercial Times, Intel is significantly increasing its outsourcing of "Arrow Lake" CPU production to TSMC, a strategic move as it grapples with persistent issues in its own foundry division. This decision to outsource a substantial portion of Arrow Lake's production is a significant shift in Intel's strategy, showing the company's rising reliance on external partners to meet quality and performance demands. The Arrow Lake Core Ultra 200 series is Intel's first major outsourcing initiative, in which Intel gave its core IP to third-party foundries, more specifically for a 3 nm node at TSMC. However, it clearly indicates the performance gaps in Intel's own Intel Foundry and the high demand expectations for the new CPUs. Originally intended to use Intel 20A node, Intel shifted focus of 18A node for its products and upcoming foundry customers.

Intel's recent orders with TSMC extend to its upcoming Lunar Lake chips and next-generation Falcon Shores AI GPUs, both of which will use TSMC's 3 nm process. Although Intel's 18A node remains promising, the company relies on current products to sustain its revenue streams, making TSMC's support crucial in ensuring timely shipments. This increased outsourcing reflects Intel's need to maintain competitive performance in the short term. Once its Foundry division meets performance and capacity targets, Intel aims to bring more CPU manufacturing back in-house. However, if anything goes wrong, Intel could face challenges securing sufficient volume from TSMC, as the foundry has longstanding commitments with major clients like Apple, NVIDIA, Qualcomm, and AMD.

Apple and Samsung are reportedly in the fray to acquire Intel, according a spectacular rumor cited by Moore's Law is Dead. This would put the list of companies looking to acquire Intel at 3—Apple, Samsung, and Qualcomm. All three are Arm licensees, with unique characteristics. Apple currently has an Arm-based SoC hardware division that makes custom chips for all its devices, including Macs. Samsung would go on to be an overseas parent company for an American heritage company like Intel, but something like this is not unheard of when you consider examples such as Boston Dynamics being acquired by Hyundai Motors, or Westinghouse Nuclear's acquisition by Japan's Toshiba, before changing hands to Canadian Bookfield Partners. Then there's Qualcomm—the American company is having a bit of a falling out with Arm, and the prospect of owning the x86 IP should be tempting.

Intel retains large amounts of market-share in both the PC processor and server processor markets, however, the company's stock price has been on a downward trend for several quarters now, causing its valuation to drop to levels where any of the other big tech companies can afford to buy it out. The company spent close to $10 billion on a GPU architecture project spanning not just a contemporary graphics architecture to power the integrated graphics solutions of its PC processors, but also discrete gaming GPUs; and most importantly, an AI GPU architecture under the "Ponte Vecchio" project. Intel's Xe-HP AI GPU missed its performance targets or was too late to the market, leaving Intel with a gaping hole that it could only fill with a slew of cost-cutting measures. It doesn't help that Intel Foundry is losing its edge, and none of the logic tiles of Core Ultra "Arrow Lake" processor is made on an Intel foundry node.

Intel Corporation today reported third-quarter 2024 financial results.

"Our Q3 results underscore the solid progress we are making against the plan we outlined last quarter to reduce costs, simplify our portfolio and improve organizational efficiency. We delivered revenue above the midpoint of our guidance, and are acting with urgency to position the business for sustainable value creation moving forward," said Pat Gelsinger, Intel CEO. "The momentum we are building across our product portfolio to maximize the value of our x86 franchise, combined with the strong interest Intel 18A is attracting from foundry customers, reflects the impact of our actions and the opportunities ahead."

Samsung Electronics today reported financial results for the third quarter ended Sept. 30, 2024. The Company posted KRW 79.1 trillion in consolidated revenue, an increase of 7% from the previous quarter, on the back of the launch effects of new smartphone models and increased sales of high-end memory products. Operating profit declined to KRW 9.18 trillion, largely due to one-off costs, including the provision of incentives in the Device Solutions (DS) Division. The strength of the Korean won against the U.S. dollar resulted in a negative impact on company-wide operating profit of about KRW 0.5 trillion compared to the previous quarter.

In the fourth quarter, while memory demand for mobile and PC may encounter softness, growth in AI will keep demand at robust levels. Against this backdrop, the Company will concentrate on driving sales of High Bandwidth Memory (HBM) and high-density products. The Foundry Business aims to increase order volumes by enhancing advanced process technologies. Samsung Display Corporation (SDC) expects the demand of flagship products from major customers to continue, while maintaining a quite conservative outlook on its performance. The Device eXperience (DX) Division will continue to focus on premium products, but sales are expected to decline slightly compared to the previous quarter.

Last time we reported on Samsung Foundry, the company publicly apologized for its setbacks in the memory and foundry divisions, especially as its 3 nm GAA FET node has failed to attract new customers. On the other hand, Intel has also been struggling with its Foundry unit bleeding billions of Dollars in a bid to secure its spot as one of the best foundries for companies to manufacture their chips. There is no better pair than two struggling foundries looking for customers and new ways to conduct research than Intel and Samsung. According to an exclusive by South Korean media outlet "MK," it has reportedly been confirmed that Intel approached Samsung to form a "Foundry Alliance" to boost their foundry business units.

According to the source, Intel CEO Pat Gelsinger is reportedly eager to meet with Samsung Electronics Chairman Lee Jae-yong face-to-face to discuss "comprehensive collaboration in the foundry sector." What exactly will happen between the two is still unclear. Back in 2014, GlobalFoundries and Samsung formed a partnership for 14 nm FinFET offerings, and that was a wide success. Jointly developing a node and offering it in their foundry units could be the target goal for Intel and Samsung. At some level, research and development, as well as sharing valuable manufacturing information on yield improvements, should be beneficial for both to put together the final pieces of the semiconductor puzzle.

Samsung Electronics is speeding up its work on 2 nm production facilities, industry sources say. The company has started to install advanced equipment at its "S3" foundry line in Hwaseong to set up a 2 nm production line. This line aims to produce 7,000 wafers each month by the first quarter of next year. Also, Samsung plans to create a 1.4 nm production line at its "S5" foundry in Pyeongtaek Plant 2 by the second quarter of next year. This line has a goal to make 2,000 to 3,000 wafers each month. By the end of next year, Samsung will change all the remaining 3 nm production lines at "S3" to 2 nm.

As we reported earlier, Samsung has pushed back the start date for its Tyler, Texas foundry. The plant set to open by late 2024, won't install equipment until after 2026. Also, Samsung has changed its plans for the Pyeongtaek Fab 4 foundry line. Because of lower demand, it will now make DRAM instead, moreover, at Pyeongtaek Fab 3, which has a 4 nm line, Samsung has cut back production. These changes are part of Samsung's plan to make 2 nm chips next year and 1.4 nm chips by 2027. The company wants to catch up with its rival TSMC, right now, Samsung has 11.5% of the global foundry market in Q2, while TSMC leads with 62.3%. An industry expert stressed how crucial this is saying, "With the delay in 3 nm Exynos production and other issues, getting the 2 nm process right could make or break Samsung Foundry". The struggle for Samsung is real, with the company's top management, led by DS Division Vice Chairman Jeon Young-hyun, having recently issued a public apology for the division's underwhelming performance.

After Apple, we just learned that AMD is the next company in line for US-based manufacturing in the TSMC Arizona facility. Industry analyst Tim Culpan reports that TSMC's Fab 21 in Arizona will soon be producing AMD's high-performance computing (HPC) processors, with tape out and manufacturing expected to commence on TSMC's 5 nm node next year. This move comes after previously reported Apple's A16 SoC production, which is already in progress at the facility and could see shipments before the end of this year, significantly ahead of the initially projected early 2025 schedule. The production of AMD's HPC chips in Arizona marks a crucial step towards establishing an AI-hardware supply chain operating entirely on American soil, which is expected to further expand with Intel Foundry and Samsung Texas facility.

Making HPC processors domestically serves as a significant milestone in reducing dependence on overseas semiconductor manufacturing and strengthening the US's position in the global chip industry. Adding to the momentum, TSMC and Amkor recently announced a collaboration on advanced packaging technologies, including Integrated Fan-Out (InFO) and Chip-on-Wafer-on-Substrate (CoWoS), which are vital for high-performance AI chips. However, as Amkor facilities are yet to be built, these chips are going to be shipped back to Taiwan for packaging before being integrated into the final product. Once the Amkor facility is up and running, Arizona will become the birthplace of fully manufactured and packaged silicon chips.

Samsung Electronics is grappling with significant challenges in its semiconductor division, particularly in its memory and foundry businesses. The company's top management, led by DS Division Vice Chairman Jeon Young-hyun, recently issued a public apology for the division's underwhelming performance. The tech giant's struggles are best seen in its advanced 3 nm Gate-All-Around (GAA) FET node, which reportedly yields only 10-20% of working silicon. This low yield rate has made potential customers hesitant to partner with Samsung, dealing a blow to its foundry business. Samsung Securities projects a 500 billion won (approximately $385 million) loss this year for Samsung Foundry and the LSI division combined. In the global foundry market, Samsung's position has weakened considerably. The company currently holds just 11.5% of the market share in Q2, while industry leader TSMC dominates with a commanding 62.3%. This disparity has led to speculation about the possible spinoff of Samsung Foundry, as the company reevaluates its strategy in the advanced semiconductor manufacturing sector.

Memory unit, one of Samsung's biggest assets, is slowly being one-upped by SK Hynix, which could overtake Samsung as the number one memory maker thanks to strong HBM demand. The management's apology acknowledges the concerns raised about the company's technological competitiveness and future prospects. Vice Chairman Jeon emphasized the need to restore fundamental competitiveness in technology and quality, which he described as the company's "lifeblood." Despite these challenges, Samsung's leadership remains optimistic about turning the crisis into an opportunity. They have pledged to focus on long-term solutions, invest in pioneering technologies, and foster a culture of innovation and open communication within the organization. As one of only three companies left in the advanced semiconductor manufacturing field, alongside TSMC and Intel, Samsung's ability to overcome these hurdles will be crucial not only for the company but for the entire industry.

The grass isn't always greener on the other side, especially as we're running out of sides in the advanced semiconductor manufacturing sector. A recent report by Business Korea highlights Samsung Securities' July publication titled "Geopolitical Paradigm Shift and Industry," which paints a less-than-optimistic picture of Samsung's current state of affairs. The report even evaluates a possible spinoff of Samsung Foundry. The Korean tech giant has faced various business setbacks related to its state-of-the-art 3 nm Gate-All-Around (GAA) FET node. Reports indicate that this node only manages to yield 10-20% of working silicon, making potential customers reluctant to secure partnerships with Samsung. Samsung Securities projects that Samsung Foundry, along with the LSI division, will suffer a 500 billion won (about $385 million) loss this year.

Poor yields and difficulty securing customers have left Samsung facing tough choices, including the possible sale of its massive Foundry unit, which manufactures logic for external customers. It's noteworthy that Samsung is one of only three companies left in the advanced semiconductor manufacturing field, alongside TSMC and Intel. Many companies struggled to deliver results when transitioning to sub-7 nm nodes. Global Foundries dropped out of the race to focus on mature nodes, while Intel faced delays. TSMC has been the only company so far to consistently set and execute its goals, positioning itself as the industry leader. With low yields on the 3 nm GAA FET node, Samsung currently holds 11.5% of the global foundry market share in Q2, while TSMC dominates with 62.3%.

Yesterday, Intel launched its Xeon 6 family of server processors based on P-cores manufactured on Intel 3 node. While the early reviews seem promising, Intel is preparing a more advanced generation of processors that will make or break its product and foundry leadership. Codenamed "Clearwater Forest," these CPUs are expected to be the first high-volume production chips based on the Intel 18A node. We have pictures of the five-tile Clearwater Forest processor thanks to Tom's Hardware. During the Enterprise Tech Tour event in Portland, Oregon, Tom's Hardware managed to take a picture of the complex Clearwater Forest design. With compute logic built on 18A, this CPU uses Intel's 3-T process technology, which serves as the foundation for the base die, marking its debut in this role. Compute dies are stacked on this base die, making the CPU building more complex but more flexible.

The Foveros Direct 3D and EMIB technologies enable large-scale integration on a package, achieving capabilities that previous monolithic single-chip designs could not deliver. Other technologies like RibbonFET and PowerVia will also be present for Clearwater Forest. If everything continues to advance according to plan, we expect to see this next-generation CPU sometime next year. However, it is crucial to note that if this CPU shows that the high-volume production of Intel 18A is viable, many Intel Foundry customers would be reassured that Intel can compete with TSMC and Samsung in producing high-performance silicon on advanced nodes at scale.

Intel has announced the cancellation of its 20A node for Foundry customers, as well as shifting majority of Arrow Lake production to external foundries. The tech giant will instead focus its resources on the more advanced 18A node while relying on external partners for Arrow Lake production, likely tapping TSMC or Samsung for their 2 nm nodes. The decision follows Intel's successful release of the 18A Process Design Kit (PDK) 1.0 in July, which garnered positive feedback from the ecosystem, according to the company. Intel reports that the 18A node is already operational, booting operating systems and yielding well, keeping the company on track for a 2025 launch. This early success has enabled Intel to reallocate engineering resources from 20A to 18A sooner than anticipated. As a result, the "Arrow Lake processor family will be built primarily using external partners and packaged by Intel Foundry".

The 20A node, while now cancelled for Arrow Lake, has played a crucial role in Intel's journey towards 18A. It served as a testbed for new techniques, materials, and transistor architectures essential for advancing Moore's Law. The 20A node successfully integrated both RibbonFET gate-all-around transistor architecture and PowerVia backside power delivery for the first time, providing valuable insights that directly informed the development of 18A. Intel's decision to focus on 18A is also driven by economic factors. With the current 18A defect density already at D0 <0.40, the company sees an opportunity to optimize its engineering investments by transitioning now. However, challenges remain, as evidenced by recent reports of Broadcom's disappointment in the 18A node. Despite these hurdles, Intel remains optimistic about the future of its foundry services and the potential of its advanced manufacturing processes. The coming months will be crucial as the company works to demonstrate the capabilities of its 18A node and secure more partners for its foundry business.

Intel is reportedly exploring the sale of its Altera business, a move guided by CEO Pat Gelsinger as part of broader restructuring efforts. Acquired by Intel in 2015 for $16.7 billion, Altera, formerly known as the Programmable Solutions Group, has been a profitable segment. However, with Intel facing financial strain due to extensive spending, the company is now considering divesting its FPGA business to recoup capital. Currently, Altera operates as a separate entity within Intel, relying on the tech giant for R&D, sales, marketing, and support. Gelsinger is expected to propose the sale at a board meeting scheduled for mid-September, where he will outline his vision for Intel's future. This restructuring could also affect other parts of Intel's operations, including its Foundry business.

While previous reports suggested that Intel might spin off its Foundry unit or sell it to industry leaders like TSMC or Samsung, the latest information indicates that Intel plans to retain this division, albeit with scaled-back expansion efforts. The $32 billion factory in Germany, for example, may be scrapped, along with other capital-intensive projects, and other capital expansions may also be put on hold. Pat Gelsinger's vision still needs to be finalized and is still in the drafting phase, so until the mid-September board meeting, we have to wait to gain more information.

According to a recent report from Bloomberg, Intel is in talks with investment banks about a possible spin-out of its foundry business, as well as scraping some existing expansion plans to cut losses. As the report highlights, sources close to Intel noted that the company is exploring various ways to deal with the recent Q2 2024 earnings report. While Intel's revenues are in decline, they are still high. However, the profitability of running its business has declined so much that the company is now operating on a net loss, with an astonishing $1.61 billion in the red. CEO Pat Gelsinger is now exploring various ways to control these losses and make the 56-year-old giant profitable again. Goldman Sachs and Morgan Stanley are reportedly advising Intel about its future moves regarding the foundry business and overall operations.

The Intel Foundry unit represents the biggest consumer of the company's funds, as the expansion plans across the US and Europe are costing Intel billions of US Dollars. Even though the company receives various state subsidies to build semiconductor manufacturing facilities, it still has to put much of its capital to work. Given that the company is running tight on funds, some of these expansion plans that are not business-critical may get scraped. Additionally, running the foundry business is also turning out to be rather costly, with Q2 2024 recording a negative 65.5% operating margin. Separating Intel Product and Intel Foundry may be an option, or even selling the foundry business as a whole is on the table. Whatever happens next is yet to be cleared up. During the Deutsche Bank Technology Conference on Thursday, Pat Gelsinger also noted that "It's been a difficult few weeks" for Intel, with many employees getting laid off to try to establish new cost-saving measures.

Intel today announced that its lead products on Intel 18A, Panther Lake (AI PC client processor) and Clearwater Forest (server processor), are out of the fab and have powered-on and booted operating systems. These milestones were achieved less than two quarters after tape-out, with both products on track to start production in 2025. The company also announced that the first external customer is expected to tape out on Intel 18A in the first half of next year.

"We are pioneering multiple systems foundry technologies for the AI era and delivering a full stack of innovation that's essential to the next generation of products for Intel and our foundry customers. We are encouraged by our progress and are working closely with customers to bring Intel 18A to market in 2025." -Kevin O'Buckley, Intel senior vice president and general manager of Foundry Services

Intel Corporation today reported second-quarter 2024 financial results. "Our Q2 financial performance was disappointing, even as we hit key product and process technology milestones. Second-half trends are more challenging than we previously expected, and we are leveraging our new operating model to take decisive actions that will improve operating and capital efficiencies while accelerating our IDM 2.0 transformation," said Pat Gelsinger, Intel CEO. "These actions, combined with the launch of Intel 18A next year to regain process technology leadership, will strengthen our position in the market, improve our profitability and create shareholder value."

"Second-quarter results were impacted by gross margin headwinds from the accelerated ramp of our AI PC product, higher than typical charges related to non-core businesses and the impact from unused capacity," said David Zinsner, Intel CFO. "By implementing our spending reductions, we are taking proactive steps to improve our profits and strengthen our balance sheet. We expect these actions to meaningfully improve liquidity and reduce our debt balance while enabling us to make the right investments to drive long-term value for shareholders."

Samsung Electronics today reported financial results for the second quarter ended June 30, 2024. The Company posted KRW 74.07 trillion in consolidated revenue and operating profit of KRW 10.44 trillion as favorable memory market conditions drove higher average sales price (ASP), while robust sales of OLED panels also contributed to the results.

Memory Market Continues To Recover; Solid Second Half Outlook Centered on Server Demand
The DS Division posted KRW 28.56 trillion in consolidated revenue and KRW 6.45 trillion in operating profit for the second quarter. Driven by strong demand for HBM as well as conventional DRAM and server SSDs, the memory market as a whole continued its recovery. This increased demand is a result of the continued AI investments by cloud service providers and growing demand for AI from businesses for their on-premise servers.

Intel Corporation today announced the appointment of Dr. Naga Chandrasekaran as chief global operations officer, executive vice president and general manager of Intel Foundry Manufacturing and Supply Chain organization. Chandrasekaran joins Intel from Micron, where he served as senior vice president for Technology Development. He will be a member of Intel's executive leadership team and report to CEO Pat Gelsinger.

Chandrasekaran succeeds Keyvan Esfarjani, who has decided to retire from Intel after nearly 30 years of dedicated service. Esfarjani's distinguished career set a strong foundation for Intel Foundry, and his leadership in global supply chain resilience and manufacturing excellence has helped to position Intel's business for long-term success. He will remain with Intel through the end of the year to ensure a seamless transition.

Samsung Electronics, a world leader in advanced semiconductor technology, today announced that it will provide turnkey semiconductor solutions using the 2-nanometer (nm) foundry process and the advanced 2.5D packaging technology Interposer-Cube S (I-Cube S) to Preferred Networks, a leading Japanese AI company.

By leveraging Samsung's leading-edge foundry and advanced packaging products, Preferred Networks aims to develop powerful AI accelerators that meet the ever-growing demand for computing power driven by generative AI.

Samsung Electronics, a world leader in advanced semiconductor technology, today unveiled its latest foundry innovations and outlined its vision for the AI era during Samsung Foundry Forum (SFF) U.S., an annual event held at the company's Device Solutions America headquarters in San Jose, California. Under the theme "Empowering the AI Revolution," Samsung announced its reinforced process technology roadmap, including two new cutting-edge nodes—SF2Z and SF4U—as well as its integrated Samsung AI Solutions platform harnessing the unique strengths of its Foundry, Memory and Advanced Package (AVP) businesses.

"At a time when numerous technologies are evolving around AI, the key to its implementation lies in high-performance, low-power semiconductors," said Dr. Siyoung Choi, President and Head of Foundry Business at Samsung Electronics. "Alongside our proven GAA process optimized for AI chips, we plan to introduce integrated, co-packaged optics (CPO) technology for high-speed, low-power data processing, providing our customers with the one-stop AI solutions they need to thrive in this transformative era."