Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced that it has pioneered a new custom HBM compute architecture that enables XPUs to achieve greater compute and memory density. The new technology is available to all of its custom silicon customers to improve the performance, efficiency and TCO of their custom XPUs. Marvell is collaborating with its cloud customers and leading HBM manufacturers, Micron, Samsung Electronics, and SK hynix to define and develop custom HBM solutions for next-generation XPUs.

HBM is a critical component integrated within the XPU using advanced 2.5D packaging technology and high-speed industry-standard interfaces. However, the scaling of XPUs is limited by the current standard interface-based architecture. The new Marvell custom HBM compute architecture introduces tailored interfaces to optimize performance, power, die size, and cost for specific XPU designs. This approach considers the compute silicon, HBM stacks, and packaging. By customizing the HBM memory subsystem, including the stack itself, Marvell is advancing customization in cloud data center infrastructure. Marvell is collaborating with major HBM makers to implement this new architecture and meet cloud data center operators' needs.

Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, today announced that it has pioneered a new custom HBM compute architecture that enables XPUs to achieve greater compute and memory density. The new technology is available to all of its custom silicon customers to improve the performance, efficiency and TCO of their custom XPUs. Marvell is collaborating with its cloud customers and leading HBM manufacturers, Micron, Samsung Electronics, and SK hynix to define and develop custom HBM solutions for next-generation XPUs.

HBM is a critical component integrated within the XPU using advanced 2.5D packaging technology and high-speed industry-standard interfaces. However, the scaling of XPUs is limited by the current standard interface-based architecture. The new Marvell custom HBM compute architecture introduces tailored interfaces to optimize performance, power, die size, and cost for specific XPU designs. This approach considers the compute silicon, HBM stacks, and packaging. By customizing the HBM memory subsystem, including the stack itself, Marvell is advancing customization in cloud data center infrastructure. Marvell is collaborating with major HBM makers to implement this new architecture and meet cloud data center operators' needs.

Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, today introduced Marvell Ara, the industry's first 3 nm 1.6 Tbps PAM4 interconnects platform featuring 200 Gbps electrical and optical interfaces. Building on the success of the Nova 2 DSP, the industry's first 5 nm 1.6 Tbps PAM4 DSP with 200 Gbps electrical and optical interfaces, Ara leverages the comprehensive Marvell 3 nm platform with industry-leading 200 Gbps SerDes and integrated optical modulator drivers, to reduce 1.6 Tbps optical module power by over 20%. The energy efficiency improvement reduces operational costs and enables new AI server and networking architectures to address the need for higher bandwidth and performance for AI workloads, within the significant power constraints of the data center.

Ara, the industry's first 3 nm PAM4 optical DSP, builds on six generations of Marvell leadership in PAM4 optical DSP technology. It integrates eight 200 Gbps electrical lanes to the host and eight 200 Gbps optical lanes, enabling 1.6 Tbps in a compact, standardized module form factor. Leveraging 3 nm technology and laser driver integration, Ara reduces module design complexity, power consumption and cost, setting a new benchmark for next-generation AI and cloud infrastructure.

Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, demonstrates its industry-leading 3 nm PCIe Gen 7 connectivity at the OCP Global Summit, October 15-17, at the San Jose Convention Center. PCIe Gen 7 doubles data transfer speeds, enabling continued scaling of compute fabrics inside accelerated server platforms, general-purpose servers, CXL systems and disaggregated infrastructure. Building on its widely deployed PAM4 technology and utilizing its industry-leading accelerated infrastructure silicon platform, Marvell has developed the industry's most comprehensive interconnect portfolio addressing all high-bandwidth optical and copper connections in AI data centers. This innovative portfolio empowers cloud data center operators to optimize their infrastructure for their specific architectures and workloads to meet the exponential demands of AI.

Marvell pioneered PAM4 technology over a decade ago and leads the industry in PAM4 interconnect shipments. Today, most of the optical interconnects used in data center backend and frontend networks are based on PAM4 technology. As compared to PCIe Gen 5, which was based on NRZ modulation, PCIe Gen 6 and 7 require the use of PAM4 modulation. With its recent PCIe Gen 6 retimer announcement and this PCIe Gen 7 demonstration, Marvell extends its industry-leading PAM4-based optical and copper interconnect portfolio beyond Ethernet and InfiniBand into copper and optical PCIe, CXL and proprietary compute fabric links.

Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced the development of FBNIC, a custom 5 nm network interface controller (NIC) ASIC in collaboration with Meta to meet the company's infrastructure and use case requirements. The FBNIC board design will also be contributed by Marvell to the Open Compute Project (OCP) community. FBNIC combines a customized network controller designed by Marvell and Meta, a co-designed board, and Meta's ASIC, firmware and software. This custom design delivers innovative capabilities, optimizes performance, increases efficiencies, and reduces the average time needed to resolve potential network and server issues.

"The future of large-scale, data center computing will increasingly revolve around optimizing semiconductors and other components for specific applications and cloud infrastructure architectures," said Raghib Hussain, President of Products and Technologies at Marvell. "It's been exciting to partner with Meta on developing their custom FBNIC on our industry-leading 5 nm accelerated infrastructure silicon platform. We look forward to the OCP community leveraging the board design for future innovations."

MSI unveils the X870E and X870 motherboards, designed to harness the full power of AMD's Ryzen 9000 Series desktop processors. The lineup includes four models: MEG X870E GODLIKE, MPG X870E CARBON WIFI, MAG X870 TOMAHAWK WIFI, and PRO X870-P WIFI. These motherboards deliver exceptional value and performance with cutting-edge features and exclusive MSI innovations. Offering top components, innovative features, and easy DIY options, MSI's X870E and X870 motherboards make building and using your PC seamless.

Introducing MSI's Ultra Connect feature in the X870E and X870 motherboards, offering next-gen networking, storage, and expansion. With built-in 5G LAN and Wi-Fi 7, users can enjoy lightning-fast speeds, reaching up to 5.8 Gbps. As well as TriLink Connectivity, Expansion is made to future-proof with PCIe Gen 5.0 for next-gen graphics cards and SSDs. The USB4 ports, which are Thunderbolt compatible, enable fast data transfers and support a wide range of next-gen devices, including display output through USB-C.

ASUS over the weekend introduced the XG-C100C V3, a client-segment 10 GbE PCIe network interface card. The card features a ubiquitous RJ-45 connector that supports 803.2an (10 Gbps), and slower standards, such as 5 GbE, 2.5 GbE, 1 GbE, and 10/100 Mbps. The single-slot, half-height (low-profile) card features a PCI-Express 3.0 x4 host interface, and uses a Marvell AQtion AQC113 controller, with a heatsink. The card features dual-color link/activity LEDs. OS support includes Windows 11, Windows 10, and most recent desktop Linux distributions. The company didn't announce pricing.

Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, today launched the Marvell Structera product line of Compute Express Link (CXL) devices that enable cloud data center operators to overcome memory performance and scaling challenges in general-purpose servers.

To address memory-intensive applications, data center operators add extra servers to get higher memory bandwidth and higher memory capacity. The compute capabilities from the added processors are typically not utilized for these applications, making the servers inefficient from cost and power perspectives. The CXL industry standard addresses this challenge by enabling new architectures that can efficiently add memory to general-purpose servers.

DapuStor Corporation, a pioneer in high-performance data storage solutions, announced today that it is expanding its collaboration with Marvell to deliver breakthrough Flexible Data Placement (FDP) technology optimized for Quad-Level Cell (QLC) and Triple-Level Cell (TLC) Solid-State Drives (SSDs). This collaboration aims to revolutionize the storage industry by addressing the inherent challenges of QLC SSDs, enhancing their performance, endurance, and capacity, thereby providing a robust and cost-effective solution for data centers, cloud computing, and high-performance computing environments.

Unlocking the Potential of QLC SSDs with FDP Technology
QLC SSDs are renowned for their ability to store four bits of data per memory cell, offering significant capacity advantages and a lower Total Cost of Ownership (TCO) compared to other SSD types. Despite these benefits, QLC SSDs face challenges such as lower endurance and slower write speeds. The innovative FDP technology supported in the Marvell Bravera SC5 SSD controller with firmware level solution developed by DapuStor directly addresses these issues.

At Computex last week, we got a first look at Gigabyte's new TRX50 AI TOP motherboard—where TOP stands for trillions of operations per second—designed for AMD's Threadripper and Threadripper Pro CPUs. Now the company has released the full specifications of the TRX50 AI TOP and the board is packed to the brim with features. The E-ATX board is home to four PCIe x16 slots, all of which can operate in PCIe 5.0, but one can be limited to PCIe 4.0, depending on your choice of CPU. There's also four NVMe M.2 slots, with CPU dependent functionality. Other features include eight DIMM slots, but these are again CPU dependent, two 10 Gbps Ethernet interfaces via a pair of Marvell AQtion AQC113C controllers, WiFi 7 via a Qualcomm QCNCM865 module and dual audio chips, one for the rear ports and one for the front panel audio.

As this is a 2024 model, USB4 is of course also part of the package, but only one of the two USB4 supports DP Alt-mode, due to there only being one DP input. The board also has an internal USB 3.2 Gen 2x2 (20 Gbps) header for a case mounted USB-C port, a further six rear 5 Gbps USB Type-A ports, plus a pair of internal headers for a further four 5 Gbps USB Type-A ports. The board also has four SATA ports, a 16+8+4 power phase design, a 14-layer PCB, a debug display and the now common easy release features for the M.2 drive heatsinks and the graphics card. The TRX50 AI TOP also sports what Gigabyte calls "UC BIOS" which has a "User-Centred intuitive UX with Quick Access function", but there's currently no details of how this differs from previous UEFI releases from Gigabyte. There was no word on pricing.

Marvell Technology, a leader in data infrastructure semiconductor solutions, today expanded its connectivity portfolio with the launch of the new Alaska P PCIe retimer product line built to scale data center compute fabrics inside accelerated servers, general-purpose servers, CXL systems and disaggregated infrastructure. The first two products, 8- and 16-lane PCIe Gen 6 retimers, connect AI accelerators, GPUs, CPUs and other components inside server systems.

Artificial intelligence (AI) and machine learning (ML) applications are driving data flows and connections inside server systems at significantly higher bandwidth, necessitating PCIe retimers to meet the required connection distances at faster speeds. PCIe is the industry standard for inside-server-system connections between AI accelerators, GPUs, CPUs and other server components. AI models are doubling their computation requirements every six months1 and are now the primary driver of the PCIe roadmap, with PCIe Gen 6 becoming a requirement.

Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, is extending its collaboration with TSMC to develop the industry's first technology platform to produce 2 nm semiconductors optimized for accelerated infrastructure.

Behind the Marvell 2 nm platform is the company's industry-leading IP portfolio that covers the full spectrum of infrastructure requirements, including high-speed long-reach SerDes at speeds beyond 200 Gbps, processor subsystems, encryption engines, system-on-chip fabrics, chip-to-chip interconnects, and a variety of high-bandwidth physical layer interfaces for compute, memory, networking and storage architectures. These technologies will serve as the foundation for producing cloud-optimized custom compute accelerators, Ethernet switches, optical and copper interconnect digital signal processors, and other devices for powering AI clusters, cloud data centers and other accelerated infrastructure.

The sneak peeks from the upcoming IEEE Solid State Circuit Conference continues, as the agenda items unveil interesting tech that will be either unveiled or demonstrated there. Intel, Synopsys, and Marvell, are leading providers of DRAM physical layer interface (PHY) IP. Various processor, GPU, and SoC manufacturers license PHY and memory controller IP from these companies, to integrate with their designs. All three companies are ready with over 200 Gbps around the 2.69 to 3 petajoule per bit range. This energy cost is as important as the data-rate on offer; as it showcases the viability of the PHY for a specific application (for example, a smartphone SoC has to conduct its memory sub-system at a vastly more constrained energy budget compared to an HPC processor).

Intel is the first in the pack to showcase a 224 Gbps sub-picojoule/bit PHY transmitter that supports PAM4 and PAM6 signaling, and is designed for 3 nm-class FinFET foundry nodes. If you recall, Intel 3 will be the company's final FinFET node before it transitions to nanosheets with the Intel 20A node. At the physical layer, all digital memory signal is analogue, and Intel's IP focuses on the DAC aspect of the PHY. Next up, is a somewhat similar transceiver IP by Synopsys. This too claims 224 Gbps speeds at 3 pJ/b, but at a 40 dB insertion loss; and is designed for 3 nm class FinFET nodes such as the TSMC N3 family and Intel 3. Samsung's 3 nm node uses the incompatible GAAFET technology for its 3 nm EUV node. Lastly, there's Marvell, with a 212 Gb/s DSP-based transceiver for optical direct-detect applications on the 5 nm FinFET nodes, which is relevant for high speed network switching fabrics.

Plextor, one of the most iconic names in PC storage once known for high performance and quality, has announced it will cease operations. Parent company Kioxia has decided to retire the Plextor brand name for solid state drives (SSDs). Instead, it will market products under its Solid State Storage Technology Corporation (SSSTC) brand going forward. The move comes after Kioxia acquired Plextor and its parent company Lite-On's SSD business back in 2019. Since then, Plextor has struggled to keep pace with new storage technologies. With PCIe Gen 4 and PCIe Gen 5 SSD controllers coming to market, Plextor failed to adopt the new Phison and InnoGrit platforms, instead sticking with Marvell controllers, lagging behind at that time.

Now, SSSTC and Kioxia will strictly focus SSD sales on the enterprise, data center, and industrial segments rather than the consumer market. The Plextor website is already redirecting to SSSTC.com, which no longer lists any drives for client PCs. While current Plextor SSD owners will continue to receive warranty support and RMA services, no new Plextor drives are expected to be released. The company had a history stretching back over 30 years of making top-performing optical disk drives and SSDs. Similarly to OCZ after its acquisition by Toshiba, the Plextor name will now fade into history. But in the fast-moving storage business, companies live and die by their ability to adopt cutting-edge technologies. Hence, companies are always on the edge of their seats, trying to survive.

TrendForce reports that 3Q23 has been a historic quarter for the world's leading IC design houses as total revenue soared 17.8% to reach a record-breaking US$44.7 billion. This remarkable growth is fueled by a robust season of stockpiling for smartphones and laptops, combined with a rapid acceleration in the shipment of generative AI chips and components. NVIDIA, capitalizing on the AI boom, emerged as the top performer in revenue and market share. Notably, analog IC supplier Cirrus Logic overtook US PMIC manufacturer MPS to snatch the tenth spot, driven by strong demand for smartphone stockpiling.

NVIDIA's revenue soared 45.7% to US$16.5 billion in the third quarter, bolstered by sustained demand for generative AI and LLMs. Its data center business—accounting for nearly 80% of its revenue—was a key driver in this exceptional growth.

Marvell Technology, a leader in data infrastructure semiconductor solutions, is enabling networking equipment and firewall manufacturers achieve breakthrough levels of performance and efficiency with two new OCTEON 10 data processing units (DPUs), the OCTEON 10 CN102 and OCTEON 10 CN103. The 5 nm OCTEON CN102 and CN103, broadly available to OEMs for product design and pilot production, are optimized for data and control plane applications in routers, firewalls, 5G small cells, SD-WAN appliances, and control plane applications in top-of-rack switches and line card controllers. Several of the world's largest networking equipment manufacturers have already incorporated the OCTEON 10 CN102 into a number of product designs.

Containing up to eight Arm Neoverse N2 cores, OCTEON 10 CN102 and CN103 deliver 3x the performance of Marvell current DPU solutions for devices while reducing power consumption by 50% to 25 W. Achieving SPEC CPU (2017) integer rate (SPECint) scores of 36.5, OCTEON 10 CN102 and CN103 are able to deliver nearly 1.5 SPECint points per Watt. The chips can serve as an offload DPU for host processors or as the primary processor in devices; advanced performance per watt also enables OEMs to design fanless systems to simplify systems and further reduce cost, maintenance and power consumption.

Leading global motherboard manufacturer, ASRock, proudly announces its new WRX90 WS EVO & TRX50 WS motherboard for new AMD Ryzen Threadripper 7000 and AMD Ryzen Threadripper PRO 7000 WX-Series processors. The new motherboards support 4/8 channel memory up to 1 TB/2 TB DDR5 ECC RDIMM, PCI-Express 5.0 expansion slots, server grade storage expansion such as Slim-SAS & MCIO and 10 Gbps Ethernet, giving ultimate performance for almost every application such as content creating, video rendering, high-end workstation and even AI machine learning.

Ultimate Performance & Rock-Solid Stability
To ensure stability for AMD Ryzen Threadripper 7000 and AMD Ryzen Threadripper PRO 7000 WX-Series processors in all conditions and systems loads, the WRX90 WS EVO & TRX50 WS has been given a flagship-class server grade ultra-low loss PCB and 18+3+3 phase SPS Dr.MOS VRM design to ensure ultimate performance and superb reliability, even when subjected to the most demanding sustained workloads.

Fueled by an AI-driven inventory stocking frenzy across the supply chain, TrendForce reveals that Q2 revenue for the top 10 global IC design powerhouses soared to US $38.1 billion, marking a 12.5% quarterly increase. In this rising tide, NVIDIA seized the crown, officially dethroning Qualcomm as the world's premier IC design house, while the remainder of the leaderboard remained stable.

AI charges ahead, buoying IC design performance amid a seasonal stocking slump
NVIDIA is reaping the rewards of a global transformation. Bolstered by the global demand from CSPs, internet behemoths, and enterprises diving into generative AI and large language models, NVIDIA's data center revenue skyrocketed by a whopping 105%. A deluge of shipments, including the likes of their advanced Hopper and Ampere architecture HGX systems and the high-performing InfinBand, played a pivotal role. Beyond that, both gaming and professional visualization sectors thrived under the allure of fresh product launches. Clocking a Q2 revenue of US$11.33 billion (a 68.3% surge), NVIDIA has vaulted over both Qualcomm and Broadcom to seize the IC design throne.

TrendForce reports that inventory reduction in Q1 fell short of expectations and coincided with the industry's traditional off-season, leading to overall subdued demand. However, due to new product release and a surge in urgent orders for specialized specifications, Q1 revenue of the global top ten IC design houses remained on par with 4Q22, with a modest QoQ increase of 0.1% for a total revenue of US$33.86 billion. Changes in ranking included Cirrus Logic slipping from the top ten as well as the ninth and tenth positions being replaced by WillSemi and MPS, respectively. The rest of the rankings remained unchanged.

The smartphone supply continues to grapple with overstock, but AI applications are entering a period of rapid growth
Qualcomm witnessed an uptick in its revenue, largely attributed to the launch and subsequent shipments of its latest flagship chip, the Snapdragon 8Gen2. The company saw 6.1% in QoQ growth in its smartphone business, which effectively offset the downturn from its automotive and IoT sectors. As a result, Qualcomm's Q1 revenue increased marginally by 0.6%, cementing its position at the top of the pack with a market share of 23.5%.

The global economy has faced increased inflation risks and downstream inventory corrections in 2H22, which have affected IC design houses faster than wafer foundries, as they are far more sensitive and responsive to market reversals. TrendForce reports that adverse factors such as weak overall consumption, restrictions from China, and the slowdown of corporate IT spending and CSP demand have impacted the revenue performance of the world's top 10 IC design houses in 4Q22, leading to a QoQ decline of 9.2%, or approximately US$33.96 billion.

TrendForce predicts that the revenue of these top 10 companies keep declining—though with a slight convergence—into 1Q23, owing to ongoing inventory corrections across the entire supply chain as well as Q1 being the traditional off-season for consumer demand. Demand will continue to be weak despite new product launches and inventory replenishment in the supply chain.

Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, announced today that it has selected Amazon Web Services, Inc. (AWS) as its cloud provider for electronic design automation (EDA). A cloud-first approach helps Marvell to rapidly and securely scale its service on the world's leading cloud, rise to the challenges brought by increasingly complex chip design processes, and deliver continuous innovation for the expanding needs across the automotive, carrier, data center, and enterprise infrastructure markets it serves. The work extends the longstanding relationship between the two companies—Marvell is also a key semiconductor supplier for AWS, helping the company support the design and rapid delivery of cloud services that best meet customers' demanding requirements.

EDA refers to the specialized and compute-intensive processes used in chip making and is a critical piece of Marvell's R&D. Over the years, the number of transistors on an integrated chip has increased exponentially. Each advance in chip design calls for a calculated application of software modules overseeing logic design, debugging, component placement, wire routing, optimization of time and power consumption, and verification. Due to the computationally intensive nature of EDA workloads, it is no longer cost-effective or timely to run EDA on premises. By powering its EDA with AWS, Marvell leverages an unmatched portfolio of services including secure, elastic, high-performance compute capacity in the cloud to solve challenges around speed, latency, security of IP, and data transfer.

Yes, you read that correctly, ASUS didn't launch just one, but two W790 based LGA-4677 motherboards today, namely the Pro WS W790-Sage SE and the Pro WS W790-Ace. The main difference here is that the Sage supports up to seven PCIe 5.0 x16 slots—one is a x8 slot electrically—and is designed for the Xeon W-3400 series, whereas the Ace supports five PCIe 5.0 x16 slots and is in turn designed for the Xeon W-2400 series. One downside of these boards is that they might not fit in a standard ATX case, as the Sage follows the SSI-EEB form factor and the Ace the SSI-CEB form factor, both of which are a fair bit wider than an ATX motherboard and with different mounting holes.

The Pro WS W790-ACE also sports eight DDR5 DIMM slots that operate in quad-channel and supports up to 2 TB of RAM if ECC R-DIMMs are used. Furthermore, ASUS has kitted out the Ace with a pair of PCIe 4.0 M.2 slots, one 2280 and one 22110 slot, four SATA ports, three slim SAS ports, a Marvell 10 Gbps and an Intel 2.5 Gbps Ethernet interface, a single USB 3.2 Gen 2x2 20 Gbps USB Type-C port around the back and an internal header for a second, case mounted port. Finally the board has four USB 3.2 Gen 2 10 Gbps Type-A ports around the back and a header for a further two., as well as eight USB 2.0 ports around the back and audio courtesy of a Realtek S1220A based solution with optical S/PDIF out.

Leading global motherboard manufacturer, ASRock, proudly announces its new ASRock W790 WS motherboard for workstations for Intel Xeon W-3400/W-2400 series processors (LGA4677). The ASRock W790 WS features up to 2 TB DDR5 ECC RDIMM support, PCI-Express 5.0 expansion slots, USB4/Thunderbolt 4 and Dual 10 Gbps Ethernet. A flagship-class 14-layer PCB and 20+2 phase CPU VRM ensures ultimate performance and superb reliability, even when subjected to the most demanding sustained workloads.

Supports New 4th Generation Xeon Processor
The W790 WS chipset is optimized for new Intel Xeon W-2400 series (LGA4677) processors and is compatible with W-3400 series processors with up to 56 cores also. The ASRock W790 WS provides a quad-channel DDR5 design with 2DPC over 8 DIMM slots, maximizing memory performance, potential memory pool capacity and supports ECC RDIMMs to ensure data reliability.

Global market intelligence firm TrendForce reports that the revenue generation momentum of the global IC design industry slowed down in 3Q22. The main factors behind this development were the Russia-Ukraine military conflict, the recent COVID-19 lockdowns in China, the ongoing inflation, and clients undergoing inventory corrections. The total revenue of the global top 10 IC design houses came to US$37.38 billion for 3Q22, showing a QoQ decline of 5.3%. Qualcomm remained first place in the ranking of the global top 10 IC design houses by revenue for 3Q22. Broadcom returned to second place by overtaking NVIDIA and AMD, who slipped to third and fourth respectively due to weakening demand for PCs and cryptocurrency mining machines.

Regarding US-based IC design houses that were in the top 10 group for 3Q22, Qualcomm recorded a QoQ increase for the sales of smartphone SoCs and 5G modem chips. It also made gains in the automotive electronics market by expanding its collaborations with partners in the automotive industry. As a result, Qualcomm's 3Q22 revenue figures for mobile and automotive offerings reflected QoQ increases of 6.8% and 22.0% respectively. The revenue growth of these two major product categories offset the marginal decline in the revenue for RF front-end chips. Qualcomm's IC design revenue as a whole climbed up by 5.6% QoQ to US$9.90 billion for 3Q22. The company sat firmly at the top of the ranking.

ASUS today announced the availability of new Intel Z790 motherboards, including the ROG Maximus Z790 Apex, TUF Gaming Z790-PLUS WiFi and ProArt Z790-Creator WiFi - all of which provide DDR5 memory module support and PCIe 5.0 slots for video cards and storage.ASUS Z790 motherboards offer tremendous value to anyone assembling an Intel 13th Gen machine that includes AEMP II, AI Overclocking, AI Cooling II, PCIe 5.0 M.2 slots, Thunderbolt 4, WiFi 6E, Quick Charge 4+ technology and comprehensive connectivity. Overall, new ASUS Z790 motherboards are ideal solutions for any user who wants to build a next-gen machine or upgrade their existing system.

First up is the ROG Maximus Z790 Apex. The ultimate option for memory overclocking enthusiasts, this motherboard boasts a cutting-edge feature set. Then, for creative professionals of all kinds, ASUS offers the ProArt Z790-Creator WiFi. This motherboard offers premium connectivity and bespoke style, and it's fully ready for next-gen graphics cards and ultra-fast PCIe 5.0 storage. Finally, ASUS is bolstering its TUF Gaming lineup with the TUF Gaming Z790-Plus WiFi, which brings DDR5 support to the family.