Last week, South Korean semiconductor industry moles let slip about the development of an "Exynos 2600" mobile chipset at Samsung Electronics. This speculative flagship processor was linked to the manufacturer's (inevitable) launch of Galaxy S26 smartphone models in early 2026. Despite rumors of the firm's Foundry service making decent progress with their preparation of a cutting-edge 2 nm Gate-All-Around (GAA) node, certain critics reckon that Samsung will be forced into signing another (less than ideal) chip supply deal with Qualcomm. According to The Bell SK's latest news report, Samsung's LSI Division is working with plenty of determination—an alleged main goal being the next wave of top-end Galaxy smartphones deployed next year with in-house tech onboard.

Inside sources propose that Samsung's Exynos 2600 SoC needs to be "finished by the middle of the third quarter of this year," thus ensuring the release of in-house chip-powered Galaxy S26 devices. It is not clear whether this forecast refers to a finalized design or the start of mass production. The latest whispers regarding another proprietary next-gen mobile processor—Exynos 2500—paint a murky picture. Past leaks indicated possible avenues heading towards forthcoming Galaxy Z Flip 7 and Fold 7 smartphone models. The latest reports have linked this design to a mature 4 nm process and eventual fitting inside affordable "Galaxy Z Flip FE" Enterprise Edition SKUs. The Bell contacted one of its trusted sources—the unnamed informant observed that everything is in flux: "Exynos 2500 production plan is constantly changing...I thought it was certain, but I heard that the possibility has recently decreased slightly." Reportedly, Samsung employees have their plates full with plenty of simultaneous projects in 2025.

Earlier in the week, Apple specialist press outlets picked up on a noted industry analyst's technological forecast for a future iPhone processor design. Jeff Pu—of GF Industries, Hong Kong—predicted that the next-generation A20 SoC would be produced via a TSMC 3 nm (N3P) nodes process. Despite rumors of Apple gaining front row seats at the "2 nm ballgame," the partnership between fabless chip designer and foundry could potentially revisit already covered ground. The A19 chipset was previously linked to N3P (by insiders), with Pu expressing the belief that A20 would utilize the same fundamental lithographic underpinnings; albeit enhanced with TSMC's Chip on Wafer on Substrate (CoWoS) packaging technology (for AI improvements).

This morning, MacRumors followed up on their initial news article—they reported that "wires were crossed" at GF Industries, regarding projections for the (2026) iPhone 18 generation. The publication received direct feedback from the man of the hour: "Jeff Pu (lead Apple analyst) has since clarified that he believes the A20 chip will be manufactured with the N2 process, so the information about the chip using the N3P process should be disregarded. Earlier reports had said the A20 chip would be 2 nm, so rumors align again. This is ultimately good news, as it means the A20 chip should have more substantial performance and power efficiency improvements over the A19 chip." Cutting-edge smartphone processor enthusiasts expressed much disappointment when A20 was (regressively) linked to N3P; the latest revisement should instill some joy. According to industry moles, TSMC is making good progress with its cutting-edge 2 nm node process—mass production is expected to start at some point within the second half of 2025.

We're stepping up our multiplatform gaming offering with exciting news dropping at this year's Game Developers Conference (GDC). We're bringing users more games, more ways to play your games across devices, and improved gameplay. You can read all about the updates for users from The Keyword. At GDC, we'll be diving into all of the latest games coming to Play, plus new developer tools that'll help improve gameplay across the Android ecosystem.

We're sharing a closer look at what's new from Android. We're making Vulkan the official graphics API on Android, enabling you to build immersive visuals, and we're enhancing the Android Dynamic Performance Framework (ADPF) to help you deliver longer, more stable gameplays. Check out our video, or keep reading below.

According to an attendee of a recent Intel AI presentation, company representatives revealed a release timeline for next-gen Core Ultra "Panther Lake" mobile processor family. Team Blue's China office appears to be courting users of DeepSeek R1, as evidenced by meng59739449's sharing of a processor product roadmap (machine translated by VideoCardz). A volume launch of Core Ultra 300 "Panther Lake-H" series seems to be on the cards for Q1 2026. Earlier this month, an Intel executive insisted that Panther Lake was on track for a second half of 2025 roll out. Lately, industry moles have alleged that a "problematic 18A node" process has caused delays across new generation product lines.

Team Blue watchdogs reckon that high volume manufacturing (HVM) of Panther Lake chips will kick off in September. By October, an Early Enablement Program (EEP) is expected to start—with samples sent off to OEMs for full approval. Industry experts believe that Intel will following a familiar pattern of "announcing the processor in the second half of the prior year, but ramping up mass production in the following year." Previous generation mobile CPU platforms—Meteor Lake and Lunar Lake—received similar treatment in the recent past. Last week, a Panther Lake-H (PTL-H) sample was on general display at Embedded World 2025—the German office is similarly engaged in hyping up the AI-crunching capabilities of roadmapped products.

Late last month, industry insiders posited that pleasing progress was being made with Samsung's cutting-edge 2 nm Gate-All-Around (GAA) node process. The rumored abandonment of an older 3 nm GAA-based project—in late 2024—has likely sent the South Korean foundry team into overdrive. A speculated Exynos 2500 flagship mobile processor was previously linked to said 3 nm node, but industry watchdogs believe that company engineers are experimenting with a 2 nm GAA manufacturing process. According to the latest insider report—from FN News SK—Samsung Foundry (SF) has assembled a special "task force (TF)." Allegedly, this elite team will be dedicated to getting a newer "Exynos 2600 chip" over the finish line—suggesting an abandonment of the older "2500" design, or a simple renaming.

Samsung's recent launch of Galaxy S25 series smartphones was reportedly viewed as a disappointing compromise—with all models being powered by Qualcomm's "first-of-its-kind customized Snapdragon 8 Elite Mobile Platform," instead of in-house devised chipsets. According to industry moles, one of the SF task force's main goals is a boosting of 2 nm GAA production yields up to "economically viable" levels (roughly 60-70%)—apparently last month's best result was ~30%. Mass production of prototype chipsets is tipped to start by May. Samsung's reported target of "stabilizing their Exynos 2600" SoC design will ensure that "Galaxy S26 series" devices will not become reliant on Qualcomm internals. Additionally, FN News proposes a bigger picture scenario: "the stabilization of 2 nm (SF2/GAA) products, is expected to speed up the acquisition of customers for Samsung Electronics' foundry division, which is thirsty for leading-edge process customers." A forthcoming rival next-gen mobile chip—Snapdragon 8 Elite Gen 2—is supposedly in the pipeline. The smartphone industry inside track reckons that Qualcomm has signed up with TSMC; with a 2 nm manufacturing process in mind.

The oft-rumored status of Intel's refreshed generation of Arrow Lake processors (ARL-R) was the topic of much debate in 2023. By September 2024, certain industry watchdogs believed that the endeavor had ended. Early last month, Golden Pig Upgrade proposed that Team Blue leadership had resurrected the troubled project—at least with "ARL-S Refresh" desktop CPUs. Earlier today, the noted leaker of inside information returned to the topic of Arrow Lake Refresh. According to industry moles, the launch of refreshed desktop processors (on LGA 1851) is confirmed.

An extended timeline was disclosed in Golden Pig Upgrade's latest musing: "Arrow Lake HX Refresh is confirmed to return. Don't criticize the interface for only one generation. AI PCs are getting bigger and stronger." Given that ARL-HX-equipped high-end notebooks and mini PCs—with Core Ultra 7 200 series APUs—are relatively new arrivals, a mild update later on in the year could be considered pointless. Intel has committed themselves to a launch of Panther Lake mobile processors (PTL-H) in the second half of 2025. As disclosed by past leaks, the "beefing up" of onboard NPUs—to Lunar Lake-esque standards—is a reported goal; at least with Arrow Lake-S.

According to Digital Chat Station—a repeat leaker of unannounced Qualcomm hardware—unnamed Android smartphone manufacturers are considering an eSIM-only operating model for future flagship devices. Starting with the iPhone 14 generation (2022), Apple has continued to deliver gadgets that are not reliant on "slotted-in" physical SIM cards. According to industry insiders, competitors could copy the market leader's homework—Digital Chat Station's latest Weibo blog post discusses the space-saving benefits of eSIM operation; being "conducive to lightweight and integrated design." Forthcoming top-tier slimline Android mobile devices are tipped to utilize Qualcomm's rumored second-generation "Snapdragon 8 Elite Gen 2" (SM8850) chipset.

Digital Chat Station reckons that: "SM8850 series phones at the end of the year are testing eSIM. Whether they can be implemented in China is still a question mark. Let's wait and see the iPhone 17 Air. In order to have an ultra-thin body, this phone directly cancels the physical SIM card slot. Either it will be a special phone for the domestic market, or it will get eSIM." The phasing out of physical SIM cards within the Chinese mobile market could be a tricky prospect for local OEMs, but reports suggest that "traditionally-dimensioned" flagship offerings will continue to support the familiar subscriber identity module standard. Physical SIM card purists often point out that the format still provides superior network support range.

On Monday (March 3), Qualcomm introduced its Dragonwing FWA Gen 4 Elite model—advertised as the world's first 5G Advanced-capable FWA platform. Inevitably, the company's brand-new Snapdragon X85 5G modem will be compared to a rival design—Apple's proprietary C1 chip launched last month; as featured in the A18 SoC-powered iPhone 16e series. The two companies were closely intertwined for a number of years; with a longer than anticipated co-development of 5G solutions for multiple iPhone product generations. Cristiano Amon—the CEO of Qualcomm—believes that his team's X85 5G design will end up as the victor, when pitched against Apple's C1. In a CNBC-conducted interview, he boasted: "it's the first modem that has so much AI, it actually increases the range of performance of the modem—so the modem can deal with weaker signals. What that will do will set a huge delta between the performance of premium Android devices, and iOS devices, when you compare what Qualcomm can do versus what Apple is doing."

Smartphone industry watchdogs reckon that Apple's C1 model will leverage superior power efficiency; courtesy of the contained modem and receiver being based on TSMC 4 nm and 7 nm processes (respectively). Qualcomm has not revealed the fundamental aspects of its new Snapdragon X85, so it is difficult to project its power consumption habits. Official press material concentrates on two big selling points: downlink speeds up to 12.5 Gbps, and 40 TOPS of NPU processing power. Insiders have posited that the in-house designed C1 modem will make its way into next-gen iPads and Apple wearables—additionally, the development of a successor is rumored. Despite doing less business with Apple, Amon thinks that the future is peachy: "if modem is relevant there's always a place for Qualcomm technology. In the age of AI, modems are going to be more important than they have ever been. And I think that's going to drive consumer preference about do they want the best possible modem in the computer that's in their hand all the time." Qualcomm's chief expects that the supply of Snapdragon 5G Modem‑RF Systems—to Apple—will end in 2027.

The "Medusa" or "Medusa Point" codename started to appear online over the past couple of months. These mysterious AMD projects were linked to next-generation "Zen 6" Ryzen desktop and mobile processor families (respectively). Initially, insiders reckoned that Team Red had selected an RDNA 4-based graphics solution for integration their futuristic new-gen laptop APU design. Two days ago, Golden Pig Upgrade weighed in with a different theory—the veteran leaker believes that provisions have regressed on the "Medusa Point" iGPU front.

Previous reports have suggested that the "Medusa Point" processor's iGPU aspect will utilize up to 16 compute units (CU), based on a theorized count of eight workgroup processors (WGPs) from leaked imagery. The latest insider tip points to the utilization of a non-specific "RDNA 3.x" branch, instead of conjectured RDNA 4 graphics technology. Industry watchdogs hold the belief that AMD will be sticking with RDNA 3.5 for a while—as featured on their current-gen "Zen 5" mobile-oriented Strix Point, Strix Halo and Krackan Point chips. As pointed out by Notebookcheck, Team Red leadership disclosed that RDNA 4 is exclusive to discrete card families (for the time being). RDNA 3.5-equipped APUs have—so far—received a warm welcome; AMD engineers could be reserving development resources for a distant future project.

Jio Platforms Limited (JPL), together with AMD, Cisco, and Nokia, announced at Mobile World Congress 2025 plans to form an innovative, new Open Telecom AI Platform. Designed to support today's operators and service providers with real-world, AI-driven solutions, the Telecom AI Platform is set to drive unprecedented efficiency, security, capabilities, and new revenue opportunities for the service provider industry.

End-to-end Network Intelligence
Fueled by the collective expertise of world leaders from across domains including RAN, Routing, AI Data Center, Security and Telecom, the Telecom AI Platform will create a new central intelligence layer for telecom and digital services. This multi-domain intelligence framework will integrate AI and automation into every layer of network operations.

The telecommunications industry is undergoing a major transformation as AI and 5G technologies reshape networks and connectivity. While operators are eager to modernize infrastructure, challenges remain, such as high capital expenditures, security concerns and integration with legacy systems. At MWC 2025, Intel - alongside more than 50 partners and customers - will showcase groundbreaking solutions that deliver high capacity and high efficiency performance with built-in AI integration, eliminating the need for costly additional hardware and delivering optimized total cost of ownership (TCO).

"By leveraging cloud technologies and fostering close collaborations with partners, we are helping operators virtualize both 5G core and radio access networks - proving that the most demanding, mission-critical workloads can run efficiently on general-purpose silicon," said Sachin Katti, senior vice president and general manager of the Network and Edge Group at Intel Corporation. "Through our Xeon 6 processors, we are enabling the future of AI-powered network modernization."

pureLiFi, the global leader in LiFi technology, has announced the launch of its ground-breaking LINXC Bridge system, at Mobile World Congress Barcelona. Developed with Solace Power, this innovative solution empowers Fixed Wireless Access (FWA) broadband providers to deliver self-installable, higher quality and more reliable connectivity to consumers using outdoor Customer Premises Equipment (CPE). With this solution broadband customers will experience much faster installation times, more reliable speeds and an improved user experience.

The LINXC Bridge streamlines broadband deployment, eliminating complex installations, significantly reducing subscriber acquisition cost, shortening time to revenue and increasing customer satisfaction. The LINXC Bridge system will be showcased live at the pureLiFi booth (7B27) alongside the latest cutting-edge CPE equipment from demonstration collaborators, Sonim Technologies.

Samsung Display today revealed plans to exhibit its next-generation OLED technology, boasting an impressive maximum brightness of 5,000 nits, at the Mobile World Congress 2025 (MWC25) on March 3.

The ultra-high brightness OLED was developed based on the polarizer-less display, also known as on-cell film (OCF) technology, which Samsung Display was the first to commercialize. This innovation not only enhances outdoor visibility but also reduces power consumption, paving the way for significant design flexibility. OCF technology is being applied to a bar-type smartphone and a rollable laptop, following its success in foldable smartphones, and is being recognized by customers as a high-value display technology.

Qualcomm has introduced "Dragonwing," a new brand portfolio consolidating its non-Snapdragon products for industrial applications. The portfolio encompasses industrial IoT, networking, and cellular infrastructure solutions previously marketed under various product lines. The Dragonwing stack integrates AI processing capabilities with low-power computing and connectivity technologies optimized for edge deployment. Target applications include industrial robotics, specialized cameras, industrial handhelds, and unmanned aerial systems. Qualcomm aims to position these solutions in sectors including energy utilities, manufacturing, retail, supply chain, and telecommunications infrastructure.

The branding effort marks a strategic diversification beyond Qualcomm's consumer-focused Snapdragon line. Visually, Dragonwing adopts a purple color scheme that combines elements from Qualcomm's corporate identity with a stylized dragon icon. The portfolio will debut at the Mobile World Congress in Barcelona (March 3-7) and Embedded World in Nuremberg (March 11-13). Although limited, for now, information about Dragonwing processors and solutions should appear soon and give an insight into interesting low-power solutions that will power the next stage of the industrial revolution. Qualcomm has decided to use its mobile development experience and know-how to tap a large market, and solid branding will help it differentiate from competitors instead of the generic product names used in the past. Additionally, Qualcomm's Dragonwing products are mostly focused on more mature nodes like 14 nm and larger, instead of chasing the 3 nm and smaller like its Snapdragon product portfolio.

GL.iNet, a leading innovator in networking solutions, announces the launch of the Spitz Plus (GL-X2000), a powerful 4G LTE Wi-Fi 6 router engineered for seamless connectivity, even in challenging environments. Whether you're streaming in a remote cabin, video conferencing from an RV, or establishing a stable network in a rural area, the Spitz Plus delivers unwavering performance and flexibility.

Your Gateway to Uninterrupted Connectivity
The Spitz Plus seamlessly blends advanced technology with a practical minimalist design, perfectly suited for today's mobile and geographically diverse lifestyles. Its features simplify staying connected, no matter where life takes you.

Last month, ASUS revealed its refreshed ROG XG Mobile design at CES 2025. The latest iteration of their premium external GPU dock is prepped for NVIDIA's "Blackwell" GeForce RTX 50 Mobile GPU-series. According to an ITHome report, the new model will be released next week; the manufacturer's Chinese office has seemingly produced marketing material that teases a launch on February 25. The redesigned ROG XG platform leverages an improved vapor chamber system; offering "150% more cooling surface area," and features "pioneering" Thunderbolt 5 connectivity (max. 80 Gbps bidirectional bandwidth). Press material from January indicated that a top configuration would house Team Green's GeForce RTX 5090 Mobile 24 GB GPU.

An updated official product page also lists support for NVIDIA's "GeForce RTX 5070 Ti Laptop" 12 GB GPU. ASUS will bundle in a 330 W AC adapter, according to its spec sheet. The off-black translucent enclosure weighs in at 0.952 kg, and dimensions are listed as: "20.8 x 15.5 x 2.96 cm." ITHome expects ASUS to reveal regional pricing (for China) on February 25; Western markets will be charged $2199.99 (US MSRP) for the flagship configuration, if price hikes do not go into effect at launch. The less potent variant—powered by a GB205 GPU—is priced at $1199.99.

Retailers are set to open up pre-order floodgates for upcoming GeForce RTX 50-series laptops on February 25, as we learned earlier this week. According to a new DigiTimes report, the launch of mobile devices—sporting Team Green "Blackwell" GPUs—is expected to be "significantly delayed." A loose March launch window was teased during Jensen Huang's keynote presentation at CES 2025, but supply chain insiders have claimed that high-end RTX 50 laptops were "originally planned to be launched in January 2025." Additionally, they surmise that mid-range and low-end offerings are postponed to April. DigiTimes believes that the rumored postponements have surprised supply chain moles; Team Green is not known to delay product launches. Extenuating circumstances are cited as the reason behind alleged deferred release windows, but insiders have not yet determined the extent of lengthened launch parameters.

An anonymous source stated: "NVIDIA, which has never been late in the past, also encountered this situation. It is probably related to NVIDIA's full sprint to AI servers. Even though there are differences in server and PC chip design and manufacturing processes, the company's resource allocation may still affect the debugging efficiency of new products." Other insiders have murmured about GeForce RTX 50-series mobile GPU performance not meeting expectations. Rumors have swirled about problems with early sample units; most notably the encountering of major screen issues when the "hardware is turned on." Laptop/notebook supply chain insiders reckon that manufacturers have anticipated a healthy level of growth in 2025—thanks to the emergence of new NVIDIA graphics cards—but targets have been reduced, due to anticipated delays. Optimistic industry chatter predicts higher education students and esport enthusiasts driving unit sales upward, following a stagnant 2024 market.

Earlier today, NVIDIA happily declared that: "GeForce RTX 50-series laptop pre-orders start February 25 from OEMs." A March launch window was mentioned during the company's official unveiling of its "Blackwell" GPU architecture at CES 2025. Mobile variants of the GeForce RTX 5090, RTX 5080, and RTX 5070 Ti are expected to ship with laptops next month. GeForce RTX 5070 Mobile-equipped devices are due in April. As reported by VideoCardz, a Finnish retailer's webstore has confirmed the February 25 pre-order start date. The Gigantti.fi site lists several new ASUS ROG Zephyrus and Strix laptops; configured with the latest Intel Core Ultra 200HX or AMD "Strix Point/Fire Range" mobile APUs, and NVIDIA GeForce RTX 50-series discrete graphics solutions. The most expensive option is listed with a €5499 price point—interested buyers are looking at a spec that includes a 16-inch OLED screen, Core Ultra 9-285H processor, 32 GB LPDDR5X RAM, 1 TB M.2 PCIe SSD, and a GeForce RTX 5090 32 GB mobile GPU. At the time of writing, Gigantti's "cheapest" option is a €2999 ROG Strix 16 model; sporting a Ryzen 9 9955HX APU and GeForce RTX 5070 Ti 12 GB Mobile GPU.

NVIDIA disclosed official MSRPs during last month's CES presentation: $2199 for RTX 5090, $2199 for RTX 5080, $1599 for RTX 5070 Ti, and $1299 for the RTX 5070. Western press outlets have scouted North American online retail outlets. Tom's Hardware observed (ASUS and HP) price ranges starting at $1800. The most expensive offering came in at $4200; an ultra high-end ROG Strix Scar 18 laptop featuring a GeForce RTX 5090 Mobile GPU and an Intel Core Ultra 9 275HX CPU. Team Green's upcoming launch partners include Acer, ASUS, Dell, Gigabyte, HP, Lenovo, Mechrevo, MSI and Razer. NVIDIA seems to have extra GeForce RTX 50-series announcements in the pipeline—they recommend that potential buyers: "stay tuned for more details!"

Valve has updated its Steam platform policies to prevent mobile-style advertising practices from infiltrating the PC gaming market. The new guidelines, recently added to the Steam Terms of Service, explicitly ban any game that requires players to watch or interact with advertisements to progress. Under the revised rules, developers must eliminate any ad systems that force players to engage with promotional content as a prerequisite for gameplay. Games that rely on mandatory ads for rewards or advancement will not be permitted on Steam. While cross-promotional partnerships and product placements remain acceptable, the forced ad model is no longer supported. Mobile games often burden players with unwanted commercial interruptions. Developers are now encouraged to pursue alternative monetization strategies, such as single-purchase models, optional microtransactions, or downloadable content packages.

"If your game's revenue relies on advertising on other platforms, you will need to find a new monetization model in order to release on Steam."—states Valve pricing guide. In addition to banning forced advertisements, Valve has introduced a new feature for early-access titles. This functionality displays the time elapsed since the last update, offering players greater transparency regarding game development progress. By drawing a clear line against aggressive in-game advertising, Valve is fighting smartphone-style ads that force players into watching unwanted content. Valve's commitment to ecosystem quality ensures that Steam remains a trusted platform for gamers seeking pure gaming and ad-free experiences. Other platforms are likely to follow suit.

The GameSir X3 Pro integrated cooler mobile controller merges an advanced cooling system with high-quality performance. It is designed to enhance your gaming comfort and elevate your gaming experience with extreme esports sensation. It's compatible with Android devices and iPhone 15 and above, supporting phones with a length of 110-180 mm. Now available in exclusive Deadpool edition.

Officially licensed by Marvel, this edition showcases Deadpool's iconic black and red color scheme, capturing the essence of the beloved anti-hero. Equipped with a 900 mm cooling plate, it delivers an impressive 12 W of cooling power, keeping your phone cool even during long gaming sessions or in high temperatures. The GameSir Hall Effect anti-drift sticks offer 360° precision control, providing seamless and pinpoint accuracy. Combined with their durability, they meet the high standards that gamers demand for a top-tier gaming experience.

Samsung Electronics today reported financial results for the fourth quarter and the fiscal year 2024. The Company posted KRW 75.8 trillion in consolidated revenue and KRW 6.5 trillion in operating profit in the quarter ended December 31, 2024. For the full year, it reported KRW 300.9 trillion in annual revenue and KRW 32.7 trillion in operating profit.

Although fourth quarter revenue and operating profit decreased on a quarter-on-quarter (QoQ) basis, annual revenue reached the second-highest on record, surpassed only in 2022. Meanwhile, operating profit was down KRW 2.7 trillion QoQ, due to soft market conditions especially for IT products, and an increase in expenditures including R&D. In the first quarter of 2025, while overall earnings improvement may be limited due to weakness in the semiconductors business, the Company aims to pursue growth through increased sales of smartphones with differentiated AI experiences, as well as premium products in the Device eXperience (DX) Division.

AMD's small portfolio of current-gen (RDNA 3) mobile-oriented Radeon dedicated GPUs pales in comparison to a wide selection of related desktop offerings—a certain demographic of PC gamers have wondered whether the incoming RDNA 4 generation will produce more options for portable platforms. An extensive Notebookcheck article indicates that Team Red is not (immediately) interested in catering to mobile dGPU enthusiasts—the online publication conducted an interview with Ben Conrad, director of product management (client-side). The "Navi Mobile" Radeon RX 7000M range is an uncommon sight on gaming laptops—relative to NVIDIA's wide rollout of dedicated GeForce RTX 4000 Mobile GPUs—normally, higher-end models are present on ultra-expensive specification sheets (paired with "Dragon Range" Ryzen HX CPUs). Industry experts believe that lower-end options are more likely to turn up inside external enclosures.

One of Notebookcheck's questions focused in on this topic—they believe that: "the number of AMD dGPU-based laptop SKUs have been pretty anemic." Their interviewee was ambushed with a query regarding his company's outlook for mobile RDNA 4 options. In response, Conrad stated: "our current graphics strategy is focused on the desktop market with RDNA 4. So, I think you'll see those types of products first in the future. Certainly, RDNA 4 and future graphics technologies will make it into mobile, whether they be on APUs or future products." VideoCardz has read "between-the-lines" and posits that Team Red could skip a generation—UDNA is possibly a better fit for a new wave of laptop dGPUs. A sort-of stopgap has appeared on the horizon—in the shape of AMD's forthcoming "Strix Halo" RDNA 3.5-based integrated solution. The flagship chip's Radeon 8060S iGPU looks promising when compared to a current-gen dGPU, but it will likely struggle when pitted against Team Green's "Blackwell" dedicated mobile platform. Upcoming competition in the APU field will arrive in the form of Intel's "Panther Lake" processors—slated for launch later this year. Its next-gen iGPU is said to utilize the Xe3 "Celestial" architecture.

Intel product change notification documents—published on January 6—have revealed the planned "End of Life" (EOL) phasing out of 12th Generation "Alder Lake" mobile processor models. Tom's Hardware has pored over the listed products/SKUs and concluded that the vast majority of Team Blue's mobile-oriented Alder Lake selection are destined for retirement. Team Blue's HX series is being kept alive for a little while longer. Two documents show differing "discontinuance timelines" for their respective inventories—including lower-end Celeron and Pentium Gold SKUs, as well as familiar higher-up Core i3, i5, i7, and i9 families. U, P, H and HK-affixed models are lined up for the chopping block.

Intel's 13th Generation "Raptor Lake" mobile processor selection—comprised of Core 100 (series 1) and Core 200 (series 2)—offers similar silicon makeup. Many equivalent alternatives to older generation "Alder Lake" chips reside here—Tom's Hardware presented a key example: "i5-1235U, which is designated for thin and lightweight laptops. OEMs can instead opt for the i5-1335U, the Core 5 120U, or the Core 5 220U, as they're just better bins of the 1235U on the same FCBGA1744 socket." A significant number of Alder Lake mobile SKUs will be available to OEMs for ordering up until 26 April, with final shipments heading out on 25 October. The rest have been assigned a July 25 order cut-off date, with final shipments scheduled on 26 January 2026.

TCL, a pioneer in display across feature-rich smartphones, tablets, and connected devices, is elevating digital experiences to unprecedented levels at CES this year. Building on its comprehensive product ecosystem, TCL unveils the new NXTPAPER 4.0 display technology, the TCL NXTPAPER 11 Plus tablet, and the TCL 60 XE NXTPAPER 5G smartphone, marking significant advancements in enhancing visual clarity and comfort. TCL continues to 'Inspire Greatness' in daily life with the launch of its latest smart connectivity products, along with a strategic partnership with Microsoft to leverage advanced AI in TCL devices, reinforcing the commitment to providing users with innovative and accessible digital solutions.

The Future of Display Technology with TCL NXTPAPER 4.0
Driven by a mission to make technology more human, TCL's pioneering NXTPAPER technology addresses everyday visual comfort challenges as screen usage continues to increase globally. With an unwavering dedication and a strong sense of purpose, TCL has been on a remarkable journey to transform the way we interact with technology.

Acer today launched the new Nitro Blaze 8 and Nitro Blaze 11 handheld gaming devices, designed to elevate mobile gaming experiences with cutting-edge performance and versatile features. Powered by AMD Ryzen 7 8840HS processors, 16 GB of LPDDR5X memory, and up to 2 TB of storage, the Nitro Blaze series boasts lightning-fast performance and responsiveness. Their WQXGA touch panels (8.8-inch or 10.95-inch) featuring Radeon Super Resolution and AMD FidelityFX Super Resolution technology, ensure fluid image quality. The dedicated Acer Game Space application simplifies managing and accessing popular games and applications on handheld gaming PCs.

The new Nitro Mobile Gaming Controller enhances the mobile gaming experience by enabling users to game anywhere and anytime with its foldable design. It supports fast charging to allow uninterrupted gaming sessions while powering mobile devices quickly.