ASUS IoT, a leader in AIoT solutions, today introduces R680EA-IM-Z, a high-performance industrial ATX motherboard built to empower advanced industrial applications with exceptional processing power and robust reliability. Powered by 14th Gen Intel Core processors, R680EA-IM-Z delivers up to 21%-faster CPU performance, providing the optimal foundation for AI-enabled machine vision, robotics and real-time data analysis.

Optimized for data-heavy industrial workloads, R680EA-IM-Z efficiently handles high-resolution image processing and complex algorithmic tasks. Its advanced computing capability ensures seamless integration into intelligent manufacturing and automation systems - where real-time responsiveness and unwavering reliability are essential.

GIGABYTE Technology, a global leader in high-performance motherboards, graphics cards, and hardware solutions, today announces the groundbreaking Ultra Turbo Mode feature for its Intel Z890 series motherboards. This innovative BIOS level enhancement unlocks significant gaming performance boosts of up to 35% without requiring any additional hardware investment. With a simple BIOS update, users can access dramatically enhanced system performance, further solidifying GIGABYTE's commitment to delivering innovative, reliable, and performance-driven solutions.

Maximize Performance without Extra Expense
The Ultra Turbo Mode extracts maximum performance from systems without the need for expensive hardware upgrades. By intelligently optimizing BIOS settings, this revolutionary feature unlocks hidden potential in the latest Intel Core Ultra 2 9/7/5 K-SKU processors. The results are impressive: memory performance achieves a remarkable boost of up to 68% in AIDA64 testing across various high-performance memory configurations. Gaming performance also sees significant gains, with up to 35% higher frame rates in demanding AAA titles like Hitman 3: Dartmoor.

GAMDIAS, a global leader in high-performance gaming hardware, proudly announces the launch of the ATHENA P3, a cutting-edge mid-tower chassis engineered for gamers and PC enthusiasts who demand uncompromising airflow and expansive hardware support. Continuing the legacy of the ATHENA series, the ATHENA P3 features a mesh-dominant front panel with dual solid bar accents, delivering both strong airflow performance and a bold, streamlined design. "Our design philosophy with the ATHENA P3 was to merge premium airflow with visual appeal and builder-friendly features," said Stimson Wang, CEO of GAMDIAS Technology. "This case reflects our pursuit of high-performance computing with seamless aesthetics and thoughtful design elements that elevate any gaming setup."

AIRFLOW-OPTIMIZED DESIGN WITH GAP BRIDGING BRACKET AND HIGH-PERFORMANCE FANS
Built for superior thermal performance, the ATHENA P3 is equipped with three 140 mm PWM ARGB intake fans at the front and a single 140 mm PWM ARGB exhaust fan at the rear, delivering optimized airflow straight out of the box. At the heart of its design is a gap-bridging front bracket, uniquely developed to seal airflow leaks between the mesh panel and the fan mounts—ensuring consistent, focused cooling efficiency. The case also includes a pre-installed 8-port PWM ARGB hub for streamlined control of fans and lighting through motherboard synchronization or the dedicated LED button. A seamless tempered glass side panel offers a clean, unobstructed view of your build, showcasing its cooling power and craftsmanship.

MSI IPC is proud to unveil the MS-CF23, a high-performance Mini-ITX motherboard designed for mainstream embedded and industrial applications. Powered by the latest 15th Gen Intel Arrow Lake-S Core Ultra 9/7/5 Series processors and integrated with the Intel H810 chipset, the MS-CF23 delivers exceptional processing power, enhanced connectivity, and maximum flexibility in a compact size.

Notably, the Arrow Lake Core Ultra processors are Intel's first to include an integrated Neural Processing Unit (NPU), bringing dedicated AI acceleration directly on the chip for smarter and faster edge computing. Engineered to meet diverse application needs such as digital signage, automation, and edge computing, the MS-CF23 offers rich I/O, scalable memory support, and advanced display capabilities, all with robust reliability and simple integration. Ideal for applications such as automation, digital signage, and edge computing, the MS-CF23 is packed with features to support robust computing and connectivity.

MSI listed the MPG B850I EDGE TI WIFI, a Mini-ITX form-format AMD AM5 socket motherboard built around AMD's B850 chipset with support for the latest Ryzen CPU series. The board features an 8+2+1 phase digital VRM with 90 A SPS DrMOS power stages, powered through a single 8-pin EPS connector. It uses a 10-layer PCB with 2oz copper for enhanced conductivity and thermal performance. The motherboard supports DDR5 memory up to 8200 MT/s in a dual-slot, single DIMM per channel configuration. Storage connectivity includes a front-mounted PCIe 5.0×4 M.2 slot with active cooling fan connected directly to the CPU, plus a rear PCIe 4.0×4 M.2 slot through the chipset and two SATA III ports. A single PCIe 5.0×16 slot provides GPU connectivity via CPU lanes.

Networking capabilities include 5 GbE wired connectivity through a Realtek RTK8126 controller and Wi-Fi 7 with 320 MHz channels supporting up to 5.8 Gbps, alongside Bluetooth 5.4. Audio processing uses the Realtek ALC4080 codec. The I/O configuration provides USB-C connectivity at 20 Gbps on the rear panel and 10 Gbps via internal header, multiple USB-A ports ranging from 480 Mbps to 10 Gbps speeds, HDMI 2.1 FRL video output, S/PDIF digital audio, and dual antenna connectors for wireless connectivity. The active cooling fan on the primary M.2 slot addresses thermal management for high-performance PCIe 5.0 SSDs while maintaining the compact Mini-ITX form factor.

The BCM RX880W is a new microATX motherboard built on Intel's latest Core Ultra platform, formerly known as Arrow Lake-S/Arrow Lake-S Refresh, pairing the Intel W880 chipset with the LGA1851 socket to support the 15th Gen Intel Core Ultra processors (Series 2). This board is designed to deliver cutting-edge performance while retaining robust legacy support, making it ideal for hardware and system engineers in the fields of medical & healthcare, industrial & automation, smart retail, digital signage, intelligent Kiosk, Edge AI server, security, and electronics distributors seeking next-generation solutions.

RX880W microATX New Design Features for Edge AI Computing and Compact Storage Servers
High-Performance with AI enabled CPU Support:

• LGA1851 socket supports Intel's latest Core Ultra 5/7/9 processors (Series 2), up to 125 W TDP
• Dual SlimSAS Connectors - High-Speed Storage in Compact Systems
  • The RX880W integrates two SlimSAS (SFF-8654) connectors—a standout feature rarely seen on industrial Micro ATX motherboards. Each SlimSAS supports PCIe Gen 4 x4, enabling flexible, high-bandwidth storage options ideal for dense, compact edge and storage platforms.

It seems as though an official international launch for the elusive AMD Ryzen 9000G APUs might still be on the cards for later this year, after all. While an announcement was expected at Computex 2025, along with a full-scale retail launch later this year, AMD was suspiciously quiet about its CPUs at the electronics trade show. Now, it looks as though Gigabyte has seemingly started preparing its B650 motherboard line-up for the arrival of AMD's Ryzen 9000G APUs.

On Gigabyte's B650 Gaming motherboard memory compatibility page, the hardware maker seems to have replaced any mention of Ryzen 9000 series CPUs with "Ryzen 9000 G-series CPUs," altogether. It's unclear whether this change means the same memory compatibility table will apply for both AMD Ryzen 9000 and 9000G CPUs, but that seems to be the case. At any rate, this leak suggests that previous rumors claiming a Q4 launch may have been correct. Those same leaks suggested that the Ryzen 9000G APUs would feature AMD Zen 5 CPU cores paired with AMD RDNA 3.5 iGPUs, with the top-spec iGPU likely being capable of running at least some lighter-weight games and e-sports titles. As it stands, the iGPUs found in recent AMD Ryzen CPUs are merely there for basic video output and diagnostic purposes, while the G-series APUs are generally intended for use without a dedicated GPU. It seems reasonable to expect AMD to launch at least one variant in the AMD Ryzen 9000G APU series equipped with the Radeon 890M, which also powers some of the most popular Windows gaming handhelds on the market.

ASRock has finally acknowledged that the mysterious AMD Ryzen "processor deaths" plaguing its mid- and high-end motherboards weren't caused by defective AMD chips or stray debris but rather overly aggressive Precision Boost Overdrive settings in its BIOS. After more than 100 reports of Ryzen 7 9800X3D and Ryzen 9 9950X CPUs going dark on boards like the X670E Taichi and B650E Steel Legend, the company rolled out BIOS version 3.25 to dial back the Thermal Design Current and Electrical Design Current limits and apologized for initially blaming memory quirks and socket contaminants. ASRock will repair or replace affected motherboards free of charge (including shipping), though users whose CPUs have already failed must seek warranties through their retailer or AMD.

"No, we're not saying it's an AMD issue. We found that it should be related to our BIOS setting — that's the PBO settings, Precision Boost Overdrive. More technically, we adjusted two main settings in PBO. One is TDC (Thermal Design Current) and the other is EDC (Electrical Design Current). We found that our original values for these two settings might have been too high. So now, with BIOS version 3.25, we lowered the PBO values. We believe this can solve the problem."—Chris Lee, ASRock VP of Motherboard Business

Earlier this month, Bryan Bilowol—of Tech YES City fame—was taken aback by the unexpected "death" of his Ryzen 9 9950X processor, at the alleged hands of an ASRock X870 Steel Legend motherboard. Throughout early 2025, widespread news reports and community tracking efforts have largely implicated ASRock boards. AMD's highly popular Ryzen 7 9800X3D gaming CPU has "fallen victim" on numerous occasions, but a smaller number of incidents have affected non-3D V-Cache equipped Ryzen 9000 "Granite Ridge" models. The Taiwanese manufacturer and Team Red have investigated these problems, and have released fixes via BIOS updates. Despite these efforts, unhappy owners have experienced CPU failures in Q2'25. Following the uploading of initial findings and theories, Bilowol promised further reports. Fortunately, a sit-down—with ASRock's motherboard team—happened late last week, at Computex 2025. At the time of writing, the company has not published an official statement regarding their latest findings or fixes. Tech YES City shared a couple of compelling details in a May 26 YouTube upload (viewable below).

Commenting on the Ryzen 9000 CPU failure situation, Bilowol relayed important ASRock material: (the motherboard team) told me it had to do with the EDC and TDC, which is the electric design current as well as the thermal design current. Essentially, they're saying it's an ampage problem that exists with the precision boost overdrive (PBO) settings. In particular, these mid-range and high-end motherboards—say for instance a B650E or an X670E Taichi or even a B850 Steel Legend—have the ability to run Ryzen 9000 series CPUs at their maximum PBO settings out of the box. What's happening here is ASRock told me they were implementing these settings to what they believe was too aggressive for what the CPUs were able to handle, at least for earlier samples. However, they do promise me that these issues have been fixed with their latest BIOS updates that they're rolling out for these mid-range and high-end motherboards. They also told me that the lower-end boards, say for instance, an A620 HDV or something like that, shouldn't be affected by this issue simply because those PBO settings have been deliberately tuned down, due to the motherboard in question not being a high-end model." Three months back, ASRock's Japanese branch accused the PC hardware community of spreading "misinformation." Hopefully, the latest batch of fixes will bring an end to all Ryzen 9000 CPU + high-end/mid-range ASRock mainboard controversies.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today announced the availability of BIOS updates for its TRX50 motherboard lineup, bringing full support for AMD's latest launched Ryzen Threadripper 9000 series and Ryzen Threadripper PRO 9000 WX-series processors. The new firmware enables users to take full advantage of AMD's cutting-edge TSMC 4 nm processors on GIGABYTE's premium TRX50 platform.

The updated BIOS versions, featuring Combo-AGESA 1.0.0.0 or later version, are now available for download from GIGABYTE's official website. Compatible motherboards include the TRX50 AERO D and TRX50 AI TOP models, both engineered to deliver exceptional performance with the new AMD Ryzen Threadripper 9000 series and Ryzen Threadripper PRO 9000 WX-series processors.

Sapphire brought unique new hardware to Computex 2025. We begin our tour with the new Sapphire Edge AI line of mini PCs. First up, is the Edge AI 370, a mini PC measuring 117 mm x 111 mm x 30 mm (WxDxH). It is powered by AMD Ryzen AI 9 HX 370 "Strix Point" mobile processor, with two DDR5 SO-DIMM slots supporting up to 96 GB of memory. Storage comes from a 1 TB Gen 4 NVMe SSD. The CPU is configured with 12 cores (4x Zen 5 + 8x Zen 5c), while the maxed out RDNA 3.5 iGPU has 16 CU. The XDNA 2 NPU is clocked for 50 AI TOPS, and meets Microsoft Copilot+ requirements.

Next up, is the Sapphire X870EA Wi-Fi PhantomLink Edition motherboard. This is Sapphire's first high-end motherboard in years. The Socket AM5 motherboard is based on the flagship AMD X870E chipset, and offers premium connectivity and I/O features. It's also designed to visually match the company's latest Radeon RX 9070 XT NITRO+ graphics card, but its most striking feature is PhantomLink. This is a backside power delivery feature similar to ASUS BTF. The main PCI-Express 5.0 x16 slot has a trailing power delivery slot that relays power from a 12V-2x6 power input located next to the 24-pin ATX connector on the motherboard. This may not be a complete backside I/O motherboard, but at least keeps the graphics card free from any power cables sticking out. To use PhantomLink, however, you need a compatible graphics card, and Sapphire showed us the Radeon RX 9070 XT NITRO+ PhantomLink Edition.

GIGABYTE has just rolled out its refreshed Z890 AORUS Tachyon ICE CAMM2 motherboard, designed to give overclockers and power users a serious edge. The biggest change is support for CAMM2 DDR5 memory modules, which offer cleaner signaling and much higher speeds compared to traditional DIMMs. At first glance, the new board looks a lot like the previous Tachyon ICE model. It still features the distinctive 90-degree rotated CPU socket and top-mounted memory slots. But instead of multiple DIMM slots, you now get a single CAMM2 connector. That slot comes with a toolless heatsink for better cooling—no fiddly screws required, just snap it on and you're ready to push your memory harder. If you're into extreme memory overclocking, the original Z890 AORUS Tachyon ICE recently set a world record at DDR5-12752 thanks to GIGABYTE's in-house expert, HiCookie, using V-Color's Manta Xfinity RGB modules. That achievement shows just how far this platform can be pushed. We recently reported on G.Skill offering a DDR5-10000, 64 GB of density (2-channels or 4 sub-channels), and timings of CL56-70-70 in CAMM2 form factor. That might be interesting to keep an eye on in the future, as it is definitely a new possible world-record contender.

ASRock proudly announces that its WRX90 WS EVO and TRX50 WS workstation motherboards now offer full support for AMD Ryzen Threadripper Pro 9000 and Threadripper 9000 series processors, delivering outstanding computing performance for HEDT & Workstation platform. Featuring the latest Zen 5 architecture, the AMD Ryzen Threadripper Pro 9000 / Threadripper 9000 series processors boast up to 96 cores and supports more PCIe 5.0 lanes, setting a new benchmark for industry-leading performance.

ASRock WS series motherboards, including the WRX90 WS EVO and TRX50 WS, support AMD Ryzen Threadripper Pro 9000 / Threadripper 9000 series processors through a simple BIOS update, which is now available to download from ASRock official website.

In addition to new graphics cards, ASRock also showcased a couple of new motherboards at the Computex 2025 show in Taipei, including the new X870E Taichi OCF, X870 Taichi Creator, as well as the new Phantom Gaming X870 Nova Wi-Fi motherboard.

The star of the show is the new X870E Taichi OCF, which is also the first OC Formula motherboard based on AMD platform. This feature packed motherboard will support AMD Ryzen 9000, 8000, and 7000 series processors on AM5 socket. It features a 25-power phase VRM with 110A SPS, has two DDR5 DIMM slots, two PCIe 5.0 x16 and single PCIe 4.0 x4 slot, a total of six M.2 ports (two of which are PCIe Gen 5 x4), plenty of USB ports, 5 Gbps Ethernet, integrated Wi-Fi 7 and Bluetooth, and most importantly, "Professional Overclocking Toolkit", which means that this one is aimed at some high overclocking. ASRock also showcased the new X870 Taichi Creator, a more standard motherboard that has 21-phase VRM design, but comes with Marvell's 5 Gbps and 10 Gbps Ethernet ports.

MSI's Computex booth has prepared new products for everyone, even for overclockers in microATX form factors. The company has presented a microATX MPOWER B850E motherboard, as we expected the MPOWER series comeback, with a very simple visual layout, aiming to please overclockers and even extreme LN2 users, with little add-ons to obstruct operations. Based on the B850E chipset, it accommodates AM5 processors with up to 16 cores and 32 threads in the top-end AMD Ryzen 9 9950X SKU. There are two eight-pin CPU connectors instead of the regular single eight-pin connector, for more overclocking headroom. VRM phases are covered in low-profile heatsinks so that LN2 coolers, often large and chunky, don't interfere with motherboard elements, which would usually require removal and later thermal isolation. What is particularly interesting is the usage of two memory DIMM slots, which is ideal for overclocking as it requires less CPU signaling to the memory. For easy signaling, MSI's EZ dashboard integrates power, reset, clear CMOS buttons, and a debug LED for CPU status codes.

ASRock, a global leader in motherboards, graphics cards, mini PCs, power supplies, and gaming monitors, is excited to announce the participation in Computex Taipei 2025. Under the theme Gaming Beyond Limits, AI Beyond Imagination, ASRock will showcase the dual focus on next-level gaming and AI applications. From immersive gaming setups to AI solutions, the exhibit highlights ASRock's commitment to innovation across both fields. Visitors are invited to explore the latest products and technologies, and to experience the Phantom Gaming Zone at booth L0818.

ASRock Unveils Flagship Taichi OCF and Taichi Creator AM5 Motherboards
To expand its success on AMD AM5 motherboards, ASRock will be adding more exciting products into its product portfolio. New product such as X870E Taichi OCF, the very first OC formula motherboard based on AMD platform, Phantom Gaming X870 Nova WiFi, the new high end gaming motherboard based on X870 chipset, a functional yet elegantly designed X870 Taichi Creator and also a lot more products that are based on X870 / B850 / B840 / A620A chipset.

Today, MSI announced a lineup of entry-level servers and server motherboards powered by AMD EPYC 4005 Series Processors. Featuring up to 16 cores based on the Zen 5 architecture, these platforms deliver the performance, efficiency, and cost-effectiveness that small businesses, new business owners, and system integrators need to build reliable infrastructure, all within limited IT budgets and space footprints.

"We see this launch as a way to make enterprise-grade compute more accessible to smaller organizations," said Danny Hsu, General Manager of MSI's Enterprise Platform Solutions. "By pairing AMD EPYC 4005 Series Processors with MSI's proven hardware design, we're delivering practical, scalable server solutions built for real-world business scenarios—from private cloud and storage to web hosting and office IT systems."

GIGABYTE TECHNOLOGY Co. Ltd, the world's leading computer brand, continues to redefine DIY PC building with its innovative Project STEALTH, first introduced in 2022. The Project STEALTH concept was the industry's pioneer in adopting reverse-connector motherboards for a cleaner, more streamlined assembly. Now, responding to the growing demand for all-white and cableless PC builds, GIGABYTE launches the STEALTH ICE Series, featuring the AMD X870 and B850 chipset motherboards.

Beyond aesthetics and easier assembly, GIGABYTE ensures that the Project STEALTH build is highly compatible. In addition to supporting its own chassis lineup (GIGABYTE C500P STEALTH Series), GIGABYTE has partnered with over 10 renowned case manufacturers, including Corsair, Cooler Master, Fractal Design, Phanteks, and more, to provide reverse-connector-ready cases across more than 25 models. This makes the GIGABYTE Project STEALTH Series the most compatible, the most widely supported and flexible solution in the market for cableless PC builds.

Unlucky owners of AMD Ryzen 7 9800X3D processors have encountered major problems that largely involve ASRock motherboards. Throughout early 2025, user feedback provided insight into numerous cases of "catastrophic CPU failures." Members of the official ASRock subreddit have kept track of these unfortunate incidents; now closing in on 200 documented "murdered" specimens. Industry watchdogs reckon that even more disagreements—involving the Zen 5-based 9000X3D series and ASRock B- and X- (AM5) boards—exist outside of this community-aggregated log. At the end of February, ASRock pushed out an important BIOS update—this fix did not resolve all problems. Over a month later, AMD weighed in with their findings—in response, ASRock released another update.

Evidently, Ryzen 7 9800X3D products continue to perish—Tech YES City's Bryan Bilowol has added Team Red's Ryzen 9 9950X model to the mix. The tech YouTuber was surprised by the death of his example; apparently caused by an ASRock X870 Steel Legend mainboard. Standard "Granite Ridge" processors—that lack 3D V-Cache—have received less attention, but observers believe that these non-X3D options are still vulnerable. Bilowol did not personally experience the moment of catastrophe—instead, a friend was borrowing an affected PC build. As demonstrated in a new Tech YES City video post-mortem, the completely dead CPU sported some worrying gray marks. Tech YES City has a fairly large audience, so ASRock leadership will likely be cursing after noticing another uptick in public scrutiny. Past reports have pointed out the manufacturer's belief that too much "misinformation" is being spread. Bilowol surmised that the company is keeping this issue: "under the radar—they seem to be hoping that the issue will just go away." Despite collaborating with ASRock for over a decade, Tech YES City will not pull any punches—await for more gory details in upcoming follow-up investigations.

GIGABYTE Technology, one of the top global manufacturers of motherboards, graphics cards, and hardware solutions, is proud to announce that its cutting-edge motherboard lineup has been honored with the coveted 2025 IF Design Awards. This recognition celebrates GIGABYTE's commitment to exceptional design, functionality, and innovation in the competitive computing hardware landscape. The award-winning motherboard series exemplifies GIGABYTE's dedication to creating products that seamlessly blend technological innovation with thoughtful design principles. Each board showcases GIGABYTE's meticulous attention to both performance and aesthetics.
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The winning motherboard includes:

• B650E AORUS STEALTH ICE delivers the world's first pure white reverse connector motherboard, enabling a virtually cable-free desktop with faster assembly, improved airflow, and enhanced performance in an uncluttered, spacious design.
• The Z890 AERO G, engineered specifically for content creators, delivers superior performance for demanding tasks including 3D rendering and video editing.
• The TRX50 AI TOP workstation motherboard features an innovative design optimized for unparalleled performance and scalability, meeting the rigorous demands of AI training and high-performance computing applications.
• The revolutionary Z890 AI TOP motherboard enables AI fine-tuning capabilities directly at your desk, exceling in scalability, next-generation connectivity, and innovative DIY-friendly designs.

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Sapphire Technology has revealed another new motherboard design; the PURE B650M WIFI. As of late last week, this "polar white" model was introduced as a natural accompaniment to similarly pale graphics card options—one promotional shot had the newly launched product sat next to the manufacturer's PURE Radeon RX 9070 XT SKU. Sapphire's shift into motherboard territories is a relatively new endeavor; a premium NITRO+ B650M WIFI SKU was showcased last year. A B850 chipset-based successor was released in China, just over two months ago. A likely budget friendly offering was previewed around mid-April: PULSE A620AM WIFI. The PURE B650M WIFI's overall aesthetic brings ASRock's various compact Steel Legend board designs to mind.

Sapphire's official Weibo account positions the freshly unveiled PURE model as a mid-tier option: "the overall design style of this (microATX) motherboard is simple and stylish. Neither the PCB nor the heat dissipation armor is overly complicated." Despite these modest provisions, the PURE B650M WIFI is still a very capable piece of kit—the article's author delved into some technical nitty-gritty: "this motherboard (uses) a 12+2+1 power supply module. PWM control is RT3678BE, MOSFET is DrMOS from ALPHA & OMEGA with part code EX00. I checked the official website but couldn't find the specific model, it should be a new model. After asking Sapphire officials, I learned that the code is actually AOZ5510QI, a 55 A DrMos. Therefore, the power supply capacity of this motherboard is as strong as other Sapphire models, and can drive the current flagship Ryzen 9000X3D processor to full output." Regional reviewers seem to possess evaluation samples, but the brand has not yet announced an upcoming retail launch in China.

Minisforum is working on a new MoDT (Mobile on Desktop) motherboard lineup featuring mobile versions of AMD Ryzen processors, one of them being the F1FGM model. The motherboard came in a compact microATX form factor built around the AMD X870M chipset and is equipped with the latest AMD Ryzen 9 9955HX processor rather than traditional socket-type processors. This CPU has a boost clock of up to 5.4 GHz and is based on the Zen 5 architecture offering 16 cores, 32 threads, and 64 MB of L3 cache. Interestingly, even if this processor is rated at 55 W by default, in this particular Minisforum implementation it can be pushed up to a whopping 160 W. To efficiently dissipate the substantial 160 W thermal output and considering that mobile CPUs don't have an IHS, the motherboard comes equipped with a pre-installed vapor chamber heat spreader. The VRM features a solid design with 13-phase 60 A SPS DrMOS. Minisforum has also included large heatsinks across the VRMs, M.2 Slots and PCH.

For expansion, the Minisforum F1FGM motherboard offers one PCIe 5.0 x16 slot and one PCIe 4.0 x16 slot. Storage interfaces include one PCIe 5.0 compatible M.2 slot, three additional M.2 slots (one is rated at Gen 5 x4), two SATA 6 Gbps connections and two BIOS Debug LEDs. On the connectivity side it features two USB4 ports, one HDMI, one DisplayPort, five Gigabit Ethernet, and Wi-Fi 7 compatibility. The four 5 V ARGB LED control pin headers is a clear step towards DIY users and according to company representatives, the main competition for this motherboard will be ASUS ROG products. PCWatch reports that Minisforum intends to offer the F1FGM motherboard at a price point comparable to a standalone desktop CPU in the second half of this year.

MSI proudly announces full support for Intel 200S Boost technology for the latest Z890 motherboard lineup, empowering gamers, creators, and enthusiasts to unlock next-level performance with a single click. Intel 200S Boost is a cutting edge memory enhancement technology that allows users to safely elevate DDR5 memory performance when paired with Intel Core Ultra 200S Series Desktop "K-SKU" processors and "Z890 series motherboards". To fully optimize this feature, MSI has forged strong partnerships with leading memory brands. Together, we've rigorously tested and validated a wide range of DDR5 modules to meet Intel 200S Boost standards, delivering exceptional performance, stability, and compatibility. Learn more about Intel 200S Boost.

Once a compatible processor and supported memory kit are installed, users can instantly activate 200S Boost via MSI Click BIOS X, no manual tuning or technical expertise required. This one click feature enables real performance improvements in gaming, content creation, and everyday multitasking. To support this breakthrough, MSI has released the latest BIOS for all Z890 series motherboards, ensuring full compatibility with Intel 200S Boost. Users are encouraged to visit MSI's official website and product pages for the latest BIOS updates.

Introducing the MS-CF20, a high-performance ATX motherboard with the Intel W880 chipset, supporting the 15th Gen Intel Arrow Lake-S Series processors. Designed to meet the needs of advanced computing applications, the MS-CF20 combines next-generation CPU support with robust legacy features, offering unparalleled versatility for both modern and existing systems.

The MS-CF20 supports Intel Core U9/U7/U5, Pentium, and Celeron processors, leveraging the latest advancements in Intel 15th Gen Arrow Lake-S technology. With higher core counts, improved instructions per clock, and greater energy efficiency, the new processors deliver exceptional performance for demanding and AI-driven workloads. The board is equipped with 4 DDR5 UDIMM slots, supporting both ECC and non-ECC memory at speeds up to 5600 MT/s and a maximum capacity of 192 GB, enabling unmatched performance for data-intensive applications.

GIGABYTE Technology, one of the top global manufacturers of motherboards, graphics cards, and hardware solutions, is pleased to announce that our entire line of Intel Z890 motherboards now fully supports Intel 200S Boost technology, offering gamers a simple way to enhance performance while maintaining warranty protection.

Intel 200S Boost delivers pre-configured overclocking profiles for Intel Core Ultra 200S Series processors that enhance gaming performance by raising frequencies across processor components for improved framerates and system responsiveness. GIGABYTE Z890 motherboard owners can activate this feature with a simple one-touch profile in the BIOS, eliminating traditional overclocking guesswork while supporting blazing-fast Intel XMP profiles up to DDR5-8000. Best of all, Intel 200S Boost is fully covered under Intel's 3-year processor warranty, allowing gamers to enjoy performance benefits without traditional warranty concerns.