Taiwanese press outlets have put a spotlight on an inexplicably devised "GIGABYTE RTX 5090 Super Bundle." According to regional reports, a local company—Deyuan Computer—has listed this unusual multi-piece package on Taiwan's MOMO e-commerce platform. GeForce RTX 5090 graphics cards are a hot commodity nowadays—unfortunately, limited supplies and scalping activities have created a volatile environment for regular punters. Retail outlets have implemented various "nifty" sales methods in attempt to create a fairer buying environment—pre- and post-launch. Hong Kong's HKEPC Media has acknowledged that locals are very used to a "bundling culture" that requires the purchase of superfluous extra items.

By comparison, these offerings look quite reasonable when lined up against a Taiwanese business dealing in staggeringly silly combination platters. To claim ownership of a single GIGABYTE RTX 5090 GAMING OC graphics card, potential buyers are strong-armed into adding forty(!) GIGABYTE H610M-K-DDR4 motherboards to virtual shopping carts. A grand total expenditure of NT$191,500 (~$5832 USD) unlocks "GIGABYTE RTX 5090 Super Bundle" ownership. By itself, the high-end/award-winning GIGABYTE graphics card would cost NT$91,900 (~$2796 USD). An individual entry-level H610M-K-DDR4 Micro ATX model comes in at NT$2490 (~$76 USD). Willing customers will have to deal with an inventory of slightly outdated motherboards—a full build's worth of components would make more sense. Around late January, Taiwan's AutoBuy advertised an anti-scalping deal for GeForce RTX 5080 cards—requiring shoppers to load up on parts for a near complete Intel Core Ultra 200S CPU-based system.

COLORFUL has introduced a compelling new "X3D Gaming Mode" for its AM5-socketed motherboard models. The Chinese manufacturer previewed this newly supported feature via their official Weibo video channel—naturally, this mode was advertised as working in conjunction with compatible AMD Ryzen 7000X3D and 9000X3D processors. Curiously, COLORFUL did mention that non-3D V-Cache-equipped AM5 CPUs can work with their "X3D Gaming Mode." The aforementioned preview video demonstrates this new feature—accessed via the showcased B650 motherboard's BIOS interface—disabling Simultaneous Multi-Threading (SMT) on an involved processor. The population of dual-CCD Team Red 3D V-Cache models is set to grow this month, with the upcoming launch of Ryzen 9 9950X3D and 9900X3D chips.

COLORFUL's X3D Gaming Mode is touted to improve performance on dual-CCD CPUs, since it will disable the second unit. By transferring workloads to the (active) primary CCD, latency is reduced—thus boosting in-game performance. COLORFUL claimed that frame rates—in PUBG—increased by 17%, following the enabling of their snazzy X3D Gaming Mode. Wccftech opined on this scenario: "for processors like Ryzen 9 9900X3D and Ryzen 9 9950X3D, the X3D Gaming Mode is more ideal than on the single CCD non-X3D processors (e.g. Ryzen 7 9800X3D). Keep in mind that the performance of the Ryzen 9 9900X3D may be affected noticeably when one of its CCDs gets disabled. Since the processor brings only six cores on each CCD, it may not be ideal for a lot of users...Colorful's X3D Gaming Mode reminds us of Gigabyte's X3D Turbo Mode, but the latter works a bit differently and doesn't disable SMT or CCD but tweaks some CPU parameters." A "halved" Ryzen 9 9950X3D (16-core) is expected to behave in a similar manner to the current reigning champion (8-core) within gaming ecosystems.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, storage devices, and IPC solutions, today introduced the new B850MT2-E DJ motherboard. Built on AMD's B850 chip architecture, B850MT2-E DJ is tailor-made for casual home and office use.

Engineered to support the latest AMD Ryzen 9000, 8000, and 7000 series processors, the B850MT2-E DJ ensures seamless multitasking and efficient power management, making it an ideal choice for modern computing needs. Supporting up to 128 GB of DDR5 across two DIMM slots, the B850MT2-E DJ offers more bandwidth than DDR4, delivering faster data access and smoother performance. Additionally, PCIe 4.0 M.2 support provides lower latency and lightning-fast speeds of up to 64 Gb/s, doubling the bandwidth of PCIe 3.0 M.2 for quick data transfers and minimal load times, ensuring a smooth and efficient user experience.

ASRock, a global leader in motherboards, graphics cards, mini PCs, power supplies, and gaming monitors, has observed reports on Reddit from users experiencing unexpected boot issues and error codes when using ASRock AM5 motherboards paired with minority proportion of AMD Ryzen 9000 series processors. To enhance user experience, ASRock promptly released the latest 3.20 Beta BIOS for its AM5 series motherboards, further improving AMD Ryzen 9000 series processors boot issues.

Users can download and install the BIOS from the official ASRock website or use the BIOS Flashback function on their motherboard for a quick update. ASRock also promises to continue enhancing the compatibility of its products.

MSI is pleased to announce support for the upcoming AMD Ryzen 9 9950X3D and 9900X3D processors, built on the Zen 5 architecture and featuring AMD's cutting-edge 2nd generation AMD 3D V-Cache technology. This innovative technology is designed to significantly increases the cache size, allowing faster data access and improved performance. Engineered to deliver exceptional performance, these processors meet the demands of even the most intensive gaming and content creation workloads.

At the heart of this experience is the MSI MEG X870E GODLIKE motherboard, which sets a new standard with its innovative design and robust features. The Dynamic Dashboard III, a 3.99-inch full-color LCD, offers real-time hardware monitoring, troubleshooting, BIOS update status, clock display, and personalization options, enhancing user experience and system control. MSI's EZ Link design complements this, streamlining cable management by consolidating the front panel, fan, and RGB headers into the EZ Bridge and EZ Control Hub, ensuring a cleaner build and simplified installation process.

MSI is excited to partner with SEGA for an exclusive limited-time offer! From February 20 to March 20, 2025, customers who purchase selected MSI Z890 Series Motherboards will receive a FREE Like a Dragon: Pirate Yakuza in Hawaii game key. Dive into the pirate adventure and level up your gaming experience today!

About Like a Dragon: Pirate Yakuza in Hawaii
Step into the boots of a pirate with no memory and a fierce desire to uncover your past. Sail the dangerous, treasure-filled seas of Hawaii, battling ruthless enemies and forging alliances. Every decision shapes your journey - recruit a crew, hijack ships, and explore the lawless island of Madlantis. With thrilling combat, a gripping story, and unforgettable characters, this is a world where danger and treasure await at every turn. The fate of the seas is in your hands - will you conquer the waves, or be lost to the tides forever?

Press outlets have spotted two new B650M motherboard models on ASRock's product site; the B650M Pro X3D and B650M Pro X3D WiFi (6E). According to the manufacturer's descriptions, both are advertised as: "optimized for AMD Ryzen X3D processors, delivering superior stability, compatibility, and enhanced performance, making it ideal for gaming and creating." The "Pro X3D" SKUs have not launched at retail, so pricing information is not available at the time of writing. ASRock could publish a dedicated press release in the near future, but we are looking at a very quiet reveal. Curiously, the Taiwan-based motherboard and graphics card specialist has seemingly "downcycled" its fairly new B850M Pro "Race Sport" RS board design.

VideoCardz's coverage of the Pro X3D series includes a handy image comparison tool. When lined up against each other (visually), the B650M Pro X3D and B850M Pro RS designs are nigh identical. Two of the images (below) show a minor difference in printed-on model names. As expected, the ASRock website comparison tool reveals only minor disparities between respective specification sheets. The standard B850M Pro RS variant is currently on sale for $148 (normally $180). The B650M Pro X3D (non-WiFi 6E) equivalent could arrive at retail with a slightly lower price point. ASRock has signalled that its "Pro X3D" mainboard series will only be available within certain regions. According to VideoCardz, a comprehensive global rollout is not planned.

One feature that gamers have loved about AMD Ryzen processors is the company's commitment to socket longevity. If you have a PC with an AMD Ryzen 7000 Series CPU and an AM5 motherboard, for example, you're able to upgrade to an AMD Ryzen 9000 Series CPU without stripping your PC down to the studs and replacing the motherboard. But perhaps you're starting from scratch with your first AM5 PC. In that case, you have several years' worth of AM5 motherboard options to consider, including the TUF Gaming B850-Plus WiFi from our B850 motherboard family.

For years, one of the most popular AM5 motherboards has been the TUF Gaming B650-Plus WiFi. This rock-solid, battle-proven board delivers on all fronts with its durable design, comprehensive cooling, and ruggedized aesthetic. Yet if you're building a new PC in 2025, we think you'll be happier in the long run with this board's successor, the TUF Gaming B850-Plus WiFi. Armed with key updates like a bolstered power solution, PCIe 5.0 x16 slot, Wi-Fi 7, and more and faster USB ports, this motherboard offers incredible value for your gaming rig.

Sapphire Technology has introduced a new NITRO+ motherboard model in China—weekend reports pointed to a listing on JD.com, where the latest addition resides alongside various previous-gen B650 options. This appears to be another region specific release—priced at 1299 RMB (~$179 USD). The NITRO+ B850M Wi-Fi model seems to share its overall aesthetic design with the preceding B650M-equipped equivalent. As surmised by VideoCardz, the Sapphire NITRO+ board's VRM patterning reminded them of the leaked premium-tier Radeon NITRO+ RX 9070 graphics card series.

The generational jump from AMD B650 to B850 chipset—as expected—yields only minor benefits (see below). The older NITRO+ B650M Wi-Fi model is a significantly cheaper prospect; coming in at 899 RMB ($124 USD). VideoCardz's weekend detective work settled on a nice improvement: "based on our research, the memory overclocking support has increased from 7600 MT/s+ to 8000 MT/s. Keep in mind that these figures may be higher for both motherboards; this is just what Sapphire guarantees when paired with a supported memory kit." Industry watchdogs believe that ASRock is likely involved in the contract manufacturing of Sapphire's motherboard offerings—the former has been long-involved in pumping out NZXT-badged products.

Late last week, Colorful Technology revealed a brand-new series of "CVN" motherboards—the manufacturer's Bilibili account hinted at an upcoming launch and uploaded three highly-stylized promotional images. As reported by ITHome, Colorful's debut AMD X870 chipset-based board will be: "equipped with Colorful's first-generation graphics card quick-release device." Western press outlets have covered the functional validity of similar systems in recent times, but Colorful's teaser seems to be poking fun at a rival's current predicament. The incoming CVN X870 series will sport a unique selling point; its GPU removal system features an "ON or OFF" switch. Colorful advertises this proprietary design as being "really safe."

CVN X870 or X870E product pages have not appeared online, but ITHome reckons that this new range will sit in-between Colorful's familiar iGame and Tomahawk motherboard lines. The intended target audience appears to be "mainstream DIY" builders. According to one of the teaser images, Colorful reckons that its silver/white-tinted CVN X870 boards will "live up to expectations." The Chinese manufacturer has devised a new "Frost Armor" structure that covers a board's VRM sections—sporting "composite heat dissipation grooves and heat pipes." Lower-end CVN B840 and B850 models could be in the pipeline, but Colorful is likely testing the waters with its initial launch of X870-equipped fare.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, PC peripherals, and IPC solutions, proudly unveils the B860MT-E PRO motherboard, designed to meet the growing needs of modern office users, home entertainment, and mid-range gaming. The B860MT-E PRO, built on Intel's B860 single-chip architecture, supports Intel Core Ultra 9/7/5 processors, providing outstanding performance and advanced AI PC features for seamless computing, entertainment, and gaming. With support for up to 256 GB of 4-DIMM DDR5 memory, it effortlessly handles heavy multitasking and demanding generative AI applications.

Featuring PCIe 5.0 M.2, the latest storage technology, it offers a significant performance boost—doubling the speed of its predecessor with a data transfer rate of up to 32 GT/s and a maximum bandwidth of 128 GB/s for smooth, high-speed communication. Backward compatibility ensures a seamless user experience for those upgrading their systems.

MSI introduced an impressive number of new AMD B850 and B840 chipset-based motherboards at January's CES trade event. According to a Wccftech report, the company's AM5—socketed lineup will expand in the near future—a leaked presentation slide provides an early preview of (allegedly) incoming budget-friendly offerings. MSI's leaked roadmap (Q1 to Q2 2025) shows new additions—mostly smaller form factor—across performance (MPG) and Pro Series product ranges. Their Arsenal Gaming (MAG) B850 range seems to be fully released, as of the first quarter of this year—consisting of models already unveiled at CES.

Five new models are seemingly lined up for release within the next couple of months—the Wccftech article listed the following SKUs: MPG B850I Edge WIFI (Mini-ITX), PRO B850M-P WIFI (M-ATX), PRO B850M-B (M-ATX), B850 Gaming PLUS WIFI PZ (ATX) and PRO B850M-A WIFI PZ (M-ATX). The publication commented on its discoveries: "as you can see, MSI will have at least one new variant within the MPG lineup which will feature a Mini-ITX design. The company has already released the full ATX-sized version of the EDGE TI WIFI, and it's nice to know that we will get a Mini-ITX variant too." The report proposes that MSI has prepped its new budget models with the latest connectivity features—most notably, Wi-Fi 7 rated at the full 320 MHz band. Support for Zen 4 and 5 Ryzen X3D CPUs is expected upon launch.

ChangXin Memory Technology (CXMT) is playing catch up with competitors based in neighboring nations—as reported earlier today, this Chinese memory module manufacturer is making advancements in the field of commercial DDR5 products. Reports from the region suggest that a well-known motherboard manufacturer has embraced some of ChangXin new portfolio. According to a recent ITHome article, MSI has implemented a multitude of optimizations for new-ish Intel "Arrow Lake" Core Ultra Series 2 CPU-oriented motherboards—notably the MAG B860 TOMAHAWK WIFI, MAG B860M MORTAR WIFI, and PRO B860M-A WIFI models.

The publication provided evidence of MSI enabling transfer rates of 6800 MT/s across four engaged modules—a welcome step up from the usual twin-stick setup. ITHome also points out that the motherboard specialist has prepared a new BIOS version for B860 chipset mainboards: "specially optimized for the recently popular DDR5 domestic memory particles of ChangXin Storage, which undoubtedly gives the gaming community (in China) more choices." MSI appears to be the first major international vendor to enable support for CXMT's DDR5 modules—thus, representing a significant achievement for the Chinese memory industry.

MSI has provided a detailed look into its motherboard production facilities through a new interactive webpage. The company has outlined the 15-step manufacturing process that transforms bare circuit boards into complete motherboards. The process begins with solder paste printing, where a precise layer of conductive paste is applied to the bare PCB. This is followed by automated inspection using imaging systems to verify proper paste placement. High-speed machines then position electronic components onto the board before they move through reflow ovens that permanently bond the components. Multiple inspection stages are integrated throughout the assembly line, including automated optical systems that check both sides of the board. Specialized machines handle routing, component insertion, wave soldering, and alloy welding.

Each board undergoes circuit testing and receives mechanical components through automated screw-locking systems before final functional testing and molding. The complexity of modern motherboard manufacturing requires rigorous quality checks and final power tests before the motherboard leaves manufacturing facilities. For interested enthusiasts, MSI's new landing page is here. The manufacturing reveal accompanies MSI's launch of two new motherboard series—Z790 and B860. To celebrate this launch, MSI has announced promotional events running from January 20 to March 31, 2025, including Steam game codes with select product purchases. A new reward program offers points for product reviews and referrals.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, PC peripherals, and IPC solutions, introduces the B850MT-E PRO motherboard, designed to deliver exceptional performance for office professionals and casual use. The BIOSTAR B850MT-E PRO motherboard is designed to meet the diverse needs of various users, offering a perfect blend of performance and reliability. Built on AMD 's B850 chipset, this motherboard combines superior features at an affordable price. It supports the latest AMD Ryzen 9000, 8000, and 7000 series processors, enabling seamless multitasking and efficient power management.

The B850MT-E PRO is expertly engineered for versatility, making it the definitive solution for office professionals, small businesses, and system integrators. It guarantees stable and efficient performance for everyday tasks and document management. With BIOSTAR's renowned 55 A Dr. MOS and Digital PWM technology, you can expect steady power delivery that ensures consistent performance and enhanced durability, even during extended work sessions.

GIGABYTE, the world's leading computer brand, unveils the new generation of Intel B860 and AMD B850 series motherboards at CES 2025. These new series are designed to unleash the performance of the latest Intel Core Ultra and AMD Ryzen processors by leveraging AI-enhanced technology and user-friendly design for a seamless gaming and PC-building experience. Equipped with all digital power and enhanced thermal design, GIGABYTE B800 series motherboards are the gateway to mainstream PC gamers.

GIGABYTE achieved the remarkable milestone of claiming the highest market share on X870 series motherboards due to fully supporting AMD Ryzen 5 7000 and 9000 series X3D processors. The new B800 series motherboards are also adopted with ultra-durable and high-end components and the revolutionary AI suite, D5 Bionics Corsa, integrates software, hardware, and firmware to boost DD5 memory performance up to 8600 MT/s on AMD B850 models and 9466 MT/s on Intel B860 motherboards. The AI SNATCH is an exclusive AI-based software for enhancing DDR5 performance with just a few clicks. Meanwhile, the AI-Driven PCB Design ensures low signal reflection for peak performance across multiple layers through AI simulation. Plus, HyperTune BIOS integrates AI-driven optimizations to fine-tune the Memory Reference Code on Intel B860 series motherboards for high-demand gaming and multitasking. Specially built for AMD Ryzen 9000 series X3D processors, GIGABYTE applies X3D Turbo mode on AMD B850 series motherboards by adjusting core count to boost gaming performance.

Earlier in the week, ASRock debuted its Intel B860/H810 and full range of AMD B850 motherboards—the TechPowerUp team headed across CES 2025's showroom floor to check whether the Taiwanese manufacturer had some of these newly announced products on display. Various white Steel Legend models were present, including an intriguing B850 mainboard sample sporting ASRock's back mount design (BMD). The B860M Pro BMD board was not in sight (or not captured on camera)—according to a press release from earlier in the week, BMD had its premiere on this Intel-based solution.

AsRock reps happily showed off two Intel B860-chipset Steel Legend boards with traditional all-front facing connectors—an ATX option as well as an M-ATX (B860M) model were examined from close-up. A Phantom Gaming B860 Lightning Wi-Fi model was presented to TechPowerUp—its darker aesthetic contrasts sharply when lined up against its pale Steel Legend neighbors.

ASUS extended its line of motherboards at CES 2025, featuring a design that moves power connectors to the back of the board. The company calls this approach "BTF" (Back To Future), aiming to improve cable management in PC builds. The TUF GAMING B850-BTF WIFI and B860-PLUS WIFI models demonstrate this new design, which can deliver up to 600 watts through the motherboard to support modern graphics cards. The boards include Wi-Fi 7 connectivity, PCIe 5.0 support, and multiple M.2 slots for storage devices. In the high-end segment, ASUS presented the ROG Maximus Z890 HERO BTF, compatible with Intel's LGA1851 processors. This board features DDR5 memory support, dual Thunderbolt 4 ports, and tools like Q-Release for easier graphics card removal.

For professional users, ASUS released the ProArt Z890 CREATOR WIFI, equipped with Thunderbolt 4 ports and specialized cooling systems. The company also showed new gaming-focused models including the ROG Crosshair X870E APEX, for the fastest Ryzen 9000X3D series gaming processors. The motherboards share several technical features across different price points. All models support PCIe 5.0 for graphics cards and storage, while most include Wi-Fi 7 capabilities. ASUS has added tool-free installation mechanisms for M.2 drives across the lineup. ASUS has not yet announced pricing or specific release dates for the new motherboards. The BTF design represents a significant change in motherboard layout, though it will require compatible PC cases and power supplies to function as intended. This marks one of the first major changes to standard motherboard design since the ATX format became common in the 1990s.

ASRock Industrial is proud to announce the launch of its highly anticipated NUC(S) Ultra 200 BOX Series and NUC Ultra 200 Motherboard Series built to revolutionize AI-driven computing. Powered by Intel Core Ultra 200H processors (Arrow Lake-H), the series delivers up to 99 TOPS of AI inferencing power, offering cutting-edge performance in a compact form factor. Designed to meet the growing needs of industries such as AI-enhanced business operations, immersive content creation, and high-performance gaming, the NUC(S) Ultra 200 BOX Series is engineered to provide next-level computing power with Intel's latest performance hybrid architecture, Intel Arc GPU, and NPU.

These compact systems are built for users who demand powerful multitasking capabilities, from AI inferencing to media-rich applications and data processing. With its space-saving design and exceptional versatility, the NUC(S) Ultra 200 BOX Series ensures efficient, high-speed performance across a range of applications—redefining what's possible in modern computing.

ASRock Industrial unveils the 4X4 BOX AI300 Series, a compact powerhouse designed to redefine AI computing with AMD Ryzen AI 300 Series processors. Featuring the Ryzen AI 7 350 and Ryzen AI 5 340 processors, this series delivers up to 50 TOPS of NPU performance, supporting Copilot+ PC experiences and AI-enhanced multitasking. With up to 96 GB dual-channel DDR5 5600 MHz memory, quad display up to 8K, and versatile connectivity, including dual LAN ports, Wi-Fi 6E, five USB ports with two USB4, it combines exceptional AI performance with scalability and efficiency.

Equipped with Ryzen AI as its dedicated AI engine, the 4X4 BOX AI300 Series ensures responsive AI processing paving the way for next generation productivity. Living up to its slogan, "Tiny Box AI Rocks," the 4X4 BOX AI300 Series is engineered for AI PCs, gaming, content creation, tech enthusiasts, prosumers, and AIoT applications.

At CES 2025, GIGABYTE unveiled an impressive lineup of motherboards designed for Intel and AMD platforms for gaming, content creation, and professional use, with support for the latest processors, PCIe 5.0, and Wi-Fi 7. GIGABYTE introduced several Z890 chipset motherboards for Intel's "Arrow Lake" Core Ultra 200S series. The flagship Z890 AORUS Master offers features like DDR5 memory overclocking, tool-free PCIe and M.2 installation, and Wi-Fi 7 connectivity. The compact Z890I AORUS Ultra targets Mini-ITX builds with its efficient 8+1+2 VRM solution and AI-enhanced BIOS profiles. Despite its small form factor, it delivers robust performance and thermal management. For those looking for aesthetics and reliability, the Z890 AORUS Elite WiFi 7 ICE impresses with a sleek white design, digital VRM capabilities, and simplified Wi-Fi EZ-Plug installation for improved connectivity. For more budget-friendly options, GIGABYTE showed B860M AORUS Elite WiFi6E ICE motherboard, too.

MSI introduces its newest lineup of motherboards built for the Intel B860 and H810 chipsets. Combining performance and innovation, these motherboards deliver exceptional reliability and user-friendly features. They are designed to empower mainstream users, gamers, and creators with advanced computing capabilities. The B860 chipset brings several advantages over the H810, making it a standout choice for high-performance computing. It supports PCIe 5.0 slot and M.2 storage, enabling faster speeds and enhanced efficiency for demanding workloads. Unlike the H810, the B860 chipset also allows for memory overclocking, giving users more flexibility and control over their system's performance. With the B860 chipset having 24 PCIe lanes compared to the H810's 16, the B860 delivers a significant boost in performance with its superior bandwidth and connectivity for peripherals and components.

Further enhancing its capabilities, both chipsets include Thunderbolt 4, ensuring high-speed connectivity for a seamless user experience. However, the B860 chipset supports up to 8 Direct Media Interface (DMI) Gen 4 lanes, doubling the data transfer capacity between the CPU and chipset compared to the H810's 4 lanes. MSI's motherboards built on the B860 chipset deliver exceptional performance, reliability, and versatility, instilling confidence in gamers, creators, and everyday users seeking cutting-edge technology.

The ASUS ROG Apex brand extension is reserved for motherboards with the best CPU and memory overclocking capabilities. Since Intel processors tended to overclock better than AMD, Apex remained confined to the Intel platform, until now. ASUS at CES showed off the ROG Crosshair X870E Apex, the first AMD platform motherboard to feature this brand extension. The board features a powerful CPU VRM solution meant for sub-zero overclocking of Ryzen 9000X3D processors that are fully capable of overclocking. It also comes with a 1 DIMM-per-channel memory topology, with just two DDR5 DIMM slots. 1DPC is the most optimal dual-channel topology for memory overclocking.

The topmost M.2 Gen 5 NVMe slot features an elaborate fan-heatsink solution. Right next to the two DDR5 DIMM slots, is a breakout DIMM.2 module that provides additional M.2 NVMe slots. There are a couple of more Gen 4 NVMe slots scattered across the board. The board features an I/O feature-set that's at least as good as the ROG Crosshair X870E Hero. The board draws power from two 8-pin EPS, a 24-pin ATX, and an additional 8-pin PCIe power input. The board is packed to the gills with features professional overclockers would look for, including onboard buttons, diagnostic readouts, a hydrophobic PCB surface treatment, dual-BIOS, and clearly labelled voltage domains.

ASUS today announced the B850 and B840 series of AM5 motherboards for AMD processors, which includes models from the ROG Strix, TUF Gaming and Prime families. These motherboards give builders higher speeds, more ports and more slots for USB devices and M.2 SSDs. Many ASUS B850 motherboards also break into the next generation of wireless networking with WiFi 7 support, and also provide robust support for fast DDR5 kits. In addition, each model makes the PC building process easier than ever with tool-free M.2 SSD installation, easy troubleshooting and hassle-free installation and removal of graphics cards.

Meanwhile, B840 motherboards are designed to serve the needs of builders who do not intend to overclock their CPUs or install a PCIe 5.0 M.2 SSD or graphics card. For anyone looking to build a very affordable and efficient PC—perhaps one centered around a CPU with powerful integrated graphics capabilities—ASUS B840 motherboards are a cost-effective choice. The first ASUS B840 motherboards all hail from the tried-and-true Prime family.

GIGABYTE Technology, one of the top global manufacturers of motherboards, graphics cards, and hardware solutions, proudly announces the launch of its cutting-edge B860 series motherboard, featuring the groundbreaking D5 Bionic Corsa technology and innovative AI-Driven capabilities that set new standards for memory performance and user-friendly experience.⁠

Infinite Memory Performance with AI-Driven Optimization
Building on the success of our Z890 series, the B860 AORUS motherboards achieve remarkable DDR5 speeds of up to 9466 MT/s on 4DIMM slot configurations. This exceptional performance is powered by our proven D5 Bionic Corsa technology, ensuring optimal memory efficiency across the entire lineup. D5 Bionic Corsa boasts four key technologies from software, hardware to firmware side. The AORUS AI SNATCH and AI SNATCH Engine present AI-overclocking for ultimate performance, while AI-Driven PCB Design and HyperTune BIOS deliver AI-design for signal enhancement on motherboards.
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