ASRock, the global leading manufacturer of motherboards, graphics cards, mini PCs, and gaming monitors, today announced a full line-up of flagship to mainstream motherboards using the AMD X870E/X870 series chipset, which is designed expressly for the latest AMD Ryzen 9000 series processors using AM5 socket. New motherboards include the flagship series X870E Taichi and Taichi Lite, newly introduced flagship Phantom Gaming X870E Nova WiFi, mainstream gaming X870 Riptide WiFi, plus the always popular X870 Steel Legend WiFi, X870 Pro RS and Pro RS WiFi, which are both now available in a white design.

All the new ASRock X870E/X870 motherboards, from the flagship Taichi series to the mainstream Steel Legend and Pro RS WiFi, feature a highly robust design for extreme performance. The Taichi series combines SPS Dr.MOS power delivery of up to 24+2+1 phases, server-grade 8-layer PCBs enabling excellent memory overclocking up to DDR5-8200, and exclusive low-ripple 1000μf 20K black capacitors that guarantee stable and superior performance for the CPU.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, IPC solutions, and storage devices, today is excited to unveil the shiny new X870E VALKYRIE flagship motherboard designed to run the latest "Zen 5" architecture based AMD Ryzen 9000 series processors. Built on BIOSTAR's top-of-the-line VALKYRIE platform, the X870E VALKYRIE delivers exceptional features and functionality, catering to gamers, content creators, and PC enthusiasts alike.

Meticulously crafted to cater to the modern-day professional, the X870E VALKYRIE motherboard offers unparalleled power and stability across the most demanding applications. Whether you're designing immersive 3D worlds, rendering high-definition animations, editing ultra-high-resolution videos, or pushing the limits of AAA gaming, this motherboard is engineered to deliver. Powered by the latest AMD Ryzen 9000 series processors built on "Zen 5" architecture, with support for up to 192 GB of DDR5 memory and PCIe 5.0 technology, the X870E VALKYRIE ensures seamless, high-speed performance for even the most intensive tasks, including generative AI computing. With support for AMD EXPO & Intel XMP technologies, it can extract the maximum capability out of all hardware to deliver the best user experience.

MSI unveils the X870E and X870 motherboards, designed to harness the full power of AMD's Ryzen 9000 Series desktop processors. The lineup includes four models: MEG X870E GODLIKE, MPG X870E CARBON WIFI, MAG X870 TOMAHAWK WIFI, and PRO X870-P WIFI. These motherboards deliver exceptional value and performance with cutting-edge features and exclusive MSI innovations. Offering top components, innovative features, and easy DIY options, MSI's X870E and X870 motherboards make building and using your PC seamless.

Introducing MSI's Ultra Connect feature in the X870E and X870 motherboards, offering next-gen networking, storage, and expansion. With built-in 5G LAN and Wi-Fi 7, users can enjoy lightning-fast speeds, reaching up to 5.8 Gbps. As well as TriLink Connectivity, Expansion is made to future-proof with PCIe Gen 5.0 for next-gen graphics cards and SSDs. The USB4 ports, which are Thunderbolt compatible, enable fast data transfers and support a wide range of next-gen devices, including display output through USB-C.

Detailed specifications and a somewhat blurry slide showing off all the details of MSI's upcoming high-end MEG Z890 Unify-X motherboard have leaked courtesy of @ChamberTech_ on X/Twitter. The motherboard is likely to appeal to those looking to squeeze every extra bit of performance out of their new Ultra 200K series CPU when they launch next month. You get support for memory speeds of up to 10,000 MT/s and with only two DIMM slots, it might be able to go even higher with the latest DDR5 CUDIMMs. The board also sports a 110 Ampere 20+1+1+1 VRM design on an eight layer PCB, and it also ships with what MSI calls an OC Tuning Controller, suggesting the board is targeting overclockers.

MSI has included a pair of PCIe 5.0 x16 slots for GPUs that presumably operate in dual x8 mode when both slots are in use, and a third PCIe 4.0 x16 slot that operates in x4 mode, as well as a single PCIe 4.0 x1 slot. There's also no less than six M.2 slots, of which two are PCIe 5.0 and one PCIe 4.0, as well as six SATA ports. Where things get a bit interesting is in the network connectivity, as the slide claims that the board features a 5 Gbps Intel Killer Ethernet interface, which is the first we've heard of such a thing, as well as an Intel Killer Wi-Fi 7 and Bluetooth 5.4 module for wireless connectivity.

In today's fast-paced business environment, efficiency and performance are paramount. ASRock Industrial introduces the IMB-X1900, a motherboard that combines cutting-edge innovation with unparalleled processing power and AI acceleration to drive the future of high-performance systems. Designed to elevate industry standards and redefine performance in demanding environments, the IMB-X1900 exemplifies ASRock Industrial's commitment to excellence. With powerful processing capabilities, expansive memory support, and advanced connectivity options, this motherboard is built on the robust Intel Xeon W-3500/3400 and W-2500/2400 Series Processors, ensuring it effortlessly manages even the most complex parallelized tasks, delivering exceptional efficiency and speed.

Key Features of the IMB-X1900 Motherboard:

• Unrivaled Processing Power: Featuring Intel Xeon W-3500/3400 and W-2500/2400 Series Processors with W790 chipset, the IMB-X1900 supports up to 60 cores, making it a powerhouse for computationally intensive workloads. This capability is crucial for industries such as 3D rendering, product simulation, and large-scale AI models training and inference.
• Expansive Memory Capacity: With support for up to 2 TB of DDR5 RDIMM ECC memory across 8 slots, the IMB-X1900 ensures seamless management of extensive datasets and complex simulations. This inclusion of ECC memory further enhances system reliability and data integrity, essential for industries like financial analysis, scientific research, and mission-critical applications.

MSI is thrilled to introduce a groundbreaking feature on its X870(E) series motherboards. This innovative is designed with gamers and professionals in mind, provides the extra power required for AI computing and GPU-intensive applications. The supplemental PCIe Power feature, equipped with an integrated 8-pin PCIe power connector, delivers additional power for GPUs demanding higher wattage, ensuring they can achieve their peak performance. Paired with the ATX 3.1 power standard, which can hold up to a 2.5x power excursion for enhanced reliability and better power delivery, this feature ensures stable, efficient, and sustained performance, even under heavy loads. Whether gaming or tackling complex applications, this supplemental PCIe Power offers unmatched reliability and stability for the most demanding environments.

What is Supplemental PCIe Power?
Think of it as an extra battery pack for your motherboard. The system's 12 V power on the 24pin power connector from the motherboard basically handles all the PCIe interface, fans and RGB extensions. Still, the supplemental PCIe power ensures everything runs smoothly when your PC is pushed to the limit—like when running very intensive graphical games or maximizing all the fan dissipation for extreme performance.

Motherboard vendors have been sporadically announcing their new premium- and high-end motherboards based on the AMD X870E and AMD X870 desktop chipsets, however, we've had a hard time finding or ordering these online. It turns out that although AMD allowed its motherboard partners to tease or announce their products based on the new chipset models, their market availability is timed.

Apparently, you should be able to buy these motherboards starting September 30, 2024. In the run-up to their availability, various online retailers have put up these motherboards at fairly high prices. Motherboards based on the cheaper AMD X870 are typically priced above $250, while those based on the top X870E start around $325. It is widely rumored that the mid-range AMD B850 will launch early next year. Until then, you always have the option of older AMD B650 chipset motherboards. If you want to pair these with newer Ryzen 9000 series "Granite Ridge" processors, you can take advantage of the UEFI BIOS Flashback feature.

We are excited to introduce the MS-CF13 Mini-ITX motherboard, a groundbreaking solution designed to meet the demands of modern applications with its fanless, low-profile, and ultra low-power features. Powered by the Intel Alder Lake-N SoC series, the MS-CF13 offers exceptional performance while maintaining energy efficiency, making it an ideal choice for a variety of industries.

Key Features:

• Powered by Intel Alder Lake-N Processor: The MS-CF13 is equipped with Intel Alder Lake-N PC Client & Embedded Series SoC, delivering reliable and efficient performance for diverse applications.
• High-Speed Memory: Featuring a DDR5 4800 MHz SODIMM slot, the motherboard supports up to 16 GB of memory, ensuring robust data handling capabilities.
• Triple Independent Displays: Supports DP, HDMI/DP, and LVDS/eDP, making it perfect for applications that require multiple high-resolution screens.
• Enhanced Network Connectivity: Includes 2 2.5 GbE LAN ports with RJ-45, providing high-speed network connections for data-intensive tasks.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, announced today the latest BIOS release to include TDP to 105 W option for AMD Ryzen 7 9700X and Ryzen 5 9600X processors, which can boost CPU performance up to 13%.⁠

The September latest BIOS version AGESA 1.2.0.1a provides a new option enabling users to raise the CPU TDP from 65 W to 105 W with just one click for Ryzen 9600X and 9700X on GIGABYTE 600 series motherboards. This new BIOS has been verified to show an approximately 13% multicore performance boost compared to default TDP 65 W by Cinebench R23 test results.

Colorful Technology Company Limited, a leading brand in gaming PC components, gaming laptops, and Hi-fi audio products, launches the flagship iGame Z790D5 Vulcan W and Z790D5 Vulcan X motherboards. First seen at COMPUTEX 2024, the iGame Z790D5 Vulcan is available in white and black models and comes in an E-ATX form-factor. The motherboard comes equipped with the latest technologies including USB4 40 Gbps connectivity and the latest Wi-Fi 7 solution.

Designed for high-performance gaming and content creation, the iGame Z790D5 Vulcan W/X motherboards are equipped with a 19+1+1 power phase design with DrMos 105 A power stages. Furthermore, the motherboard has a dedicated LN2 Mode for extreme overclocking. The motherboard's server-grade 8-layer low-loss PCB helps achieve higher and stable overclocks.

GIGABYTE just released its second AMD 800-series chipset motherboard following last week's debut of the X870E AORUS Master, the more affordable X870 AORUS Elite WIFI7. This board is based on the slightly more affordable AMD X870 (non-E) chipset, which offers connectivity nearly identical to that of the previous-generation AMD B650E, but with the addition of USB4. The board is built in the ATX form-factor, and features a 6-layer PCB. It draws power from a combination of 24-pin ATX and two 8-pin EPS power connectors. The CPU VRM solution consists of a 16+2+2 phase setup, with the vCore side of it being 8-phase with phase doubling. The Socket AM5 is wired to four DDR5 DIMM slots for up to 256 GB of memory.

Expansion slots include a PCI-Express 5.0 x16 wired to the CPU, a PCI-Express 4.0 x16 (electrical Gen 4 x4), and a third PCI-Express 3.0 x16 (electrical Gen 3 x2). The main Gen 5 x16 PEG slot gets a quick-release lever. You press a button, and it ejects the graphics card. Storage connectivity includes three M.2 Gen 5 x4 slots, two of these are wired to the CPU's dedicated Gen 5 x4 NVMe lanes, while the third slot subtracts 8 lanes from the Gen 5 x16 PEG slot. There is a fourth M.2 slot, which is Gen 4 x4, and wired to the X870 FCH. All four slots get heatsinks. Four SATA 6 Gbps ports make for the rest of the storage connectivity.

Leading global motherboard manufacturer, ASRock has announced that its W790 series workstation motherboards, including the W790 WS and W790 WS R2.0, now support the newly released Intel Xeon W-3500 series and Xeon W-2500 series processors. This enables consumers to experience the superior performance of the latest Intel Xeon series processors.

The ASRock W790 WS series workstation motherboards feature up to 2 TB DDR5 ECC RDIMM support, PCI-Express 5.0 expansion slots, USB4/Thunderbolt 4 and Dual 10 Gbps Ethernet. A flagship-class 14-layer PCB and 20+2 phase CPU VRM ensures ultimate performance and superb reliability, even when subjected to the most demanding sustained workloads.

MSI is set to launch its most advanced AM5 motherboard to date: the MEG X870E GODLIKE. This flagship model is designed to support AMD's Ryzen 9000 series processors and beyond. The MEG X870E GODLIKE boasts an impressive 28-phase power delivery system with 110 A power stages, surpassing its predecessor's capabilities. This robust VRM design ensures a stable power supply even for the most demanding scenarios of next-generation CPUs. The motherboard's E-ATX form factor provides ample space for its array of features, including support for DDR5 memory speeds exceeding 8000 MT/s and a capacity of up to 256 GB. Connectivity is a strong suit for this motherboard, featuring eight USB Type-C ports with varying speeds of up to 40 Gbps. Storage options include five M.2 slots (two PCIe Gen 5 and three Gen 4) and four SATA III ports.

For graphics, the board offers two PCIe Gen 5.0 slots. MSI has also included several user-friendly features, such as EZ M.2 and PCIe release mechanisms, making component installation and removal a breeze. The M.2 slots are equipped with MSI's Shield Frozr heatsinks, ensuring optimal thermal performance for NVMe SSDs. Perhaps most intriguing is the inclusion of an additional 8-pin power connector, specifically designed to support future multi-GPU setups like NVIDIA's anticipated RTX 50 "Blackwell" series. While pricing details are yet to be announced, the MEG X870E GODLIKE is expected to carry a premium price tag, reflecting its top-tier status in MSI's lineup. With the high-end power delivery setup, overclockers will find this motherboard interesting, and users are planning to upgrade to next-generation RTX 50 series GPUs. Availability is also unknown as of time of writing.

Thermaltake, a leading PC DIY brand for premium hardware solutions, is proud to launch The Tower 600 Mid Tower Chassis in Black, Snow, Hydrangea Blue, and Matcha Green. It is a new ATX case of The Tower series with unparalleled aesthetic appeal and hardware compatibility. The Tower 600 is built with a classic vertical case design and comes in a distinctive octagonal prism shape. It supports a hidden-connector motherboard and a special horizontal placement, elevating its visual charm to new heights. Additionally, The Tower 600 can accommodate up to a 420 mm AIO radiator on the right side and a 360 mm AIO radiator on the left side, enabling a superior cooling solution to your high-end PC configuration.

The Tower 600 is compatible with both standard motherboards and the latest hidden-connector motherboards such as ASUS BTF Series, MSI PROJECT ZERO Series, and GIGABYTE PROJECT STEALTH Series. Hidden-connector motherboards can simplify cable routing by directing cables to the back, leading to improved cable management and a more refined look for the interior build. The Tower 600 ensures seamless integration and compatibility with these next-generation motherboards.

ASRock, a global leader in motherboards, graphics cards, gaming monitors, and small form factor PCs, is proud to announce the release of the X600TM-ITX, the world's first thin mini ITX motherboard supporting AMD AM5 series processors. This revolutionary motherboard brings exceptional performance and versatile features to users, enhancing their computing experience in various applications.

The X600TM-ITX stands out as the first thin mini ITX motherboard compatible with AMD AM5 series processors in the world. This compatibility ensures unprecedented performance, allowing users to experience faster computing speeds, better multitasking capabilities, and improved overall efficiency. Ideal for those who demand power in a compact form factor, the X600TM-ITX sets a new standard in motherboard technology.

GIGABYTE today debuted its AMD 800-series motherboards with the launch of the premium X870E AORUS Master. This will go on to be the company's second most premium product on this chipset, as the company is also planning the X870E AORUS Xtreme. The AORUS Master is still packed to the gills with everything this chipset has to offer, along with high-end onboard devices. The board is built in the ATX form-factor, and draws power from a combination of 24-pin ATX and two 8-pin EPS power connectors. It offers a 16+2+2 phase digital VRM featuring 110 A power stages. The board is laid out on a premium 8-layer PCB. You get tall extruded aluminium heatsinks for the CPU VRM, and the topmost M.2 NVMe Gen 5 slot.

The AMD Socket AM5 is wired to four DDR5 DIMM slots that support up to 192 GB of dual-channel DDR5, at speeds of over DDR5-8000. It also puts out no less than three M.2 NVMe Gen 5 slots. Two of these are wired to the dedicated x4 interfaces from the AMD "Raphael" or "Granite Ridge" processor, while one of them subtracts 4 lanes from the board's PCI-Express 5.0 x16 PEG slot. The board's fourth M.2 NVMe slot is Gen 4, and wired to the chipset. The only other expansion slots are a couple of PCI-Express 4.0 x16 (electrical Gen 4 x1). Besides the M.2 slots, you get four SATA 6 Gbps ports completing the board's storage connectivity.

AMD has reportedly pushed the launch of mid-tier models from its AMD 800-series chipset to early 2025, reports ComputerBase.de. With the Ryzen 9000-series "Zen 5" processors already launched earlier this month, and compatible with existing AMD 600-series chipset motherboards with a BIOS update, motherboard vendors are leisurely announcing their motherboards based on the AMD X870E and AMD X870 chipsets. Motherboards based on both offer drop-in compatibility with Ryzen 9000-series processors, and introduce new connectivity features such as 40 Gbps USB4 and Wi-Fi 7.

The company probably wants the two to have some time in the Sun before they're joined by the more affordable B850, which gamers could be drawn to. The AMD B850 has mostly identical platform I/O to the AMD X870, except Gen 5 support for the PCI-Express x16 slot is optional (motherboard vendors can choose to wire this out as Gen 4). The 40 Gbps USB4 is also optional here. You still get CPU overclocking support. The B840 is an entry-level chipset that's being launched to probably phase out the A620 and A620A, since it features similar I/O features to the A620A, but will probably come with drop-in compatibility for 65 W Socket AM5 processors. A deferred launch of the mid-tier chipset isn't too off character for AMD. It launched its popular B450 and B550 chipsets several months after the X470 and X570, respectively.

We are excited to announce the launch of the MS-CF10 Mini-ITX motherboard, designed to deliver exceptional performance and versatility for a wide range of applications. Powered by the latest 14th/13th/12th Gen Intel Raptor Lake-S Refresh/Raptor Lake-S/Alder Lake-S series processors, including Core i9/i7/i5/i3, Pentium, and Celeron processors, the MS-CF10 is engineered to meet the demands of high-performance computing solutions.

Key Features:

• Advanced Processor Support: The MS-CF10 supports Intel 14th/13th/12th Gen Raptor Lake-S Refresh/Raptor Lake-S/Alder Lake-S series processors with R680E/Q670E/H610E chipsets, ensuring top-tier performance and efficiency.
• High-Speed Memory: Equipped with 2x DDR5 5200 MT/s ECC/non-ECC SODIMM slots, the motherboard supports up to 64 GB of memory, providing robust data handling capabilities.
• Multiple Display Outputs: Featuring quadruple independent displays with 2x DP, HDMI 2.0, and LVDS/eDP, the MS-CF10 is ideal for applications requiring multiple high-resolution screens.

Thermaltake, a leading PC DIY brand for premium hardware solutions, is delighted to announce that the Ceres 350 MX Mid Tower Chassis is available now, offered in 7 colors: Black, Snow, Matcha Green, Hydrangea Blue, Racing Green, Bumblebee, and Bubble Pink. The Ceres 350 MX is an ATX case built with a focus on visual appeal. It supports the latest hidden-connector motherboards for excellent cable management. Furthermore, this case features two interchangeable front panels, enabling PC enthusiasts to choose their preferred setup. Users also can upgrade the Ceres 350 MX with an additional 2.1" Circle LCD Screen Kit, achieving a more eye-catching build.

Besides standard motherboards, the Ceres 350 MX supports hidden-connector motherboards as well, including the ASUS BTF Series, the MSI PROJECT ZERO Series, and the GIGABYTE PROJECT STEALTH Series. It is beneficial for aesthetics inside the chassis by organizing messy cables to the rear. Through the 4 mm tempered glass panel on the left side of the Ceres 350 MX, the outstanding cable management and the RGB lighting of components can fully be displayed. The case comes with a dual interchangeable front panel design, users can install a tempered glass panel for wide viewing or a perforated panel for enhanced airflow.

ASRock has silently unveiled the X600TM-ITX, currently the "world's only" AM5 Thin Mini-ITX motherboard designed for AMD Ryzen 9000 "Zen 5" processors along with 8000 and 7000 series CPUs with a max TDP of 65 W. Its "Thin" Mini-ITX form factor (17.0 cm x 17.0 cm) stands out with a compact 25 mm I/O shield height compared to the standard 44 mm.

Unlike traditional Mini-ITX boards, the X600TM-ITX utilizes SODIMM memory (max. 96 GB of Dual DDR5 6400+) and supports onboard power supply via one DC Jack on the rear panel I/O, eliminating the need for a separate ATX PSU. This makes it an ideal choice for DIY mini PC enthusiasts. However, the board lacks PCIe slots for discrete GPUs, limiting its gaming potential. Nevertheless, the integrated graphics in AM5 processors should handle most games at lower settings, especially with higher-end CPUs.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, announced BIOS updates for X670, B650, and A620 Motherboards to support AMD Ryzen 9000 processors. The critical BIOS updates for GIGABYTE X670, B650, and A620 series motherboards ensure the compatibility and optimized performance with the upcoming AMD Ryzen 9000 series processors.

GIGABYTE remains committed to providing the best possible experience for users and works closely with AMD to ensure prompt updates as new AGESA versions become available. Beta BIOS will be regularly updated on the GIGABYTE website. Users can easily update the BIOS using GIGABYTE's ＠BIOS, Q-Flash, or Q-Flash Plus technology.

Colorful Technology Company Limited, a leading brand in gaming PC components, gaming laptops, and Hi-fi audio products, is proud to announce the CVN Z790D5 ARK FROZEN motherboard for the 14th Gen, 13th Gen, and 12th Gen Intel Core processors. The motherboard supports DDR5 memory and comes with four PCIe 4.0 M.2 slots for high-speed NVMe SSDs.

The design of the CVN Z790D5 ARK FROZEN is inspired by the powerful CVN-class battleships. The motherboard features a titanium gray color from the heat sinks to the PCB finish. The motherboard features a 14+1+1 digital power phase design with 90 A high-spec DrMOS VRMs with tantalum polymer capacitor to support high-end Intel Core i9 processors with ease. The CVN Z790D5 ARK FROZEN motherboard comes with a 2.5 GbE Ethernet port and Wi-Fi 6E with Bluetooth 5.3. The motherboard has single PCIe 5.0 X16 slot that's backward compatible with PCIe 4.0 devices such as the latest NVIDIA GeForce RTX 40 Series graphics cards. There's also a bottom PCIe 4.0x4 slot for add-in devices such as RAID controllers, capture cards, and others.

ADLINK Technology Inc., a global leader in edge computing, and a global supplier of industrial PCs and motherboards, announces the launch of the new IMB-C Value Series of ATX motherboards, extending the IMB series motherboard range with new, more affordable, options for users seeking high-performance at a lower price point. The IMB-C value series comes with processor options ranging from Gen 10 to Gen 14 Intel Core i9/i7/i5/i3 and includes features such as 2.5 Gbe, PCIe 4.0, DDR4, and USB 3.0, to suit applications in warehousing, industrial automation, smart manufacturing, and new energy.

The IMB-C series expands the IMB ATX motherboard range, providing a cost-effective alternative to the high-performance IMB-M series. Tailored for budget-sensitive projects without sacrificing essential features, the IMB-C models support DDR4 and PCIe 4.0, catering to applications that require solid performance with cost efficiency. Conversely, the IMB-M series is designed for top-tier performance, supporting DDR5 and PCIe 5.0, ideal for cutting-edge industrial use. The IMB-C series offers a comprehensive portfolio from Intel's 10th to 14th gen processors. Specifically, the IMB-C46 and IMB-C46H models come equipped with the Q470 and H420E chipsets respectively, optimized for 10th Gen Intel Core processors. Meanwhile, the IMB-M47 with the Q670 chipset, and the IMB-M47H with the H610 chipset, both support the 12th to 14th gen Intel Core processors, aligning with advanced system requirements and higher performance expectations.

MSI introduced the PRO B650-A WIFI, a feature-rich entry-mainstream Socket AM5 motherboard under its PRO series. Built in the standard ATX form-factor, the board features a 6-layer PCB, and includes heatsinks for all its M.2 slots, The board draws power from a 24-pin ATX and two 8-pin EPS power connectors and uses a 14+2+1 phase VRM solution that's capable of even the top 170 W TDP Ryzen 9 chips. The CPU socket is wired to four DDR5 DIMM slots, a PCI-Express 4.0 x16 slot, and two M.2 NVMe Gen 4 slots. The board's third M.2 Gen 4 slot is wired to the B650 FCH.

The MSI PRO B650-A WIFI offers a fairly premium onboard audio solution driven by a Realtek ALC4080 CODEC. USB connectivity includes a 20 Gbps USB 3.2 Gen 2x2 type-C port, three 10 Gbps USB 3.2 Gen 2 type-A, four 5 Gbps USB 3.2 Gen 1, and a few USB 3.2 and USB 2.0 ports by internal headers. Display outputs include HDMI and DisplayPort. Networking connectivity includes a 2.5 GbE interface driven by a Realtek 8125B controller, and an AMD/Mediatek sourced WLAN module with Wi-Fi 6E and Bluetooth 5.3. Besides the three M.2 Gen 4 slots, you get four SATA 6 Gbps ports. The board supports USB BIOS Flashback. The company didn't reveal pricing.

Thermaltake, a leading PC DIY brand for premium hardware solutions, is proud to launch the CTE E660 MX Mid Tower Chassis, a dual chamber mid-tower supporting ASUS and MSI Hidden-Connector motherboards. Along with excellent motherboard compatibility, the CTE E660 MX also features an interchangeable dual front panel design, a three-way GPU installation option, and exceptional cooling support, enabling the creation of a dream PC with superior flexibility. Available in four colors, including Black, Snow, Racing Green, and Hydrangea Blue, this chassis offers a variety of options to suit your preferences.

Designed for next-generation motherboards, the CTE E660 MX is compatible with both standard motherboards and the latest hidden-connector motherboards (ROG MAXIMUS Z790 HERO BTF / ASUS TUF GAMING Z790-BTF WIFI / MSI Z790 PROJECT ZERO). Using a hidden-connector motherboard enables you to route messy cables to the rear, improving cable management and enhancing the aesthetics of your builds. To cater to diverse needs in PC customization, the CTE E660 MX combines sleek design with practicality. The left side of the chassis incorporates a 4 mm tempered glass panel, offering a clear view of the interior configuration. Additionally, the CTE E660 MX provides two interchangeable front panels: a tempered glass panel for expansive visibility and a perforated panel for enhanced airflow, allowing you to tailor setups for aesthetic appeal and optimal performance.