To tackle upcoming generations of Ultrabooks and NUC that lack space for discrete graphics, yet having to keep up with the demands of higher display resolutions (i.e. proliferation of 3840 x 2160), Intel is designing special variants of its Core "Haswell" processors that feature large integrated graphics cores bolstered by fourth-level eDRAM caches on-package. Pictured below, is one such contraption.

The graphics-enhanced Core "Haswell" processor is an MCM (multi-chip module) of two dies, the larger one is the actual "Haswell" processor complex with cores, uncore, and the larger GT3 integrated graphics core. While the standard Haswell silicon with GT1 and GT2 integrated GPU options, physically features up to 20 execution units (EUs), the large GT3 silicon features double that, at 40 EUs.

Akasa unveiled pictures of two new fanless PC cases for 2013, the Galileo and the Newton (pictured in that order). Both cases are made almost completely of aluminum, double up as CPU heatsinks, and feature VESA-mount capabilities. The Galileo is a thin mini-ITX case which can passively cool CPUs with thermal output as high as 35W, while the Newton is designed for the NUC form-factor. Both cases will be showcased at Computex 2013, held in June.

HABEY USA, a leading manufacturer of embedded computer and an Associate member of the Intel Intelligent Systems Alliance, introduces the BIS-6621. It is the latest and greatest offering of our ultra compact fanless PCs. This tiny box measures 5"x5.25"x2", just slightly larger than the incredibly tiny Intel NUC. Besides the small footprint, the features available on this tiny system will simply amaze you.

Equipped with a 2.5" drive bay, this fanless PC will accept just about any 2.5" form factor storage device. The full size mini PCI-e slot can also be an mSATA compatible expansion slot as an option. The mini PCI-e card can also be used to run a WIFI card for wireless network access. Additionally, the BIS-6621 offers an externally accessible SIM card slot allowing for wireless data from a mobile carrier. It also includes 3 USB 2.0 ports for all your needed peripherals and also a COM port for any serial peripherals.

Streacom gave us a sneak-peek into its upcoming case for Intel's next unit of computing (NUC) form-factor. Made of aluminum and ABS, the case doubles up as heatsink for the NUC's hot components (such as CPU and PCH). It features a universal CPU block, so the case can adapt to future NUC boards with CPUs at different spots.

The sides of the case are not made of aluminum, this is where the NUC's WLAN/Bluetooth antennae attach, and so an ABS panel boosts signal strength. The case is designed specifically for Intel's D33217GKE motherboard, with ports mapped for its two HDMI connectors, three USB ports, power, and Ethernet. It will be available in two color options, silver (pictured below) and carbon-black. Availability is expected sometime in Q2 2013.

British silent PC maker Tranquil PC released passive-cooled all-aluminum cases for Intel's NUC (next unit of computing) form-factor, the NUC-BY (for Intel D33217CK board) and NUC-YE (for Intel D33217GKE). Both models measure 110 x 164 x 47 mm each, their bodies are ridged to double up as heatsinks for the CPU, PCH, and other hot components on the system board. The company claims the aerospace-grade aluminum used keeps the CPU 5 to 15 °C cooler than even the reference fan-cooled case. Both cases are priced at £99.00 ($156).

Intel decided to quit the PC motherboard business by shutting down its Desktop Board brand. To company will begin shrinking its motherboard product line with the arrival of socket LGA1150 Core "Haswell" processors, and eventually leave the market within 3 years. One can draw three distinct inferences from this move. First, Intel's Desktop Board lineup is too bloated, and the desktop form-factor is on a rapid decline in relation to the rest of the PC industry. Second, with the emergence of new high-volume brands in the motherboard industry, Intel is finding its lineup out of place.

Third, and more interestingly, this could be a move by Intel to pacify other motherboard vendors about the impending transition of a bulk of the motherboard volume from changeable CPU socket to hardwired BGA, which is bound to happen in a couple of years from now. Other vendors expressed apprehensions over the transition to BGA believing such a more could make Desktop Board put them out of business. Intel's Desktop Board team will instead spend resources in developing new form-factors such as the NUC.

Quite a few case-makers are jumping in with replacement cases for Intel's new NUC (next unit of computing) form-factor (Intel Desktop Boards D33217CK and D33217GKE), which beats all established volume/performance standards. Lian-Li's contribution is the PC-N1. This all-aluminum case measures 122 x 40 x 108 mm (WxHxD), which is roughly as big as a router. Following strict form-factor specifications, it lacks any additional drive bays, or active cooling, leaving its high-quality aluminum to do the tedious job of dissipating heat.

It's no secret that nearly all Intel Core processors are carved out of essentially one or two physical dies, be it the "2M" die that physically features four cores and 8 MB of L3 cache, or the "1M" die, which physically features two cores and 4 MB of L3 cache. The two silicons are further graded for energy-efficiency and performance before being assigned a package most suited to them: desktop LGA, mobile PGA, mobile BGA, and with the introduction of the 4th generation Core "Haswell," SoC (system on chip, a package that's going to be a multi-chip module of the CPU and PCH dies). The SoC package will be designed to conserve PCB real-estate, and will be suited for extremely size-sensitive devices such as Ultrabooks.

The third kind of grading for the two silicons relates to its on-die graphics processor, which makes up over a third of the die area. Depending on the number of programmable shaders and ROPs unlocked, there are two grades: GT2, and GT3, with GT3 being the most powerful. On the desktop front (identified by silicon extension "-DT,") Intel very much will retain dual-core processors, which will make up its Core i3, Pentium, and Celeron processor lines. It will be lead by quad-core parts. All desktop processors feature the GT2 graphics core.

In addition to last month's NE01 and NE02 full-aluminum replacement cases for Intel's revolutionary NUC desktop, Japanese PC case maker Abee debuted the NE03 and NE04 (pictured in that order). Available in five metallic color options, the NE03 features a brick-shaped design with a clear acrylic top. It measures 140 x 200 x 50 mm (WxDxH). The NE04, on the other hand, features a cubical design, is available in five soft color options of its own, measures 125 x 110 x 117 mm, and supports a 60 mm fan. The two are priced at 17,980¥ (US $213) and 15,980¥ ($190), respectively.

Abee unveiled the Acubic NE01 and NE02 lines of replacement cases for Intel NUC. Made of brushed, anodized aluminum, the cases are available in a variety of glossy colors. The NE01, the first group of cases pictured below, measures 125 x 111 x 41 mm, featuring an edgy design. The NE02, on the other hand, measures 126 x 111 x 42 mm, featuring a slightly rounded and curvy design. Both cases weigh roughly 450 g. Designed strictly for the NUC form-factor, the two support Intel Desktop Boards D33217CK and D33217GKE only, are are compatible with their rear-panel bracket, and front USB port positions. Both cases support VESA mount, and can latch onto your flat-panel. Slated for Wednesday (28/11), the NE01 and NE02 are priced around US $99.