Intel experienced another leadership setback on Monday when Justin Hotard, who led its Data Center and AI (DCAI) division said he was leaving to become Nokia's CEO. Hotard joined Intel in early 2024 and worked there for just over a year. He will take over from Pekka Lundmark at Nokia on April 1. In his short time at Intel, Hotard oversaw the release of Intel's Sierra Forest E-core and Granite Rapids P-core Xeon 6 platforms. These helped Intel catch up to AMD in core count for the first time since 2017. Intel has temporarily appointed Karin Eibschitz Segal, an 18-year company veteran and co-CEO at Intel Israel, as the interim chief of DCAI.

However, Justin Hotard's exit comes as the DCAI division faces several problems. Not long ago, Intel said it would push back the launch of its next-generation Clearwater Forest Xeons to the first half of 2026 blaming low demand. The company also scrapped its Falcon Shores accelerators to focus on a future rack-scale platform called Jaguar Shores. These setbacks came after Intel fellow Sailesh Kottapalli left for Qualcomm last month. Kottapalli had worked at Intel for 28 years and played a key role in developing many Xeon server processors.

A significant legal challenge has emerged for Intel's leadership as shareholders aim for the company's representation of its foundry business performance. LR Trust has filed a lawsuit against former CEO Pat Gelsinger and current co-CEO David Zinsner, seeking to return substantial executive compensation amid allegations of misleading statements and financial mismanagement. The lawsuit centers on Intel Foundry Services (IFS), a division that was once positioned as a crucial growth engine for Team Blue. The Intel Foundry, as it is now called, is here referred as Intel Foundry Services, which was its older name back in 2023. According to court documents, LR Trust claims that while Intel's leadership painted an optimistic picture of IFS's trajectory, the division struggled to attract major clients and accumulated significant losses. Gelsinger's $207 million compensation package is at the heart of the dispute, where shareholders now demand that these funds should be returned to the company.

The legal action also targets additional compensation received by Zinsner, arguing that executive rewards were secured through misrepresenting the company's financial health. The allegations point to a troubled 2023, during which Intel's chip production unit reportedly lost $7 billion. These challenges extended into 2024, as increased investments in new fab facilities further strained the company's finances. The lawsuit alleges that executives issued "materially false and misleading" statements regarding cost savings and revenue potential, ultimately driving shareholder value to the very bottom. LR Trust's legal filing accuses Intel's leadership of breaching its financial duties through inadequate internal controls and inaccurate financial disclosures. Beyond seeking the return of executive compensation, the lawsuit pursues damages and legal cost reimbursement, with any recovered funds potentially being returned to Intel's coffers. Intel has yet to respond formally to these allegations. This is just another lawsuit in line as Intel already has several other lawsuits going on, with one recent from August.

A few days ago, we published a report about Intel's 18A yields being at an abysmal 10%. This sparked quite a lot of discussion among the tech community, as well as responses from industry analysts and Intel's now ex-CEO Pat Gelsinger. Today, we are diving into known information about Intel's 18A node and checking out what the yields of possible products could be, using tools such as Die Yield Calculator from SemiAnalysis. First, we know that the defect rate of the 18A node is 0.4 defects per cm². This information is from August, and up-to-date defect rates could be much lower, especially since semiconductor nodes tend to evolve even when they are production-ready. To measure yields, manufacturers use various yield models based on the information they have, like the aforementioned 0.4 defect density. Expressed in defects per square centimeter (def/cm²), it measures manufacturing process quality by quantifying the average number of defects present in each unit area of a semiconductor wafer.

Measuring yields is a complex task. Manufacturers design some smaller chips for mobile and some bigger chips for HPC tasks. Thus, these two would have different yields, as bigger chips require more silicon area and are more prone to defects. Smaller mobile chips occupy less silicon area, and defects occurring on the wafer often yield more usable chips than wasted silicon. Stating that a node only yields x% of usable chips is only one side of the story, as the size of the test production chip is not known. For example, NVIDIA's H100 die is measuring at 814 mm²—a size that is pushing modern manufacturing to its limits. The size of a modern photomask, the actual pattern mask used in printing the design of a chip to silicon wafer, is only 858 mm² (26x33 mm). Thus, that is the limit before exceeding the mask and needing a redesign. At that size, nodes are yielding much less usable chips than something like a 100 mm² mobile chip, where defects don't wreak havoc on the yield curve.

Intel's Foundry business is the company's current pain point and probably the reason why the company board of directors forced out ex-CEO Pat Gelsinger. However, the new interim co-CEO, David Zinsner, confirmed that the foundry plan would remain the same. At the UBS technology conference, Zinsner indicated that the company's core strategy remains unchanged and reiterated the forecasts shared in October, highlighting optimism about growth in its PC and server segments. This is a healthy sign that Intel will not lose its foundry subsidiary, which, even though difficult to operate, could be Intel's silver lining with growth opportunities ahead.

Yesterday, we covered the choice of Lip-Bu Tan as Intel's next CEO. However, the new co-CEO, Zinsner, stated, "I'm not in the process, but I'm guessing that the CEO will have some capability around foundry as well as on the product side." A new CEO would be left with a lot of work that, apparently, no one so far can finish. There are speculations that Intel's 18A node is yielding 10% of usable silicon, while Intel's head of foundry business, Naga Chandrasekaran, has noted that 18A node is going through evolution phases to improve final yields and remain profitable, noting that "there's nothing fundamentally challenging on this node now. It is about going through the remaining yield challenges, defect density challenges."

The search for a new Chief Executive Officer (CEO) of Intel has begun following Pat Gelsinger's departure on Monday. And it is not exactly an easy role to be filled. The tech giant's board is primarily considering external candidates to lead the company through one of its most challenging periods. Among the potential successors is Lip-Bu Tan, a former Intel board member and semiconductor industry veteran. Tan, who previously served as CEO of Cadence Design, left Intel's board in August 2023 after disagreements with Gelsinger over the company's strategic direction. Despite these past tensions, Intel's board has reportedly recently approached Tan to gauge his interest in the position. The search for new leadership is extremely difficult, considering the requirements and massive problems the new CEO would face.

Coming at a critical moment for Intel, which has experienced significant financial challenges under Gelsinger's tenure, the new CEO would need to get the Foundry business to pick up and maintain a solid product roadmap. The company's revenue dropped to $54 billion in 2023, marking a nearly one-third decline since Gelsinger took the helm in 2021. Analysts project Intel's first annual net loss since 1986 this year, with long-term signs of recovery. Gelsinger's exit, which came after the board presented him with the option to retire or be removed, reflects growing impatience with the pace of his ambitious turnaround strategy. The company has appointed CFO David Zinsner and senior executive Michelle Johnston Holthaus as interim co-CEOs while the search committee works to identify a permanent replacement.

Intel Corporation (NASDAQ: INTC) today announced that CEO Pat Gelsinger retired from the company after a distinguished 40-plus-year career and has stepped down from the board of directors, effective Dec. 1, 2024. Intel has named two senior leaders, David Zinsner and Michelle (MJ) Johnston Holthaus, as interim co-chief executive officers while the board of directors conducts a search for a new CEO. Zinsner is executive vice president and chief financial officer, and Holthaus has been appointed to the newly created position of CEO of Intel Products, a group that encompasses the company's Client Computing Group (CCG), Data Center and AI Group (DCAI) and Network and Edge Group (NEX). Frank Yeary, independent chair of the board of Intel, will become interim executive chair during the period of transition. Intel Foundry leadership structure remains unchanged.

The board has formed a search committee and will work diligently and expeditiously to find a permanent successor to Gelsinger. Yeary said, "On behalf of the board, I want to thank Pat for his many years of service and dedication to Intel across a long career in technology leadership. Pat spent his formative years at Intel, then returned at a critical time for the company in 2021. As a leader, Pat helped launch and revitalize process manufacturing by investing in state-of-the-art semiconductor manufacturing, while working tirelessly to drive innovation throughout the company."

In a recent report from Bloomberg citing people familiar with the matter, it seems that Qualcomm is now rethinking its acquisition of Intel because of financial and regulatory issues, which indicates that the potential purchase of Intel is, in some way, losing speed. Undoubtedly, the prospective arrangement has its flaws which are of a big nature. Let us not forget that Intel's debt burden of approximately $50 billion further complicates the company's financial picture. Further to the merger, regulatory approvals would be involved, which would be a long process and, therefore, very difficult. Qualcomm is currently thinking about whether to buy only a certain segment of Intel's business, possibly the division of the company that produces semiconductor chips, instead of the whole company.

Intel's CEO, Pat Gelsinger, has made it clear that they are not planning to split up the company. During an interview in November, he talked about his determination which he described as "energy and passion" to move the organization in the right direction and their strategy of "being different and at the same time, better together." Intel is leveraging other options to better its financial standing as recently this week, the company closed a $7.86 billion financing deal which is part of the US CHIPS Act, among the $3 billion from Pentagon contract confirmed this summer. Intel is still on the lookout for possibilities to do away with some of its divisions; Altera is one that it seems to be most willing to sell. Lattice Semiconductor has made a statement that it is ready to take over Altera and it would not be a surprise if Qualcomm also enters the bidding game. Qualcomm's goal is to generate an additional $22 billion in annual revenue by 2029, however, CEO Cristiano Amon said in a Bloomberg interview last week that "right now, at this time, we have not identified any large acquisition that is necessary for us to execute on this $22 billion."

Intel Corporation today reported third-quarter 2024 financial results.

"Our Q3 results underscore the solid progress we are making against the plan we outlined last quarter to reduce costs, simplify our portfolio and improve organizational efficiency. We delivered revenue above the midpoint of our guidance, and are acting with urgency to position the business for sustainable value creation moving forward," said Pat Gelsinger, Intel CEO. "The momentum we are building across our product portfolio to maximize the value of our x86 franchise, combined with the strong interest Intel 18A is attracting from foundry customers, reflects the impact of our actions and the opportunities ahead."

Last time we reported on Samsung Foundry, the company publicly apologized for its setbacks in the memory and foundry divisions, especially as its 3 nm GAA FET node has failed to attract new customers. On the other hand, Intel has also been struggling with its Foundry unit bleeding billions of Dollars in a bid to secure its spot as one of the best foundries for companies to manufacture their chips. There is no better pair than two struggling foundries looking for customers and new ways to conduct research than Intel and Samsung. According to an exclusive by South Korean media outlet "MK," it has reportedly been confirmed that Intel approached Samsung to form a "Foundry Alliance" to boost their foundry business units.

According to the source, Intel CEO Pat Gelsinger is reportedly eager to meet with Samsung Electronics Chairman Lee Jae-yong face-to-face to discuss "comprehensive collaboration in the foundry sector." What exactly will happen between the two is still unclear. Back in 2014, GlobalFoundries and Samsung formed a partnership for 14 nm FinFET offerings, and that was a wide success. Jointly developing a node and offering it in their foundry units could be the target goal for Intel and Samsung. At some level, research and development, as well as sharing valuable manufacturing information on yield improvements, should be beneficial for both to put together the final pieces of the semiconductor puzzle.

Intel CEO Pat Gelsinger was a special guest at Lenovo Tech World 2024, the computing giant's annual showcase of its latest innovations. The opening keynote address saw Gelsinger make a special appearance to greet Lenovo CEO Yang Yuanqing, but he wasn't alone. In his pocket was a next-generation "Panther Lake" processor. This chip appears to be an H-segment package for mainstream notebooks, which makes the chip a direct successor to the "Arrow Lake-H" mobile processor that comes out in Q1-2025.

According to leaks from reliable sources, "Panther Lake-H" is said to come in CPU core-counts of up to 18. That's 6P+8E+4LP. It sees the reintroduction of low-power island E-cores located in the SoC tile. The six P-cores are "Cougar Cove," which could feature a generational IPC uplift over the current "Lion Cove," while the current "Skymont" E-cores are carried forward into "Panther Lake." The SoC tile could see an upgrade to a newer foundry node from its current 6 nm on "Arrow Lake," to accommodate the low-power island E-cores, and possibly a faster NPU. The iGPU of "Panther Lake" is allegedly based on the next-generation Xe3 "Celestial" graphics architecture. This faster iGPU, along with a faster NPU, low-power island E-cores, and slightly faster P-cores, could be what "Panther Lake-H" brings to the table. Given that "Arrow Lake-H" sees an early-2025 introduction, we don't expect "Panther Lake-H" out till at least 2026.

Intel Corp. (INTC) and AMD (NASDAQ: AMD) today announced the creation of an x86 ecosystem advisory group bringing together technology leaders to shape the future of the world's most widely used computing architecture. x86 is uniquely positioned to meet customers' emerging needs by delivering superior performance and seamless interoperability across hardware and software platforms. The group will focus on identifying new ways to expand the x86 ecosystem by enabling compatibility across platforms, simplifying software development, and providing developers with a platform to identify architectural needs and features to create innovative and scalable solutions for the future.

For over four decades, x86 has served as the bedrock of modern computing, establishing itself as the preferred architecture in data centers and PCs worldwide. In today's evolving landscape - characterized by dynamic AI workloads, custom chiplets, and advancements in 3D packaging and system architectures - the importance of a robust and expanding x86 ecosystem is more crucial than ever.

All eyes have been on Intel since we announced Q2 earnings. There has been no shortage of rumors and speculation about the company, including last week's Board of Directors meeting, so I'm writing today to provide some updates and outline what comes next. Let me start by saying we had a highly productive and supportive Board meeting. We have a strong Board comprised of independent directors whose job it is to challenge and push us to perform at our best. And we had deep discussions about our strategy, our portfolio and the immediate progress we are making against the plan we announced on August 1.

The Board and I agreed that we have a lot of work ahead to drive greater efficiency, improve our profitability and enhance our market competitiveness—and there are three key takeaways from last week's meeting that I want to focus on:

• We must build on our momentum in Foundry as we near the launch of Intel 18A and drive greater capital efficiency across this part of our business.
• We must continue acting with urgency to create a more competitive cost structure and deliver the $10B in savings target we announced last month.
• We must refocus on our strong x86 franchise as we drive our AI strategy while streamlining our product portfolio in service to Intel customers and partners.

We have several pieces of news to share that support these priorities.

According to a recent Reuters report, Intel's 18A node doesn't seem to be production-ready. As the sources indicate, Broadcom has been reportedly testing Intel's 18A node on its internal company designs, which include an extensive range of products from AI accelerators to networking switches. However, as Broadcom received the initial production run from Intel, the 18A node seems to be in a worse state than initially expected. After testing the wafers and powering them on, Broadcom reportedly concluded that the 18A process is not yet ready for high-volume production. With Broadcom's comments reflecting high-volume production, it signals that the 18A node is not producing a decent yield that would satisfy external customers.

While this is not a good sign of Intel's Fundry contract business development, it shows that the node is presumably in a good state in terms of power/performance. Intel's CEO Pat Gelsinger confirmed that 18A is now at 0.4 d0 defect density, and it is now a "healthy process." However, alternatives exist at TSMC, which proves to be a very challenging competitor to take on, as its N7 and N5 nodes had a defect density of 0.33 during development and 0.1 defect density during high-volume production. This leads to better yields and lower costs for the contracting party, resulting in higher profits. Ultimately, it is up to Intel to improve its production process further to satisfy customers. Gelsinger wants to see Intel Foundry as "manufacturing ready" by the end of the year, and we can see the first designs in 2025 reach volume production. There are still a few more months to improve the node, and we expect to see changes implemented by the end of the year.

Intel is reportedly exploring the sale of its Altera business, a move guided by CEO Pat Gelsinger as part of broader restructuring efforts. Acquired by Intel in 2015 for $16.7 billion, Altera, formerly known as the Programmable Solutions Group, has been a profitable segment. However, with Intel facing financial strain due to extensive spending, the company is now considering divesting its FPGA business to recoup capital. Currently, Altera operates as a separate entity within Intel, relying on the tech giant for R&D, sales, marketing, and support. Gelsinger is expected to propose the sale at a board meeting scheduled for mid-September, where he will outline his vision for Intel's future. This restructuring could also affect other parts of Intel's operations, including its Foundry business.

While previous reports suggested that Intel might spin off its Foundry unit or sell it to industry leaders like TSMC or Samsung, the latest information indicates that Intel plans to retain this division, albeit with scaled-back expansion efforts. The $32 billion factory in Germany, for example, may be scrapped, along with other capital-intensive projects, and other capital expansions may also be put on hold. Pat Gelsinger's vision still needs to be finalized and is still in the drafting phase, so until the mid-September board meeting, we have to wait to gain more information.

According to a recent report from Bloomberg, Intel is in talks with investment banks about a possible spin-out of its foundry business, as well as scraping some existing expansion plans to cut losses. As the report highlights, sources close to Intel noted that the company is exploring various ways to deal with the recent Q2 2024 earnings report. While Intel's revenues are in decline, they are still high. However, the profitability of running its business has declined so much that the company is now operating on a net loss, with an astonishing $1.61 billion in the red. CEO Pat Gelsinger is now exploring various ways to control these losses and make the 56-year-old giant profitable again. Goldman Sachs and Morgan Stanley are reportedly advising Intel about its future moves regarding the foundry business and overall operations.

The Intel Foundry unit represents the biggest consumer of the company's funds, as the expansion plans across the US and Europe are costing Intel billions of US Dollars. Even though the company receives various state subsidies to build semiconductor manufacturing facilities, it still has to put much of its capital to work. Given that the company is running tight on funds, some of these expansion plans that are not business-critical may get scraped. Additionally, running the foundry business is also turning out to be rather costly, with Q2 2024 recording a negative 65.5% operating margin. Separating Intel Product and Intel Foundry may be an option, or even selling the foundry business as a whole is on the table. Whatever happens next is yet to be cleared up. During the Deutsche Bank Technology Conference on Thursday, Pat Gelsinger also noted that "It's been a difficult few weeks" for Intel, with many employees getting laid off to try to establish new cost-saving measures.

According to a recent report from Reuters, tech giant Intel is facing a significant legal challenge as shareholders file a lawsuit following a dramatic plunge in the company's stock price. The legal action comes from Intel's recent announcement of dividend suspensions and plans to lay off over 15,000 employees. The semiconductor behemoth saw its market value plummet by a staggering $32 billion in a single day, leaving investors reeling. The Construction Laborers Pension Trust of Greater St. Louis has initiated a proposed class action suit, naming Intel, CEO Pat Gelsinger, and CFO David Zinsner as defendants. The plaintiffs allege that the company made misleading statements about its business operations and manufacturing capabilities, artificially inflating its stock price between January 25 and August 1.

Intel's financial woes stem from underperforming contract foundry operations and 1% drop in revenue during the second quarter of 2024. While it may seem miniscule, declining revenue is paired with a negative 15.3% operating margin, resulting in a net loss of $1.61 billion. The company's August 1 announcement caught many shareholders off guard, prompting accusations of inadequate disclosure and transparency. This lawsuit is just one of several legal battles Intel is currently strangled in. The company is also locked in a patent dispute with R2 Semiconductor across multiple European countries, centering on voltage regulation technology. While Intel has secured a victory in the UK, it faces ongoing litigation in Germany, France, and Italy. Adding to Intel's troubles, a separate class action lawsuit is being explored on behalf of customers who purchased potentially faulty 13th and 14th-generation processors. The company also canceled its September 2024 Innovation event, citing poor financials, without any words on Arrow Lake or Lunar Lake. While the cancelation of events is sad, it is necessary to get financials back on track, and product launches should continue as usual.

In a conversation with Intel's CEO Pat Gelsinger, industry analyst Patrick Moorhead revealed that Intel's Meteor Lake CPU platform suffers from some production issues. More specifically, Intel has been facing some yield and/or back-end production issues with its Meteor Lake platform, resulting in a negative impact on Intel's margins when producing the chip. The market is showing great demand for these chips, and Intel has been forced to run productions of "hot lots"-- batch production of silicon with the highest priority that gets moved to the front of the production line so they can get packaged as fast as possible. While this is a good sign that the demand is there, running hot lots increases production costs overall as some other wafers have to go back so Meteor Lake can pass.

The yield issues associated with Meteor Lake could be stemming from the only tile made by Intel in the MTL package: the compute tile made on the Intel 4 process. Intel 4 process is specific to Meteor Lake. No other Intel product uses it, not even the Xeon 6, which uses Intel 3, or any of the upcoming CPUs like Arrow Lake, which uses the Intel 20A node. So, Intel is doing multiple nodes for multiple generations of processors, further driving up costs as typical high-volume production with a single node for multiple processors yields lower costs. Additionally, the company is left with lots of "wafers to burn" with Intel 4 node, so even with Meteor Lake having yield issues, the production is ultimately fine, while the operating costs and margins take a hit.

Intel Corporation today reported second-quarter 2024 financial results. "Our Q2 financial performance was disappointing, even as we hit key product and process technology milestones. Second-half trends are more challenging than we previously expected, and we are leveraging our new operating model to take decisive actions that will improve operating and capital efficiencies while accelerating our IDM 2.0 transformation," said Pat Gelsinger, Intel CEO. "These actions, combined with the launch of Intel 18A next year to regain process technology leadership, will strengthen our position in the market, improve our profitability and create shareholder value."

"Second-quarter results were impacted by gross margin headwinds from the accelerated ramp of our AI PC product, higher than typical charges related to non-core businesses and the impact from unused capacity," said David Zinsner, Intel CFO. "By implementing our spending reductions, we are taking proactive steps to improve our profits and strengthen our balance sheet. We expect these actions to meaningfully improve liquidity and reduce our debt balance while enabling us to make the right investments to drive long-term value for shareholders."

According to sources close to Bloomberg, Intel plans to cut 10,000 jobs from its global workforce. The news comes amid heavy pressure on the semiconductor giant, which has been on a steady decline over the years, while other industry rivals like AMD and NVIDIA have been rising and taking market share in various areas from Intel. It is reported that Intel currently has 110,000 employees globally, and reducing the workforce by 10,000 would net Intel around 100,000 global employees left. These figures exclude employees from spun-out units like Altera FPGA company, which is under Intel's ownership. Intel's aim to reduce its workforce is expected to come with a significant cost benefit to the company, with projected savings of $10 billion by 2025.

The news isn't yet official, but it is expected to see the light of the day as soon as this week. As Intel's CEO Pat Gelsinger invests heavily into the fab construction and development of next-generation products, there have been a few notes that Intel would have to overcome some challenges shortly to reach its long-term goals like more advanced silicon manufacturing facilities and new products for AI/HPC and client sector. One of those short-term measures is reducing the workforce to cut down expenses. Intel has reduced its workforce before. In 2022, the company announced reduced spending in non-critical areas and reducing the workforce, and in 2023, cut the workforce by 5% to 124,800 employees last year, only to be left with 110,000 employees in 2024.

We are live from the Intel Computex 2024 Keynote address in Taipei. CEO Pat Gelsinger, along with the heads of the company's various business groups will take stage to unveil the latest in PC processors, server processors, generative AI accelerators, datacenter infrastructure gear, and lots more! In particular, we're interested in their Core Ultra "Lunar Lake" and "Arrow Lake" processors, and next-generation Xeon 6 chips. Can Gaudi 3 break into the duopoly between NVIDIA and AMD? Join us to find out in this live-blog!02:55 UTC: Something really cool from the show: The camera is pointing at Intel's industry partners in the audience, and a Gaudi 3 is turning them into superhero images!03:02 UTC: Pat Gelsinger takes center stage.

Intel's CEO, Pat Gelsinger, has confirmed that the upcoming 18A process of the Panther Lake CPU generation is on schedule for a mid-2025 release, which aligns with the initial projection. This development marks a significant milestone in the company's ongoing efforts to integrate AI capabilities into its processors. The mid-2025 release date is expected to follow the debut of Intel's Arrow Lake process in late 2024 or early 2025, a release that holds the promise of significant advancements in AI computing. During Intel's Q1 2024 Quarterly Results, Gelsinger expressed confidence in the company's AI capabilities, stating that the Core Ultra platform currently delivers leadership AI performance and that the next-generation platforms, Lunar Lake and Arrow Lake, will launch later this year, tripling AI performance. He also mentioned that the Panther Lake generation, set to release in 2025, will grow AI performance up to an additional 2x.

The Panther Lake generation represents the culmination of three generations of work in a short time and is expected to continue Intel's iterative approach. This transition is marked by a shift from a hybrid architecture, a combination of different types of processors, to a disaggregated die, where different components of the processor are separated, as AI computing becomes increasingly prominent. This strategic move is aimed at optimizing AI performance and flexibility. This marks the third generation of the Intel Core Ultra series, following Ultra 100 (Meteor Lake), Ultra 200 (Arrow Lake), and Lunar Lake (200V). Intel's release strategy mirrors the pattern set by the Hybrid Architecture, with Alder Lake debuting in 2021, followed by Raptor Lake in 2022, and a refreshed Raptor Lake released last year to bridge the gap until LGA 1851 was ready. However, Intel's roadmap has seen adjustments in the past, such as the initial promise of an Arrow Lake release before the end of 2024, which was later retracted. The mid-2025 release of Panther Lake aligns with rumors of Arrow Lake's late 2024 or early 2025 debut, suggesting that the 18A process CPU generation could debut several months after Arrow Lake.

At the Intel Vision 2024 customer and partner conference, Intel introduced the Intel Gaudi 3 accelerator to bring performance, openness and choice to enterprise generative AI (GenAI), and unveiled a suite of new open scalable systems, next-gen products and strategic collaborations to accelerate GenAI adoption. With only 10% of enterprises successfully moving GenAI projects into production last year, Intel's latest offerings address the challenges businesses face in scaling AI initiatives.

"Innovation is advancing at an unprecedented pace, all enabled by silicon - and every company is quickly becoming an AI company," said Intel CEO Pat Gelsinger. "Intel is bringing AI everywhere across the enterprise, from the PC to the data center to the edge. Our latest Gaudi, Xeon and Core Ultra platforms are delivering a cohesive set of flexible solutions tailored to meet the changing needs of our customers and partners and capitalize on the immense opportunities ahead."

Intel Corporation today outlined a new financial reporting structure that is aligned with the company's previously announced foundry operating model for 2024 and beyond. This new structure is designed to drive increased cost discipline and higher returns by providing greater transparency, accountability and incentives across the business. To support the new structure, Intel provided recast operating segment financial results for the years 2023, 2022 and 2021. The company also shared a targeted path toward long-term growth and profitability of Intel Foundry, as well as clear goals for driving financial performance improvement and shareholder value creation.

"Intel's differentiated position as both a world-class semiconductor manufacturer and a fabless technology leader creates significant opportunities to drive long-term sustainable growth across these two complementary businesses," said Pat Gelsinger, Intel CEO. "Implementing this new model marks a key achievement in our IDM 2.0 transformation as we hone our execution engine, stand up the industry's first and only systems foundry with geographically diverse leading-edge manufacturing capacity, and advance our mission to bring AI Everywhere."

Intel is revamping its foundry play, and the company is set on its goals of becoming a strong contender to rivals such as TSMC and Samsung. Under Pat Gelsinger's lead, Intel recently split (virtually, under the same company) its units into Intel Product and Intel Foundry. During the SPIE 2024 conference for optics and photonics, Anne Kelleher, Intel's senior vice president, revealed that the 14A (1.4 nm) process offers a 15% performance-per-watt improvement over the company's 18A (1.8 nanometers) process. Additionally, the enhanced 14A-E process boasts a further 5% performance boost from the regular A14 node, being a small refresh. Intel's 14A process is set to be the first to utilize High-NA extreme ultraviolet (EUV) equipment, delivering a 20% increase in transistor logic density compared to the 18A node.

The company's aggressive pursuit of next-generation processes poses a significant threat to Samsung Electronics, which currently holds the second position in the foundry market. As part of its IDM 2.0 strategy, Intel hopes to reclaim its position as a leading foundry player and surpass Samsung by 2030. The company's collaboration with American companies, such as Microsoft, further solidifies its ambitions. Intel has already secured a $15 billion chip production contract with Microsoft for its 1.8 nm 18A process. The semiconductor industry is closely monitoring Intel's progress, as the company's advancements in process technology could potentially reshape the competitive landscape. With Samsung planning to mass-produce 2 nm process products next year, the race for dominance in the foundry market is heating up.

TAITRA (Taiwan External Trade Development Council) has announced Pat Gelsinger, CEO of Intel Corporation, as a keynote speaker at COMPUTEX 2024 on June 4. Embracing COMPUTEX's theme of artificial intelligence (AI), Gelsinger will showcase Intel's next-generation data center and client computing products bringing AI Everywhere by making the technology accessible through exceptionally engineered platforms, secure solutions and open ecosystems support.

Gelsinger will detail how Intel's AI portfolio - including AI-accelerated Intel Xeon, Intel Gaudi and Intel Core Ultra processor families - unlocks new possibilities in the data center and cloud and across the world's network and edge applications, and how it ushers in the age of the AI PC, transforming the future of productivity and creativity. Gelsinger will also discuss how Intel Xeon processors deliver exceptional performance-per-watt efficiencies, freeing up server capacity for more AI tasks while delivering optimal total cost of ownership (TCO) and power-saving sustainability benefits.