AMD has recently filed a patent revealing plans to implement "multi-chip stacking" in future Ryzen SoCs, as Wccftech reports, quoting a post on X from @coreteks: "New patent from AMD shows how future Zen SoCs could look. Basically a novel packaging design that enables compact chip stacking and interconnection by having them partially overlap, as in this figure. The dotted line is a larger die stacked on top of those smaller ones". The patent details a new approach where smaller chiplets partially overlap with a larger die, creating space for additional components and functions on the same die. This strategy aims to improve the efficiency of the contact area, thus making room for higher core counts, larger caches, and increased memory bandwidth within the same die size. The proposed stacking will reduce the physical distance between components through overlapping chiplets, thus minimizing interconnect latency and achieving faster communication between different chip parts. The design will also improve power management, as the segregated chiplets allow for better control of each unit through power gating.

Even if long-time rival Intel has lost some of its momentum (and market share) this year, AMD's chance to push ahead with its intention to become number one in the market is to continue to innovate. In the same way that its 3D V-Cache technology made the X3D processor lineup so successful, this chip stacking approach could play a major role in future AMD Ryzen SoCs. It seems that AMD is committed to moving away from the monolithic design era and taking the road of multi-chiplet; however, it can be a long wait until (and if) this chip stacking will complete the journey from patents to design, production, and final product.

Xockets, inventor of Data Processing Unit (DPU) technology has launched a legal battle against NVIDIA and Microsoft. The lawsuit, filed in Texas, accuses the companies of forming an illegal cartel to avoid fair compensation for its patented DPU technology. Xockets claims that the Data Processing Unit technology its co-founder Parin Dalal invented in 2012 is fundamental to NVIDIA's GPU-enabled AI systems and Microsoft's AI platforms. The lawsuit alleges that NVIDIA has infringed on Xockets' patents since its 2020 acquisition of Mellanox, a deal NVIDIA's CEO Jensen Huang once called a "homerun." Xockets is seeking injunctions to halt the release of NVIDIA's new Blackwell GPU-enabled AI systems and Microsoft's use of these systems in their generative AI platforms.

The case touches on the bigger issues of intellectual property rights and the monopoly in the tech sector. Robert Cote, a Xockets board member, describes the suit as a fight against "Big Tech's predatory infringement playbook," accusing NVIDIA and Microsoft of making moves to devalue smaller companies' innovations. The AI revolution continues to transform the tech world, and this legal dispute may have a profound effect on the way intellectual property is valued and protected in the industry, possibly introducing new precedents for the relationship between tech giants and smaller innovators.

Microsoft, in a patent application, revealed that it is developing a new pixel dimming technology that allows software to control the brightness of specific regions of a compatible display, to greatly enhance realism. Put simply, this is a means for software to tell a display to increase the brightness of specific pixels of a display, while dimming others.

This is accomplished more easily on some display types, such as OLED, where each pixel is its own source of illumination. LCDs rely on backlit illumination from usually no more than a hundred LEDs, and so they're not capable of this technology, at least the way Microsoft describes it. Patent applications tend to have oversimplified language, and here, Microsoft describes how a component called an EM gate driver sends a PWM signal to pixels to adjust their brightness. All modern displays rely on the concept of PWM to adjust brightness, where the number of pulses of energy in a time period define how bright a display gets; and so Microsoft's language is rather vague. What's important, though, is that the company is claiming that it found a way to dim individual pixels. The patent application was originally filed in 2022, but published on March 21, 2024.

Microsoft has filed for a new and even potentially groundbreaking patent that could transform the way ray tracing graphics are processed, especially when video memory (VRAM) is scarce. The patent proposes a technique to minimize the memory footprint of ray tracing graphics, tackling the escalating concerns about the growing memory demands for ray tracing and path tracing. The innovation outlined in Microsoft's patent employs a dynamic level of detail (LOD) approach to adaptively modify the quality of ray tracing effects based on accessible resources. The patent portrays the ray tracing pipeline as an acceleration structure that can be streamlined using this LOD system. The cornerstone of this optimization is a residency map that aligns with a bounding volume hierarchy of objects. The graphics processing system can then utilize this map to ascertain the suitable quality level for objects at any given moment. This methodology enables a more reasonable allocation of resources, guaranteeing that the most crucial objects receive the highest quality rendering. At the same time, less important elements can be rendered at lower quality to conserve memory.

Microsoft's patent could have far-reaching ramifications for the design and performance of upcoming GPUs. By implementing this novel LOD system, GPUs with more modest VRAM capacities, such as those with 8 GB, could provide ray tracing performance on par with higher-end models boasting larger memory buffers, given enough compute capacity. This advancement could pave the way for more budget-friendly GPUs that still deliver adequate ray tracing capabilities, making the technology more accessible. Moreover, the adaptive nature of the LOD system could contribute to a more reliable performance across diverse scenarios, as the GPU would be capable of adjusting to the available resources in real time. Microsoft's patent could emerge as a game-changer in the realm of GPU design and performance, and we are now waiting to see if any real-world implementations appear.

According to Financial Times, a regional court in Düsseldorf, Germany, created a significant setback for Intel on Wednesday, issuing an injunction prohibiting sales of some of its processors due to allegations they infringe on a patent held by R2 Semiconductor. R2, a technology firm based in Palo Alto, California, accused Intel of violating its patent related to processor voltage regulation. The ruling applies to Intel's 10th, 11th, and 12th generation Core processors, known as Ice Lake, Tiger Lake, and Alder Lake, as well as its Ice Lake Xeon server SKUs. Newer processors generations (13th, 14th, etc.) don't infringe the patent. Even though Intel noted that it plans to appeal the decision, the ramifications could extend beyond the company itself. Industry experts warn the court order could lead to a sweeping ban on products containing the disputed Intel chips, including laptops and pre-built PCs from major manufacturers like HP and Dell. R2 has waged an ongoing legal fight across multiple jurisdictions to defend its intellectual property.

After initially filing suit against Intel in the United States, R2 shifted its efforts to Germany and other European countries after its patent was invalidated stateside. Intel strongly denied R2's patent infringement claims, alleging the company's entire business model relies on extracting legal settlements through serial litigation. Intel believes the injunction serves only R2's financial interests while harming consumers, businesses, and the economy. The two firms traded barbs in official statements about the case. R2's CEO, David Fisher, rebuffed Intel's characterization of his company, saying it has only targeted Intel for infringement of its clear IP rights. As the war of words continues, the practical impact of the German court's decision remains uncertain, pending Intel's appeal. However, the preliminary injunction demonstrates the massive financial consequences at stake in battles over technological patents.

A U.S. appeals court has overturned a staggering $2.18 billion patent infringement verdict against Intel Corporation, initially won by VLSI Technology, marking a pivotal shift in one of the most prominent patent law cases in U.S. history. The 2021 decision by a Texas jury, which found Intel guilty of infringing on a VLSI patent, was reversed by the U.S. Court of Appeals for the Federal Circuit due to insufficient evidence. Additionally, a new trial in Texas has been ordered to determine the appropriate amount Intel owes for infringing a second patent owned by VLSI. This patent-holding company, affiliated with Fortress Investment Group and recently involved in a majority share acquisition by Abu Dhabi's Mubadala Investment Co from Japan's Softbank, has been in multiple legal confrontations with Intel over semiconductor technology patents, which VLSI acquired from NXP Semiconductors.

The legal disputes have seen varied outcomes; Intel deflected a claim for more than $3 billion in damages in a separate Waco jury trial in 2021. However, the same year, VLSI was awarded nearly $949 million from Intel in another patent case by a jury in Austin, Texas. The companies mutually agreed to dismiss another potential multi-billion-dollar lawsuit in Delaware. With Intel's stock experiencing a downturn (-6.05% in the past five days) following the latest court ruling and the scheduled 2024 trial in Northern California, the ongoing legal battles between the two tech entities continue to influence market dynamics and the semiconductor industry at large. Detaining if the patent infringement happened is still relatively complex, as VLSI needs a team of engineers to determine if Intel used any of its patents.

Lenovo (United States) Inc., part of the global technology corporation, Lenovo Group, filed a patent infringement action on November 15th with the United States International Trade Commission (ITC) against ASUSTeK Computer Inc. and ASUS Computer International (ASUS) for infringement of a variety of Lenovo's patents related to software, hardware, and connectivity across multiple ASUS products. The action is in response to ASUS's August 2023 filings in the Regional Court of Munich related to cellular technologies, where Lenovo had offered a cross-licensing deal as a solution.

Lenovo is a strong proponent of cross-licensing agreements, open and transparent negotiations, and licensing within the industry on fair, reasonable, and non-discriminatory (FRAND) terms. This is evidenced by the Group's ongoing litigation with InterDigital, where it advocated for greater transparency and less discrimination in licensing negotiations and was proven by the UK Court to be a willing licensee. The action against ASUSTeK reflects the Group's commitment to protecting its significant contributions to technology innovation and industry "firsts" over the past 39 years, building a portfolio of over 28,000 patents with a further 14,000 applications pending.

Phanteks put out its first statement in response to reports about Lian Li filing a patent infringement lawsuit against it. Lian Li alleges that Phanteks D30 RGB line of compound fans for radiators infringe upon a design patent held by the company, and that Lian Li Uni Fan series implement the original design defined in the patent. In particular, the controversy is around the design of the mechanism that lets you daisy-chain individual fans without cables. In its defense, Phanteks says that during the development of the D30 RGB series, its lawyers were duly consulted to look for IP conflicts. The company stated that it will face the legal challenge and is confident to prove that its product is not in infringement of Lian Li IP. The statement by Phanteks follows.

We at Phanteks can confirm the filing of the patent infringement suit filed by a fellow PC enthusiast brand. We want to inform the community that our legal team is and has always properly handled any legal issue or communication that has arose.

From the start of the Phanteks D30 fan development, we set out to design an original product that innovates to provide new solutions to PC enthusiasts. We have consulted with patent lawyers during the development and prior to the announcement of the D30 fans and the fans were not found to infringe on the claims in the patent. Phanteks D30 fans are an original idea and have been issued patents in multiple countries to date.

We value and respect valid and enforceable IP rights and are confident that the result of this legal matter will confirm there is no infringement. We will continue our mission to serve the PC community by creating unique and innovative solutions.

A legal dispute between Realtek and MediaTek has kicked off over Realtek claiming that MediaTek has gotten a third party company to sue Realtek over some unspecified patents involving technology used in smart TVs and set-top boxes. The third party involved goes under the name of IPValue Management Inc and appears to be what is generally known as a patent troll, i.e. a company that buys up patents and uses them to take legal actions against other companies, without actually producing anything related to the patents in question. Realtek claims that MediaTek is conspiring with IPValue to drive Realtek out of the market, leaving Mediatek in a close to monopoly situation in the market.

According to Reuters, Realtek told the publication that it filed the lawsuit against MediaTek to "protect free and fair competition in the industry" and "prevent further harm to the public." Neither MediaTek or IPValue have commented on the lawsuit to the publication. What makes this entire mess even more peculiar, is that MediaTek is said to have a licensing agreement in place with a subsidiary of IPValue called Future Link System LLC, which was signed in 2019. This agreement was brought up by the U.S. International Trade Commission (ITC) in a separate lawsuit last year, with the ITC calling it alarming and the court calling it improper. After the ITC criticism last year, Future Link apparently settled with several other companies such as Amlogic, but not with Realtek, which is why the company is now taking things to court. Realtek claims that MediaTek is trying to force any allegedly infringing chips out of the market and trying to make Realtek look like an unreliable partner and supplier to its customers. As such, Realtek wants the court to end the alleged conspiracy and is also asking for damages. Time will tell if Realtek is successful or not, but it seems strange that a patent troll would agree to licence its patents to some parties, but not all, since the only reason for a patent troll to exist is to make money from its patents.

Netlist Inc. an enterprise solid state storage drive specialist has been awarded over $303 million in damages by a federal jury in Texas on April 21, over apparent patent infringement on Samsung's part. Netlist has alleged that the South Korean multinational electronics corporation had knowingly infringed on five patents, all relating to improvements in data processing within the design makeup of memory modules intended for high performance computing (HPC) purposes. The Irvine, CA-based computer-memory specialist has sued Samsung in the past - with a legal suit filed at the Federal District Court for the Central District of California.

Netlist was seemingly pleased by the verdict reached at the time (2021) when the court: "granted summary judgements in favor of Netlist and against Samsung for material breach of various obligations under the Joint Development and License Agreement (JDLA), which the parties executed in November 2015. A summary judgment is a final determination rendered by the judge and has the same force and effect as a final ruling after a jury trial in litigation."

The Financial Times this weekend has published details about an interesting development project that is currently in-the-works at British semiconductor specialist firm Arm Ltd. The article states that several executives in the industry have divulged (anonymously) that Arm's engineering team is designing a proprietary chip - these insider sources opine that this new creation could be one of the company's most advanced undertakings. The SoftBank-owned chipmaker is having a bumper year in terms of financial success and has invested in its future - it is speculated that their own semiconductor design will be showcased as a prototype product to potential new clients - with the main goal being to drum up more business and growth. Parent group SoftBank is likely pushing for maximum profit margins as it prepares Arm for an initial public offering (IPO) this year.

Arm's modus operandi involves partnering up with other chip manufacturers in order to license out its semiconductor intellectual properties. In turn these partners are expected to deal with the overall design and manufacturing processes of chips (plus sales of). Arm has teamed up with foundries TSMC and Samsung in the past to create prototypes for software testing purposes, but not much has been heard about those proofing projects in the following years. In an unusual turn (from certain industry perspectives) from its traditional working methodologies, it seems that Arm is embracing a different approach by producing its own compelling designs, with the hope of demonstrating greater potential to customers. FT's sources have provided evidence that Arm has expanded its operations and that a newly formed "solutions engineering" team is focused on prototyping new silicon for usage in mobile hardware and related devices.

MPEG LA, LLC today announced that the HEVC enforcement actions brought in Landgericht Düsseldorf, Germany against Samsung Electronics GmbH ("Samsung") announced on 28 March 2022, have been settled with the taking of licenses. As a result, all legal disputes related to those patent enforcement actions have been resolved. Details of the actions by MPEG LA against Samsung can be accessed in the release dated March 28, 2022, here.

AMD and Analog Devices, Inc. today announced that they have resolved all their ongoing patent litigations, based on mutually agreed upon terms. As part of this resolution, the two companies have committed to pursue technology collaborations to bring next generation solutions to their communications and data center customers.

For more than 50 years AMD has driven innovation in high-performance computing, graphics and visualization technologies. Billions of people, leading Fortune 500 businesses and cutting-edge scientific research institutions around the world rely on AMD technology daily to improve how they live, work and play. AMD employees are focused on building leadership high-performance and adaptive products that push the boundaries of what is possible. Analog Devices, Inc. operates at the center of the modern digital economy, converting real-world phenomena into actionable insight with its comprehensive suite of analog and mixed signal, power management, radio frequency (RF), and digital and sensor technologies. ADI serves 125,000 customers worldwide with more than 75,000 products in the industrial, communications, automotive, and consumer markets. ADI is headquartered in Wilmington, MA.

AMD and ATI Technologies ULC have filed a complaint with the United States International Trade Commission (USITC) against Realtek Semiconductor and TCL Industries holdings. The complaint lists five patent infringements from both companies, mostly related to graphics technologies such as texture decompression, a unified shader approach to graphics architectures, a multi-threaded graphics processing system, as well as methods to synchronize thread wavefront data and events and a patent covering a processing unit for asynchronous dispatch.

According to AMD, both companies integrated solutions based on AMD's intellectual property without appropriate, prior licensing. The USITC has already come forward with an investigation announcement towards a number of Realtek and TCL-designed products, including graphics systems, digital televisions, and assorted components, found in some products shipped and sold in the U.S. market. The lawsuit aims for an exclusion order and cease and desist on sales of affected products.

AMD is innovating its own x86 hybrid processor technology formulated along the Arm big.LITTLE hybrid CPU core topology that inspired Hybrid processors by Intel. Under this, the processor has two kinds of CPU cores with very different performance/Watt bands—one kind focuses on performance and remains dormant under mild processing loads; while the other hand handles most lightweight processing loads that don't require powerful cores. This is easier said than done, as the two kinds of cores feature significantly different CPU core microarchitectures, and instruction sets.

AMD has filed a patent describing a method for processing workloads to be switched between the two CPU core types, on the fly. Unlike homogenous CPU core designs where workload from one core is seamlessly picked up by another over a victim cache like the L3, there is some logic involved in handover between the two core types. According to the patent application, in an AMD hybrid processor, the two CPU core types are interfaced over the processor's main switching fabric, and not a victim cache, much in the same way as the CPU cores and integrated GPU are separated in current-gen AMD APUs.

As AMD's upcoming feature that rivals NVIDIA DLSS nears release, reportedly this June, a USPTO patent application sheds some light on its inner workings. In its November 2019 application, AMD describes the feature as "Gaming Super Resolution." The abstract points to what the feature essentially does—downscaling or upscaling images using various methods, with the goal of improving performance, without much loss in fidelity. "The present application provides devices and methods for efficiently super-resolving an image, which preserves the original information of the image while upscaling the image and improving fidelity. The devices and methods utilize linear and non-linear up-sampling in a wholly learned environment," the application reads.

The application emphasizes on using a combination of linear and non-linear upscaling methods to improve the fidelity of the lower-resolution render output to the user's display resolution, including leveraging a "wholly learned" AI deep-learning network. This would be a DNN that relies on ground-truth information to reconstruct some fidelity to the upscaled image. "The devices and methods include a gaming super resolution (GSR) network architecture which efficiently super resolves images in a convolutional and generalizable manner."

Ericsson and Samsung have reached a multi-year agreement on global patent licenses between the two companies, including patents relating to all cellular technologies. The cross-license agreement covers sales of network infrastructure and handsets from January 1, 2021. Furthermore, Ericsson and Samsung have agreed on technology cooperation projects to advance the mobile industry in open standardization and create valuable solutions for consumers and enterprises.

This settlement ends complaints filed by both companies before the United States International Trade Commission (USITC) as well as the ongoing lawsuits in several countries and confirms the value of the strong patent portfolios of both companies. The details of the agreement are confidential and will not be disclosed. Ericsson's IPR licensing revenues continue to be affected by several factors, mainly expired patent license agreements pending renewal, geopolitical impact on the handset market, technology shift from 4G to 5G, and possible currency effects going forward. In the second quarter 2021, IPR licensing revenues, including the new agreement covering sales from January 1, 2021, are expected to be SEK 2.0 b to 2.5 b.

Christina Petersson, Chief Intellectual Property Officer at Ericsson says: "We are delighted to sign a mutually beneficial agreement with Samsung. This important deal confirms the value of our patent portfolio and further illustrates Ericsson's commitment to FRAND principles."

A federal jury in Texas has ruled that Intel Corporation violated two patents of VLSI Technology and must pay 2.18 billion USD in damages. The damages include 1.5 billion for one patent and 675 million for the other. The patents are related to clock frequency control and minimum memory operating voltage technique and were awarded to Freescale Semiconductor Inc in 2012 and SigmaTel in 2010. Freescale bought SigmaTel gaining control of the two patents before being passed to NXP after the company acquired Freescale in 2015, these patents were then transferred to the newly resurrected VLSI Technology in 2019 with the sole purpose of launching a legal battle against Intel. In a comment to Tom's Hardware the company said "Intel strongly disagrees with today's jury verdict. We intend to appeal and are confident that we will prevail.". This legal battle will likely drag-out for several years as Intel plans to appeal the recent ruling. Intel recorded a net income of 5.9 billion USD in Q4 2020 so this fine is by no means insignificant.

Valve has recently been ordered to pay 4 million USD in damages after they knowingly infringed on patents owned by Ironburg Inventions with the Steam Controller rear grip button design. Ironburg Inventions is the IP-holding arm of controller manufacturer SCUF who was acquired by Corsair in late 2019. Valve was warned by Ironburg Inventions in 2014 that their Steam Controller infringed on their patent relating to rear-side control surfaces. Valve ignored the warning and went on to produce 1.6 million units before discontinuing the device in 2019. The Jury awarded Ironburg Inventions 4 million USD in damages and found that Valve willfully infringed on Ironberg's patents which opens them up to further litigation. Corsair has published a statement on the case which can be found below.

AMD has filed a patent whereby they describe a MLA (Machine Learning Accelerator) chiplet design that can then be paired with a GPU unit (such as RDNA 3) and a cache unit (likely a GPU-excised version of AMD's Infinity Cache design debuted with RDNA 2) to create what AMD is calling an "APD" (Accelerated Processing Device). The design would thus enable AMD to create a chiplet-based machine learning accelerator whose sole function would be to accelerate machine learning - specifically, matrix multiplication. This would enable capabilities not unlike those available through NVIDIA's Tensor cores.

This could give AMD a modular way to add machine-learning capabilities to several of their designs through the inclusion of such a chiplet, and might be AMD's way of achieving hardware acceleration of a DLSS-like feature. This would avoid the shortcomings associated with implementing it in the GPU package itself - an increase in overall die area, with thus increased cost and reduced yields, while at the same time enabling AMD to deploy it in other products other than GPU packages. The patent describes the possibility of different manufacturing technologies being employed in the chiplet-based design - harkening back to the I/O modules in Ryzen CPUs, manufactured via a 12 nm process, and not the 7 nm one used for the core chiplets. The patent also describes acceleration of cache-requests from the GPU die to the cache chiplet, and on-the-fly usage of it as actual cache, or as directly-addressable memory.

Apple has today patented a new approach to how it uses memory in the System-on-Chip (SoC) subsystem. With the announcement of the M1 processor, Apple has switched away from the traditional Intel-supplied chips and transitioned into a fully custom SoC design called Apple Silicon. The new designs have to integrate every component like the Arm CPU and a custom GPU. Both of these processors need good memory access, and Apple has figured out a solution to the problem of having both the CPU and the GPU accessing the same pool of memory. The so-called UMA (unified memory access) represents a bottleneck because both processors share the bandwidth and the total memory capacity, which would leave one processor starving in some scenarios.

Apple has patented a design that aims to solve this problem by combining high-bandwidth cache DRAM as well as high-capacity main DRAM. "With two types of DRAM forming the memory system, one of which may be optimized for bandwidth and the other of which may be optimized for capacity, the goals of bandwidth increase and capacity increase may both be realized, in some embodiments," says the patent, " to implement energy efficiency improvements, which may provide a highly energy-efficient memory solution that is also high performance and high bandwidth." The patent got filed way back in 2016 and it means that we could start seeing this technology in the future Apple Silicon designs, following the M1 chip.

Update 21:14 UTC: We have been reached out by Mr. Kerry Creeron, an attorney with the firm of Banner & Witcoff, who provided us with additional insights about the patent. Mr. Creeron has provided us with his personal commentary about it, and you can find Mr. Creeron's quote below.

AMD has applied for a United States Patent that describes a CPU design with FPGA (Field-Programmable Gate Array) elements integrated into its core design. Titled "Method and Apparatus for Efficient Programmable Instructions in Computer Systems", the patent application describes a CPU with FPGA elements inscribed into its very core design, where the FPGA elements actually share CPU resources such as registers for floating-point and integer execution units. This patent undoubtedly comes in the wake of AMD's announced Xilinx acquisition plans, and brings FPGA and CPU marriages to a whole other level. FPGA,as the name implies, are hardware constructions which can reconfigure themselves according to predetermined tables (which can also be updated) to execute desired and specific functions.

Intel have themselves already shipped a CPU + FPGA combo in the same package; the company's Xeon 6138P, for example, includes an Arria 10 GX 1150 FPGA on-package, offering 1,150,000 logic elements. However, this is simply a CPU + FPGA combo on the same substrate; not a native, core-integrated FPGA design. Intel's product has severe performance and latency penalties due to the fact that complex operations performed in the FPGA have to be brought out of the CPU, processed in the FPGA, and then its results have to be returned to the CPU. AMD's design effectively ditches that particular roundabout, and should thus allow for much higher performance.

On December 31st, AMD's Radeon group has filed a patent for a chiplet architecture of the GPU, showing its vision about the future of Radeon GPUs. Currently, all of the GPUs available on the market utilize the monolithic approach, meaning that the graphics processing units are located on a single die. However, the current approach has its limitations. As the dies get bigger for high-performance GPU configurations, they are more expensive to manufacture and can not scale that well. Especially with modern semiconductor nodes, the costs of dies are rising. For example, it would be more economically viable to have two dies that are 100 mm² in size each than to have one at 200 mm². AMD realized that as well and has thus worked on a chiplet approach to the design.

AMD reports that the use of multiple GPU configuration is inefficient due to limited software support, so that is the reason why GPUs were kept monolithic for years. However, it seems like the company has found a way to go past the limitations and implement a sufficient solution. AMD believes that by using its new high bandwidth passive crosslinks, it can achieve ideal chiplet-to-chiplet communication, where each GPU in the chiplet array would be coupled to the first GPU in the array. All the communication would go through an active interposer which would contain many layers of wires that are high bandwidth passive crosslinks. The company envisions that the first GPU in the array would communicably be coupled to the CPU, meaning that it will have to use the CPU possibly as a communication bridge for the GPU arrays. Such a thing would have big latency hit so it is questionable what it means really.

AMD Project Quantum has been quite a mysterious product. While we knew that is was an ITX sized, water-cooled case that would feature an Intel CPU with AMD GPU, we never knew if it was coming or not. Featuring a unique, two-chamber design, AMD managed to develop two sections, where one is used for all the compute components, and the other one contains the radiator and fan for dissipating the heat produced by the compute chamber. Four years ago, we got the news that the project isn't dead and that it will get an update with AMD's upcoming Zen CPU and Vega GPU back then. However, since that announcement, there was no word on it.

Until today. Thanks to a Twitter user PeteB(@Pete_2097) who found a newly listed patent, the hope of Project Quantum is not yet dead it seems. On September 15th, AMD filed a patent for the Project Quantum, now protecting the unique design and possibly saving it for some time in the future. It is almost certain that the company has not abandoned the project, and it could be just waiting for the right time to launch it.

Today we are finding out that Intel has allegedly infringed FinFET patents of Microelectronics Institute of the Chinese Academy of Sciences. On July 28th, the patent review committee has heard an application that accuses Intel of violating a patent 201110240931.5 commonly referred to as FinFET patent. The patent dates back to 2011, and it comes from the Chinese Academy of Sciences, mainly Microelectronics Institute. The Chinese patent holders are asking for as much as 200 million yuan, which roughly translates to 28,664,380 US dollars. Given that this patent infringement is a major one for Intel, it is sure that a company will be pursued extensively in court. All of the Intel's semiconductors use FinFET technology, and if this is true, the violation is rather big. For more in detail reading, please refer to the source which goes through the history of Intel and Microelectronics Institute patent violation filing.