QNAP Systems, Inc., a leading computing, and storage solutions innovator, today unveiled the new high-capacity TS-hx77AXU-RP ZFS NAS series, including 12-bay TS-h1277AXU-RP and 16-bay TS-h1677AXU-RP rackmount models powered by AMD Ryzen 7000 Series processors based on the cutting-edge AMD Socket AM5 platform. By integrating robust hardware and diverse I/O including DDR5 RAM, M.2 PCIe Gen 5, PCIe Gen 4 slots, and redundant power supplies, the TS-hx77AXU-RP series unleashes enterprise-level performance and delivers ultra-high bandwidth, futureproof expandability, and trusted reliability for performance-demanding Tier 2 storage, virtualization, 4K video editing, and PB-level storage applications.

"The whole new TS-hx77AXU-RP series ZFS NAS provides enterprises with superb performance and large storage capacity to tackle business-critical workloads and storage-demanding applications. The AMD Ryzen 7000 Series multi-core processors further unlocks the key performance of DDR5 and M.2 PCIe Gen 5," said Alex Shih, Product Manager of QNAP, adding "Paired with the ZFS file system that's most suited for business applications, the TS-hx77AXU-RP series stands out as the top choice for storage solutions that require uncompromising data integrity."

TYAN, an industry leader in server platform design and a subsidiary of MiTAC Computing Technology Corporation, debuts its new server line-up for 4th Gen AMD EPYC & AMD Ryzen Processors at SC23, Booth #1917, in the Colorado Convention Center, Denver, CO, November 13-16.

AMD EPYC 9004 processor features leadership performance and is optimized for a wide range of HPC, cloud-native computing and Generative AI workloads
TYAN offers server platforms supporting the AMD EPYC 9004 processors that provide up to 128 Zen 4C cores and 256 MB of L3 Cache for dynamic cloud-native applications with high performance, density, energy efficiency, and compatibility.

TYAN, an industry leader in server platform design and a subsidiary of MiTAC Computing Technology Corporation, unveils an immersion cooling solution that delivering significant PUE (Power Usage Effectiveness) enhancement and showcases its latest server platforms powered by 4th Gen. Intel Xeon Scalable Processors targeting HPC, AI and Cloud Computing applications at SC23, Booth #1917.

Significant PUE Enhancement shown in an Immersion-cooling Tank vs. Conventional Air-cooling Operation Cabinet
The immersion cooling system live demonstrated at TYAN booth during SC23 is a 4U hybrid single phase tank enclosure equipped with 4 units of TYAN GC68A-B7136 cloud computing servers. Comparing to conventional Air-cooling operating cabinet, this hybrid immersion cooling system could offer huge improvement of PUE which makes it become an ideal mission-critical solution for the users aimed in energy-saving and green products.

According to the discovery made by @ghost_motley on X/Twitter, we have information that MSI is starting to roll out BIOS updates to accommodate Intel's Application Optimization called APO shortly. This update, however, comes with significant restrictions. Intel APO, designed to enhance performance, is exclusively compatible with 14th Gen Intel CPUs, leaving owners of previous-generation Intel processors, mainly the closely comparable 13th Gen, without this benefit. Intel's APO is an extension of its Dynamic Tuning Technology (DTT) specifically for gaming. It is available on select 14th Gen Core processors like the i9-14900K/KF, enhancing workload distribution across hardware resources like P-cores and optimizing them for peak frequencies.

As noted, the current rollout of Intel APO support is limited, namely to the Intel Core i7-14700K, i7-14700KF, i9-14900K, and i9-14900KF, excluding the Core i5 series. This omission is significant given APO's focus on boosting gaming performance, a feature that would be highly beneficial to Core i5 users. However, the feature is currently supported by only two games: Tom Clancy's Rainbow Six Siege and Metro Exodus. The frame rate improvements in Rainbow can be as high as 13% while also boosting Metro Exodus FPS by 16%. Whether we will see more APO-optimized games or not, owners of MSI motherboards have received their updates and are ready to enjoy the FPS increase.

Synopsys, Inc. (Nasdaq: SNPS) today announced it has extended its ARC Processor IP portfolio to include new RISC-V ARC-V Processor IP, enabling customers to choose from a broad range of flexible, extensible processor options that deliver optimal power-performance efficiency for their target applications. Synopsys leveraged decades of processor IP and software development toolkit experience to develop the new ARC-V Processor IP that is built on the proven microarchitecture of Synopsys' existing ARC Processors, with the added benefit of the expanding RISC-V software ecosystem.

Synopsys ARC-V Processor IP includes high-performance, mid-range, and ultra-low power options, as well as functional safety versions, to address a broad range of application workloads. To accelerate software development, the Synopsys ARC-V Processor IP is supported by the robust and proven Synopsys MetaWare Development Toolkit that generates highly efficient code. In addition, the Synopsys.ai full-stack AI-driven EDA suite is co-optimized with ARC-V Processor IP to provide an out-of-the-box development and verification environment that helps boost productivity and quality-of-results for ARC-V-based SoCs.

Ventana Micro Systems Inc. today announced the second generation of its Veyron family of RISC-V processors. The new Veyron V2 is the highest performance RISC-V processor available today and is offered in the form of chiplets and IP. Ventana Founder and CEO Balaji Baktha will share the details of Veyron V2 today during his keynote speech at the RISC-V Summit North America 2023 in Santa Clara, California.

"Veyron V2 represents a leap forward in our quest to lead the industry in high-performance RISC-V CPUs that are ready for rapid customer adoption," said Balaji Baktha, Founder and CEO of Ventana. "It substantiates our commitment to customer innovation, workload acceleration, and overall optimization to achieve best in class performance per Watt per dollar. V2 enhancements unleash innovation across data center, automotive, 5G, AI, and client applications."

Phanteks today expanded the Glacier One D30 Lineup with the new Glacier One 420D30 AllIn-One Liquid CPU cooler. Featuring triple D30-140 fans and 420 mm radiator configuration, this cooler not only delivers exceptional performance but also boasts stunning visual brilliance. One of the standout features of the Glacier One D30 AIO cooler is the clever daisy-chaining capability of its D30 fans, enabling centralized control through a single cable. This innovative design eliminates cable clutter, simplifying the installation process and making it easier than ever to achieve a clean and organized build. The cooler's generous copper base and fin array ensure efficient heat dissipation, positioning it as the ultimate cooling solution for high-end CPUs.

Designed with compatibility at its core, the Glacier One D30 AIO cooler boasts a sleek and compact design that optimizes clearance with motherboard and RAM components. The Glacier One D30 AIO Liquid Coolers now offer a comprehensive range, including 240, 360, and the newly introduced 420 models. All variants are seamlessly compatible with the latest Intel 14th Gen, Raptor Lake Refresh Processors, ensuring that users stay current with the latest processor technology.

Leading global motherboard manufacturer, ASRock, proudly announces its new WRX90 WS EVO & TRX50 WS motherboard for new AMD Ryzen Threadripper 7000 and AMD Ryzen Threadripper PRO 7000 WX-Series processors. The new motherboards support 4/8 channel memory up to 1 TB/2 TB DDR5 ECC RDIMM, PCI-Express 5.0 expansion slots, server grade storage expansion such as Slim-SAS & MCIO and 10 Gbps Ethernet, giving ultimate performance for almost every application such as content creating, video rendering, high-end workstation and even AI machine learning.

Ultimate Performance & Rock-Solid Stability
To ensure stability for AMD Ryzen Threadripper 7000 and AMD Ryzen Threadripper PRO 7000 WX-Series processors in all conditions and systems loads, the WRX90 WS EVO & TRX50 WS has been given a flagship-class server grade ultra-low loss PCB and 18+3+3 phase SPS Dr.MOS VRM design to ensure ultimate performance and superb reliability, even when subjected to the most demanding sustained workloads.

Intel and Submer, a company specializing in immersion cooling, are set to unveil a creative immersion cooling system at the OCP Global Summit. This system can efficiently dissipate 1,000 W of power in a single-phase liquid cooling setup designed for deployment in data centers. Unlike traditional water cooling, immersion cooling systems offer higher efficiency and reliability. The solution developed by Submer and Intel is based on a Forced Convection Heat Sink (FCHS) and leverages a heat exchanger for heat transfer with a second liquid. The primary advantage of immersion cooling is its lack of active components on the cooling element, making it possible for immersed systems to operate without them for extended periods.

In this new system, a copper cooler is housed with two fans at one end to enhance liquid flow through the heat sink using forced convection. However, this active cooling component contradicts the traditional passive concept of immersion cooling based on natural convection. In its initial phase, Submer and Intel utilized Xeon processors with an 800 W TDP, with plans to increase that figure to 1,000 W in the next step. This Forced Convection Heat Sink (FCHS) offers the advantages of easy manufacturing and cost-effective usage while effectively dissipating up to 1,000 W of waste heat, making it a compelling option for immersion cooling. There are even possibilities of being 3D printed, according to Submer, and the plan is to achieve cooling of 1kW+ chip. We expect to hear more about the system during the OCP Global Summit, running from October 17 to 19, as currently, we only have a lower-resolution image from Submer's press release.

CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today announced its range-wide compatibility and readiness for Intel's new 14th Generation Intel Core processors. With a enormous range of tested and validated components such as DDR5 memory, all-in-one liquid CPU coolers, innovative and reliable power supplies, and blazing fast M.2 SSDs, you can be confident that CORSAIR components will pair exceptionally with the latest in Intel processors to help your PC reach its full potential.

The latest Core processors utilize Intel's new Performance Hybrid Architecture, featuring more efficiency-cores for the best gaming experience—even while streaming and encoding video. Other features, such as Intel Thread Director to keep background tasks from slowing down games and Smart Cache for smoother gameplay and faster load times, make 14th Gen Core processors a great choice for PC gaming. But it's not enough to just have the CPU; you need to complete your system with components that can keep up and tap into its full potential, and that's where CORSAIR comes in.

Advantech has skillfully incorporated 13th Gen Intel Core processors across a wide array of products, setting new benchmarks for performance and capability. These enhanced solutions harness cutting-edge CPU architectures in their latest designs, delivering a noticeable performance boost over the previous processor generation. This upgrade significantly enhances application efficiency in smart factories, computer vision, intelligent retail, healthcare, and edge AI applications. At Advantech, we are unwavering in our commitment to providing long-term support, ensuring that customers can rely on our products for uninterrupted operation.

Advantech's new solutions offer Intel processors with up to 24 cores and 32 threads, up to 128 GB of DDR5 memory, and a PCIe 4.0/5.0 x16 slot for efficient multitasking. Experience optimized productivity with Advantech's Embedded Design-In Services and quality solutions featuring industrial-grade components. Advantech's embedded OS and value-added software options include Windows, Ubuntu, and Yocto BSP, along with the Edge AI Suite for AI performance evaluation and DeviceOn for device management.

Today HP Inc. redefined versatility with the HP Spectre Foldable PC, a remarkable 3-in-1 device with a foldable screen that seamlessly integrates the best features of a laptop, tablet, and desktop for the ultimate hybrid experience.

"Consumers are demanding greater flexibility to connect, work, and play for their hybrid lives beyond what the traditional laptop can provide," said Jo Tan, Senior Vice President & Division President of Personal Systems Consumer Solutions, HP Inc. "We are excited to introduce the HP Spectre Foldable PC, designed to seamlessly adapt to the various ways you want to work with its unique, durable form factor that pushes the boundaries of design and technology."

Oracle has announced their next generation Ampere A2 Compute Instances based on the latest AmpereOne processor, with availability starting later this year. According to Oracle, the new instances will deliver up to 44% more price-performance compared to x86 offerings and are ideal for AI inference, databases, web services, media transcoding workloads and run-time language support, such as GO and Java.

In related news, several new customers including industry leading real-time video service companies 8x8 and Phenix, along with AI startups like Wallaroo, said they are migrating to Oracle Cloud Infrastructure (OCI) and Ampere as more and more companies seek to maximize price, performance and energy efficiency.

Intel at the 2023 InnovatiON event surprised audiences with a live demo of a reference notebook powered by a Core "Lunar Lake" processor. What's surprising about this is that "Lunar Lake" won't come out until 2025 (at least), and succeeds not just the upcoming "Meteor Lake" architecture, but also its succeeding "Arrow Lake," which debuts in 2024. Intel is expected to debut "Meteor Lake" some time later this year. What's also surprising is that Intel has proven that the Intel 18A foundry node works. The Compute tile of "Lunar Lake" is expected to be based on Intel 18A, which is four generations ahead of the current Intel 7, which will be succeeded by Intel 4, Intel 3, and Intel 20A along the way.

The demo focused on the generative AI capabilities of Intel's third generation NPU, the hardware backend of AI Boost. Using a local session of a tool similar to Stable Diffusion, the processor was made to generate the image of a giraffe wearing a hat; and a GPT program was made to pen the lyrics of a song in the genre of Taylor Swift from scratch. Both tasks were completed on stage using the chip's NPU, and in timeframes you'd normally expect from discrete AI accelerators or cloud-based services.

As the world experiences a generational shift to artificial intelligence, each of us is participating in a new era of global expansion enabled by silicon. It's the "Siliconomy," where systems powered by AI are imbued with autonomy and agency, assisting us across both knowledge-based and physical-based tasks as part of our everyday environments.

At Intel Innovation, the company unveiled technologies to bring AI everywhere and to make it more accessible across all workloads - from client and edge to network and cloud. These include easy access to AI solutions in the cloud, better price performance for Intel data center AI accelerators than the competition offers, tens of millions of new AI-enabled Intel PCs shipping in 2024 and tools for securely powering AI deployments at the edge.

ASRock Rack, the leading innovative server company, today announced its latest server motherboard lineup now supports the AMD EPYC 8004 Series processors which extend the 4th Gen EPYC Family into new markets.

The AMD EPYC 8004 Series processors bring the benefits of the "Zen 4c" processor core to markets that seek strong performance but also have significant requirements for efficient, dense form factors, limited available power, and quieter operations. "AMD EPYC 8004 Processors are purpose-built to deliver strong performance and energy efficiency in an optimized, single-socket package," said Lynn Comp, corporate vice president, Server Product and Technology Marketing, AMD. "The combination of impressive performance and streamlined platform componentry of the EPYC 8004 Series CPUs means system builders can offer their customers cost-efficient business-relevant configurations."

GIGABYTE Technology: Giga Computing, a subsidiary of GIGABYTE and an industry leader in high-performance servers, server motherboards, and workstations, today announced new GIGABYTE enterprise series solutions for the AMD EPYC 8004 Series processors. Giga Computing is committed to reaching all sizes of data centers to deliver the best compelling solution, and now is doing so with new AMD EPYC 8004 CPUs that target edge applications, CSPs, and value enterprises. For these uses, the new R243 and R143 server series are poised alongside ME33 and ME03 motherboard series to deliver cost-optimized performance.

Leveraging the "Zen 4c" core architecture, the AMD EPYC 8004 Series CPUs deliver performance and power efficiency with built-in security capabilities in an optimized single-socket platform. Additionally, the new SP6 socket was designed to enable the power, cost, and form factor requirements for the AMD EPYC 8004 Series CPUs' target markets as well as diverse applications such as intelligent edge computing and telco.

TYAN, an industry-leading server platform design manufacturer and a subsidiary of MiTAC Computing Technology Corporation, today announced availability of new single-socket server platforms supporting AMD EPYC 8004 Series processors. These platforms are purpose built for cloud services and intelligent edge deployments while offering lower operating costs and delivering impressive energy efficiency.

"The AMD EPYC 8004 Series CPUs deliver a great combination of impressive performance and streamlined platform componentry which enables us to develop business-relevant server configurations for our customers," said Eric Kuo, Vice President of the Server Infrastructure Business Unit at MiTAC Computing Technology. "TYAN's innovative server platform, fueled by EPYC 8004 Series CPUs, empowers us to provide our customers with cost-effective solutions while also expanding into new markets."

When it comes to Intel powered mini PCs, Zotac is one of the main players in the market and its latest addition, the ZBOX Pro PI339 pico is an almost pocket friendly PC based on an Intel Processor N100. For those not familiar with Intel's N-range of CPUs, these are pretty much the E-cores from Intel's higher-end chips and Intel offers a range of options from two to eight cores. The N100 is a quad core part that peaks at a 3.4 GHz turbo frequency, has 6 MB of cache and a 6 W TDP. Zotac has paired the CPU with a somewhat meagre 4 GB of LPDDR5/LPDDR5X memory and there's no way to add more RAM to this system.

Storage is handled by a single M.2 slot that's compatible with PCIe 3.0 x4 NVMe or SATA drives up to 2280 in size. In terms of connectivity the ZBOX Pro PI339 pico has a pair of HDMI 2.1 ports that are limited to 4K output at 60 Hz, two USB 3.2 Gen 2 (10 Gbps) Type A ports, a Gigabit Ethernet port and a barrel plug for power input. It's unfortunate that Zotac didn't go with USB-C for the power input, as it would've made the ZBOX far easier to power, since the supplied power adapter only outputs 20 Watts. There's also onboard WiFi 6 and Bluetooth 5.2 support, although the rather large antennas are a somewhat odd addition to the small PC. Zotac claims to support Windows 11 / Windows 10 IoT ENT LTSC 2021, Ubuntu 20.04.5 LTS Linux, but most likely any flavour of Linux should work. The ZBOX Pro PI339 pico measures 115 x 76 x 27 mm (WxDxH) and has a volume of a mere 0.27 litres. No word on pricing as yet.

Andes Technology, a leading supplier of high efficiency, low-power 32/64-bit RISC-V processor cores and Founding Premier member of RISC-V International, today proudly announces general availability of the high-performance AndesCore AX45MPV multicore vector processor IP. The AX45MPV is the third generation of the award winning AndesCore vector processor series. Equipped with powerful RISC-V vector processing and parallel execution capability, it targets the applications with large volumes of data such as ADAS, AI inference and training, AR/VR, multimedia, robotics, and signal processing.

Andes and Meta started collaboration on datacenter AI with RISC-V vector core from early 2019. Andes later unveiled the AndesCore NX27V, marking a significant milestone as the industry's first commercial RISC-V vector processor core with the capability of generating up to 4 512-bit vector (VLEN) results per cycle, at the end of 2019. It immediately attracted the attention of worldwide SoC design teams working on AI accelerators, and has landed over a dozen datacenter AI projects. Since then, the RISC-V vector processor cores have become the choice for ML and AI chip vendors.

MIPS, a leading developer of high- performance RISC-V compute IP, has announced embedded systems industry veteran Sameer Wasson as the company's new CEO. Before joining MIPS, Wasson spent 18 years at Texas Instruments (TI), most recently as Vice President, Business Unit (BU) Manager, Processors, where he was responsible for the company's Processor businesses. In that role, Wasson re-established TI as a mainstream microprocessor (MPU) and microcontroller (MCU) supplier for high growth automotive and industrial markets, and established the company's footprint in embedded AI, software defined vehicles, and electrification.

As the new CEO of MIPS, Wasson will further accelerate the company's leadership in the High-Performance RISC-V market as it continues to expand its footprint in Automotive and Enterprise markets.

Today, AMD announced Amazon Web Services (AWS) has expanded its 4th Gen AMD EPYC processor-based offerings with the general availability of Amazon Elastic Compute Cloud (EC2) M7a and Amazon EC2 Hpc7a instances, which offer next-generation performance and efficiency for applications that benefit from high performance, high throughput and tightly coupled HPC workloads, respectively.

"For customers with increasingly complex and compute-intensive workloads, 4th Gen EPYC processor-powered Amazon EC2 instances deliver a differentiated offering for customers," said David Brown, vice president of Amazon EC2 at AWS. "Combined with the power of the AWS Nitro System, both M7a and Hpc7a instances allow for fast and low-latency internode communications, advancing what our customers can achieve across our growing family of Amazon EC2 instances."

Tachyum today announced that new EDA tools, utilized during the physical design phase of the Prodigy Universal Processor, have allowed the company to achieve significantly better results with chip specifications than previously anticipated, after the successful change in physical design tools - including an increase in the number of Prodigy cores to 192.

After RTL design coding, Tachyum began work on completing the physical design (the actual placement of transistors and wires) for Prodigy. After the Prodigy design team had to replace IPs, it also had to replace RTL simulation and physical design tools. Armed with a new set of EDA tools, Tachyum was able to optimize settings and options that increased the number of cores by 50 percent, and SERDES from 64 to 96 on each chip. Die size grew minimally, from 500mm2 to 600mm2 to accommodate improved physical capabilities. While Tachyum could add more of its very efficient cores and still fit into the 858mm2 reticle limit, these cores would be memory bandwidth limited, even with 16 DDR5 controllers running in excess of 7200MT/s. Tachyum cores have much higher performance than any other processor cores.

Phoronix has recently uncovered an intriguing Linux update, with kernel improvements being prepared to handle greater microcode payloads—they believe that "future AMD CPUs will be getting larger microcode patches." The timing could suggest that upcoming Zen 5 processors will be likely candidates to meet new requirements: "Right now the Linux kernel has a maximum microcode patch size for AMD CPUs that is three times the kernel's page size (typically 4K). But with a patch (published on July 20) that will "increase substantially" to eight times the page size. The increase is intentionally quite a magnitude larger in order to avoid future patches further having to bump the patch size limit in later generations." Earlier this month, some GitHub entries demonstrated that AMD engineers had patched Linux 6.5 with updates for "Family 26" (1Ah) CPU enablement," which Phoronix believes to be for next-gen platforms (Zen 5): "It's also not elaborated on why the CPU microcode size will be increasing. In any event the simple patch to bump the AMD CPU microcode limit is now out for review. It's also marked for back-porting to existing stable kernel versions."

IBASE Technology Inc. (TPEx: 8050), a leading provider of embedded computing solutions, introduces the IB837 3.5" single board computer that is designed for a wide range of IoT applications, including industrial automation, smart retail, healthcare, smart city and edge AI solutions, combining powerful processing capabilities with extensive connectivity options.

At the heart of the IB837 is the onboard Intel Celeron N & J series (formerly Elkhart Lake) processor, offering a good balance of performance and power efficiency. With support for up to 16 GB of DDR4-3200 SO-DIMM memory, the SBC ensures smooth multitasking and efficient operation, delivering exceptional performance while consuming minimal power for applications requiring a compact form factor.