In a statement for Tom's Hardware, Intel has announced a two-year warranty extension for its 13th and 14th Generation Core processors. This decision comes in response to widespread reports of crashes and instability affecting a broad range of models, from high-end flagship chips to mid-range offerings. The extension effectively increases the standard warranty period from three to five years for most boxed processors, with even the limited-edition models seeing an increase from one to three years. This move aims to reassure customers and mitigate concerns about potential long-term damage to affected chips. Intel has identified excessive voltage as the root cause of the problem, which has led to unexpected system crashes and blue screens of death (BSODs), particularly during gaming and other demanding tasks.

The company plans to release a microcode update by mid-August to prevent further degradation in unaffected processors. However, this update will not resolve issues in chips that have already experienced problems, and users with malfunctioning processors will need to seek replacements. The tech giant has faced criticism for its delayed response to the issue, which has plagued users for months. In its statement, Intel also addressed concerns about Via Oxidation, clarifying that while this separate issue was discovered in 2022, it is not the cause of the current instability problems. The company claims to have implemented fixes and enhanced screening procedures for Via Oxidation by early 2023, with affected chips reportedly removed from the supply chain by early 2024.

Cixin Technology, a Chinese tech firm, has introduced the Cixin P1 (CP8180), the region's first AI-centric consumer processor. This new chip aims to disrupt domestic markets by capitalizing on the growing AI PC trend, featuring up to 45 TOPS. According to IT Home, Cixin needed 15 months of research and development, 4 months for production, and 3 months of testing for their first CPU.

The Cixin P1 utilizes ARM-based architecture, similar to Qualcomm's successful Snapdragon X Elite CPUs. Built on a 6 nm process, the chip boasts a 12-core ARM CPU configuration, with eight performance cores and four efficiency cores, with a maximum frequency of 3.2 GHz.

MSI is excited to introduce the MS-C907, a robust and versatile embedded Box IPC designed to meet the demanding requirements of various industries. Beyond its suitability for the chemical industry, the MS-C907 is ideal for applications in factory automation, transportation, digital signage and retail.

Meeting the Needs of Multiple Industries
The MS-C907 offers robust performance, extensive connectivity, and durable design, making it an ideal solution for a wide range of industrial applications. Whether it's automating factory processes, powering digital signage, or managing smart building systems, the MS-C907 provides the reliability and efficiency needed for continuous operation.

CTL, a global cloud-computing solution leader for education and enterprise, announced today the introduction of the new CTL Chromebook PX141E Series. This series equips educators, staff, and students with the powerful performance and connectivity they need for all-day productivity. Easy ChromeOS device manageability combined with CTL's lifecycle services reduces the burden on IT departments.

"We are excited to refresh our product line with the next-generation 14" Chromebook. As the new powerhouse performer in our Chromebook lineup, we know our education and enterprise customers will appreciate the upgraded power, Wi-Fi, memory, and storage to support all day teaching and learning, while new conveniences such as the webcam privacy shutter and additional USB-A port enhance useability," said Erik Stromquist, CEO of CTL.

AMD reportedly plans to incorporate glass substrates into its high-performance system-in-packages (SiPs) sometimes between 2025 and 2026. Glass substrates offer several advantages over traditional organic substrates, including superior flatness, thermal properties, and mechanical strength. These characteristics make them well-suited for advanced SiPs containing multiple chiplets, especially in data center applications where performance and durability are critical. The adoption of glass substrates aligns with the industry's broader trend towards more complex chip designs. As leading-edge process technologies become increasingly expensive and yield gains diminish, manufacturers turn to multi-chiplet designs to improve performance. AMD's current EPYC server processors already incorporate up to 13 chiplets, while its Instinct AI accelerators feature 22 pieces of silicon. A more extreme testament is Intel's Ponte Vecchio, which utilized 63 tiles in a single package.

Glass substrates could enable AMD to create even more complex designs without relying on costly interposers, potentially reducing overall production expenses. This technology could further boost the performance of AI and HPC accelerators, which are a growing market and require constant innovation. The glass substrate market is heating up, with major players like Intel, Samsung, and LG Innotek also investing heavily in this technology. Market projections suggest explosive growth, from $23 million in 2024 to $4.2 billion by 2034. Last year, Intel committed to investing up to 1.3 trillion Won (almost one billion USD) to start applying glass substrates to its processors by 2028. Everything suggests that glass substrates are the future of chip design, and we await to see first high-volume production designs.

AMD Socket AM4 is now an 8-year-old platform, since its debut back in 2016. AMD objectively went above and beyond for this platform, launching processors powered by the original "Zen," the refreshed "Zen+," the "Zen 2," and the Intel-beating "Zen 3" microarchitecture, including 3D V-cache versions of the "Zen 3" that were competitive even with Intel's 12th Gen Core "Alder Lake" processors in gaming. Those on older processors on AM4 are spoiled for choice with upgrades within the platform, without having to change it, with AMD releasing new processor models every year for the past 8 years. The 2024 launches include the Ryzen 5000XT series.

It's hard to call the Ryzen 5000XT a "series," since there are only two SKUs—the Ryzen 9 5900XT, and the Ryzen 7 5800XT. Neither of the two feature 3D V-cache, but push clock speeds up. The Ryzen 9 5900XT is a 16-core/32-thread part, and is not meant to be confused with the 5900X, which is a 12-core/24-thread part. The 16-core 5900XT comes with a maximum boost frequency of 4.80 GHz, which is 100 MHz less than that of the 5950X. It has the same 105 W TDP, and a significantly lower $360 price. The Ryzen 7 5800XT, on the other hand, is an 8-core/16-thread chip with 4.80 GHz maximum boost frequency, compared to the 4.70 GHz of the 5800X, and the same 105 W TDP. It's priced around $260. Both chips include an AMD Wraith Prism RGB cooler that's capable of handling 140 W TDP processors. The Ryzen 9 5900XT is claimed by AMD to offer similar gaming performance to the Intel Core i7-13700K; while the 5800XT is claimed to play games competitively to the Intel Core i5-13600KF. Both chips should be available sometime in July, 2024.

AMD's upcoming Ryzen AI "Strix Point" mobile processor family will see a product launch in August 2024, with availability ramping up by October, a representative of mini PC manufacturer AOOSTAR has revealed. This would mean that at Computex next month, the company will use its Keynote address to unveil the processors, highlight their various new features, particularly the "Zen 5" microarchitecture, and perhaps even talk about performance in broad strokes, but specific processor models will launch in August, along with a few notebook product announcements.

AMD's upcoming Ryzen AI "Strix Point" processor will feature a significantly faster 50 AI TOPS-class NPU to power Microsoft Copilot+ certified devices; increased CPU performance from the new "Zen 5" architecture, and faster graphics from the new RDNA 3+ iGPU, besides support for faster memory speeds, new power management features, and updated platform and display I/O. "Strix Point" is far from being the only mobile processor family from AMD based on "Zen 5," there's also the Ryzen 9000 "Fire Range" family of high core-count mobile processors meant for gaming notebooks; and the "Strix Halo" meant for high-performance ultraportables.

Starting Q3 2024 in time for the holiday season, Intel's upcoming client processors (code-named Lunar Lake) will power more than 80 new laptop designs across more than 20 original equipment manufacturers, delivering AI performance at a global scale for Copilot+ PCs. Lunar Lake will get the Copilot+ experiences, like Recall, via an update when available. Building on the success of Intel Core Ultra processors and with the addition of Lunar Lake, Intel will ship more than 40 million AI PC processors this year.

"With breakthrough power efficiency, the trusted compatibility of x86 architecture and the industry's deepest catalog of software enablement across the CPU, GPU and NPU, we will deliver the most competitive joint client hardware and software offering in our history with Lunar Lake and Copilot+," said Michelle Johnston Holthaus, Intel executive vice president and general manager of the Client Computing Group.

The rollout of SiPearl's much-anticipated Rhea processor for European supercomputers has been pushed back by a year to 2025, but the delay comes with a silver lining - a significant upgrade in core count and potential performance. Originally slated to arrive in 2024 with 72 cores, the homegrown high-performance chip will now pack 80 cores when it eventually launches. This decisive move by SiPearl and its partners is a strategic choice to ensure the utmost quality and capabilities for the flagship European processor. The additional 12 months will allow the engineering teams to further refine the chip's architecture, carry out extensive testing, and optimize software stacks to take full advantage of Rhea's computing power. Now called the Rhea1, the chip is a crucial component of the European Processor Initiative's mission to develop domestic high-performance computing technologies and reduce reliance on foreign processors. Supercomputer-scale simulations spanning climate science, drug discovery, energy research and more all require astonishing amounts of raw compute grunt.

By scaling up to 80 cores based on the latest Arm Neoverse V1, Rhea1 aims to go toe-to-toe with the world's most powerful processors optimized for supercomputing workloads. The SiPearl wants to utilize TSCM's N6 manufacturing process. The CPU will have 256-bit DDR5 memory connections, 104 PCIe 5.0 lanes, and four stacks of HBM2E memory. The roadmap shift also provides more time for the expansive European supercomputing ecosystem to prepare robust software stacks tailored for the upgraded Rhea silicon. Ensuring a smooth deployment with existing models and enabling future breakthroughs are top priorities. While the delay is a setback for SiPearl's launch schedule, the substantial upgrade could pay significant dividends for Europe's ambitions to join the elite ranks of worldwide supercomputer power. All eyes will be on Rhea's delivery in 2025, mainly from Europe's governments, which are funding the project.

Apple is reportedly working on creating in-house chips designed explicitly for its data centers. This news comes from a recent report by the Wall Street Journal, which highlights the company's efforts to enhance its data processing capabilities and reduce dependency on third parties to supply the infrastructure. In the internal project called Apple Chips in Data Center (ACDC), which started in 2018, Apple wanted to design data center processors to handle the massive user base and increase the company's service offerings. The most recent advancement in AI means that Apple will probably serve an LLM processed in Apple's data center. The chip will most likely focus on inference of AI models rather than training.

The AI chips are expected to play a crucial role in improving the efficiency and speed of Apple's data centers, which handle vast amounts of data generated by the company's various services and products. By developing these custom chips, Apple aims to optimize its data processing and storage capabilities, ultimately leading to better user experiences across its ecosystem. The move by Apple to develop AI-enhanced chips for data centers is seen as a strategic step in the company's efforts to stay ahead in the competitive tech landscape. Almost all major tech companies, famously called the big seven, have products that use AI in silicon and in software processing. However, Apple is the one that seemingly lacked that. Now, the company is integrating AI across the entire vertical, from the upcoming iPhone integration to M4 chips for Mac devices and ACDC chips for data centers.

Today, Intel announced it surpassed 500 AI models running optimized on new Intel Core Ultra processors - the industry's premier AI PC processor available in the market today, featuring new AI experiences, immersive graphics and optimal battery life. This significant milestone is a result of Intel's investment in client AI, the AI PC transformation, framework optimizations and AI tools including OpenVINO toolkit. The 500 models, which can be deployed across the central processing unit (CPU), graphics processing unit (GPU) and neural processing unit (NPU), are available across popular industry sources, including OpenVINO Model Zoo, Hugging Face, ONNX Model Zoo and PyTorch. The models draw from categories of local AI inferencing, including large language, diffusion, super resolution, object detection, image classification/segmentation, computer vision and others.

"Intel has a rich history of working with the ecosystem to bring AI applications to client devices, and today we celebrate another strong chapter in the heritage of client AI by surpassing 500 pre-trained AI models running optimized on Intel Core Ultra processors. This unmatched selection reflects our commitment to building not only the PC industry's most robust toolchain for AI developers, but a rock-solid foundation AI software users can implicitly trust."
-Robert Hallock, Intel vice president and general manager of AI and technical marketing in the Client Computing Group

Dynabook Americas, Inc., the gold standard for long-lasting, professional-grade laptops, today announced that it has refreshed its value-packed 14-inch Satellite Pro C40 and 15.6-inch Satellite Pro C50 laptops with Intel Core processors (Series 1) and spill-resistant keyboards, and +Care Service Warranty with On-site.

"Our refreshed Satellite Pro C Series laptops underscore Dynabook's commitment to meeting the diverse needs of the public, private and education sectors. With their blend of modern performance, durability, and affordability, these laptops empower organizations of all sizes to thrive in today's dynamic and competitive landscape," said James Robbins, General Manager, Dynabook Americas, Inc.

ASRock Technology, a global leader in motherboard manufacturing, today announced the release of the latest AGESA beta BIOS for AM5 motherboards, enabling support for next-generation Ryzen processors. ASRock AM5 motherboard lineup can now support next-generation AMD Ryzen processors with the installation of the latest new AGESA 1.1.7.0 beta BIOS, significantly improving processor compatibility and providing users of ASRock AM5 motherboards with enhanced Ryzen processor support.

Users can easily update to the latest AGESA 1.1.7.0 beta BIOS through ASRock official website or using features like BIOS Flashback and Instant Flash. ASRock recommends that users update to the latest BIOS version as soon as possible to achieve better compatibility and system performance. The official version is expected to be released later, so please stay tuned to the ASRock official website for the latest updates.

AMD's next-generation Ryzen 9000 "Strix Point" mobile processor, which succeeds the current Ryzen 8040 "Hawk Point" and Ryzen 7040 "Phoenix," is confirmed to feature a CPU core-configuration of 12-core/24-thread, according to a specs-leak by HKEPC citing sources among notebook OEMs. It appears like Computex 2024 will be big for AMD, with the company preparing next-gen processor announcements across the desktop and notebook lines. Both the "Strix Point" mobile processor and "Granite Ridge" desktop processor debut the company's next "Zen 5" microarchitecture.

Perhaps the biggest takeaway from "Zen 5" is that AMD has increased the number of CPU cores per CCX from 8 in "Zen 3" and "Zen 4," to 12 in "Zen 5." While this doesn't affect the core-counts of its CCD chiplets (which are still expected to be 8-core), the "Strix Point" processor appears to use one giant CCX with 12 cores. Each of the "Zen 5" cores has a 1 MB dedicated L2 cache, while the 12 cores share a 24 MB L3 cache. The 12-core/24-thread CPU, besides the generational IPC gains introduced by "Zen 5," marks a 50% increase in CPU muscle over "Hawk Point." It's not just the CPU complex, even the iGPU sees a hardware update.

ASUS today announced BIOS updates enabling support for next-gen AMD Ryzen processors on ASUS AM5 X670, B650 and A620 motherboards, as well as support for existing Ryzen 7000 and 8000 series processors. These updates are necessary to enable compatibility with these processors. BIOS updates for ASUS AM5 motherboards also add support for existing Ryzen 7000 and 8000 series processor.

The updates can be accessed on the ASUS BIOS update page for the models listed below.

Lenovo is putting finishing touches on the Yoga Slim 7 14 2024, one of the first non-reference laptop to feature Qualcomm's latest Snapdragon X processor. Leaked images circulating on X (formerly Twitter) reveal a sleek and stylish design, with a 14-inch or 14.5-inch display encased in a slim and portable form factor. Qualcomm has previously showcased eye-catching demo reference systems in a striking red color scheme, but Lenovo's Yoga Slim 7 14 2024 marks the first time a significant laptop manufacturer with actual product images incorporating the Snapdragon X chip. The Yoga Slim 7 14 2024 is part of Lenovo's popular Slim laptop lineup, including models powered by Intel and AMD processors. The latest "Gen 8" iteration featured options for AMD Ryzen 7040 series and Intel 13th Gen Core i and Core Ultra series CPUs.

One notable addition to the Snapdragon X-powered model is the inclusion of a dedicated Microsoft Copilot button. Qualcomm has heavily touted the Snapdragon X's Neural Processing Unit (NPU) performance and its ability to directly accelerate various AI and machine learning algorithms on the device. There have been a few comparison points between Meteor Lake with Intel's NPU and Snapdragon X Elite with Qualcomm's NPU. The chipmaker's X Elite and X Plus laptop offerings are expected to arrive soon, and there are strong indications that this may happen during the Computex trade show.Update 17:28 UTC: X user WalkingCat has posted images of Lenovo Thinkpad T14s laptop, which can be seen below.

Today, AMD announced new products that will expand its commercial mobile and desktop AI PC portfolio, delivering exceptional productivity and premium AI and connectivity experiences to business users. The new AMD Ryzen PRO 8040 Series are the most advanced x86 processors built for business laptops and mobile workstations. In addition, AMD also announced the AMD Ryzen PRO 8000 Series desktop processor, the first AI enabled desktop processor for business users, engineered to deliver cutting-edge performance with low power consumption.

With AMD Ryzen AI built into select models, AMD is further extending its AI PC leadership. By leveraging the CPU, GPU, and dedicated on-chip neural processing unit (NPU), new Ryzen AI-powered processors provide more dedicated AI processing power than previous generations, with up to 16 dedicated NPU TOPS (Trillions of Operations Per Second) and up to 39 total system TOPS. Commercial PCs equipped with new Ryzen AI-enabled processors will help transform user experience, offering next-gen performance for AI-enabled collaboration, content creation, and data and analytics workloads. With the addition of AMD PRO technologies, IT managers can unlock enterprise-grade manageability features to simplify IT operations and complete PC deployment faster across the organization, built-in security features for chip-to-cloud defense from sophisticated attacks, as well as unprecedented stability, reliability and platform longevity for enterprise software.

According to a recently published help guide, spotted by the X/Twitter user @harukaze5719, NVIDIA has addressed reported stability problems users are experiencing with Intel's latest 13th and 14th generation Raptor Lake Core processors, especially the high-performance overclockable K-series models. In a recent statement, NVIDIA recommended that owners of the affected Intel CPUs consult directly with Intel if they encounter issues such as system instability, video memory errors, game crashes, or failures to launch certain applications. The problems seem particularly prevalent when running demanding workloads like gaming on Unreal Engine 5 titles or during shader compilation tasks that heavily utilize the processor and graphics capabilities. Intel has established a dedicated website to provide support for these CPU instability cases. However, the chipmaker still needs to issue a broad public statement and provide a definitive resolution.

The instability is often attributed to the very high frequencies and performance the K-series Raptor Lake chips are designed to achieve, which are among the fastest processors in Intel's lineup. While some community suggestions like undervolting or downclocking the CPUs may help mitigate issues in the short term, it remains unclear if permanent fixes will require BIOS updates from motherboard manufacturers or game patches.

Update: As the community has pointed out, motherboard makers often run the CPU outside of Intel's default spec, specifically causing overvolting through modifying or removing power limits, which could introduce instabilities into the system. Running the CPU at Intel-defined specification must be assured with a BIOS check to see if the CPU is running at specified targets. Intel programs the voltage curve into the CPU, and when motherboard makers remove any voltage/power limits, the CPU takes freedom in utilizing the available headroom, possibly causing system instability. We advise everyone to check the power limit setting in the BIOS for the health of their own system.

DFI, the world's leading brand in embedded motherboards and industrial computers, is thrilled to announce two of the world's first Industrial MicroATX motherboards to support Intel Core 12th, 13th, and 14th (Alder Lake-S, Raptor Lake-S and Raptor Lake-S Refresh) Gen Processors. "With support for the latest Intel Core processors and features including dual GPU slots and dual 10GbE ports, RPS310 and ADS310 represent a significant leap forward in innovation for industrial and medical computing, empowering manufacturing and healthcare professionals to achieve new levels of efficiency," said Jarry Chang, General Manager of Products Center at DFI.

RPS310
Featuring dual PCIe x16 Gen 4 GPU slots, addresses key challenges for Factory Automation professionals working in Smart manufacturing field, enabling improved visualized data, complex imagery processing and quality monitoring in automated production lines. RPS310 is also perfect for medical professionals to analyze Medical imaging data with unprecedented image quality and efficiency, improving diagnosis accuracy on MRIs and CT Scanners and X-rays.

At the Intel Vision 2024 customer and partner conference, Intel introduced the Intel Gaudi 3 accelerator to bring performance, openness and choice to enterprise generative AI (GenAI), and unveiled a suite of new open scalable systems, next-gen products and strategic collaborations to accelerate GenAI adoption. With only 10% of enterprises successfully moving GenAI projects into production last year, Intel's latest offerings address the challenges businesses face in scaling AI initiatives.

"Innovation is advancing at an unprecedented pace, all enabled by silicon - and every company is quickly becoming an AI company," said Intel CEO Pat Gelsinger. "Intel is bringing AI everywhere across the enterprise, from the PC to the data center to the edge. Our latest Gaudi, Xeon and Core Ultra platforms are delivering a cohesive set of flexible solutions tailored to meet the changing needs of our customers and partners and capitalize on the immense opportunities ahead."

Acer today announced the new Nitro 14 and Nitro 16 gaming laptops, powered by AMD Ryzen 8040 Series processors with Ryzen AI[1]. With up to NVIDIA GeForce RTX 4060[2] Laptop GPUs supported by DLSS 3.5 technology, both are backed by NVIDIA's RTX AI platform, providing an array of capabilities in over 500 games and applications, enhanced by AI. Gamers are immersed in their 14- and 16-inch NVIDIA G-SYNC compatible panels with up to WQXGA (2560x1600) resolution.

Whether in call or streaming in-game, Acer PurifiedVoice 2.0 harnesses the power of AI to block out external noises, while Acer PurifiedView keeps users always front and center of all the action. Microsoft Copilot in Windows (with a dedicated Copilot key) helps accelerate everyday tasks on these AI laptops, and with one month of Xbox Game Pass Ultimate included with every device, players will enjoy hundreds of high-quality PC games. To seamlessly take command of device performance and customizations, one click of the NitroSense key directs users to the control center and the library of available AI-related functions through the new Experience Zone.

While we are all used to having a system with a CPU, GPU, and, recently, NPU—X-Silicon Inc. (XSi), a startup founded by former Silicon Valley veterans—has unveiled an interesting RISC-V processor that can simultaneously handle CPU, GPU, and NPU workloads in a chip. This innovative chip architecture, which will be open-source, aims to provide a flexible and efficient solution for a wide range of applications, including artificial intelligence, virtual reality, automotive systems, and IoT devices. The new microprocessor combines a RISC-V CPU core with vector capabilities and GPU acceleration into a single chip, creating a versatile all-in-one processor. By integrating the functionality of a CPU and GPU into a single core, X-Silicon's design offers several advantages over traditional architectures. The chip utilizes the open-source RISC-V instruction set architecture (ISA) for both CPU and GPU operations, running a single instruction stream. This approach promises lower memory footprint execution and improved efficiency, as there is no need to copy data between separate CPU and GPU memory spaces.

Called the C-GPU architecture, X-Silicon uses RISC-V Vector Core, which has 16 32-bit FPUs and a Scaler ALU for processing regular integers as well as floating point instructions. A unified instruction decoder feeds the cores, which are connected to a thread scheduler, texture unit, rasterizer, clipping engine, neural engine, and pixel processors. All is fed into a frame buffer, which feeds the video engine for video output. The setup of the cores allows the users to program each core individually for HPC, AI, video, or graphics workloads. Without software, there is no usable chip, which prompts X-Silicon to work on OpenGL ES, Vulkan, Mesa, and OpenCL APIs. Additionally, the company plans to release a hardware abstraction layer (HAL) for direct chip programming. According to Jon Peddie Research (JPR), the industry has been seeking an open-standard GPU that is flexible and scalable enough to support various markets. X-Silicon's CPU/GPU hybrid chip aims to address this need by providing manufacturers with a single, open-chip design that can handle any desired workload. The XSi gave no timeline, but it has plans to distribute the IP to OEMs and hyperscalers, so the first silicon is still away.

Shipping manifests appear to be great sources of pre-release information—only a few hours ago, the existence of prototype AMD "Strix Point" and "Fire Range" mobile processors was highlighted by hardware sleuth harukaze5719. A related leak has appeared online fairly quickly after the discovery of laptop-oriented "Zen 5" chips. momomo_us joined in on the fun, with their exposure of speculated desktop silicon. Two brand-new AMD OPN codes have been linked to the upcoming "Granite Ridge" series of AM5 processors.

100-000001404-01 is likely an eight-core/ sixteen-thread "Zen 5" Ryzen CPU with a 170 W TDP—a stepping designation, B0, indicates engineering sample status. The other listing, 100-000001290-21, seems to be an A0-type engineering sample—leaked info suggests that this a six-core/twelve-thread (105 W TDP) next-gen mainstream desktop processor. AMD is likely nearing the finish line with its Ryzen 9000-series—a new generation of chipsets, including X870E, is reportedly in the pipeline. Additionally, VideoCardz posits that a refresh of 700-series boards could be on the cards. "Granite Range" CPUs are expected to retain the current-gen 6 nm client I/O die (cIOD), as sported by "Raphael" Ryzen 7000-series desktop processors.

AMD's next-gen EPYC Zen 5 processor family seems to be nearing launch status—late last week, momomo_us uncovered an unnamed motherboard's datasheet; this particular model will accommodate a single 9000-series CPU—with a maximum 400 W TDP—via an SP5 socket. 500 W and 600 W limits have been divulged (via leaks) in the past, so the 400 W spec could be an error or a: "legitimate compatibility issue with the motherboard, though 400 Watts would be in character with high-end Zen 4 SP5 motherboards," according to Tom's Hardware analysis.

AMD's current-gen "Zen 4" based EPYC "Genoa" processor family—sporting up to 96-cores/192-threads—is somewhat limited by its DDR5 support transfer rates of up to 4800 MT/s. The latest leak suggests that "Turin" is upgraded quite nicely in this area—when compared to predecessors—the SP5 board specs indicate DDR5 speeds of up to 6000 MT/s with 4 TB of RAM. December 2023 reports pointed to "Zen 5c" variants featuring (max.) 192-core/384-thread configurations, while larger "Zen 5" models are believed to be "modestly" specced with up to 128-cores and 256-threads. AMD has not settled on an official release date for its EPYC "Turin" 9000-series processors, but a loose launch window is expected "later in 2024" based on timeframes presented within product roadmaps.

Google has just released an Arm-optimized version of its popular Chrome browser for Windows PCs. This new version is designed to take full advantage of Arm-based devices' hardware and operating system, promising users a faster and smoother browsing experience. The Arm-optimized Chrome for Windows has been developed in close collaboration with Qualcomm, ensuring that Chrome users get the best possible experience on current Arm-compatible PCs. Hiroshi Lockheimer, Senior Vice President at Google, stated, "We've designed Chrome browser to be fast, secure, and easy to use across desktops and mobile devices, and we're always looking for ways to bring this experience to more people." Early testers of the Arm-optimized Chrome have reported significant performance improvements compared to the x86-emulated version. The new browser is rolling out starting today and will be available on existing Arm devices, including PCs powered by Snapdragon 8cx, 8c, and 7c processors.

Shortly, Chrome will receive an even more performant chip boost with Qualcomm's upcoming Snapdragon X Elite SoC launch. Cristiano Amon, President and CEO of Qualcomm, expressed his excitement about the collaboration, saying, "As we enter the era of the AI PC, we can't wait to see Chrome shine by taking advantage of the powerful Snapdragon X Elite system." Qualcomm's Snapdragon X Elite devices are expected to hit the market in mid-2024 with "dramatic performance improvement in the Speedometer 2.0 benchmark" on reference hardware. Being one of the most essential applications, getting a native Chrome build to run on Windows-on-Arm is a significant step for the platform, promising more investment from software makers.