Bitspower, one of the world's leading suppliers of water-cooling equipment for performance computers, today launched the Bitspower AM5 kit which can transform AMD-based Bitspower CPU water blocks into an AM5-compatible product. More and more setups used by gamers, streamers, and creators will harness AMD's new AM5 platform, which provides native support for up to 170 W—meaning there's power to do more, play more, and create more than ever before. However, with this increased power comes higher temperatures.

Fortunately, AMD has ensured that existing AM4 cooling solutions can be supported with their newest motherboards, with the product's height and port distance being managed in a 7 mm increment. With the new AM5 kit, Bitspower's current range of AMD CPU blocks can directly migrate to AM5 socket motherboards. The company's latest generation CPU water blocks, such as the M Pro Water Blocks, are optimized for cooling Ryzen 7000-series CPUs, allowing users to take that already-powerful processor to new heights.

ENERMAX, a leading designer and manufacturer of high-performance PC hardware products, is pleased to announce that a selection of its current all-in-one (AIO) liquid and air coolers will be fully compatible with AM5 (LGA1718) socket designed for the upcoming AMD Ryzen 7000 Series CPUs. A list of compatible ENERMAX coolers is provided in the table below. For users who already own the selected ENERMAX CPU coolers and plan to switch motherboard to AMD Ryzen 7000 series, you may contact your ENERMAX local branch for assistance. For the latest installation guide and video, please visit this page.

EK, the market leader in high-end water cooling for PC products, wishes to inform existing and future customers regarding the compatibility of our existing cooling solutions with the highly anticipated AMD Socket AM5 platform. Compared to Socket AM4, the backplate mounting hole pattern is still 54 x 90 mm and uses UNC 6-32 threads, but the AM5 motherboards now have an integrated CPU-socket backplate. The stock backplate is best kept untouched since removing it also means fiddling with the CPU loading mechanism and exposing the socket pins. To avoid such risks, some EK products need to be updated, but fear not, as compatibility is handled for all existing EK products.

AMD Ryzen 7000 "Zen 4" processors can hit up to 95 °C at stock settings, with cooling most appropriate to the TDP level. This is because the PPT (package power tracking) limits for the 170 W TDP processors is as high as 230 W, and for the 105 W TDP models, it's 130 W. After reaching this temperature threshold, the processor begins to downclock itself to lower temperatures. Harukaze5719 discovered that higher than needed core voltages could be at play, and manually undervolting the processors could free up significant thermal headroom, letting the processors hold on to higher boost multipliers better.

At IFA 2022, MSI introduces its latest products, tailor-made for gamers, creators, and professionals, to the world. From gaming laptops, desktops, and components, to business monitors, industrial computers, and automotive and commercial solutions, MSI is revealing the most powerful, capable new products, covering every need and every aspect of technology.

Exhibition Date: Sep 2nd - Sep 6th, 2022
Opening Hours: 10:00 AM - 06:00 PM
Location: Stand 102, Hall 11.2 @ Messe Berlin, Germany
"IFA 2022 is one of the world's most important consumer electronics trade shows. After years of virtual and distanced living, MSI is especially well-prepared to support all industries and professions with our innovations and solutions, to help them adapt to new ways of working, living and entertaining," said Sam Chern, MSI Marketing Vice President.

XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts, today announces announced the launch of the new XPG LANCER 5600 DDR5 memory module, its first DDR5 to support AMD EXPO (Extended Profiles for Overclocking); What's more, all ADATA's and XPG's full lineup of DDR5 memory modules are compatible with AMD's latest platforms, ensuring optimal stability and performance.

XPG LANCER DDR5-5600 is capable of delivering performance of up to 5600 MT/s and comes in variants with or without RGB lighting. They also come with two heat sink color options to choose from to meet different preferences, including Midnight Black and Snow White. As AMD Ryzen 7000 series processors have been announced, XPG took the initiative to launch the XPG LANCER DDR5-5600 to allow gamers who are still on the sidelines to upgrade to DDR5 and enjoy the benefits of AMD EXPO for easy overclocking. XPG's full range of DDR5 memory models, including CASTER, LANCER, and HUNTER will all support AMD EXPO and be available globally in October.

AMD CEO Lisa Su, who has supervised the company's rise from the ashes, looked to assuage fears of reduced stock for the launch of AMD's next-gen Ryzen 7000 series CPUs. Hardware enthusiasts being understandably burned from the last generation of GPU and CPU's lack of availability (and ensuing scalping practices), the CEO in today's announcement of the Ryzen 7000 series carried a promise: "It is true that if you look at the past 18 months there have been a number of things, whether its capacity limitations or logistics," she said. "From an AMD standpoint, we have dramatically increased our overall capacity, in terms of wafers, as well as substrates and on the back end. So with our launch of Zen 4 we don't expect any supply constraints."

AMD's Zen 4 family is being launched with the new AM5 socket, which AMD says will live through 2025+ for subsequent CPU releases. The company has managed to increase IPC by 13% while decreasing the overall CCD size by 18% compared to that of Zen 3 (reducing the area/cost impact of adding integrated graphics throughout the lineup). Frequencies have gone up to a maximum 5.7 GHz thanks to smart circuitry redesign and TSMC's 5 nm node. AMD says its Ryzen 7000 can thus be expected to provide up to 29% higher single-core and 45% higher multi-core performance. Of course, with macroeconomics being what they are, and recent reports on lack of low-price chips throughout the market, it's not only the availability of Ryzen 7000 CPUs that matters: AM5 motherboards and DDR5 memory chip stocks have to be taken into account as well. But all in all, AMD seems to be prepared for a successful and quantity-adequate launch.

GeIL is readying a fairly large lineup of its EVO V and Polaris RGB DDR5 memory lines featuring the AMD EXPO technology. These modules will pack both AMD EXPO and Intel XMP 3.0 profiles, but their advertised specs will apply on AMD Ryzen 7000-series platforms, whereas the XMP 3.0 profiles included will be an approximation of these specs. GeIL's lineup includes 32 GB dual-channel kits of two 16 GB modules. Frequencies include DDR5-4800 (JEDEC native), DDR5-5200 (JEDEC native), and EXPO-backed DDR5-5600, DDR5-6000, DDR5-6000 with tighter timings, DDR5-6200, and DDR5-6400. The exact part number, timings, and module voltages, are in the table below.

AMD in its Ryzen 7000 series launch event shared its near-future CPU architecture roadmap, in which it confirmed that the "Zen 4" microarchitecture, currently on the 5 nm foundry node, will see an optical-shrink to the 4 nm process in the near future. This doesn't necessarily indicate a new-generation CCD (CPU complex die) on 4 nm, it could even be a monolithic mobile SoC on 4 nm, or perhaps even "Zen 4c" (high core-count, low clock-speed, for cloud-compute); but it doesn't rule out the possibility of a 4 nm CCD that the company can use across both its enterprise and client processors.

The last time AMD hyphenated two foundry nodes for a single generation of the "Zen" architecture, was with the original (first-generation) "Zen," which debuted on the 14 nm node, but was optically shrunk and refined on the 12 nm node, with the company designating the evolution as "Zen+." The Ryzen 7000-series desktop processors, as well as the upcoming EPYC "Genoa" server processors, will ship with 5 nm CCDs, with AMD ticking it off in its roadmap. Chronologically placed next to it are "Zen 4" with 3D Vertical Cache (3DV Cache), and the "Zen 4c." The company is planning "Zen 4" with 3DV Cache both for its server- and desktop segments. Further down the roadmap, as we approach 2024, we see the company debut the future "Zen 5" architecture on the same 4 nm node, evolving into 3 nm on certain variants.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is excited to announce two new DDR5 memory series, the Trident Z5 Neo and Flare X5 series, designed for the new AMD Ryzen 7000 Series processors and 600 series motherboards. The Trident Z5 Neo family offerings include RGB (Trident Z5 Neo RGB) and non-RGB (Trident Z5 Neo) variants. Programmed with AMD EXPO technology and created with hand-screened memory ICs, the Trident Z5 Neo and Flare X5 series allow PC enthusiasts, gamers, and overclockers to experience the performance of the new AMD AM5 platform.

Designed for DDR5 memory-enabled AMD Ryzen 7000 Series desktop processors, the Trident Z5 Neo and Flare X5 series are pre-programmed with the latest AMD EXPO (EXtended Profiles for Overclocking) memory profiles, which allow users to easily overclock the memory kits. By simply enabling the AMD EXPO profile in the BIOS with a compatible motherboard and processor, users can unleash overclocked memory speeds on AMD Ryzen 7000 Series processors.

CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today announced the launch of DOMINATOR PLATINUM RGB DDR5 for AMD, VENGEANCE RGB DDR5 for AMD and VENGEANCE DDR5 for AMD, featuring new AMD EXPO technology and ready to power the next generation of Ryzen 7000-series powered PCs.

Available in frequencies up to a screaming-fast 6,000MT/s, and even higher in the future, all CORSAIR DDR5 for AMD kits offer AMD EXPO (Extended Profiles for Overclocking), allowing these modules to be set to their rated speed and performance in just a few clicks. AMD EXPO technology makes setup simple and ensures users can easily run their memory at the speed it was created to run at.

AMD's upcoming launch of Ryzen 7000 series processors will bring an entirely new AM5 platform that will enable newer technologies and protocols. We have DDR5 memory and PCIe 5.0 connection with everything at level five. However, the upcoming chipsets AMD has designed to work alongside the new processors will be available in several variants. There will be regular X670 and B650 versions that support either a PCIe 5.0 GPU or a PCIe 5.0 M.2 NVIMe SSD. Today, we got a confirmation that not only the big X670 chipset has an "E" or "Extreme" version, but its smaller brother B650 as well. With X670E and B650E, users get both PCIe 5.0 connectivity for their GPU and M.2 NVIMe SSD. For more information, we have to wait for AMD's official launch information later today.

AMD is allegedly ready with a working "Zen 4" chiplet that has stacked 3D Vertical Cache (3DV cache) memory, which supplements the on-die L3 cache, and is found to massively improve gaming performance. "Moore's Law is Dead" reports that the Zen 4 + 3DV Cache chiplet will be used with various Ryzen 7000X3D SKUs, as well as special EPYC "Genoa" SKUs.

The 3DV Cache deployed with the "Zen 4" chiplet is a second-generation to the one on the "Zen 3 + 3DV cache" chiplet, and AMD has worked on a number of bandwidth and latency improvements, so it performs in-sync with the generationally-faster on-die L3 cache of the "Zen 4" chiplet. Unlike the CCD below it that's built on TSMC N5 (5 nm EUV), the L3D (the stacked die with the 3DV cache) is possibly be built on an older node, such as N6 (6 nm), since it only contains a slab of memory and doesn't warrant N5. "Moore's Law is Dead" reports that AMD expects to repeat the magic of the 5800X3D when it comes to gaming performance, and expects Ryzen 7000X3D processors to dominate Intel's 13th Gen "Raptor Lake" processors. This was echoed by another reliable source, greymon55.

ASUS Republic of Gamers (ROG) today announced the latest gaming gear at Gamescom 2022, including the AMD X670E series motherboards, AIO coolers, PSU, displays, networking products, and peripherals. Along with these products, ROG released its first music single Reality, with vocals by renowned voice actor and musician Troy Baker, more commonly known for his roles in video games like The Last of Us and Uncharted series. An anime-inspired interactive 360° music video featuring the song is available on YouTube.

ROG Swift OLED PG42UQ / PG48UQ: The 42-inch ROG Swift OLED PG42UQ is designed for immersive desktop gaming and features 4K visuals at an overclocked 138 Hz refresh rate. The OLED panel ensures the deepest hues, as well as vibrant colors thanks to a 98% DCI-P3 color gamut and Delta E < 2 color difference. An ultrafast 0.1 ms (GTG) response time ensures great viewing and gaming experiences. The larger, 48-inch ROG Swift OLED PG48UQ is ideal for those looking to play their games on an even bigger scale. ROG OLED monitors include a custom heatsink that offers more surface area for heat exchange, resulting in up to 8% lower operating temperatures compared to ROG monitors without a heatsink to ensure better OLED performance and longevity.

ASUS today announced a new generation of AMD-based motherboards to accompany the ROG Crosshair X670E Extreme and support the latest Ryzen 7000 processors: the ROG Crosshair X670E Hero, the ROG Strix X670E-E Gaming WiFi, and the TUF Gaming X670E-Plus WiFi. Introducing the new generation of AMD ROG motherboards: the X670E series. Featuring support for DDR5 memory modules and PCIe 5.0 devices, the ROG Crosshair X670E Hero, ROG Strix X670E-E Gaming WiFi, and TUF Gaming X670E-Plus WiFi is equipped with improved bandwidth capabilities, stability, and overall connectivity.

All three boards feature the latest ASUS Q-Design innovations. The ROG Crosshair X670E Hero and ROG Strix X670E-E Gaming WiFi includes the PCIe Q-Release button, a feature that lets users release their graphics card from the PCIe slot with one press. In addition, all three featured motherboards will include the single-sided Q-DIMM latching design to ensure ease of installation and allowing memory sticks to hold firmly in place. Lastly, the boards include the M.2 Q-latch, allowing users to secure or loosen an M.2 drive with just their fingertips.

Someone with access to an AMD Ryzen 7 7700X "Zen 4" processor posted one of the first pictures of an AMD Ryzen 7 7700X "Zen 4" desktop processor installed on a motherboard. The picture shows the 7700X seated in the Socket AM5. The retention brace of the socket only clutches against two side protrusions of the IHS. AMD explained in its recent interview with us that the odd shape of the IHS is to accommodate the various electrical SMDs outside the IHS for better thermal management. With the processor installed, we can see that they're exposed and not covered up by the retention brace. The IHS is taller than the brace, so there will be some passive ventilation for the SMDs. Installing a Ryzen 7000 processor on Socket AM5 involves familiar steps to installing Intel mainstream-desktop processors for the past 15 years. This particular processor has the "D" marking on the IHS, which denotes a non-retail sample (possibly a review sample).

CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today announced its readiness for the new AMD Ryzen 7000 Series processors and accompanying motherboard chipsets. Featuring all new Zen 4 CPU architecture, AMD Ryzen 7000 Series chips deliver a substantial performance boost over previous-generation processors, and CORSAIR has the components to help support this generational upgrade. Those looking to build a new AMD system can take advantage of the free online CORSAIR PC Builder to help shortlist compatible parts for their new system.

CORSAIR has been working closely with AMD in the lead-up to the AMD Ryzen 7000 Series launch, and has already updated its PC Builder database to include the new processors so that you can curate a parts list for a powerful new AMD PC in minutes. The CORSAIR PC Builder takes your chosen CPU, graphics card, and motherboard and checks them for compatibility against a vast database of PC parts, coming up with a comprehensive list of CORSAIR parts guaranteed to work with your system. From a correctly sized case and appropriate fans, to a PSU rated to power your build and even RGB lighting, the CORSAIR PC Builder takes the guesswork out of building your new Ryzen 7000 Series powered PC. The CORSAIR PC Builder is even able to intelligently optimize the parts selected, so that you don't overspend or bottleneck your build with a mismatched component.

PC Canada has drawn first blood in registering pricing for AMD's upcoming Ryzen 7000 series, the successor to the successful 5000 series. As spotted by renowned leaker momomo_us and shared on Twitter, the specialist retailer based in Canada listed pricing for the Ryzen 7 7600X, 7700X, 7900X and 7950X CPUs. The pricing, if representative, shows an average increase that averages to 10%-12% across SKUs when compared to the previous generation Ryzen. The prices could be placeholders based on the retailers' own expectations, so this information should be taken with a grain of salt (or two).

After conversion from CAD to US dollars, pricing settles at $340 for the Ryzen 7 7600X ($299 for the 5600X at launch, for a 13% premium); $494 for the Ryzen 7 7700X (against the later-released, $299 Ryzen 7 5700X for a 65% premium); $625 for the Ryzen 9 7900X ($549 for the launch Ryzen 9 5900X, for a 13% increase) and finally, the Ryzen 9 7950X for $906 (against the Ryzen 9 5950X's $799 asking price, for another 13% premium).

AMD has reportedly pushed market-availability date of its next-generation Ryzen 7000 series "Zen 4" desktop processors from September 15 to September 27, 2022. This would clash with the rumored product-announcement date of the Intel 13th Generation Core "Raptor Lake" processor series. If true, this is possibly a move designed to prevent Intel from sharing performance numbers of Ryzen 7000-series processors in the product-announcement presentation of "Raptor Lake," as Intel can only compare the chips it is announcing with competing AMD products that are available in the market at the time.

A September 27 market availability could still mean a late-August product announcement along the sidelines of Gamescom, with product reviews in the following weeks. It's just that the market availability date is now pushed to late-September. Intel's launch cycle for "Raptor Lake" could see a late-September announcement, but it remains to be seen if product availability is immediate, or timed weeks later. The 13th Gen Core "Raptor Lake" processor is built on the same LGA1700 package as current "Alder Lake," and compatible with existing Intel 600-series motherboards with a UEFI firmware update; although will be launched alongside new Intel 700-series chipset motherboards. AMD's Ryzen 7000-series product launch will be timed with those of compatible Socket AM5 motherboards based on the AMD 600-series chipset, and a new line of DDR5 memory modules featuring the AMD EXPO technology.

A bit late to the game compared to its competitors, MSI has finally published its product pages for three of its upcoming X670 and X670E motherboards. The three models are the MEG X670E ACE, the MPG X670E Carbon WiFi and the Pro X670-P WiFi. Earlier todaywe got a first hint with regards to the pricing of a couple of these boards and now we have most of the technical details with regards to the boards themselves. As with all other boardmakers, MSI hasn't revealed any information with regards to memory clocks and obviously no details about which CPUs will be supported. We already had a pretty good idea what to expect from these boards based on the details MSI released at Computex, but features like the power design weren't revealed at the time, nor did we get a very good look at the board.

The MEG X670E ACE appears to be MSI's high-end board for those that aren't interested in spending a small fortune on the Godlike board and it should cater to just about all needs. The board has a 22+2+1 phase power design and MSI is using a heatpipe as well as a stacked fin-array heatsink and a MOSFET backplate to help cool the oversized power circuitry. Other features include 10 Gbps Ethernet, although there is only one Ethernet interface, a DisplayPort 1.4 compatible USB-C 10 Gbps port (which was said to be DP 2.0 compliant at Computex), as well as two 20 Gbps USB-C ports around the back. USB4 is nowhere to be seen, but is most likely related to ASMedia being late to the game with its host controller. MSI has gone for a design where the x16 PCIe 5.0 lanes from the CPU are split between the first two PCIe x16 slots and the third slot is using four lanes of PCIe 5.0 from the CPU. The final four PCIe 5.0 lanes from the CPU are for one of the M.2 NVMe slots and the board has a further three M.2 PCIe 4.0 slots. On top of that, MSI also includes an M.2 Xpander-Z Gen5 Dual add-in card that can accept a further two PCIe 5.0 NVMe SSD at the cost of eight PCIe lanes from the GPU.

For those of you that are eagerly awaiting the Ryzen 7000-series CPUs, details of the potential pricing has appeared over at Canadian e-tailer DirectDial. @momomo_us was first to post the details on Twitter, but didn't provide any details of who the e-tailer was, but some sleuthing using the AMD ordering codes soon brought us to DirectDial. The company has listed the all four expected CPU models with pricing and it appears that AMD has decided to stop providing coolers entirely, as none of the four upcoming CPUs appear to be available with a cooler in the box. All the model names ending WOF are retail packaged CPUs and the ones missing WOF at the end of the product number are tray CPUs from what we can tell.

As for the pricing, the Ryzen 5 7600X is listed at CA$435 or about US$340, with the Ryzen 7 7700X coming in at CA$631 or US$494. The Ryzen 9 7900X is CA$798/US$625 and finally the Ryzen 9 7950X is a steep CA$1158/US$907. @momomo_us also found some tray pricing from a different retailer and these CPUs are priced a few bucks cheaper, but we were unable to locate who the retailer is. Note that electronics and computer parts appear to be priced a fair bit higher in Canada than the US on average. As such, these prices should only be taken as an indication of what the retail price in Canada might end up being and not what the actual MSRP will land at, when AMD decides to launch these CPUs. Currently the retail date is expected to be on the 15th of September.

Update 10:49 UTC: The tray CPU retailer is PC-Canada.

If you remember, there were quite a lot of discussions about memory speed "sweet spots" for both the Ryzen 3000- and Ryzen 5000-series, with the user experience not always meeting AMD's sweet spot for memory clocks. Now details of the Ryzen 7000-series memory sweet spot has arrived courtesy of Wccftech and the speed is said to be DDR5-6000. This is 400 MHz higher than the apparent official maximum memory clock speed of DDR5-5600, but as we know, the manufacturer's max memory clock is rarely the actual max. In AMD's case, things obviously work a bit differently, as the Infinity Fabric clock should ideally run at a 1:1 ratio with the memory in the case of the AM4 platform, to deliver best possible system performance and memory latencies.

That said, as we're using DDR memory, the actual clocks are only half of the memory speeds, so the IF clock is operating at no more than 2000 MHz if the memory is DDR4-4000. However, if the same applies to the Ryzen 7000-series, it appears that AMD has managed to bump the IF clocks by a not insignificant 1000 MHz, as the IF fabric would now be operating at up to 3000 MHz. This could see the Ryzen 7000-series offering better memory latencies than Intel's Alder Lake and upcoming Raptor Lake CPUs, as Intel is running DDR5 memory at a 2:1 ratio or a 4:1 ratio. AMD is said to still have a 2:1 ratio as well, but as with the AM4 CPUs, this offers worse overall performance.

Update 11:49 UTC: Yuri Bubliy aka @1usmus has confirmed on Twitter that the max IF frequency of 3000 MHz and it seems like AMD has added a range of new memory and bus related features to the AM5 platform, going by the additional features he posted.

Here's the first render of an AMD Ryzen 7000-series retail box. Shown here, is what a Ryzen 9 7000-series PIB package could look like. It shows what is possibly a thick cardboard box with the processor window located front and center, instead of one of the sides. The front face features a prominent dark AMD Arrow logo with the processor window in the middle. The side features a Ryzen motif with the "9" brand extension shown prominently. From the looks of it, the Ryzen 9 7000-series box appears to have a tray-type design, in which an inner tray slides out from the sides. It's possible that the Ryzen 7 7000-series and Ryzen 5 7000-series come in a simpler monolithic paperboard box.

The source of this render also revealed to VideoCardz that the Ryzen 7 7700X will launch at an identical SEP pricing to the Ryzen 7 5700X, which is USD $299. The 7800X, on the other hand, could be priced higher than the 5800X launch SEP, which could put it around $399. Similarly, the Ryzen 9 7900X and 7950X could be priced higher than the 5900X and 5950X. AMD is expected to unveil the Ryzen 7000 series "Zen 4" desktop processors at an even on August 29, with market-availability slated for September 15.

ASRock is bringing as many as five motherboard models based on the AMD X670E chipset, for upcoming Ryzen 7000-series Socket AM5 processors. The lineup includes the twins X670E Taichi and X670E Taichi Carrara at the top; followed by the X670E Steel Legend, X670E Pro RS, and the X670E Phantom Gaming Lightning. The X670E Taichi/Carrara feature a mammoth 26-phase VRM, which going by the trends, could use 90 to 105 A power-stages. You get two PCi-Express 5.0 x16 slots (x8/x8 with both populated), at least two Gen 5 M.2 slots wired to the SoC, additional Gen 5 M.2 slots from the chipset, and a plethora of connectivity options.

What sets the two Taichi boards apart is the Carrara does away with the matte-black "gearwheel" design theme, and instead features a white marble appearance. It's not known if the marble pattern is a print, or if ASRock used actual stone. ASRock has been trying to upmarket its Steel Legend SKUs for the past couple of generations, and it appears like the X670E Steel Legend will be the third-based board from the series, with no PG Velocita SKU in sight. You get just the one PCI-Express 5.0 x16, at least two Gen 5 M.2 slots, a couple of Gen 4 M.2 slots, and fairly premium connectivity, including WLAN.

GIGABYTE today showed off its upcoming AMD X670E and X670 chipset-based Socket AM5 motherboard lineup for the Ryzen 7000-series "Zen 4" desktop processors due to launch in September. Given AMD's push for PCI-Express Gen 5 connectivity beyond just the PEG slot, the new X670E chipset, with multiple Gen 5 M.2 slots, covers the upper end of the GIGABYTE AORUS motherboard series, with the X670E AORUS Xtreme and the X670E AORUS Master. The lower-end of the lineup is based on the X670, with the AORUS Pro and AORUS Elite tiers.

Both the X670E and X670 offer at least one PCI-Express 5.0 x16 slot (which can be further split into two x8 Gen 5 slots); and at least one PCI-Express 5.0 x4 M.2 NVMe slot wired to the AM5 processor. The X670E is differentiated in having an additional Gen 5 M.2 slot that is wired to the SoC, besides downstream Gen 5 PCIe connectivity from the chipset. The AORUS Xtreme leads the pack with a monstrous 18-phase VRM that uses 105 A DrMOS, an 8-layer PCB, four Gen 5 M.2 slots, the highest-grade onboard audio with ESS-made headphones DAC, AQuantia 10 GbE, WiFi 6E, and a plethora of overclocker-friendly features.