Team Group's gaming brand, T-FORCE, launches T-FORCE DELTAα RGB DDR5, a gaming memory built for AMD Ryzen 7000 Series Processors and 600 Series Motherboard. DELTAα RGB DDR5 supports the latest overclocking technology from AMD EXPO, enhancing memory performance through excellent compatibility and delivering fast and reliable OC speeds with a single click. T-FORCE is dedicated to providing outstanding performances for gamers around the world and is proud to join forces with AMD to create the ultimate gaming experience.

Modeled after a stealth aircraft, T-FORCE DELTAα RGB DDR5 features a strong and clean geometric silhouette with 120° ultra-wide lighting to deliver a fierce military style. The new gaming memory is compatible with lighting effect software such as ASUS Aura Sync, GIGABYTE RGB Fusion 2.0, MSI Mystic Light Sync, ASROCK-Polychrome Sync, and BIOSTAR Advanced VIVID LED DJ[1]. With the RGB DDR5, gamers can design their own lighting effects and create an incredibly stunning RGB system. T-FORCE DELTAα RGB DDR5 is equipped with PMIC for better power management and a strengthened PMIC cooling design using thermally conductive silicon or more effective cooling and stable PMIC operations. The memory also supports on-die ECC and one-click overclocking with AMD EXPO so that gamers can enjoy the extreme speeds of overclocking with one simple click.

AMD is planning to give its Ryzen 7000 "Zen 4" Socket AM5 desktop processor lineup a significant expansion in January, as rival Intel plans to do the same with its 13th Gen Core "Raptor Lake." AMD's lineup expansion will be in both directions—toward the higher end with its 7000X3D series; and toward the lower end, with its 7000 non-X series. It is now becoming clear that the 7000 non-X series will see a retail-channel launch, and won't be relegated to the OEM/SI channel. This would mean boxed versions of these processors, probably including a stock cooling solution.

The Ryzen 7000 non-X series in the retail channel is expected to include the 6-core/12-thread Ryzen 5 7600, the 8-core/16-thread Ryzen 7 7700, and the 12-core/24-thread Ryzen 9 7900. The defining feature of these SKUs is their significantly lower TDP of just 65 W, which would put their PPT (package power tracking) value around 90 W. Their maximum boost frequencies are still north of the 5 GHz-mark, with the 7600 boosting up to 5.10 GHz, the 7700 going up to 5.30 GHz and the 7900 up to 5.40 GHz, however their base frequencies are significantly lower, with the 7600 around 3.80 GHz, the 7700 and 7900 between 3.60-3.80 GHz. The three are expected to feature aggressive power-management to meet their lower power limits, which should also lower their cooling requirements. Wccftech predicts that AMD could announce these processors in its January 4 International CES Keynote address, followed by availability on January 10. In related news, the 7000X3D could see an announcement in the same January 4 keynote, but with a slightly later product availability date.

AMD, in its technical presentation for the new Radeon RX 7900 series "Navi 31" GPU, gave us an elaborate explanation on why it had to take the chiplets route for high-end GPUs, devices that are far more complex than CPUs. The company also enlightened us on what sets chiplet-based packages apart from classic multi-chip modules (MCMs). An MCM is a package that consists of multiple independent devices sharing a fiberglass substrate.

An example of an MCM would be a mobile Intel Core processor, in which the CPU die and the PCH die share a substrate. Here, the CPU and the PCH are independent pieces of silicon that can otherwise exist on their own packages (as they do on the desktop platform), but have been paired together on a single substrate to minimize PCB footprint, which is precious on a mobile platform. A chiplet-based device is one where a substrate is made up of multiple dies that cannot otherwise independently exist on their own packages without an impact on inter-die bandwidth or latency. They are essentially what should have been components on a monolithic die, but disintegrated into separate dies built on different semiconductor foundry nodes, with a purely cost-driven motive.

The SiSoft SANDRA user database has just been pinged by two new unreleased AMD Ryzen 7000 series "Zen 4" processor models, the Ryzen 7 7700 and Ryzen 5 7600. These chips have the same 8-core/16-thread and 6-core/12-thread core-counts as the 7700X and 7600X, respectively; but with lower clock speeds, and more importantly, a lower TDP of just 65 W. This would put their package power tracking (PPT) limit around 90 W, down from the 105 W and 140 W of the their "X" siblings.

The 7600 and 7700 come with a base frequency of 3.80 GHz, as detected by SANDRA. Every other specification, such as cache size, is the unchanged from the 7600X or 7700X. There's no word on the availability, but it's likely that AMD would debut these chips in the OEM channel first, especially given that the 7600 has the potential to undercut sales of the embattled 7600X. Things could get interesting as Intel debuts the lower end of its 13th Gen Core i5 series, which are rumored to be based on the "Alder Lake" microarchitecture, and 6P+4E SKUs.

AMD on Monday issued a statement refuting reports of performance deltas noticed for its Ryzen 7000-series "Zen 4" desktop processors observed between Windows 11 and Windows 10 operating systems when gaming. The company said that while it is investigating the reports, it has not been able to reproduce these performance deltas, and maintains that Ryzen 7000 series should perform consistently between both operating systems. Architecturally, "Zen 4" isn't different from "Zen 3" with the exception of its AVX-512 ISA that even Windows 10 supports. Windows 10 has awareness for "Zen 4" multi-core topology since it isn't any different from Ryzen 5000 "Vermeer." AMD stated that it continues to work with game developers to ensure their titles are optimized for Ryzen processors.The statement from AMD on the matter follows.

ASUS Turkey has jumped the gun and revealed ASUS' upcoming Zenbook 14 laptop, which in itself might not be a big deal, but the UM3402 as the specific model is known as, will apparently be available with an AMD Ryzen 7 7730U CPU. As AMD has as yet to unveil such a CPU, it appears that ASUS Turkey has gotten ahead of things. A quick search for the Zenbook 14 SKU in question reveals that the current UM3402 model has a Ryzen 5825U processor.

The remaining specs appear identical to the current model, but this is clearly not a typo, as the CPU SKU is mentioned at multiple points on the product page. Based on AMD's CPU model name "decoder", the Ryzen 7 7730U is based on a Zen 3 or a Zen 3+ core that sits in the 15-28 W TDP range. According to Videocardz, it will be using an AMD Vega based GPU. Beyond that, we don't know any specifics about the CPU, but one thing that stands out and may or may not be correct, is that the Zenbook 14 is only listed as supporting two USB 3.2 10 Gbps USB-C ports, rather than USB4, which seems a bit odd. Then again, this is a lower-tier CPU, so it's possible that this is the reason for lack of USB4 support. The fact that ASUS has moved to an IPS based display, from an OLED display on the current UM3402 SKU, also suggests that this might be a cheaper model in ASUS lineup.

AMD earlier this week released basic enablement for the GNU Compiler Collections (GCC), which extend "Zen 4" microarchitecture awareness. The "basic enablement patch" for the new Zenver4 target is essentially similar to Zenver3, but with added support for the new AVX-512 instructions, namely AVX512F, AVX512DQ, AVX512IFMA, AVX512CD, AVX512BW, AVX512VL, AVX512BF16, AVX512VBMI, AVX512VBMI2, GFNI, AVX512VNNI, AVX512BITALG, and AVX512VPOPCNTDQ. Besides AVX-512, "Zen 4" is largely identical to its predecessor, architecturally, and so the enablement is rather basic. This should come just in time for software vendors to prepare for next-generation EPYC "Genoa" server processors, or even small/medium businesses building servers with Ryzen 7000-series processors.

AMD reportedly scaled down production of its Ryzen 7000 series desktop processors in response to bleak demand across the PC hardware industry. Wccftech claims to have read an internal company document calling for reduced supply to the channel as market response to the Ryzen 7000-series is weak. This comes hot on the heels of AMD revising its Q3-2022 forecast, trimming its guidance by a $1 billion drop in revenue, citing weak demand in the PC market. However, we are seeing no deviation from the launch pricing for Ryzen 7000-series SKUs or compatible Socket AM5 motherboards. The platform went on sale from late September, on the same day that Intel announced its competing 13th Gen Core "Raptor Lake" processors. The new Intel chips are expected to start selling from a little later this month.

Unlike 13th Gen Core processors, Ryzen 7000 series processors appear to be a victim of the platform—notwithstanding the high pricing of the processors, which start at $299 for the 6-core 7600X, buyers lack access to affordable motherboards, and have to contend with expensive DDR5 memory. Pricing of cheaper LGA1700 motherboards based on entry-level H610 and B660 chipsets with cost-effective DDR4 memory support have added depth to consumer choice, besides Intel's 12th Gen range starting from under $150.

ASUS today announced the new Precision Boost Overdrive (PBO) enhancement, an exclusive temperature control feature for its range of X670 and B650 motherboards designed for AMD Ryzen 7000 series processors.

These latest CPUs push the limits of performance farther than ever before. They dynamically take advantage of available thermal headroom to give users higher clock speeds. This means that users might see higher CPU temperatures than they are used to in a new AMD Ryzen-powered machine. To put users in control, ASUS is rolling out a BIOS update for its X670 and B650 motherboards with new options for its PBO enhancement feature that makes it easy to balance thermals and performance. With just a few clicks, users will be able to dramatically reduce CPU temperatures—and maybe even increase performance and reduce fan noise in the process.

With the arrival of AMD's Ryzen 7000 series desktop processors based on the new Zen 4 architecture, the world's leading computer brand, GIGABYTE today announces its B650E and B650 motherboards ready to power these next-gen CPUs. Sporting the new AM5 socket, the AORUS B650E and B650 gaming motherboards are equipped with a direct digital power design and a full-covered cooling module to keep the circuitry cool. These AORUS motherboards come with PCIe 5.0 connectivity and support for DDR5 memory, which are AMD EXPO and Intel XMP capable of up to DDR5-6600 and beyond. The AORUS gaming motherboards are also equipped with the DIY-friendly PCIe and M.2 device fast installation and removal design, making future upgrades quick and easy.

Power delivery and thermal design have always been the top factors when it comes to CPU performance. To meet the needs of gamers looking for powerful yet stable system performance, the AORUS B650E and B650 gaming motherboards are designed with a maximum 16+2+2-phase twin digital power, covered by a massive heatsink that has four times more surface than the previous generation to ensure the smoothest power delivery even under loads. Other thermal designs, such as 8 mm mega-heatpipes and dedicated heatsinks on key components, greatly improves the system's stability and overall performance. With the friendly design of PCIe and M.2 EZ-Latch features on the AORUS B650 gaming motherboards, GIGABYTE makes components swapping a whole lot easier.

Noctua today announced its new NA-TPG1 thermal paste guard for AMD's latest AM5 based Ryzen processors. When the mounting pressure of the cooling solution is applied, excess thermal paste will be squeezed outwards. With AM5 CPUs, this excess paste tends to accumulate in the cut-outs at the sides of the heat-spreader and may become difficult to remove. Simple and risk-free to apply, the NA-TPG1 prevents this undesired phenomenon.

"While there's no denying that AMD's new Ryzen 7000 processors perform fantastic, we found that the cut-outs at the side of the heat-spreader tend to attract thermal paste that can be challenging to clean off" says Roland Mossig (Noctua CEO). "This is where our new thermal paste guard steps in: it's a simple yet highly effective tool for keeping your new Ryzen 7000 series CPU nice and clean."

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions announced the latest AMD B650 motherboards based on the success of the X670 series. The comprehensive lineup includes AORUS, AERO, and GAMING series to provide more reasonable options with notable features for users. GIGABYTE select B650 motherboards adopt PCIe 5.0 / 4.0 x16 graphics interface and PCIe 5.0 / 4.0 M.2 slots with EZ-Latch technology, making it easier than ever for users to upgrade graphics cards and M.2 SSDs, avoiding accidental damage to the surrounding components. Further, up to 16+2+2 phase Twin Digital power, 105 Amps Smart Power Stage, and up to 12-layer PCB provide increased stability, optimal compatibility, and performance for AMD Ryzen 7000 series processors. With the advanced thermal design, VRM temperature is reduced, stabilizing the power and performance of the PCIe 5.0 slot and PCIe 4.0 M.2 SSD and avoiding performance drop due to thermal throttling. Meanwhile, the enhanced shielding design of SMD slots strengthens the reliability of signals and slot structure. In addition, select models take advantage of Active OC Tuner technology to deliver optimized performance with a more flexible and user-friendly experience.

Last week NZXT announced its high-end Z790 motherboard for Intel's upcoming 13th gen Core processors and this week, the company is following up that announcement with its first AM5 motherboard for the Ryzen 7000 series, in the shape of the N7 B650E. The board comes with either white or black shielding, although the PCB is black in both cases, as is the rear I/O cover. NZXT has gone for a mid-range feature set, with a 16+2+1 Smart Power Stage design rated at 90 A, which places it on par with ASRock's B650E Steel Legend. Speaking of ASRock, it has been NZXT's OEM in the past, but we can't find a board with the same general layout as the N7 B650E in ASRocks' lineup this time around, so this is either a proper custom design or NZXT has changed its OEM partner.

The board has one PCIe 5.0 x16 slot and two PCIe 4.0 x16 slots, with one having four lanes of bandwidth and the other two lanes of bandwidth. The board also features three M.2 slots, one PCIe 5.0 and two PCIe 4.0, one of which is limited to two lanes of PCIe bandwidth. Other features include 2.5 Gbps Ethernet, a WiFi 6E/Bluetooth 5.2 combo module, an HDMI 2.1 port, four SATA ports and sadly what appears to be a 10 Gbps rather than a 20 Gbps USB-C port around the back. There's also a front header for another 10 Gbps USB-C port. NZXT has all the standard features you'd expect to see on a modern motherboard such as rear mounted clear CMOS and BIOS flashing buttons, debugging LEDs, albeit the basic kind and a good spread of fan headers and RGB LED connectors. A full set of audio connectors are also present and the audio chip of choice is the Realtek ALC1220. The only real hurdle for this board to become a success is going to be the price tag, as NZXT lists the board on its site for US$349.99/€429.99/£429.99, which is a very steep asking price for what's on offer here.

Leading global motherboard manufacturer, ASRock, is proud to announce its AMD B650E/B650 motherboard series. These motherboards are targeted at the mainstream AM5 segment featuring various exciting new products such as our flagship B650E Taichi, the high-end B650E Steel Legend Wi-Fi for high end market, B650E PG Riptide Wi-Fi and B650 PRO RS for mainstream users, and B650 PG Lightning a new SKU joining the Phantom Gaming family targeted the entry level market. ASRock also offers the new B650E PG-ITX WiFi for small form factor enthusiasts.

ASRock went all-out on its VRM design by creating a 24+2+1 phase Smart Power Stage (SPS) Dr.MOS on the B650E Taichi series, providing users with the most powerful AM5 platform it can offer ready to unlock maximum CPU performance. The flagship ASRock B650E Taichi motherboards are equipped with many exciting features and technologies such as PCIe 5.0 technology for graphics cards and M.2 SSDs, an incredible IO that includes the latest USB4 offering a fast and simple level of connection for work or home.

MSI, a world leading motherboard brand in high-performance and innovative computing, announces its brand new AMD B650 Series motherboards. MSI is not only tailored for enthusiast gamers, but also offers possibilities for content creation and office use. MSI is fully dedicated to all types of PC users by satisfying their needs. This time, we carefully prepared a variety of advanced technologies and exclusive features to help our customers create the most immersive experiences and maximize every ounce of performance.

"With DDR5 memory boost and an enhanced thermal design, MSI B650 Series motherboards are built to fully support the performance and capabilities of AMD Ryzen 7000 Series processors," said David McAfee, Corporate Vice President and General Manager, Client Channel Business Unit, AMD. "Designed specifically for gamers and content creators, MSI motherboards feature advanced technologies that take full advantage of the AM5 platform."

GIGABYTE released three of the first Socket AM5 server motherboards and barebones, letting you build small-business/home servers using AMD Ryzen 7000 series processors. These boards may feature a client-segment CPU socket, but come with server-grade components for 24/7 or high-uptime operation, and remote-management features. The three are based on the AMD B650E chipset, which means it gets full PCI-Express Gen 5 (for an x16 slot and an x4 Gen 5 NVMe).

The MC13-LE0 and MC13-LE1 motherboards are built in the Micro-ATX form-factor, but with a design optimized for rack airflow. Both boards feature an identical PCB layout, but differ in their network connectivity options. The MC13-LE1 offers two 10 GbE interfaces driven by an Intel X710 controller; while the MC13-LE0 gives you two 1 GbE interfaces, each driven by an Intel i210. Both boards offer an ASPEED AST2600 remote-management chip with its dedicated 1 GbE port; one M.2 PCIe Gen 5 slot, a PCI-Express 4.0 x4 slot, and four SATA 6 Gbps ports. The W332-Z00 is an M-ATX tower server/workstation barebones (you add your own processor, DDR5 memory, and storage). This features a different motherboard than the MC13-LE#, with two M.2 PCIe Gen 5 slots, and Realtek-supplied remote-management and 2.5 GbE chips.

GIGABYTE Technology, (TWSE: 2376), an industry leader in high-performance servers and workstations, today announced supporting products for the new AMD AM5 platform starting with two GIGABYTE motherboards, MC13-LE0 & MC13-LE1, that pair a consumer CPU with IPMI management functionalities via BMC. Additionally, a new desktop workstation, W332-Z00, was released using the same motherboard series platform that supports remote management, but the W332 does so with a Realtek NIC that enables DASH.

The new GIGABYTE products designed to support host systems are deceivingly powerful with a small micro-ATX form factor motherboard and enterprise rich out-of-band management features on top of PCIe Gen 5 and DDR5 technologies. These new client friendly products will be found in office settings under a desk rather than a rack in a data center, as they be managed from anywhere, provided there is a network connection. Furthermore, these new products are purpose built for the mainstream AMD B650E chipset with AMD Zen 4 architecture for AMD Ryzen 7000 Series desktop processors.

The popular PlayStation 3 emulator for PCs, RPCS3, just received a major update that lets it take advantage of the AVX-512 instruction-set on processors based on the AMD Zen 4 microarchitecture (the recently launched Ryzen 7000 series). RPCS3 emulates the PS3's CELL Broadband Engine SoC entirely on CPU, and does not use your GPU to draw any raster graphics. To emulate both a CPU and GPU of that time entirely on a multi-threaded CPU of today is no easy task, but is helped greatly by leveraging the latest instruction-sets. RPCS3 supports an AVX-512 code-path on Intel processors such as the Core i9-11900K "Rocket Lake," but the company has been fidgeting with AVX-512 support on its client processors since 12th Gen "Alder Lake." The developer of RPCS3 in a tweet confirmed that they have enabled AVX-512 support for AMD Zen 4 with the latest build.

CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today announced its comprehensive product readiness for the newly available AMD Ryzen 7000 series of processors and the accompanying X670 and B650 chipset motherboards. From a new dedicated range of CORSAIR DDR5 memory for AMD platforms, to a huge lineup of award-winning CPU coolers, PC power supplies, cases and accessories, CORSAIR has the complete lineup of products to help enthusiasts build their new AMD-powered PC.

New AMD Ryzen 7000 processors and their supporting X670 and B650 chipset motherboards bring with them a huge change from past generations in the adoption of DDR5 memory, substantially increasing memory frequency versus DDR4. CORSAIR has a complete range of performance DDR5 created especially for AMD platforms, including the illustrious DOMINATOR PLATINUM RGB DDR5, the panoramically lit VENGEANCE RGB DDR5, or minimalist VENGEANCE DDR5. Available in a range of frequencies up to 6,000 MHz and capacities up to 64 GB, all CORSAIR DDR5 memory for AMD supports the new AMD EXPO (Extended Profiles for Overclocking) standard, offering single-setting-setup to ensure owners can easily run their memory at the speed it was created to run at.

AMD today released the Adrenalin 22.9.2 drivers. These drivers add support for the Radeon Graphics iGPU of the new Ryzen 7000 desktop processors that go on sale today. Game optimization is added for "Grounded." A handful of issues have been identified with the release. Radeon Super Resolution failing to trigger after changing resolution in games such as Nioh 2, has been identified. Improper rendering of Oculus dashboard menus with RX 6000-series graphics cards has been identified. GPU utilization being stuck at 100% in Performance Metrics after closing games in some cards such as the RX 570, has been identified. Display briefly showing corruption when switching between video and games in some GPUs such as the RX 6700 XT, has been identified. Vertical Refresh Sync being set to "off" globally causing stuttering or driver timeouts, has been identified. Dropped frames in video playback have been identified.

DOWNLOAD: AMD Software Adreanlin 22.9.2 beta

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions announced the launch of their latest AMD X670 motherboards, including two segments of X670E and X670 chipsets which showcase an abundance of notable features. High-end X670E models natively support PCIe 5.0 graphics cards with enhanced slot design, while mainstream X670 models adopt PCIe 4.0 graphics card slot design. The lineup supports PCIe 5.0 M.2 slots with PCIe and M.2 EZ-Latch design, which makes it easier for users to upgrade graphics cards and M.2 SSDs, avoiding accidental damage to the surrounding components. Further, the features of 18+2+2 direct power, 105 Amps Smart Power Stage, and 8 layer PCB provide higher stability, optimal compatibility, and performance for coming AMD Ryzen 7000 Series processors. With the advanced thermal design, VRM temperature is reduced. This stabilizes the power and performance of the PCIe x16 slot and M.2 SSD, avoiding thermal throttling. Meanwhile, the enhanced shielding design of SMD slots strengthens the reliability of signals and slot structure. In addition, the lineup takes advantage of Active OC Tuner technology and all-new GCC (GIGABYTE Control Center) software to align with GIGABYTE's new PCIe 5.0 M.2 SSD and EXPO/ XMP dual mode DDR, delivering extreme performance with more user- friendly experience.

"The new GIGABYTE X670 motherboard lineup offers exclusive features and new designs, enhancing the excellent performance and multifunctioning capabilities for AMD Ryzen 7000 Series processors," said David McAfee, Corporate Vice President and General Manager, Client Channel Business Unit, AMD. "The AM5 platform is well-supported to bring the best-in-class experience that AMD users have come to expect."

With only a couple of days to go until the official retail availability of the Ryzen 7000-series CPUs and accompanying X670 and X670E motherboards, early pricing of the motherboards are starting to crop up in Europe. Courtesy of @momomo_us we now have pricing from an unknown European retailer for 11 ASUS models, as well as MSI's Godlike board. We also managed to dig up some additional pricing over at Geizhals, which is a European price comparison site, for five ASRock models and one from Gigabyte. Hopefully we're looking at placeholder pricing here, as it's not looking good in terms of value for money. Admittedly, ASUS is known for charging a premium over its competitors, but it's not looking good anywhere right now.

Starting with @momomo_us pricing and MSI for no specific reason, its upcoming MEG X670E Godlike is listed at €2,399 and that doesn't include any kind of liquid cooling accessories. This has to be one of the most expensive consumer motherboards ever, if this is the actual retail pricing it'll sell for. Moving over to ASUS, its Prime X670-P model is listed at €418.53, with the WiFi version jumping to €446.89. This is the first indicator that these are not the actual retail prices, as WiFi versions of motherboards tend to have a $/€/£10-20 premium over non-WiFi models. We're not going to go over every individual board price here, simply look at the attached pictures, but based on these early prices, ASUS has two models for well over €1,000, the ROG Crosshair X670E Hero and the ROG Crosshair X670E Extreme, with the latter being listed at €1,486.95.

Noctua today confirmed that all its CPU coolers and mounting-kits that support AMD AM4 also support the upcoming AM5 socket, except the NH-L9a-AM4 low-profile cooler and the NM-AM4-L9aL9i mounting-kit. For the latter, Noctua announced the new NM-AM5-L9aL9i kit that will be available free-of-charge from end of October. Mounting upgrade kits for older heatsink models that do not yet support AM4 will also be provided to customers at no additional cost.

"We have offered free-of-charge mounting upgrade kits to our customers ever since AMD introduced AM2 in 2006, and we're proudly continuing this tradition with the upcoming Ryzen 7000 series processors and their new AM5 socket", says Roland Mossig (Noctua CEO). "While all our current multi-socket coolers already support AM5 out of the box and don't require any updates, customers will be able to upgrade the NH-L9a as well as most older coolers at no additional cost, so even 15-year-old coolers can be used on the latest processors!"

Leading global motherboard manufacturer, ASRock, is proud to announce its X670E motherboard series, ready for new AMD Ryzen 7000 Series processors. This first wave of AMD Socket AM5 motherboards includes Special Edition X670E Taichi Carrara, flagship X670E Taichi, high-end X670E Steel Legend, mainstream X670E PRO RS, and entry X670E PG Lightning.

"With the AM5 platform we're investing in the next generation of high-performance computing and gaming," said David McAfee, Corporate Vice President and General Manager, Client Channel Business Unit, AMD. "With the continued support of best-in-class partners like ASRock, AMD is bringing the most advanced features and technologies to desktop. The X670 Extreme is designed to bring the best connectivity and ultimate overclocking with PCIe 5.0 support."

TechPowerUp released the latest version of TechPowerUp GPU-Z, the popular graphics information and diagnostics utility for gamers and PC enthusiasts. Version 2.49.0 adds support for the iGPU of the upcoming Ryzen 7000-series "Zen 4" desktop processors, codenamed "Raphael." CPU temperature monitoring for these processors works the same way as it does for older Ryzens, so no changes needed in that regard. The GPU model reporting for Intel Arc A750/A770 has been fixed. Support is added for the Intel Arc A580. Some rare application crashes with AMD Radeon cards have been fixed. The NVIDIA DLSS game scan we introduced with the previous version doesn't actually "use" DLSS in any way, it only scans for games supporting DLSS, so we made it available on all systems.

DOWNLOAD: TechPowerUp GPU-Z 2.49.0