Samsung Electronics Co., Ltd. today announced the Galaxy S25 Ultra, Galaxy S25+, and Galaxy S25, setting a new standard towards a true AI companion with our most natural and context-aware mobile experiences ever created. Introducing multimodal AI agents, the Galaxy S25 series is the first step in Samsung's vision to change the way users interact with their phone—and with their world. A first-of-its-kind customized Snapdragon 8 Elite Mobile Platform for Galaxy chipset delivers greater on-device processing power for Galaxy AI plus superior camera range and control with Galaxy's next-gen ProVisual Engine.

"The greatest innovations are a reflection of their users, which is why we evolved Galaxy AI to help everyone interact with their devices more naturally and effortlessly while trusting that their privacy is secured," said TM Roh, President and Head of Mobile eXperience Business at Samsung Electronics. "Galaxy S25 series opens the door to an AI-integrated OS that fundamentally shifts how we use technology and how we live our lives."

Reports from last November suggested that Samsung Electronics had semi-abandoned its second-generation 3 nm Gate-All-Around (GAA) process, due to missed production goals. Disappointing production yields—as low as 20%—have been floated by industry insiders, they believed (at the time) that the South Korean's foundry teams had simply moved onto developing a next-gen 2 nm manufacturing process. A freshly published news article, courtesy of Business Korea, provides further evidence of a shift to 2 nanometer processes—Samsung's S3 plant in Hwaseong is reportedly in the process of being upgraded (from 3 nm GAA). Insiders believe that new equipment will be installed across the existing production line, requiring a small-scale investment of funds.

The Pyeongtaek 2 (P2) plant is supposedly being prepared for a 1.4 nm test line—targeting a manufacturing capacity of 2000 to 3000 wafers per month. Inside track information suggests that trials will begin within the year. Business Korea's report suggests that Samsung has halved its foundry facility investment budget for 2025—around 5 trillion won, instead of last year's 10 trillion won. The article puts a spotlight on alleged "sluggish customer orders"—the primary factor behind Samsung's decision to slash its chip-making budget by 50%. Competition is fierce at this point in time—TSMC leads the way with its cutting-edge technologies. Taiwan's premier foundry has attracted many high-profile clients away from rival manufacturers. In contrast, industry watchdogs believe that Samsung's struggles have caused "big tech" customers to seek alternate channels.

Blue Cheetah Analog Design today announced the successful tape-outs of its next generation BlueLynx die-to-die (D2D) PHY on Samsung Foundry's SF4X 4 nm advanced manufacturing process. The latest PHY supports both advanced and standard chiplet packaging with an aggregate throughput exceeding 100 Tbps while achieving industry-leading silicon area footprint and power consumption. BlueLynx D2D subsystem IP enables chip architects to meet the bandwidth density and environmental robustness necessary to ensure production deployment success while preserving use case flexibility.

Using Samsung Foundry's SF4X 4 nm advanced process, the latest BlueLynx PHY supports both standard 2D and advanced 2.5D packages and enables system designers to seamlessly change packaging technologies in current and future implementations. Customer deliveries started in 2024 with silicon characterization in both advanced and standard packaging applications expected in early Q2 2025.

Samsung Electronics today announced a partnership with game developers Nexon Korea and Neople to deliver unparalleled 3D experiences in the upcoming game 'The First Berserker: Khazan.' The game's 3D elements are being specially customized and designed during development, utilizing Samsung technology and the advanced capabilities of the Odyssey 3D monitor to create an immersive 3D gaming experience.

Through this partnership, Nexon, Neople and Samsung have been working closely to tailor the 3D visuals, carefully adjusting them based on the composition of characters, backgrounds and cinematics throughout the game. This process gives the developers an unprecedented level of control over the 3D effects, enabling them to bring their creative visions to life with precision.

Samsung's native foundry operations have wrestled with the 3 nm Gate-All-Around (GAA) process—these problems have persisted since the first reports of "missed production targets" emerged late last year—online speculators floated a very disappointing yield figure: only 20%. Last December, industry moles proposed that the South Korean technology giant had devised plans to form an Exynos-centric "multi-channel partnership" with rival chipmakers. Speculation pointed to TSMC being the only valid ally. Semiconductor industry tipster—Jukanlosreve—believes that negotiations have taken place, and the answer was a firm "no." TSMC's most advanced node process order books are likely filled up with more important customers—industry watchdogs reckon that Apple usually gets first dibs.

Taiwan's top semiconductor manufacturer leads the market with its cutting-edge lithography techniques. Insiders believe that Samsung was impressed by TSMC's 2 nm trial production runs achieving (rumored) 60% yields. The higher-end Exynos chipsets are normally produced with the best node process available, but missed manufacturing goals have caused Samsung to drop in-house tech. In the recent past, Qualcomm's most powerful Snapdragon mobile chipsets have been deployed on flagship Galaxy S smartphones. Jukanlosreve believes that TSMC rejected Samsung's proposed Exynos deal due to a fear of revealing too many "trade secrets." Potentially, the South Koreans could have learned a thing or two about improving yields—courtesy of TSMC's expert knowledge.

Samsung Display will begin mass production of the world's first rollable OLED screen for laptops starting in April 2025. Samsung Display announced its rollable screen for the Lenovo ThinkBook Plus G6 Rollable laptop at CES 2025 in Las Vegas, Nevada, U.S., Lenovo also showcased the laptop and announced its plans to globally launch in June.

The ThinkBook Plus G6 Rollable laptop features a screen underneath the keypad, where the screen expands vertically by almost 50%, offering a unique mobile computing experience. When rolled in, the screen supports a 5:4 aspect ratio on a 14-inch display. When rolled out, the aspect ratio shifts to 8:9 on a 16.7-inch display, providing an enhanced view for efficient multitasking.

Samsung has revealed two new laptop models at CES 2025: the Galaxy Book5 Pro and Galaxy Book5 360, both featuring Intel's latest processors and artificial intelligence capabilities. The Galaxy Book5 Pro comes in two sizes. The 16-inch version weighs 1.56 kg and includes a 76.1Wh battery, while the 14-inch model weighs 1.23 kg with a 63.1 Wh battery. Both laptops use AMOLED displays with 2880×1800 resolution and variable refresh rates from 48 to 120 Hz. Storage options reach 1 TB, with either 16 GB or 32 GB of memory available.

The Galaxy Book5 360 features a 15.6-inch touchscreen that can fold back 360 degrees, effectively turning the laptop into a tablet. It has a 1920×1080 resolution display and weighs 1.46 kg, with a 68.1 Wh battery. Both models use Intel's Core Ultra processors with built-in NPUs that Samsung uses for features like AI Select for searching and Photo Remaster for image enhancement. The laptops also integrate with other Samsung devices through features like Multi Control for unified device navigation and Quick Share for file transfers. The new laptops include standard connectivity options like Wi-Fi 7 and Bluetooth 5.4. Samsung claims the Pro models can achieve up to 25 hours of battery life, though real-world usage typically yields shorter durations.

Samsung Display unveiled two new, game-changing QD-OLED panels today at the CES 2025 in Las Vegas, Nevada, that are expected to reinforce the company's plans to dominate the premium, self-luminous monitor market.

The new products includes the world's first 27-inch UHD (3840x2160) OLED panel with 240 Hz refresh rate and 27-inch 500 Hz OLED panel with QHD (2560x1440) resolution, boasting the highest refresh rate when compared to OLED displays currently on the market with the same resolution. Recently, global electronics manufacturers such as Samsung Electronics, ASUS, MSI, and others, announced the launch of their 2025 monitor lineups featuring these panels. Samsung Display intends to commence mass production of both panels in the first half of the year.

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of JESD220G: Universal Flash Storage 4.1. In addition, an update to the complementary JESD223F UFS Host Controller Interface (UFSHCI) version 4.1 standard has also been published. Developed for mobile applications and computing systems requiring high performance with low power consumption, UFS 4.1 offers faster data access and improved performance over the earlier version of the standard while maintaining hardware compatibility to UFS 4.0. Both standards are available for download from the JEDEC website.

"JEDEC members are continually innovating to shape the standards that will drive the next generation of mobile devices and advanced applications, and the committee's dedication to ongoing improvements to the UFS series is paving the way for future innovation," said Mian Quddus, Chairman of the JEDEC Board of Directors and the JC-64 Committee for Embedded Memory Storage and Removable Memory Cards.

Samsung Electronics Co., Ltd. today announced the global launch of the Galaxy Book5 Pro and Galaxy Book5 360, expanding the Galaxy Book5 lineup to meet a wider range of AI needs for all users. Powered by Intel Core Ultra processors (Series 2) featuring NPUs up to 47 TOPs, these latest PCs come directly integrated with Galaxy AI capabilities like the innovative AI Select as well as cutting-edge features that deliver personalized experiences across the Galaxy ecosystem. With the addition of AI Select, PC users can easily search anything, anytime with a simple click, just like on their phone except on a much larger, immersive display.

"We are thrilled to make Galaxy AI and cutting-edge innovation accessible to more people than ever before, addressing their unique productivity needs on PC and other Galaxy devices," said Changtae Kim, EVP & Head of New Computing R&D Team, Mobile eXperience Business at Samsung Electronics. "Alongside our trusted industry partners, we are delivering an AI experience on Galaxy Book that empowers users to work, create and connect in more intelligent ways through our growing ecosystem."

Samsung Electronics today unveiled its 2025 Smart Monitor, Odyssey Gaming Monitor and ViewFinity Monitor lineups, all of which will be on display at Samsung's First Look at CES on January 5. The 2025 models raise the bar for monitors by bringing AI features, industry-first sizes in the OLED market and new form factors that ignite the passions of users worldwide—whether they're working, gaming or creating.

"With the new monitors in our industry-leading lineups, we're giving people more ways to explore the content and connections that they love in new ways," said Hoon Chung, Executive Vice President of Visual Display Business at Samsung Electronics. "Because of our new AI capabilities and size options, 2025 will see users across the world find the right monitor that fits them."

Frore Systems has demonstrated the massive increase in performance possible with AirJet solid-state active cooling chips in the new Samsung Galaxy Book4 Edge 14", the thinnest Notebook on the market at just 10.9 mm. The proof-of-concept Samsung Galaxy Book4 Edge 14", upgraded with AirJet, achieves an incredible 50% increase in sustained CPU & AI performance, showing that now, consumers really can demand it all. Frore Systems will be showcasing the upgraded Samsung Notebook in January at CES 2025.

Frore Systems achieved the 50% performance boost in the Samsung Galaxy Book4 Edge 14", from 12 Watts to 18 Watts, by replacing the two large fans currently used in the Notebook with four AirJet chips. This innovative solution reduces the cooling solution footprint by 45% - the fans consuming 8,800 mm² of space vs the AirJet footprint of just 4,800 mm². Therefore, the extremely compact AirJet solution creates additional space inside the Galaxy Book4 Edge 14", potentially allowing for increasing the battery size from the current 55.9 Wh to 64.8 Wh - a 16% increase - improving video runtime from 20 hours to 23.2 hours.

Samsung Electronics America, a world leader in advanced memory technology, has expanded its microSD portfolio with a line of new cards inspired by iconic characters from the Sonic the Hedgehog franchise, giving players an exciting new way to celebrate their fandom, while expanding their storage and powering ultra-fast gameplay. Created in collaboration with SEGA, the Sonic the Hedgehog PRO Plus microSDs will feature special designs depicting Knuckles (128 GB), Tails (256 GB), Sonic (512 GB) and Shadow (1 TB).

"Samsung PRO Plus microSD cards provide gamers, content creators and more with an easy, reliable, and secure way to store large amounts of data - delivering Sonic-speed right to your fingertips," said Jim Kiczek, Vice President of Memory Marketing at Samsung Electronics America. "Since debuting more than three decades ago, Sonic has become an icon of pop culture, featured in dozens of games, TV series, and movies. Now, with the Sonic the Hedgehog PRO Plus microSD cards, we're combining the franchise's instantly recognizable characters with the speed and reliability of Samsung PRO Plus microSDs to give your gear the ultimate Sonic boost."

Laptops powered by Intel's Lunar Lake family of processors have been seeping out slowly but steadily into the market. Samsung has no intention of sitting idle either, and has lifted the curtains on its Galaxy Book 5 Pro with an impressive AMOLED display and a battery life claim of a stupendous 25 hours. The laptop will be launched in South Korea on January 2, and a global rollout should follow thereafter.

Basically, the Book 5 Pro is the more affordable sibling of the Book 5 Pro 360. As the sharp-eyed amongst you may have already guessed, the Book 5 Pro does not feature the 360° hinge, which allowed the Book 5 Pro 360 to function as a convertible. Now, of course, a lot of people simply do not care about having convertible functionality, and the newly announced notebook is likely targeted at them.

Samsung Electronics today announced that The Premiere 8K, the company's flagship premium projector, has received the industry's first 8K Association (8KA) certification for 8K projectors. This recognition underscores Samsung's leadership in projection technology while setting a new benchmark for the industry.

"The Premiere 8K receiving the industry's first 8KA certification is a major milestone as it officially demonstrates the new potential of projector technology." said Taeyoung Son, Executive Vice President of Visual Display Business at Samsung Electronics. "We are committed to expanding the 8K ecosystem by continuously and extensively integrating new technologies."

We started Android over a decade ago with a simple idea: transform computing for everyone. Android powers more than just phones—it's on tablets, watches, TVs, cars and more.

Now, we're taking the next step into the future. Advancements in AI are making interacting with computers more natural and conversational. This inflection point enables new extended reality (XR) devices, like headsets and glasses, to understand your intent and the world around you, helping you get things done in entirely new ways.

Imagine being able to step into any world in an instant—from the bustling streets of New York City to the snowy mountain tops of the Alps. These worlds are no longer merely places to observe from afar. They can now be explored and interacted with simply through a gaze, a gesture or your voice. What once seemed like science fiction has become a reality as eXtended reality (XR) transforms how we engage with the world around us.

XR is an umbrella term for technologies that use digital elements to extend or alter reality by merging the physical and digital worlds together. This includes virtual reality (VR), augmented reality (AR), mixed reality (MR) as well as other similar technologies yet to be developed. XR offers infinite possibilities, creating a dynamic spatial canvas where users' sight, sound and motion combine to interact with the outside world. A world that will unlock unprecedented experiences across core areas of life, from working and learning to entertainment, gaming and even health and wellness.

Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced that it has pioneered a new custom HBM compute architecture that enables XPUs to achieve greater compute and memory density. The new technology is available to all of its custom silicon customers to improve the performance, efficiency and TCO of their custom XPUs. Marvell is collaborating with its cloud customers and leading HBM manufacturers, Micron, Samsung Electronics, and SK hynix to define and develop custom HBM solutions for next-generation XPUs.

HBM is a critical component integrated within the XPU using advanced 2.5D packaging technology and high-speed industry-standard interfaces. However, the scaling of XPUs is limited by the current standard interface-based architecture. The new Marvell custom HBM compute architecture introduces tailored interfaces to optimize performance, power, die size, and cost for specific XPU designs. This approach considers the compute silicon, HBM stacks, and packaging. By customizing the HBM memory subsystem, including the stack itself, Marvell is advancing customization in cloud data center infrastructure. Marvell is collaborating with major HBM makers to implement this new architecture and meet cloud data center operators' needs.

TrendForce's latest investigations found that the enterprise SSD market experienced significant growth in 3Q24, driven by robust demand from AI-related applications. Prices surged as suppliers struggled to keep pace with market needs, pushing overall industry revenue up by an impressive 28.6% QoQ. Demand for high-capacity models was especially strong, fueled by the arrival of NVIDIA's H-series products and sustained orders for AI training servers. As a result, the total procurement volume for enterprise SSDs rose 15% compared to the previous quarter.

Looking ahead to 4Q24, TrendForce forecasts a slowdown in enterprise SSD revenue as procurement demand begins to cool. Total procurement volume is expected to dip, with the peak buying period behind and server OEM orders being slightly revised downward. As shipment volume declines, overall industry revenue is also projected to decrease in the fourth quarter.

Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, today announced that it has pioneered a new custom HBM compute architecture that enables XPUs to achieve greater compute and memory density. The new technology is available to all of its custom silicon customers to improve the performance, efficiency and TCO of their custom XPUs. Marvell is collaborating with its cloud customers and leading HBM manufacturers, Micron, Samsung Electronics, and SK hynix to define and develop custom HBM solutions for next-generation XPUs.

HBM is a critical component integrated within the XPU using advanced 2.5D packaging technology and high-speed industry-standard interfaces. However, the scaling of XPUs is limited by the current standard interface-based architecture. The new Marvell custom HBM compute architecture introduces tailored interfaces to optimize performance, power, die size, and cost for specific XPU designs. This approach considers the compute silicon, HBM stacks, and packaging. By customizing the HBM memory subsystem, including the stack itself, Marvell is advancing customization in cloud data center infrastructure. Marvell is collaborating with major HBM makers to implement this new architecture and meet cloud data center operators' needs.

Quobly, a leading French quantum computing startup, has reported that FD-SOI technology can serve as a scalable platform for commercial quantum computing, leveraging traditional semiconductor manufacturing fabs and CEA-Leti's R&D pilot line.

The semiconductor industry has played a pivotal role in enabling classical computers to scale at cost; it has the same transformative potential for quantum computers, making them commercially scalable and cost competitive. Silicon spin qubits are excellent for achieving fault-tolerant, large-scale quantum computing, registering clock speeds in the µsec range, fidelity above 99% for one and two-qubit gate operations and incomparably small unit cell sizes (in the hundredths of 100 nm²).

Samsung Electronics and SK hynix are working together to standardize "Low Power Double Data Rate 6 (LPDDR6) - Processing in Memory (PIM)" technology according to a report from Business Korea. This collaboration seeks to accelerate the development of low power memory products. The cooperation is still in its early stage, the companies initial work is focused on registering the standard with the Joint Electron and Device Engineering Council (JEDEC). Discussions are underway to determine technical requirements, specific characteristics of LPDDR with PIM, such as "internal bandwidth"—the data transfer rate within the memory, unlike the "external bandwidth" between the processor and memory in traditional systems. According to a Samsung Electronics representative, the two companies are in the process of developing a timeline for standardization.

This partnership is notable given how Samsung and SK hynix compete in the high-bandwidth memory (HBM) market. SK hynix beat Samsung in profits reporting 7.3 trillion won in the third quarter, while Samsung made 3.86 trillion won. However, the rise of AI with its increased demand for more memory has shaken up the scene pushing for teamwork instead of wasting resources in developing completely different and unstandardized products. Both firms see PIM technology as a way to grow, previous attempts to independently develop PIM products include Samsung's HBM and LPDDR5-PIM and SK hynix's GDDR6-PIM.

Santa Clara, CA: Tenstorrent is announcing that it has closed over $693M in its Series D funding round at a pre-money valuation of $2B. Samsung Securities and AFW Partners led the round, which was oversubscribed due to strong demand from investors. Samsung and AFW both have deep relationships with Tenstorrent, and a strong history of investing in pioneering technology companies.

In addition to the leads, many notable investors joined the round including XTX Markets, Corner Capital, MESH, Export Development Canada, Healthcare of Ontario Pension Plan, LG Electronics, Hyundai Motor Group, Fidelity, Baillie Gifford, Bezos Expeditions, and more.

Samsung Electronics today announced new leadership for the next phase of the Company's growth and to strengthen its future competitiveness, focusing on the semiconductor business.

Young Hyun Jun, Vice Chairman and Head of Device Solutions (DS) Division, was named CEO and will also become the Head of Memory Business and Samsung Advanced Institute of Technology. Jinman Han was promoted to President and will become the Head of Foundry Business, while Seok Woo Nam will become Chief Technology Officer of Foundry Business, a newly-created position.

Netlist, Inc. today announced that it won a $118 million damages award against Samsung Electronics Co., LTD., Samsung Electronics America, Inc., and Samsung Semiconductor, Inc. (together "Samsung") in the United States District Court for the Eastern District of Texas. The award resulted from a jury trial which involved three Netlist patents: U.S. Patent Nos. 7,619,912, 11,093,417 and 10,268,608. The infringing products were all Samsung DDR4 RDIMMs and DDR4 LRDIMMs. Netlist filed the complaint against Samsung in August 2022.

The federal jury's unanimous verdict confirmed that all three Netlist patents had been infringed by Samsung, that none of the patents were invalid, that Samsung willfully infringed those patents, and that money damages were owed to Netlist for the infringement of all three patents.