The late 2024 news cycle suggested that Samsung's semiconductor business was going through tough times. Alleged yield problems—affecting the 3 nm Gate-All-Around (GAA) process—were highlighted last November. Fast-forward to January 2025; the South Korean megacorp has launched its cutting-edge Galaxy S25 smartphone series. The entire lineup of newly unveiled flagship smartphones contains Qualcomm's Snapdragon 8 Elite mobile chipsets; the Southern Californian chip designer is reportedly pulling in a tidy sum from this partnership. Fresh reports from South Korean news outlets indicate that Samsung System LSI employees have received an "encouraging" email from their boss, regarding current production predicaments.

Businesskorea and Sedaily reports include quotes extracted from the (apparently) leaked internal memo. LSI division president, Park Yong-in, reportedly stated: "we are currently in a situation where we have to develop two flagship products at the same time." Both articles allege that Samsung's semiconductor teams are expected to "cultivate roots and withstand storms." Industry watchdogs believe that the aforementioned "flagship products" are the Exynos 2500 mobile chipset, and Samsung Electronic's next-gen Galaxy S26 smartphone family. Earlier this month, we heard whispers about the much-delayed in-house chip design being readied (with a 2 nm process) for a possible late 2025 launch, inside unannounced Galaxy Z Flip 7 and Fold 7 devices. Park disclosed anticipated incoming obstacles in 2025: "last year's business division profit was higher than expected, but this was a temporary phenomenon...Looking at the entire business division, there will be monthly surpluses and deficits." Last month, inside sources proposed the notion that foundry investments were slashed in half.

Inside sources—familiar with goings-ons at leading DRAM manufacturing firms—have predicted the end of DDR3 and DDR4 production lines. According to a DigiTimes Asia report (citing Nikkei), industry observers have noticed that the DRAM market is undergoing a so-called "shift." They believe that pricing trends are decreasing due to weak demand. Samsung Electronics, SK Hynix, and Micron are named as major players; allegedly involved in devising new strategies—in reaction to fluid market circumstances. The DigiTimes insider network proposes that the big three: "may phase out DDR3 and DDR4 by 2025...by the end of 2025...anticipating a future focused on advanced memory technologies." Older standards are falling out of favor, with DDR5 and high-bandwidth memory (HBM) on the ascent. Industry watchdogs reckon that possible DDR3 and DDR4 supply shortages could occur "post-summer 2025."

Taiwan's Nanya Technology has predicted that the overall DRAM market will "bottom out" within the first half of 2025. An eventual recovery is envisioned by the second quarter; AI-related demands could help drive up demand by a large margin. Additionally, Nanya points to improved inventory management and global economic stimulus. Taiwanese DRAM production houses are expected to pick up some slack, but an unnamed "key component distributor" anticipates serious after-effects. An anonymous source believes that the: "anticipated halt in production could lead to significant supply constraints, challenging market dynamics and impacting pricing strategies." Nanya Technology and Winbond Electronics produce specialized DRAM-types; therefore are not touted to be great gap fillers. The latter is reportedly reacting to weak demand for "mature" DDR products—DigiTimes commented on this development: "Winbond Electronics is advancing its manufacturing by transitioning to a 16 nm process in the latter half of 2025. This upgrade from the current 20 nm process, primarily used for 4 Gb DDR3 and DDR4, will enable Winbond to produce 8 Gb DDR memory."

NVIDIA and its memory partners, SK Hynix, Samsung, and Micron, are preparing a new memory form factor called System on Chip Advanced Memory Module—SOCAMM shortly. This technology, adapting to the now well-known CAMM memory module standard, aims to bring additional memory density to NVIDIA systems. Taking inspiration from NVIDIA's Project DIGITS, it has now been developed independently by NVIDIA outside of any official memory consortium like JEDEC. Utilizing a detachable module design, SOCAMM delivers superior specifications compared to existing solutions, featuring 694 I/O ports (versus LPCAMM's 644 and traditional DRAM's 260), direct LPDDR5X memory substrate integration, and a more compact form factor.

For reference, current-generation Project DIGITS is using NVIDIA GB10 Grace Blackwell Superchip capable of delivering one PetaFLOP of FP4 compute, paired with 128 GB of LPDDR5X memory. This configuration limits the size of AI models that run locally on the device, resulting in up to 200 billion parameter models running on a single Project DIGITS AI PC. Two stacked Project DIGITS PCs are needed for models like Llama 3.1 405B with 405 billion parameters. Most interestingly, memory capacity is the primary limiting factor; hence, NVIDIA devotes its time to developing a more memory-dense SOCAMM standard. Being a replacement compatible with LPDDR5, it can use the same controller silicon IP with only the SoC substrate being modified to fit the new memory. With NVIDIA rumored to enter the consumer PC market this year, we could also see an early implementation in consumer PC products, but the next-generation Project DIGITS is the primary target.

AMD is readying two important client segment processors powered by the next-generation "Zen 6" microarchitecture, according to a sensational new report by Moore's Law is Dead. These are the "Medusa Point" mobile processor, and the "Olympic Ridge" desktop. The former is a BGA roughly the size and Z-Height of the current "Strix Point," but the latter is being designed for the existing Socket AM5, making it the third (and probably final) microarchitecture to do so. If you recall, Socket AM4 served three generations of Zen, not counting the refreshed "Zen+." At the heart of the effort is a new CPU complex die (CCD) that AMD plans to use across its client and server lineup.

The "Zen 6" performance CCD is being designed for a 3 nm-class node, likely the TSMC N3E. This node promises a significant increase in transistor density, power, and clock speed improvements over the current TSMC N4P node being used to build the "Zen 5" CCD. Here's where it gets interesting. The CCD contains twelve full-sized "Zen 6" cores, marking the first increase in core-counts of AMD's performance cores since its very first "Zen" CCD. All 12 of these cores are part of a single CPU core complex (CCX), and share a common L3 cache. There could be a proportionate increase in cache size to 48 MB. AMD is also expected to improve the way the CCDs communicate with the I/O die and among each other.

Back in January, we covered a report about AMD designing its next-generation "Zen 6" CCDs on a 3 nm-class node by TSMC, and developing a new line of server and client I/O dies (cIOD and sIOD). The I/O die is a crucial piece of silicon that contains all the uncore components of the processor, including the memory controllers, the PCIe root complex, and Infinity Fabric interconnects to the CCDs and multi-socket connections. Back then it was reported that these new-generation I/O dies were being designed on the 4 nm silicon fabrication process, which was interpreted as being AMD's favorite 4 nm-class node, the TSMC N4P, on which the company builds everything from its current "Strix Point" mobile processors to the "Zen 5" CCDs. It turns out that AMD has other plans, and is exploring a 4 nm-class node by Samsung.

This node is very likely the Samsung 4LPP, also known as the SF4, which has been in mass-production since 2022. The table below shows how the SF4 compares with TSMC N4P and Intel 4, where it is shown striking a balance between the two. We have also added values for the TSMC N5 node from which the N4P is derived from, and you can see that the SF4 offers comparable transistor density to the N5, and is a significant improvement in transistor density over the TSMC N6, which AMD uses for its current generation of sIOD and cIOD. The new 4 nm node will allow AMD to reduce the TDP of the I/O die, implement a new power management solution, and more importantly, the need for a new I/O die is driven by the need for updated memory controllers that support higher DDR5 speeds and compatibility with new kinds of DIMMs, such as CUDIMMs, RDIMMs with RCDs, etc.

Yesterday's news cycle pointed to Samsung's alleged development of 7000 mAh capacity batteries for the next-gen "Galaxy S26" smartphone series. Additionally, reports suggest that the South Korean megacorporation's Electronics division is experimenting with silicon-carbon battery technology. Industry watchdogs reckon that Chinese manufacturers are market leaders in terms of silicon-carbon battery tech breakthrough, with Apple and Samsung trailing far behind. PandaFlashPro took issue with the latest reports, and dismissed the notion of a so-called "Galaxy S26 Ultra" model featuring a 7000 mAh capacity battery. According to their network of insider sources, Samsung engineers are struggling with their planned improvements.

Typically, flagship Galaxy S phones have utilized 5000 mAh lithium-polymer batteries. PandaFlashPro envisions an underwhelming next-gen upgrade in this department: "I'll delete my X/Twitter account if Samsung gives the 'Galaxy S26 Ultra' a 7000 mAh or even a 6000 mAh battery I bet...based on my five sources, the internal Samsung Test Lab only seem to have a maximum capacity of 5500mAh; not more." The self-proclaimed science and tech enthusiast did not clarify whether the new generation of Galaxy S models will utilize silicon-carbon tech. Industry whispers allege that Samsung is perfecting its "battery formula," thus ensuring that it meets internal standards and expectations.

At the end of January, Samsung Electronics released their financial results for the fourth quarter and the fiscal year 2024. Smartphone tech watchdogs paid close to attention to the South Korean giant's accompanying earnings call. The recently released Galaxy S25 smartphone family is, exclusively, powered by Qualcomm Snapdragon 8 Elite chipsets—insiders believe that Samsung opted out of utilizing proprietary chip designs (for this generation) due to missed production goals. Late last year, inside sources pointed to the foundry's allegedly problematic 3 nm Gate-All-Around (GAA) process node. Follow-up reports suggest that Samsung engineers have moved onto developing a 2 nm manufacturing process, possibly linked to a re-designed Exynos 2500 flagship mobile processor.

Brian Ma, a technology industry analyst, extracted relevant information from Samsung's recent earnings meeting—several press outlets have picked up on his brief social media post. The IDC employee stated: "Samsung System LSI just mentioned in its earnings call that it's optimizing Exynos 2500 and 'aiming' to secure design wins for mobile models scheduled for release in 2H" The rumor mill has proposed that new "Galaxy Z Flip 7 and Fold 7" smartphone models are currently in the development pipeline—coincidental timing indicates that the two devices could launch later in 2025, potentially with next-gen flagship Exynos SoCs onboard. Tipsters reckon that the Exynos 2500 is configured with a 10-core cluster, and its integrated graphics solution will be an AMD RDNA 3.5-enabled Xclipse 950 model.

Samsung Electronics today reported financial results for the fourth quarter and the fiscal year 2024. The Company posted KRW 75.8 trillion in consolidated revenue and KRW 6.5 trillion in operating profit in the quarter ended December 31, 2024. For the full year, it reported KRW 300.9 trillion in annual revenue and KRW 32.7 trillion in operating profit.

Although fourth quarter revenue and operating profit decreased on a quarter-on-quarter (QoQ) basis, annual revenue reached the second-highest on record, surpassed only in 2022. Meanwhile, operating profit was down KRW 2.7 trillion QoQ, due to soft market conditions especially for IT products, and an increase in expenditures including R&D. In the first quarter of 2025, while overall earnings improvement may be limited due to weakness in the semiconductors business, the Company aims to pursue growth through increased sales of smartphones with differentiated AI experiences, as well as premium products in the Device eXperience (DX) Division.

Last week, Samsung introduced its brand-new Galaxy S25 smartphone series—press material focused largely on various implementations of AI features, but industry watchdogs noted the crucial selection of Qualcomm-designed processors. A "first-of-its-kind customized Snapdragon 8 Elite Mobile Platform for Galaxy chipset" is the natural choice for this generation of Samsung flagship phones, given that proprietary Exynos designs have reportedly missed the mark (yet again). Samik Chatterjee—a J.P. Morgan analyst—believes that the latest collaboration will swell Qualcomm's revenues; he predicts a gain of $2 billion (USD). Snapdragon 8 Elite processors are utilized by the entire range of globally-released Galaxy S25 models.

The previous-gen S24 series featured a mix of Qualcomm-designed chips and Samsung Exynos silicon (for different regional markets)—market analysis estimates a total of 40 million unit shipments back in 2024. Previously, Qualcomm had a 70% share of Galaxy S24 chipsets—fast-forwarding to the present day, it becomes 100% with the rollout of Galaxy S25. Late last year, press outlets posited that the South Korean company's foundry division had moved on from a "problematic" 3 nm Gate-All-Around (GAA) process. Samsung's flagship-tier Exynos 2500 SoC was linked to this node, but insiders reckon that alternative external production avenues were explored—most notably with an arch-rival: TSMC. Industry moles reckon that Samsung's leadership has slashed foundry budgets for 2025—reports from last week suggest investments being halved, as teams move onto two nanometer processes.

Samsung Electronics Co., Ltd. today announced the Galaxy S25 Ultra, Galaxy S25+, and Galaxy S25, setting a new standard towards a true AI companion with our most natural and context-aware mobile experiences ever created. Introducing multimodal AI agents, the Galaxy S25 series is the first step in Samsung's vision to change the way users interact with their phone—and with their world. A first-of-its-kind customized Snapdragon 8 Elite Mobile Platform for Galaxy chipset delivers greater on-device processing power for Galaxy AI plus superior camera range and control with Galaxy's next-gen ProVisual Engine.

"The greatest innovations are a reflection of their users, which is why we evolved Galaxy AI to help everyone interact with their devices more naturally and effortlessly while trusting that their privacy is secured," said TM Roh, President and Head of Mobile eXperience Business at Samsung Electronics. "Galaxy S25 series opens the door to an AI-integrated OS that fundamentally shifts how we use technology and how we live our lives."

Reports from last November suggested that Samsung Electronics had semi-abandoned its second-generation 3 nm Gate-All-Around (GAA) process, due to missed production goals. Disappointing production yields—as low as 20%—have been floated by industry insiders, they believed (at the time) that the South Korean's foundry teams had simply moved onto developing a next-gen 2 nm manufacturing process. A freshly published news article, courtesy of Business Korea, provides further evidence of a shift to 2 nanometer processes—Samsung's S3 plant in Hwaseong is reportedly in the process of being upgraded (from 3 nm GAA). Insiders believe that new equipment will be installed across the existing production line, requiring a small-scale investment of funds.

The Pyeongtaek 2 (P2) plant is supposedly being prepared for a 1.4 nm test line—targeting a manufacturing capacity of 2000 to 3000 wafers per month. Inside track information suggests that trials will begin within the year. Business Korea's report suggests that Samsung has halved its foundry facility investment budget for 2025—around 5 trillion won, instead of last year's 10 trillion won. The article puts a spotlight on alleged "sluggish customer orders"—the primary factor behind Samsung's decision to slash its chip-making budget by 50%. Competition is fierce at this point in time—TSMC leads the way with its cutting-edge technologies. Taiwan's premier foundry has attracted many high-profile clients away from rival manufacturers. In contrast, industry watchdogs believe that Samsung's struggles have caused "big tech" customers to seek alternate channels.

Blue Cheetah Analog Design today announced the successful tape-outs of its next generation BlueLynx die-to-die (D2D) PHY on Samsung Foundry's SF4X 4 nm advanced manufacturing process. The latest PHY supports both advanced and standard chiplet packaging with an aggregate throughput exceeding 100 Tbps while achieving industry-leading silicon area footprint and power consumption. BlueLynx D2D subsystem IP enables chip architects to meet the bandwidth density and environmental robustness necessary to ensure production deployment success while preserving use case flexibility.

Using Samsung Foundry's SF4X 4 nm advanced process, the latest BlueLynx PHY supports both standard 2D and advanced 2.5D packages and enables system designers to seamlessly change packaging technologies in current and future implementations. Customer deliveries started in 2024 with silicon characterization in both advanced and standard packaging applications expected in early Q2 2025.

Samsung Electronics today announced a partnership with game developers Nexon Korea and Neople to deliver unparalleled 3D experiences in the upcoming game 'The First Berserker: Khazan.' The game's 3D elements are being specially customized and designed during development, utilizing Samsung technology and the advanced capabilities of the Odyssey 3D monitor to create an immersive 3D gaming experience.

Through this partnership, Nexon, Neople and Samsung have been working closely to tailor the 3D visuals, carefully adjusting them based on the composition of characters, backgrounds and cinematics throughout the game. This process gives the developers an unprecedented level of control over the 3D effects, enabling them to bring their creative visions to life with precision.

Samsung's native foundry operations have wrestled with the 3 nm Gate-All-Around (GAA) process—these problems have persisted since the first reports of "missed production targets" emerged late last year—online speculators floated a very disappointing yield figure: only 20%. Last December, industry moles proposed that the South Korean technology giant had devised plans to form an Exynos-centric "multi-channel partnership" with rival chipmakers. Speculation pointed to TSMC being the only valid ally. Semiconductor industry tipster—Jukanlosreve—believes that negotiations have taken place, and the answer was a firm "no." TSMC's most advanced node process order books are likely filled up with more important customers—industry watchdogs reckon that Apple usually gets first dibs.

Taiwan's top semiconductor manufacturer leads the market with its cutting-edge lithography techniques. Insiders believe that Samsung was impressed by TSMC's 2 nm trial production runs achieving (rumored) 60% yields. The higher-end Exynos chipsets are normally produced with the best node process available, but missed manufacturing goals have caused Samsung to drop in-house tech. In the recent past, Qualcomm's most powerful Snapdragon mobile chipsets have been deployed on flagship Galaxy S smartphones. Jukanlosreve believes that TSMC rejected Samsung's proposed Exynos deal due to a fear of revealing too many "trade secrets." Potentially, the South Koreans could have learned a thing or two about improving yields—courtesy of TSMC's expert knowledge.

Samsung Display will begin mass production of the world's first rollable OLED screen for laptops starting in April 2025. Samsung Display announced its rollable screen for the Lenovo ThinkBook Plus G6 Rollable laptop at CES 2025 in Las Vegas, Nevada, U.S., Lenovo also showcased the laptop and announced its plans to globally launch in June.

The ThinkBook Plus G6 Rollable laptop features a screen underneath the keypad, where the screen expands vertically by almost 50%, offering a unique mobile computing experience. When rolled in, the screen supports a 5:4 aspect ratio on a 14-inch display. When rolled out, the aspect ratio shifts to 8:9 on a 16.7-inch display, providing an enhanced view for efficient multitasking.

Samsung has revealed two new laptop models at CES 2025: the Galaxy Book5 Pro and Galaxy Book5 360, both featuring Intel's latest processors and artificial intelligence capabilities. The Galaxy Book5 Pro comes in two sizes. The 16-inch version weighs 1.56 kg and includes a 76.1Wh battery, while the 14-inch model weighs 1.23 kg with a 63.1 Wh battery. Both laptops use AMOLED displays with 2880×1800 resolution and variable refresh rates from 48 to 120 Hz. Storage options reach 1 TB, with either 16 GB or 32 GB of memory available.

The Galaxy Book5 360 features a 15.6-inch touchscreen that can fold back 360 degrees, effectively turning the laptop into a tablet. It has a 1920×1080 resolution display and weighs 1.46 kg, with a 68.1 Wh battery. Both models use Intel's Core Ultra processors with built-in NPUs that Samsung uses for features like AI Select for searching and Photo Remaster for image enhancement. The laptops also integrate with other Samsung devices through features like Multi Control for unified device navigation and Quick Share for file transfers. The new laptops include standard connectivity options like Wi-Fi 7 and Bluetooth 5.4. Samsung claims the Pro models can achieve up to 25 hours of battery life, though real-world usage typically yields shorter durations.

Samsung Display unveiled two new, game-changing QD-OLED panels today at the CES 2025 in Las Vegas, Nevada, that are expected to reinforce the company's plans to dominate the premium, self-luminous monitor market.

The new products includes the world's first 27-inch UHD (3840x2160) OLED panel with 240 Hz refresh rate and 27-inch 500 Hz OLED panel with QHD (2560x1440) resolution, boasting the highest refresh rate when compared to OLED displays currently on the market with the same resolution. Recently, global electronics manufacturers such as Samsung Electronics, ASUS, MSI, and others, announced the launch of their 2025 monitor lineups featuring these panels. Samsung Display intends to commence mass production of both panels in the first half of the year.

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of JESD220G: Universal Flash Storage 4.1. In addition, an update to the complementary JESD223F UFS Host Controller Interface (UFSHCI) version 4.1 standard has also been published. Developed for mobile applications and computing systems requiring high performance with low power consumption, UFS 4.1 offers faster data access and improved performance over the earlier version of the standard while maintaining hardware compatibility to UFS 4.0. Both standards are available for download from the JEDEC website.

"JEDEC members are continually innovating to shape the standards that will drive the next generation of mobile devices and advanced applications, and the committee's dedication to ongoing improvements to the UFS series is paving the way for future innovation," said Mian Quddus, Chairman of the JEDEC Board of Directors and the JC-64 Committee for Embedded Memory Storage and Removable Memory Cards.

Samsung Electronics Co., Ltd. today announced the global launch of the Galaxy Book5 Pro and Galaxy Book5 360, expanding the Galaxy Book5 lineup to meet a wider range of AI needs for all users. Powered by Intel Core Ultra processors (Series 2) featuring NPUs up to 47 TOPs, these latest PCs come directly integrated with Galaxy AI capabilities like the innovative AI Select as well as cutting-edge features that deliver personalized experiences across the Galaxy ecosystem. With the addition of AI Select, PC users can easily search anything, anytime with a simple click, just like on their phone except on a much larger, immersive display.

"We are thrilled to make Galaxy AI and cutting-edge innovation accessible to more people than ever before, addressing their unique productivity needs on PC and other Galaxy devices," said Changtae Kim, EVP & Head of New Computing R&D Team, Mobile eXperience Business at Samsung Electronics. "Alongside our trusted industry partners, we are delivering an AI experience on Galaxy Book that empowers users to work, create and connect in more intelligent ways through our growing ecosystem."

Samsung Electronics today unveiled its 2025 Smart Monitor, Odyssey Gaming Monitor and ViewFinity Monitor lineups, all of which will be on display at Samsung's First Look at CES on January 5. The 2025 models raise the bar for monitors by bringing AI features, industry-first sizes in the OLED market and new form factors that ignite the passions of users worldwide—whether they're working, gaming or creating.

"With the new monitors in our industry-leading lineups, we're giving people more ways to explore the content and connections that they love in new ways," said Hoon Chung, Executive Vice President of Visual Display Business at Samsung Electronics. "Because of our new AI capabilities and size options, 2025 will see users across the world find the right monitor that fits them."

Frore Systems has demonstrated the massive increase in performance possible with AirJet solid-state active cooling chips in the new Samsung Galaxy Book4 Edge 14", the thinnest Notebook on the market at just 10.9 mm. The proof-of-concept Samsung Galaxy Book4 Edge 14", upgraded with AirJet, achieves an incredible 50% increase in sustained CPU & AI performance, showing that now, consumers really can demand it all. Frore Systems will be showcasing the upgraded Samsung Notebook in January at CES 2025.

Frore Systems achieved the 50% performance boost in the Samsung Galaxy Book4 Edge 14", from 12 Watts to 18 Watts, by replacing the two large fans currently used in the Notebook with four AirJet chips. This innovative solution reduces the cooling solution footprint by 45% - the fans consuming 8,800 mm² of space vs the AirJet footprint of just 4,800 mm². Therefore, the extremely compact AirJet solution creates additional space inside the Galaxy Book4 Edge 14", potentially allowing for increasing the battery size from the current 55.9 Wh to 64.8 Wh - a 16% increase - improving video runtime from 20 hours to 23.2 hours.

Samsung Electronics America, a world leader in advanced memory technology, has expanded its microSD portfolio with a line of new cards inspired by iconic characters from the Sonic the Hedgehog franchise, giving players an exciting new way to celebrate their fandom, while expanding their storage and powering ultra-fast gameplay. Created in collaboration with SEGA, the Sonic the Hedgehog PRO Plus microSDs will feature special designs depicting Knuckles (128 GB), Tails (256 GB), Sonic (512 GB) and Shadow (1 TB).

"Samsung PRO Plus microSD cards provide gamers, content creators and more with an easy, reliable, and secure way to store large amounts of data - delivering Sonic-speed right to your fingertips," said Jim Kiczek, Vice President of Memory Marketing at Samsung Electronics America. "Since debuting more than three decades ago, Sonic has become an icon of pop culture, featured in dozens of games, TV series, and movies. Now, with the Sonic the Hedgehog PRO Plus microSD cards, we're combining the franchise's instantly recognizable characters with the speed and reliability of Samsung PRO Plus microSDs to give your gear the ultimate Sonic boost."

Laptops powered by Intel's Lunar Lake family of processors have been seeping out slowly but steadily into the market. Samsung has no intention of sitting idle either, and has lifted the curtains on its Galaxy Book 5 Pro with an impressive AMOLED display and a battery life claim of a stupendous 25 hours. The laptop will be launched in South Korea on January 2, and a global rollout should follow thereafter.

Basically, the Book 5 Pro is the more affordable sibling of the Book 5 Pro 360. As the sharp-eyed amongst you may have already guessed, the Book 5 Pro does not feature the 360° hinge, which allowed the Book 5 Pro 360 to function as a convertible. Now, of course, a lot of people simply do not care about having convertible functionality, and the newly announced notebook is likely targeted at them.

Samsung Electronics today announced that The Premiere 8K, the company's flagship premium projector, has received the industry's first 8K Association (8KA) certification for 8K projectors. This recognition underscores Samsung's leadership in projection technology while setting a new benchmark for the industry.

"The Premiere 8K receiving the industry's first 8KA certification is a major milestone as it officially demonstrates the new potential of projector technology." said Taeyoung Son, Executive Vice President of Visual Display Business at Samsung Electronics. "We are committed to expanding the 8K ecosystem by continuously and extensively integrating new technologies."

We started Android over a decade ago with a simple idea: transform computing for everyone. Android powers more than just phones—it's on tablets, watches, TVs, cars and more.

Now, we're taking the next step into the future. Advancements in AI are making interacting with computers more natural and conversational. This inflection point enables new extended reality (XR) devices, like headsets and glasses, to understand your intent and the world around you, helping you get things done in entirely new ways.