MSI posted its third teaser pic for one of its upcoming socket LGA2066 motherboards, which is likely the X299 Gaming Pro. Designed for Core i7 "Kaby Lake-X" and Core i9 "Skylake-X" processors, the board appears to feature eight DDR4 DIMM slots (four slots on the left side of the socket). The teaser also gives us a glance of the LGA2066 socket, which could feature a similar retention mechanism to the current LGA2011v3 socket, even if the cooler support isn't consistent, given that some cooler manufacturers such as Noctua are already giving away LGA2066 brackets. The teaser pic also reveals two CPU power inputs, an 8-pin EPS and 4-pin ATX. This is unusual for a "mid-range" brand extension such as Gaming Pro, unless some of the Core i9 "Skylake-X" chips really do have >140W TDPs that demand more power inputs than your run of the mill single 8-pin EPS.

It seems that Intel's accelerated released schedule for its upcoming HEDT platform is starting to slowly bear fruits, with many details leaking through the cracks almost non-stop during the last few days (and before you ask, yes, I did have more links to show you.)

These should be two of the top performing processors in Intel's line-up, and the i9 7900X (10-core) and 7920X (12-core) have been tested on integer and floating point calculations. The 10-core i9-7900X (3.1 GHz base frequency, no Turbo listed)) scores 107 points in single-core benchmarks, and 1467 points in the multi-core test. The 12-core, 2.9 GHz base frequency 7920X, however, scores a head-scratchingly-higher 130 points in the same single-threaded benchmark, despite carrying the same architecture at... hmm... lower clocks. Maybe this processor's Turbo is working as expected, up to 3.25 GHz (average), and that's the factor for the higher single-core performance?

AMD Ryzen 9 "Threadripper" series 12-core, 14-core, and 16-core client desktop processors, which will form the company's next-generation high-end desktop (HEDT) lineup, which goes against Intel Core i9 "Skylake-X" series, could come in a brand new socket. This shouldn't come as a surprise because the chips have higher electrical requirements, besides double the I/O of socket AM4 Ryzen processors, such as a 44-lane PCIe gen 3.0 root complex, quad-channel DDR4 memory interface, and more. This socket, according to a "HotHardware" report, is an LGA (land-grid array) with 4,094 pins.

The new LGA-4094 socket, so-called SP3r2, will be slightly scaled up from the SP3 socket AMD has been selling enterprise Opteron-brand multi-socket CPUs on (pictured below). The consumer version of this socket could feature a more user-friendly retention mechanism that shouldn't require a screwdriver to fasten. Motherboards based on this distinctively rectangular socket will feature up to eight DDR4 DIMM slots to hold quad-channel DDR4 memory, and over four PCI-Express 3.0 x16 slots, with support for 3-way and 4-way multi-GPU solutions. The motherboards will also feature copious amounts of onboard devices, M.2 slots, and other storage connectivity. Since "Threadripper" is rumored to be a multi-chip module of two 14 nm "Summit Ridge" dies linked together on-package with with an Infinity Fabric interconnect, only one of the two dies links to the motherboard chipset (AMD X399 chipset), while all the PCIe lanes of the second die (including those which would make up the chipset bus) are freed up.

Intel is reportedly giving final touches to a new line of high-end desktop processors under the Core i9 brand extension. Until now, the company used the Core i7 brand extension broadly, to cover both the top-end parts of the mainstream-desktop (LGA115x) segment, and the high-end desktop (HEDT) segment, consisting of the LGA1366 and LGA2011-series sockets. With the advent of the new LGA2066 socket, Intel will be launching two distinct kinds of products - the Core i7 "Kaby Lake-X" quad-core series; and the Core i9 "Skylake-X" 6-core, 8-core, 10-core, and 12-core processors.

The Core i7 "Kaby Lake-X" will include the much talked about Core i7-7740K and i7-7640K quad-core processors (there's no Core i5 Kaby Lake-X). These chips will feature up to 1 MB of dedicated L2 cache per core, which is four times that of the existing i7-7700K chip. The i7-7740K features 8 MB of shared L2 cache; while the i7-7640K features just 6 MB. Interestingly, the i7-7640K also happens to lack HyperThreading, while the i7-7740K features it. The i7-7740K will ship with higher clock speeds than the i7-7700K, with 4.30 GHz core, and 4.50 GHz Turbo Boost. The i7-7640K features 4.00 GHz core, with 4.20 GHz Turbo Boost. The Core i9 series is a whole different beast.

Noctua today announced that it will continue its tradition of supplying customers with its premium-class SecuFirm2 mounting kits for novel platforms free of charge. While most current Noctua heatsinks support the new LGA2066 socket of Intel's 'Basin Falls' X299 platform for 'Skylake-X' and 'Kaby Lake-X' CPUs out of the box, older models can be upgraded with the NM-I2011 or NM-i20xx kits at no additional cost.

"We're determined to provide the best possible support to our customers and, over the years, we've sent many thousands of mounting kits free of charge to users who wanted to upgrade to new platforms", says Roland Mossig (Noctua CEO). "With Skylake-X just around the corner, we're pleased to announce that we'll extend this offer for LGA2066. Owners of older Noctua retail heatsinks that don't support LGA2011/LGA2066 out of the box will be able to upgrade to the new socket free of charge!"

Two days, two leaks on an upcoming Intel platform (the accelerated release dates gods are working hard with the blue giant, it would seem.) Now, it's Intel's own i7-7740K, a Kaby Lake-X HEDT processor that packs 4 cores and 8 threads, which is interesting when one considers that AMD's latest mainstream processors, Ryzen, already pack double the cores and threads in a non-HEDT platform. Interesting things about the Kaby Lake-X processors is that they are rumored to carry 16x PCIe 3.0 lane from the CPU (which can be configured as a singularly populated 16x or as a triple-populated 1x @ 8x and 2x @ 4x PCIe ports. Since these parts are reported as being based of on consumer, LGA-1151 Kaby Lake processors, it would seem these eschew Intel's integrated graphics, thus saving die space. And these do seem to deliver a quad-channel memory controller as well, though we've seen with Ryzen R7 reviews how much of a difference that makes for some of the use cases.

Intel's X299 HEDT platform, whose launch we recently covered as having been pushed forward by the company so as to better compete against AMD's upcoming X399 HEDT platform, has some new, juicy rumors floating about it. Namely, Bench.Life has reported that Intel's upcoming Kaby Lake-X and Skylake-X lines of high performance CPUs will also feature 12-core offerings on its Skylake-X materialization, instead of just the previously reported 6, 8, and 10-core designs.

This really looks like an Intel that's stretching its manufacturing and chip design prowess so as to prevent itself from being buried in higher-performing, higher core and thread count offerings from its rival AMD, which has turned Intel's line-up in the mainstream consumer market head-over-heels already. Latest reports peg the new series as being presented on Computex 2017 (specifically, on may 30th), with availability being expected on June 26th. Which platform are most interested in, and what do you think of this move from Intel?

According to DigiTimes, sources among Taiwan-based PC vendors have indicated that Intel's upcoming Basin Falls platform, which includes Skylake-X and Kaby Lake-X processors on a new X299 chipset, will be unveiled at Computex 2017 (May 30th, June 3rd), in Taipei - two months earlier than expected. This move comes accompanied by an accelerated launch of the Coffee Lake microarchitecture, which still uses the 14 nm process, to August 2017 from an initial January 2018 launch. If true, this is big in a number of ways - that Intel would bring forward a product launch 4 months has some interesting implications - or at least, confirmations.

Remember that Coffee Lake is supposed to carry an increased number of cores in its mainstream designs. And we all know how Intel's line-up has almost been torn apart by Ryzen's aggressive core and thread-count, with AMD offering more cores and threads than Intel at virtually all price-points. And even if an argument is made regarding Intel's better gaming performance, that's one scenario out of many. Future proofing, professional work, multimedia, all of these assert AMD's dominance in a pure price-performance ratio. I, for one, would gladly give up some FPS in some games and accept an increased number of cores than go the other way around (especially with AMD's platform support and the number of patches that have increased game performance on Ryzen CPUs.)

The rumor mill turns, and Ages come and pass, leaving memories that become legend. However, some of those really do turn to reality, like recent accounts of an AMD Polaris 20 chip surfacing in the latest RX 500 series. This time, Intel is in the crosshairs, with the company's high-performance Skylake-X and Kaby Lake-X desktop components being pegged for release between June 19th and July 9th. This would place an announcement on the new chipset and CPUs debut to drop around Computex 2017, which kicks off on May 30 and runs through June 3 in Taipei.

Skylake-X and Kaby Lake-X parts are supposed to use the same LGA 2066 socket, with Skylake-X said to include anywhere between six to 10 cores, support quad-channel DDR4 memory and have a metric ton of PCIe 3.0 lanes. Kaby Lake-X parts, meanwhile, are reportedly limited to just four cores, dual-channel memory and just 16 PCIe lanes from the CPU - which gives an impression of a simple, Kaby Lake desktop CPUs being repackaged for the new socket.(And yes, inquisitive readers, that was a random reference to Robert Jordan's "The Wheel of Time" in the first line of this article.)

Intel's next high-end desktop (HEDT) platform to succeed the current "Broadwell-E" LGA2011v3 will be the X-series "Basin Falls" platform. This consists of the "Skylake-X" and "Kaby Lake-X" processors, and a chipset derived from Intel's upcoming 200-series. Just as Intel changed sockets for its previous three HEDT platforms (LGA1366 for "Nehalem" and "Westmere/Gulftown," LGA2011 for "Sandy Bridge-E" and "Ivy Bridge-E," and LGA2011v3 for "Haswell-E" and "Broadwell-E,") the company will launch a new socket, the LGA2066.

As with its HEDT predecessors, "Skylake-X" and "Kaby Lake-X" will be multi-core processors devoid of integrated graphics, with double the memory bus width and up to triple the PCIe lane budgets as the desktop ("Skylake-D," eg: Core i7-6700) processors. In an interesting move, Intel will launch both "Skylake-X" and "Kaby Lake-X" in quick succession, with a catch - "Skylake-X" will come in 6-core, 8-core, and 10-core variants; while the "Kaby Lake-X" will initially only be offered in quad-core. The "Kaby Lake-X" chip will further only feature a dual-channel memory bus, and the LGA2066 motherboard will have half its DDR4 DIMM slots disabled, besides a few PCIe lanes.