Sapphire brought unique new hardware to Computex 2025. We begin our tour with the new Sapphire Edge AI line of mini PCs. First up, is the Edge AI 370, a mini PC measuring 117 mm x 111 mm x 30 mm (WxDxH). It is powered by AMD Ryzen AI 9 HX 370 "Strix Point" mobile processor, with two DDR5 SO-DIMM slots supporting up to 96 GB of memory. Storage comes from a 1 TB Gen 4 NVMe SSD. The CPU is configured with 12 cores (4x Zen 5 + 8x Zen 5c), while the maxed out RDNA 3.5 iGPU has 16 CU. The XDNA 2 NPU is clocked for 50 AI TOPS, and meets Microsoft Copilot+ requirements.

Next up, is the Sapphire X870EA Wi-Fi PhantomLink Edition motherboard. This is Sapphire's first high-end motherboard in years. The Socket AM5 motherboard is based on the flagship AMD X870E chipset, and offers premium connectivity and I/O features. It's also designed to visually match the company's latest Radeon RX 9070 XT NITRO+ graphics card, but its most striking feature is PhantomLink. This is a backside power delivery feature similar to ASUS BTF. The main PCI-Express 5.0 x16 slot has a trailing power delivery slot that relays power from a 12V-2x6 power input located next to the 24-pin ATX connector on the motherboard. This may not be a complete backside I/O motherboard, but at least keeps the graphics card free from any power cables sticking out. To use PhantomLink, however, you need a compatible graphics card, and Sapphire showed us the Radeon RX 9070 XT NITRO+ PhantomLink Edition.

Zotac is set to unveil the next generation of its Gaming Zone handheld at Computex in Taiwan later this month, following its initial entry into the portable gaming PC market last summer. This upcoming device will feature the powerful AMD Ryzen AI 9 HX 370 processor and, surprisingly, will run on a custom Manjaro Linux-based operating system specifically designed for handheld devices as reported by Liliputing. This represents a departure from using Windows or adopting Valve's SteamOS, which powers the popular Steam Deck.

The next-gen Zotac Gaming Zone will boast a 7-inch OLED display with a 120 Hz refresh rate. Inside, the Ryzen AI 9 HX 370 Strix Point chip makes a big leap in performance compared to the first version (the first-gen Zotac Gaming Zone featured an AMD Ryzen 7 8840U Hawk Point processor with an 8-core Zen 4 CPU and 12-core RDNA 3 graphics). It has 12 Zen 5 CPU cores and 16 RDNA 3.5 GPU compute units. It also comes with a better NPU to handle AI tasks. Other features include LPDDR5x memory, a PCIe 4.0 NVMe SSD slot (M.2 2280), Wi-Fi 6E and Bluetooth 5.2, two USB4 ports and a 48.5Wh battery.

One of the interesting long-term trends in the commercial market is the shift in how people are functionally using PCs. Over the past few years, AI has gone from a dinner party conversation piece to practical use cases. Hand-waved discussions of future benefits are now concrete benefits in the here-and-now, from writing and validating software code to shaping customer communication. While many of these early AI workloads were executed in the cloud, we are seeing new use cases that require new local PC capabilities - capabilities AMD has been working to develop as part of its larger AI PC initiative. We've seen AI deployment accelerate in PCs, particularly as Microsoft builds these functions right into the operating system via its Windows 11 Copilot+ PC program.

In just two years, we've moved from an environment where the NPU was an unsupported, unknown proposition, to integrating NPU support into first and third-party applications. Commercial OEMs are expected to introduce AI PCs and Copilot+ PCs at a variety of price points throughout 2025, making local AI support more available and affordable. That's an important factor for corporate customers, many of which will be simultaneously negotiating the end of Windows 10 support and a historically large, pandemic-related system refresh wave. AI presents a further variable. The nature of the AI question has evolved over the last couple of years from "Does AI have a future in the enterprise?" to "What are the best practices for enterprise AI and AI PC deployment?" That's a significant shift, and it's worth unpacking in a little more detail.

PC hardware watchers continue to pore over official AMD repositories and adjacent databases, in the hopes of finding unannounced next-gen technologies. Olrak29 and InstLatX64 have presented their latest Team Red-related findings; apparently reaching across futuristic desktop, mobile, and workstation product families. As outlined and interpreted by VideoCardz, several of these next-gen branches are already somewhat "known" properties—namely AMD's allegedly Zen 5-based Ryzen Threadripper "Shimada Peak" 9000WX (workstation) processor series. Following almost two years of leaks, an official introduction is expected to happen during Computex 2025. The Ryzen 9000G "Gorgon Point" desktop (Zen 5 + RDNA 3.5) APU series has turned up again; now "fully" linked to the AM5 socket platform (not a big surprise). The two leakers have also uncovered another rumored AM5-bound product lineup—"Grado" chips could be based on existing "Granite Ridge" foundations, but elevated to commercial/enterprise levels. These speculated basic/entry-level "EPYC 4005" processors are floated as natural successors to currently available 4004 forebears (related to Ryzen 7000 "Raphael" architecture).

Olrak29 and InstLatX64 have also found multiple mysterious FP8 socket-related Ryzen AI Mobile SoCs. "Krackan2" could be a cheaper refresh of current "Krackan Point" APUs—Tom's Hardware proposes smaller designs that sport fewer cores, and not configured with NPUs. Kepler_L2 has weighed in on the matter of three listed "Gorgon Point" IPs—he reckons that the third variant ("Gorgon Point3") will be a spin-off (aka refresh) of a "Krackan2" design. As suggested by insider knowledge, Team Red's convoluted scheme points to "Gorgon Point" being the sequel to "Strix Point." An FF5-based "Soundwave" processor design has appeared alongside the aforementioned futuristic Ryzen AI Mobile chipsets—industry whispers propose that AMD will be leveraging Arm architecture within a lower product tier. InstLatX64 pulled additional compelling information from AMD's Technical Information Portal—providing further insight into Ryzen AI "Medusa Point" APUs (Zen 6 + RDNA 3.5) being dreamt up, with a matching "larger footprint" FP10 platform.

AMD is preparing to launch as many as six new laptop discrete GPUs this Computex based on its latest RDNA 4 graphics architecture. The lineup will be built on its 4 nm "Navi 48" and "Navi 44" chips. It will be led by the Radeon RX 9080M, its new flagship part that maxes out the "Navi 48," enabling all 64 compute units for a core-configuration resembling that of the desktop RX 9070 XT. This rumor comes from AllTheWatts! on Twitter, a reliable source with AMD leaks. The RX 9080M gets 16 GB of memory across the chip's full 256-bit memory interface.

Positioned below the RX 9080M will be the RX 9070M XT, configured with 48 compute units for 3,072 stream processors, 96 AI accelerators, 48 RT accelerators, 192 TMUs, and possibly 96 ROPs. It gets 12 GB of memory across a 192-bit wide memory bus. This is essentially the same core-config as the upcoming desktop RX 9070 GRE. A rather huge notch below the RX 9070M, which is based on the physically smaller "Navi 44" silicon, and has 32 compute units for 2,048 stream processors, 64 AI accelerators, 32 RT accelerators, 128 TMUs, and 64 ROPs. This chip gets 8 GB of memory across a 128-bit memory bus.

Two weeks ago, unannounced APU model names—"Ryzen AI Z2 Extreme" and "Ryzen Z2 A"—were leaked by Hoang Anh Phu. AMD introduced its Ryzen Z2 series at CES 2025; officially consisting of three options: Z2 Extreme, Z2 and Z2 Go. Technical make up of the two alleged new additions remained a mystery, but watchdog theorizations positioned the rumored "Ryzen AI Z2 Extreme" as the (expanded) lineup's flagship—likely due to the enablement of an integrated XDNA 2 NPU. The vanilla Z2 Extreme APU is a handheld gaming-oriented product; existing as a spin-off from Team Red's "Strix Point" mobile processor design—utilizing Zen 5 and RDNA 3.5 technologies. By similar deduction, the leaked "Ryzen Z2 A" SKU was viewed as a "Hawk Point" (Zen 4 + RDNA 3) processor, possibly with a "switched on" AI aspect. Earlier today Hoang Anh Phu provided a new follow-up claim—this morning's social media post proposes a return to "Van Gogh" pastures.

The not-yet-official "Ryzen Z2 A" APU design could be derived from the Steam Deck's Zen 2 + RDNA 2 package. Valve and AMD's collaboration resulted in the "Van Gogh" custom chip design—also known as "Aerith"—debuting back in 2022. A die shrink—from 7 nm to 6 nm—arrived in the form of Steam Deck OLED's "Sephiroth" chipset (2023). Phu's latest prediction places the "Ryzen Z2 A" closer to the already unveiled Ryzen Z2 Go, graphics technology-wise. As discussed in the past, this entry-level "Phoenix 2" solution sports an RDNA 2 iGPU, albeit paired with Zen 3 processor cores. The Ryzen Z2 Go chipset powers Lenovo's Legion Go S handheld gaming PC—in the near future, this offering will be made available with two different operating system options: Windows 11 or SteamOS. As extrapolated from Phu's fresh prediction, similar-ish lower end devices—prepped with Valve's proprietary OS—could arrive with "Ryzen Z2 A" APUs onboard.

Over the years, we have witnessed plenty of product leaks via webpages that went live well before they were supposed to. Something similar appears to have happened with Lenovo's Malaysian site, granting us a glimpse at the upcoming ThinkPad P14s Gen 6 powered by up to the full-fat 12-core Ryzen AI 9 HX 370 APU. The leaked product specifications, as listed below, reveal that the P14s will support up to a whopping 96 GB of DDR5-5600 memory, although only with the lower-end Ryzen AI 7 PRO 350 and Ryzen AI 5 PRO 340 variants.

Compared to the previous edition ThinkPad P14s with AMD's Ryzen 7 8840HS APU, the highest-end variant with the Ryzen AI 9 HX 370 will undoubtedly be substantially faster in both single and multicore performance. The Radeon 890M iGPU will also handily outperform the 780M, although the difference is unlikely to be earth-shattering. Like its predecessor, the Gen 6 will continue being available with a 2.8K 120 Hz OLED display, with a higher peak brightness of 500 nits and 100% coverage of the DCI-P3 color gamut. The port selection, as can be expected from a ThinkPad, is plenty admirable, packing dual Thunderbolt 4 (with DisplayPort 1.4), HDMI 2.1, Ethernet, dual USB-A, optional nano sim and smart card reader, as well as a headphone jack.

A few months ago, the OneXPlayer X1 Pro gaming handheld became one of the first in its category to boast AMD's 12-core Ryzen AI HX 370 'Strix Point' APU. The product also packed a pretty large 10.95-inch 120 Hz, 2560 x 1600 display as well as up to 64 GB of memory and a whopping 4 TB of internal solid-state storage. Now, the company behind the product has introduced a fresh new limited-edition variant named 'EVA' with a Neon Genesis-based theme and Arrow Lake-H internals. To be specific, this variant will boast Intel's Core Ultra 7 255H processor along with an eye-watering $1650 price tag.

The 16-core Core Ultra 7 255H will be paired with 64 GB of LPDDR5X memory, and 2 TB of SSD storage will be on offer. Unlike the AMD-powered variant, lower-end SKUs with 32 GB of memory and lesser storage space are not available. In terms of performance, the systems are quite neck-and-neck, which makes sense considering that the equivalent configurations are priced identically. The AMD APU has the lead in multicore performance, while the Intel part leads in single-core. In terms of GPU performance, the Arc 140T is quite a bit faster than the Radeon 890M, at least in synthetic tests. Real-life gaming performance is very similar, although performance varies heavily depending on the game being played.

Three months ago, AMD unveiled its Ryzen Z2 APU series at CES 2025—purpose made for deployment in next-gen handheld gaming PCs. The officially announced flagship—Ryzen Z2 Extreme "Strix Point," utilizing Zen 5 and RDNA 3.5 technologies—was previously alluded to by leakers in late 2024; albeit with some curious claims regarding an "odd 3+5 core configuration." Last week, Hoang Anh Phu (@AnhPhuH) presented an alleged expanded lineup of Ryzen Z2 processors—headlined by a mysterious "Ryzen AI Z2 Extreme" SKU.

PC hardware watchdogs believe that this speculative variant will eventually arrive with an enabled XDNA 2 NPU (a first for the series); likely readied to take on Intel's Core Ultra 200V "Lunar Lake" processor family. MSI's Core Ultra 7 258V-powered Claw 8 AI+ and Claw 7 AI+ handhelds launched not too long ago, boasting all sorts of Microsoft Copilot+ capabilities. Mid-way through March, an Xbox executive introduced "Copilot for Gaming." Team Red and manufacturing partners are likely jumping onto this "AI gaming" bandwagon with the aforementioned "AI Ryzen Z2 Extreme" chip, as well as Phu's fanciful "Ryzen Z2 A" model. The latter could be a spin-off of AMD's vanilla Ryzen Z2 "Hawk Point" design, with a "switched on" XDNA NPU.

Successors to AMD's current-generation lineup of Ryzen 8000G desktop APUs are reportedly in the pipeline—according to the latest HXL/9550pro predictive declaration, finalized units could arrive at retail later this year. They propose that an "AMD AM5 New APU" family could arrive alongside an unannounced MSI Unify-X enthusiast-grade motherboard design, within the final quarter of 2025. Press interpretations of this inside track information point to possible upcoming "Ryzen 9000G" processors, utilizing Team Red's Zen 5 and RDNA 3.5 technologies. This potent combination already exists, albeit in mobile form—namely within Team Red's stable of Ryzen AI "Strix Halo, Strix Point," and "Krackan Point" APUs.

Industry experts opine that AMD will most likely deploy high-end "Strix Point" silicon to desktop, or more fancifully: "Gorgon Point." The latter codename turned up via leaks last week. Around early 2024, we witnessed Team Red's transfer of "Phoenix"—from original mobile formats—to their AM5 desktop platform. TechPowerUp's W1zzard evaluated the Ryzen 5 8500G "Phoenix 2" APU last summer; this plucky budget-friendly model sports Zen 4 and Zen 4c cores. Theoretically a flagship "Ryzen 9000G" SKU could emerge with twelve processor cores (4x "Zen 5" + 8x "Zen 5c"), a Radeon 890M iGPU, and an XDNA 2 NPU.

Shipping manifests have served as fairly reliable sources of pre-launch information—Everest (aka Olrak29) has discovered many juicy details in recent times. Their latest sleuthing session—combing through NBD documents—has indicated AMD's (alleged) prepping of a larger socket design for next-generation mobile processors. A leaked document alludes to the existence of various "MEDUSA01" jig and block "FP10" socket validation parts. Current-generation Ryzen AI "Strix Point" 300 series APUs utilize the FP8 socket format. Based on the "MEDUSA01" shipping manifest, it seems that a successor will arrive with a larger footprint—measurements of 25 mm x 42.5 mm are repeated throughout the leaked description list. Industry watchdogs surmise that "Medusa Point's" BGA FP10 socket will be approximately 6% larger than its predecessor.

Mid-way through last month, insider theorizations pointed to "Medusa Point" being a chiplet-based design. A "single 12-core Zen 6 CCD" was linked to a TSMC 3 nm-class node, with "N4P" reportedly selected for a separate mobile client I/O die. Readily available 4 nm Ryzen AI "Strix Point" processors are monolithic in nature. Initial inside track info mentioned RDNA 4 technology in the same equation as "Medusa Point," but recent Team Red's recent-ish targeting of "GFX1153" places RDNA 3.5 as the de facto choice.

Officially, NVIDIA has only revealed mobile variants of its GeForce RTX 50 "Blackwell" GPU series going down to RTX 5070. At CES 2025, Jensen Huang's keynote presentation proposed a $1299 entry point for GB206-equipped gaming laptops—rated up to 800 AI TOPS. As demonstrated by recent market trends, "MSRP" recommendations are widely viewed as whimsical recommendations (at best). Pre-orders for upper crust to mid-range GeForce RTX 50-series laptops opened up on February 25, but the missing ROP (Raster Operations Pipeline) problem has seemingly spread to Blackwell's mobile offshoot. Reports suggest that necessary investigations have pushed initial customer-bound deliveries into April. Presumably, unannounced lower end products—in GeForce RTX 5060 and RTX 5050 Mobile form—are similarly delayed.

Earlier today, momomo_us—a notable source of pre-launch information—unearthed an alleged "Razer-authored" new product document. The American-Singaporean brand appears to be preparing a multitude of Razer Blade 16 (2025) SKUs, with a series identified as "RZ09-0528." The leaked MSRP guide contains a major error; Razer's forthcoming flagship model—powered by an AMD Ryzen AI 9 HX 370 "Strix Point" APU and GeForce RTX 5090 Mobile GPU—will not arrive at retail/e-tail with a $1499 price tag. Focusing on the opposite end of Razer's chart, VideoCardz highlighted the $1999 OLED-equipped SKU—featuring a Ryzen AI 9 365 processor and Team Green's unannounced GeForce RTX 5060 Mobile GPU. The speculative steep asking price is not a big surprise, given the expected tagging on of Razer "premium tax." Mid-way through last week, "lowly" GeForce RTX 5050-powered laptops were accidentally listed by retail outlets. The cheapest offering was advertised with a $1720 (including VAT) price point—based on these recent (possibly unfinalized) data points, industry watchdogs have predicted steep asking prices for even the most basic of Blackwell mobile options.

Framework has finally introduced its next-generation Framework Laptop 13, now powered by the extremely potent Ryzen AI 300 "Strix Point" APUs. The product is already available for pre-order on Framework's website, with prices starting from $899 for the Do-It-Yourself variant, and $1,099 for the fully assembled variant. From the outside, the design of the product has been left mostly unchanged, which may appear somewhat disappointing at first, although an unaltered design likely indicates compatibility of components between the two laptops, which is undoubtedly one of the primary selling points for the Framework Laptop.

As mentioned, the biggest upgrade that the new Framework Laptop brings to the table is the new selection of processors, with the Ryzen AI 9 HX 370 APU sitting at the highest-end. Unsurprisingly, the Strix Point APUs allow for excellent performance improvements to both CPU and GPU side of things. With 12 cores (4 Zen 5 + 8 Zen 5c) and 24 threads, the highest-end Ryzen AI 9 HX 370 APU performs admirably well in benchmarks as well as real-life workloads. The Radeon 890M iGPU is among the fastest available on the market, trading blows with the Arc 140T iGPU in synthetic benchmarks. Of course, the 50 TOPS NPU allows for CoPilot functionality, for those who care. The Windows variant ships with a dedicated CoPilot key as well, while the DIY variant does not.

Navigating AMD's various modern processor model naming schemes is tricky business, and another layer of complexity has been added this week; with newly revealed "Strix Point" and "Krackan Point" CPUs. Three previously unannounced SKUs have appeared on AMD's Chinese website: Ryzen AI 9 H 365, Ryzen AI 7 H 350, and Ryzen AI 5 H 340. At first glance, these models codes seem to be familiar—after a double take, we see a small difference in nomenclature. The addition of a middle-placed/detached "H" has press outlets and hardware enthusiasts scratching their collective heads. After discovering Team Red's Ryzen AI 9 H 365 APU listing, Lonely City Hardware posted a humorous observation on social media: "for the Chinese market. No one can remember the full name."

Frustratingly, Western search engines (at the time of writing) just point you to the non-H equivalents. The "H" designation denotes Chinese market exclusivity; TechPowerUp has covered previous-generation examples in the recent past. When comparing technical details and specification sheets to Western equivalents, VideoCardz noted that there were no apparent differences—platform and packaging are the same (FP8). A cross-reference—of clock speeds, thermal ratings, and core architecture (Zen 5/Zen 5C)—points to spec parity across East and West variants.

Back in January, we covered a report about AMD designing its next-generation "Zen 6" CCDs on a 3 nm-class node by TSMC, and developing a new line of server and client I/O dies (cIOD and sIOD). The I/O die is a crucial piece of silicon that contains all the uncore components of the processor, including the memory controllers, the PCIe root complex, and Infinity Fabric interconnects to the CCDs and multi-socket connections. Back then it was reported that these new-generation I/O dies were being designed on the 4 nm silicon fabrication process, which was interpreted as being AMD's favorite 4 nm-class node, the TSMC N4P, on which the company builds everything from its current "Strix Point" mobile processors to the "Zen 5" CCDs. It turns out that AMD has other plans, and is exploring a 4 nm-class node by Samsung.

This node is very likely the Samsung 4LPP, also known as the SF4, which has been in mass-production since 2022. The table below shows how the SF4 compares with TSMC N4P and Intel 4, where it is shown striking a balance between the two. We have also added values for the TSMC N5 node from which the N4P is derived from, and you can see that the SF4 offers comparable transistor density to the N5, and is a significant improvement in transistor density over the TSMC N6, which AMD uses for its current generation of sIOD and cIOD. The new 4 nm node will allow AMD to reduce the TDP of the I/O die, implement a new power management solution, and more importantly, the need for a new I/O die is driven by the need for updated memory controllers that support higher DDR5 speeds and compatibility with new kinds of DIMMs, such as CUDIMMs, RDIMMs with RCDs, etc.

At some point this week, HP's North American online store was updated with new high-end EliteBooks that feature AMD Strix Point APUs. Three models appear to support up to 128 GB of LPDDR5X-8533 memory—these curious entries were highlighted by tech enthusiast Hoang Anh Phu (AnhPhuH). The advertised maximum 8533 MT/s transfer rate exceeds Team Red's official reference figure (7500 MT/s) for the EliteBook X G1a's Ryzen AI 9 HX 375 APU. Looking further up in the Team Red "Strix Point" product stack, we spotted their Ryzen AI 9 HX PRO 375 spec sheet boasting a maximum LPDDR5x transfer speed of 8000 MT/s. Press outlets have expressed doubt when analyzing three of HP's EliteBook X G1a SKUs. Theories point to product pages containing possible placeholder information, or inaccuracies.

Working with the belief that the specs are legit, AnhPhuH commented: "this is the first laptop featured with 128 GB LPDDR5x-8533 128-bit memory. That would mean it's using four 256 Gb x32 modules(?!). As far as I know, all three major DRAM manufacturers currently only have 128 Gb x32 modules...the EliteBook X G1a uses Strix Point, not Strix Halo, so it only pairs with four x32 modules (two 64-bit channels)." HP's web shop states that the EliteBook X G1a models are due to launch on March 14. We hope that further clarification and concrete specifications appear online closer to release time. Initial pricing starts at $2749 for the lowliest of the three "128 GB LPDDR5X-8533" equipped models. The agonizingly named flagship "HP EliteBook X G1a 14 inch Notebook Next Gen AI PC Wolf Pro Security Edition" offering comes in at an eye-watering $4299.

The AOKZOE A1 X was recently teased by its maker as a new AMD Strix Point-powered gaming handheld, featuring the commendably potent Ryzen AI 9 HX 370 APU with the equally admirable RDNA 3.5-based Radeon 890M iGPU. Details were scarce regarding the handheld, but now the company has shed some much-needed light on a few features of the upcoming handheld. We still do not have a clue as to when the handheld will finally see the light of day, or even an expected price bracket. Considering that AOKZOE is not nearly as well known as its competitors in this space, the A1 X can be expected to launch with a price tag that undercuts its rivals. Thanks to a previous teaser, already know that the A1 X will sport an 8-inch 120 Hz display with VRR support.

Addressing the features teased recently, AOKZOE has revealed that the handheld will sport a 72.7 Wh battery with support for bypass charging, allowing it to draw power directly without having to pass it through the battery, thereby increasing the battery's lifespan. Moreover, the A1 X will also sport MicroSD 4.0 support, allowing for transfer speeds of up to 300 MB/s. The handheld will sport dual USB4 ports, along with an OCuLink port which will allow for speedy eGPU connections for gaming sessions that demand more horsepower than the Radeon 890M can provide. Going by the shared images, the A1 X will also sport at least one USB-A port, which will surely come in handy when the need arises for additional peripherals.

Apple's M4 SoC was released to overwhelmingly positive reviews, particularly regarding the commendable performance and efficiency benefits it brought to the table. The chip first appeared in the OLED iPad Pro lineup last May, arriving in the company's MacBook Pro lineup only much later, giving Intel's Lunar Lake and AMD's Strix Point a run for their money. Now, it appears that the company is cognizant of the heat brought by AMD's Strix Halo, and has already commenced mass production for the first SoC in the M5 family - the vanilla M5, according to Korean news outlet ET News.

Just like last time, the M5 SoC has been repeatedly rumored to first arrive in the next-generation iPad Pro, scheduled to enter production sometime in the second half of this year. The MacBook Pro will likely be next-in-line for the M5 treatment, followed the rest of the lineup as per tradition. Interestingly, although Apple decided against using TSMC's 2 nm process for this year's chips, the higher-tier variants, including the M5 Pro and M5 Max are expected to utilize TSMC's SoIC-mH technology, allowing for vertical stacking of chips that should ideally benefit thermals, and possibly even allow for better and larger GPUs thanks to the separation of the CPU and GPU portions. Consequently, yields will also improve, which will allow Apple to bring costs down.

AMD today put out detailed guides on how to get DeepSeek R1 distilled reasoning models to run on Radeon RX graphics cards and Ryzen AI processors. The guide confirms that the new Ryzen AI Max "Strix Halo" processors come in hardwired to LPCAMM2 memory configurations of 32 GB, 64 GB, and 128 GB, and there won't be a 16 GB memory option for notebook manufacturers to cheap out with. The guide goes on to explain that "Strix Halo" will be able to locally accelerate DeepSeek-R1-Distill-Llama with 70 billion parameters on the 64 GB and 128 GB memory configurations of "Strix Halo" powered notebooks, while the 32 GB model should be able to run DeepSeek-R1-Distill-Qwen-32B. Ryzen AI "Strix Point" mobile processors should be capable of running DeepSeek-R1-Distill-Qwen-14B and DeepSeek-R1-Distill-Llama-14B on their RDNA 3.5 iGPUs and NPUs. Meanwhile, older generation processors based on "Phoenix Point" and "Hawk Point" chips should be capable of DeepSeek-R1-Distill-Llama-14B. The company recommends running all of the above distills in Q4 K M quantization.

Switching gears to the discrete graphics cards, and AMD is only recommending its Radeon RX 7000 series for now, since the RDNA 3 graphics architecture introduces AI accelerators. The flagship Radeon RX 7900 XTX is recommended for DeepSeek-R1-Distill-Qwen-32B distill, while all SKUs with 12 GB to 20 GB of memory—that's RX 7600 XT, RX 7700 XT, RX 7800 XT, RX 7900 GRE, and RX 7900 XT, are recommended till DeepSeek-R1-Distill-Qwen-14B. The mainstream RX 7600 with its 8 GB memory is only recommended till DeepSeek-R1-Distill-Llama-8B. You will need LM Studio 0.3.8 or later and Radeon Software Adrenalin 25.1.1 beta or later drivers. AMD put out first party LMStudio 0.3.8 tokens/second performance numbers for the RX 7900 XTX, comparing it with the NVIDIA GeForce RTX 4080 SUPER and the RTX 4090.

After several months of teasers, the Ayaneo 3 gaming handheld has finally witnessed its official launch. The product will be available with two APUs - the Ryzen 7 8840U for the entry variant, and the Ryzen AI 9 HX 370 for the high-end variant. The system can be equipped with up to 64 GB of LPDDR5X-7500 memory, and a whopping 4 TB of SSD storage. The handheld will also feature modular controllers, which can be detached with the click of a single button.

The Ayaneo 3 will also give customers the option to chose between an LCD or an OLED panel, and as VideoCardz notes, selecting the OLED option does not change the final price. As mentioned earlier, the system will be available with either a Zen 4 or a Zen 5 APU. The Strix Point variant leads the Hawk Point part by almost around 50% in multicore tests, and the HX 370's integrated Radeon 890M iGPU is somewhere around 25% more performant than the 8840U's Radeon 780M. Clearly, the performance gap between the two variants will be substantial.

Ayaneo has been teasing the Ayaneo 3 gaming handheld for what seems like an eternity now. The handheld was among the first to be powered by the Ryzen AI 9 HX 370 "Strix Point" APU with the extremely potent Radeon 890M iGPU, promising impressive performance potential. However, the 7-inch gaming handheld is yet to see the light of day, and we still have no clue when it finally will.

However, Ayaneo has gone ahead and teased the Ayaneo 3 once again, showing off a new colorway for the gaming handheld. This edition, dubbed "Retro Power", utilizes a beige-themed design with red accents on some of the controls. The device will also be available in black and white colorways, making the "Retro Power" variant a fun alternative for those who prefer something other than black or white for their handheld gaming console. That is, when the Ayaneo 3 finally ships, of course.

The Beelink SER9 Pro made headlines a few months ago as one of the first mini PCs with AMD's Strix Point APUs. Powered by the Ryzen AI 9 HX 370 APU with the powerful Radeon 890M iGPU, the SER9 Pro promised impressive performance and efficiency in a commendably compact form factor. Now, the brand has unveiled a new variant of the SER9 Pro, powered by the slightly less-powerful Ryzen AI 9 365 APU. This variant will likely be more affordable than its higher-tier sibling, which currently starts from $999 in the US.

The differences between the Ryzen AI HX 370 and the Ryzen AI 365 are actually more substantial than one might think. Both the APUs sport four Zen 5 cores, while the AI 365 gets only six Zen 5c cores compared to the HX 370's eight. The AI 365 also gets a 100 MHz lower boost clock, and a notably slower Radeon 880M iGPU with fewer shaders. Beelink had equipped the HX 370 variant with a 65 watt TDP, but has not disclosed the TDP value for the AI 365 variant yet. That said, going by synthetic benchmark scores, the Ryzen AI 9 365 variant will likely be roughly 20% and 10% slower in CPU and GPU performance respectively than the Ryzen AI HX 370 variant.

The market for gaming handhelds has been expanding at an unprecedented rate, largely thanks to the impressive performance and efficiency improvements brought to the table by modern APUs. AMD's Strix Point APUs are no exception, and are expected to power a multitude of high-end handhelds. Thanks to its 12 (4 Zen 5 + 8 Zen 5c) cores and RDNA 3.5-based Radeon 890M iGPU, the Ryzen AI 9 HX 370 is an impressive performer for sure. The chip can already be found in a plethora of gaming-oriented handhelds and laptops, and now a fresh offering from AOKZOE is poised to join the list.

Of course, AOKZOE is not nearly as well known as some of its competitors, such as GPD and Minisforum. AOKZOE has revealed only a single image for the product so far, and the differences between the A1, A1 Pro, and A1 X are expected to be minimal, at least on the outside. The company has revealed that the handheld will sport the aforementioned Strix Point flagship APU, along with an 8-inch display with a refresh rate of 120 Hz and a 72.7 Wh battery. These specifications are nothing extraordinary nowadays, and further details regarding the product, such as thermal performance, display quality, battery life, and the like can only be established with proper hands-on reviews. There are is no information on pricing or availability as of now, and more such details should become available as we inch closer to the A1 X's release.

The market for compact gaming handheld is expanding at an unprecedented rate, thanks to the popularity boom that handhelds have received in recent months. The GPD Win Min (2025) is one such offering, sitting alongside the rest of interesting gaming products that GPD is known for. The Win Mini is now available for pre-order on Indiegogo, with a starting price of $769 (backers only), and a retail price of $839. Of course, interested buyers are encouraged to be mindful of the risks associated with crowdfunding campaigns, although GPD has mostly had a complaint-free track record.

Unfortunately, and rather unsurprisingly, the entry-level variant does not ship with the latest AMD Strix Point chips, but rather the older Hawk Point offerings, specifically the Ryzen 7 8840U with the Radeon 780M iGPU with 12 CUs. The higher-tier variants ship with Strix Point APUs, starting at the Ryzen AI 9 HX 365 APU, going all the way up to the 12-core Ryzen AI 9 HX 370 with the powerful Radeon 890M iGPU. To accommodate the new APUs, GPD has reworked the thermals, and has added room for full-sized M.2 2280 SSD drives as well. The product packs hall-effect joysticks, plug-and-play grips, and a bunch of useful ports including USB4, USB 3.2 Type-C, an SD Card slot, an audio jack, as well as a good old USB-A port. The 7-inch 1080p display ramps up to 120 Hz, and the system can be equipped with up to 64 GB of memory and 2 TB of PCIe 4.0 storage, and a 44.24 Wh battery is also present.

At CES, AMD unleashed the much awaited Ryzen AI Max "Strix Halo" APUs with mammoth iGPUs, up to a whopping 40 CUs for the Radeon 8060S. These chips are powerful enough to not require discrete graphics at all, making them ideal for mini PCs, which lack the physical room for dedicated graphics. GMK appears to be among the first to announce a mini PC with the top-end Ryzen AI Max+ 395 APU, although any further details are under wraps as of now.

Unlike the Strix Point parts, Strix Halo abandons the smaller and more efficient Zen 5c cores for a Zen 5-only setup, with up to 16 Zen 5 cores for the highest-end Ryzen AI Max+ 395 SKU. This allows for some serious performance potential, with AMD promising substantially better performance than both Intel's Lunar Lake and Apple's M4 Pro, although it would be much fairer to compare Strix Halo to Apple's M4 Max, and Intel's Arrow Lake-H/X instead. Regardless, there is no denying Strix Halo APUs open up new doors in terms of performance for compact systems, the rest remains to be seen as and when the products reach reviewers.