AMD succeeded in delivering on its backwards-compatibility promise for the 3rd generation Ryzen processors on motherboards based on AMD 300-series and 400-series chipsets. This promise was very close to being derailed suggests a community thread on MSI forums. According to MSI representatives active on the forum, the capacity of the SPI flash EEPROM chip that stores the motherboard UEFI firmware is woefully limited to cram in the AGESA ComboAM4 1.0.0.3a microcode on many of its motherboards.

The company had to make several changes to its UEFI BIOS package that's currently being circulated as a "beta," to accommodate support for 3rd generation Ryzen processors along with AGESA ComboAM4 1.0.0.3a. First, it had to kick out support for A-series and Athlon processors based on the 28 nm "Bristol Ridge" silicon. Second, it had to [and this is a big one], kick the RAID module, breaking SATA RAID on many of its motherboards. Third, it had to replace its feature-rich Click BIOS 5 setup program with a barebones "GSE Lite" Click BIOS program, which lacks many of the features of the original program, and comes with a dull, low-resolution UI. This program still includes some essential MSI-exclusive features such as A-XMP (which translates Intel XMP profiles to AMD-compatible settings), Smart Fan, and M-Flash.

MSI mid-March began quietly rolling out BIOS updates for its socket AM4 motherboards based on AMD 400-series chipset, with a very ominous BIOS change-log entry: "Support new upcoming AMD CPU." At first, we dismissed this for being the company's follow-up to its 6th March announcement of support for some of the newer Athlon processor models, namely the 220GE and 240GE. After updating our MSI B450 Gaming Pro Carbon AC with one of these BIOSes, however, we discovered a very interesting microcode string - AGESA COMBO-AM4 0.0.7.2.

Such a major change in AGESA shouldn't be warranted to add support for two new chips based on existing "Raven Ridge" architecture that both AGESA "Summit Ridge" and AGESA PiR (Pinnacle Ridge) series microcodes should be able to comfortably run. We spoke with sources familiar with AMD microcode, who revealed that this AGESA COMBO-AM4 0.0.7.2 is designed for the upcoming "Zen 2" microarchitecture, and its first socket AM4 implementation, codenamed "Matisse." AMD internal versions of AGESA with Matisse support begin with the version sequence 0.0.7.x., and as we head closer to formal launch of these chips, AMD could release a 1.0.0.0 version of "AGESA COMBO-AM4." For our B450 Gaming Pro Carbon AC, the BIOS version packing this new AGESA is v1.60, and we wager this board should now be able to run Ryzen "Matisse" engineering samples. Now, if we can only get our hands on one.

AMD's "Polaris 30" silicon at the heart of Radeon RX 590 graphics card is the company's first 12 nm GPU. Unlike NVIDIA, which is exclusively sourcing its "Turing" family of GPUs from TSMC, the "Polaris 30" is coming from not one, but two sources. This, according to AMD in response to a question by TechPowerUp. The two foundries manufacturing "Polaris 30" are GlobalFoundries and Samsung. AMD did not provide us with visual cues on how to tell chips made from either foundries apart (such as serial numbering schemes). Packaging of dies sourced from both foundries is done in China, and the national-origin marking for the chip is on the package, rather than printed on the die.

GlobalFoundries' 12 nanometer FinFET node, called GloFo 12LP, shares a lot of similarities with Samsung's 11LPP, because both are "nodelets" that are derived from an original 14 nm FinFET process blueprint Samsung licensed to GloFo, deployed in its facility in upstate New York, where AMD's "Zen" processors are made. GloFo's 12 nanometer process is a refinement of its 14 nm node, in which 12 nm transistors are etched onto silicon using the same lithography meant for 14 nm. It doesn't improve transistor densities, but provides dividends in power, which explains why "Polaris 30" and "Pinnacle Ridge" have the same die sizes as "Polaris 20" and "Summit Ridge," respectively. This WikiChip article provides a good explanation of how GloFo 12LP is a nodelet.

With its 9th generation Core processors, Intel is re-introducing soldered IHS (integrated heatspreaders), at least in its top two premium models, the Core i9-9900K, and the Core i7-9700K. Intel refers to this feature as STIM (soldered thermal interface material). AMD implements soldered IHS across its Ryzen "Summit Ridge," "Pinnacle Ridge," and Threadripper families. XFastest took apart an i9-9900K to confirm that Intel is indeed using solder. Soldered IHS is generally preferred for better heat-transfer characteristics, compared to fluid TIMs. The use of fluid TIMs prompts some serious enthusiasts to even "de-lid" (run their processors without the IHS).

The 8-core "Whiskey Lake-S" die could be around 178 mm² in area, with the addition of two more cores, and 4.5 MB more cache (L2 + L3), over its predecessor. You'll recall that the 6-core "Coffee Lake" die measures 150 mm², a 25 mm² gain over the 4-core "Kaby Lake" die. We aren't expecting Intel to change the iGPU or uncore components. Intel is building these dies on the same 14 nm++ silicon fabrication node as "Coffee Lake," with the only architectural difference being silicon-level hardening against certain security vulnerabilities.

AMD today announced the B450 motherboard chipset for socket AM4 processors and APUs. Positioned as the mid-range option from AMD's 400-series chipset family, the B450 will power motherboards priced anywhere between $70 to $160, and packs certain high-end features that could let you save money over choosing pricier X470-powered boards. To begin with, the B450, like the X470, has a lower TDP and power-draw, so it runs cooler, and can make do with lighter heatsinks. It comes with slightly improved reference CPU VRM and memory wiring specifications that AMD introduced with the X470. The B450, like the X470, also supports XFR 2 "Enhanced" and Precision Boost Overdrive (that lets you tinker with boost frequencies without arbitrarily setting a high clock speed).

The B450 is recommended by AMD for both Ryzen 5 series and Ryzen 7 series, provided you don't need multi-GPU, as motherboards based on B450 aren't allowed to have PEG lane bifurcation. You still get multiplier-unlocked CPU overclocking support (something the competing Intel B360 platform lacks), as well as memory overclocking. The B450 packs out of the box support for AMD StoreMI, a storage virtualization feature that stripes a portion of your memory, your fast SSD, and slower HDD, into a single volume, and juggles hot data in and out of the faster media in the background. You can have any brand of drives to use StoreMI. B350 motherboards support StoreMI through BIOS updates.

Colorful is designing its first socket AM4 motherboards, according to industry sources. The company will release its first socket AM4 motherboards after the 2018 Computex Expo (June). These boards will be based on AMD 400-series chipsets, and will come with out of the box support for Ryzen "Pinnacle Ridge" processors, Ryzen "Raven Ridge" APUs, and existing Ryzen "Summit Ridge" processors. Taking advantage of PCI-Express gen 3.0 general-purpose connectivity of the 400-series chipset, the boards will feature multiple 32 Gbps NVMe interfaces (M.2 or U.2). It's possible that the company could attach its coveted iGame Vulcan brand to some of these models. The company currently only sells motherboards for Intel platforms. Its lineup includes motherboards based on Intel Z370 and X299 chipsets, including crypto-currency miner-centric boards based on lesser Intel chipsets, such as the B250. AMD is expected to debut its 400-series chipset alongside its 2nd generation Ryzen "Pinnacle Ridge" processors, in Q2-2018.

ASRock today announced that it has posted motherboard BIOS updates for its socket AM4 motherboard product lineup, which enables support for AMD Ryzen 3 2200G and Ryzen 5 2400G APUs based on the "Raven Ridge" silicon. The company posted BIOS updates for all 18 of its AM4 motherboard models, based on AMD X370, B350, and A320 chipsets. To get your BIOS update, visit the downloads section of the product page of your motherboard model on ASRock company website.

In related news, it looks like AMD has standardized a new label for use by motherboard manufacturers on their product boxes to denote out of the box support for AMD Ryzen 2000 series processors, on newer batches of their AMD 300-series chipset motherboards. Motherboards without this label likely won't support chips such as the 2200G or 2400G out of the box, and will require a BIOS update using a supported Ryzen "Summit Ridge" processor first. Motherboards based on the upcoming AMD 400-series chipsets, which should launch in Q2-2018, will support "Raven Ridge" and upcoming "Pinnacle Ridge" processors out of the box, including backwards-compatibility for existing "Summit Ridge" processors.

There is more clarity on when AMD plans to launch its 2nd generation Ryzen "Pinnacle Ridge" processors, along with companion 400-series chipsets. Retailers in Japan, citing upstream suppliers, expect AMD to launch Ryzen # 2000-series (or "Ryzen 2") processors in March 2018, along with two motherboard chipset models, the top-tier AMD X470, and the mid-range AMD B450. An older report pegged this launch at February. The two chipsets are differentiated from their current-generation 300-series counterparts in featuring PCI-Express gen 3.0 general purpose lanes. The "Pinnacle Ridge" processors, on the other hand, are expected to be optical-shrinks of current Ryzen "Summit Ridge" silicon to the new 12 nm silicon fabrication process, which will allow AMD to increase clock speeds with minimal impact on power-draw.

AMD Ryzen 2 "Pinnacle Ridge" processors will be built in the existing socket AM4 package, and are expected to be compatible with existing socket AM4 motherboards, subject to BIOS updates by motherboard manufacturers. AMD plans to nurture the socket AM4 ecosystem till 2020. Future motherboards based on AMD 400-series chipsets could also feature compatibility with existing "Summit Ridge" Ryzen processors. These motherboards will come with out of the box support for Ryzen "Raven Ridge" APUs, something that requires BIOS updates on current 300-series chipset motherboards.

AMD, in an interview with Overclockers UK (OCUK), confirmed that its second-generation Ryzen desktop processors will support the existing AM4 socket, so current Ryzen platform users can seamlessly upgrade to the new processors, with a BIOS update. Most current AM4 socket motherboards will require BIOS updates to support Ryzen "Raven Ridge" desktop APUs, and Ryzen "Pinnacle Ridge" CPUs, as the two require an update to the latest AGESA 1.0.0.7 version. In the interview, AMD representative James Prior confirmed that the company plans to keep AM4 its mainstream-desktop processor socket all the way up to 2020, which means at least another two to three generations of processors for it.

The next generation is "Pinnacle Ridge," which is rumored to be an optical-shrink of the "Summit Ridge" silicon to the 12 nm process, enabling higher clock speeds. The decision to keep AM4 doesn't mean the company's 300-series chipset will be made to stretch over 3 years. The company could release newer chipsets, particularly to address 300-series chipset's main shortcoming, just 6-8 older PCI-Express gen 2.0 general purpose lanes (while Intel chipsets put out up to 24 gen 3.0 lanes).

Intel's 8th generation Core "Coffee Lake" 6-core processors aim to restore the company's competitiveness in the mainstream-desktop (MSDT) platform, which eroded to AMD's unexpectedly successful Ryzen. The chips will hit the stores a little later this month, at price-points very close to the outgoing 7th generation Core "Kaby Lake" processors; although a report by SweClockers predicts that the chips will be scarcely available until early-2018.

Intel is launching "Coffee Lake" desktop processor family with a rather trimmed down lineup of six SKUs, two each under the Core i7, Core i5, and Core i3 brands, with the former two being 6-core, and the Core i3 being quad-core, marking an increase in core-counts across the board. While these chips will very much be available on launch-date in the retail channel, there could be an inventory shortage running all the way till Q1-2018.

A recent AMD roadmap leak showed the company's "tick", process-improved plans for 2018's Zen+, as well as its painter-imbued aspirations with Zen 2 in 2019. Now, there's some new info posted by DigiTimes that's being sourced straight from motherboard makers that points to the company's Pinnacle Ridge launch being set sometime in February 2018.

This information seems to have been delivered to the motherboard makers straight from AMD itself, as a heads-up for when they should be expecting to ramp up production of next-generation chipsets. Sources report that AMD will follow their Summit Ridge, Ryzen launch, with the initial release of Pinnacle 7 in February, followed by the mid-range Pinnacle 5 and entry-level Pinnacle 3 processors in March 2018. DigiTimes also reports that AMD is expecting to see its share of the desktop CPU market return to at least 30% in the first half of 2018 which, coeteris paribus, is more of a simple mathematical progression than clarvoyance.

AMD's Zen-based Ryzen and Threadripper have been said by the company as representing the "worst case scenario" of performance for their architecture. This is based on the fact that there are clear areas for improvement that AMD's engineers were keenly aware of even at the moment of Zen's tapping-out; inadvertently, some features or improvements were left on the chopping block due to time and budget constraints. As unfortunate as this is - who wouldn't love to have even more performance on their AMD processors - this also means AMD has a clear starting point in terms of improving performance of their Zen micro-architecture.

Spanish website Informatica Cero have gotten their hands on what they say is an exclusive, real piece of information from inside AMD, which shows the company's CPU roadmap until 2019, bringing some new details with it. On the desktop side, there's mention of AMD's "Pinacle Ridge" as succeeding the current Zen-based "Summit Ridge" Ryzen CPUs in 2018. These leverage the same Summit Ridge architecture, but with a performance uplift; this plays well into those reports of 12 nm being used to manufacture the second-generation Ryzen: it's an AMD tick, so to say. As such, the performance uplift likely comes from increased frequencies at the same power envelope, due to 12 nm's denser manufacturing design.

AMD's third Ryzen Threadripper series HEDT processor SKU, the Threadripper 1900X, started selling in India, ahead of its 31st August scheduled availability. Listed on the country's leading online PC hardware store PrimeABGB, the Threadripper 1900X is priced at INR 45,699. While this price roughly converts to USD $715, which is way above the $549 MSRP announced by AMD, it's important to note that in India the retailer margins and taxes on PC hardware tend to be very high. The same retailer, considered by PC enthusiasts in India as having some of the lowest prices, lists the Threadripper 1920X at INR 65,488 ($1,024), and the Threadripper 1950X at INR 82,008 ($1,283).

The PrimeABGB listing also indicates that the 8-core/16-thread Threadripper 1900X features 16 MB of L3 cache, as opposed to 32 MB on the 1920X and 1950X. This could mean that AMD is configuring the two "Summit Ridge" dies on the 1900X in a 2+2+2+2 CCX configuration, with 4 MB of L3 cache per CCX, just like on the Ryzen 5 1400. The chip still features a quad-channel DDR4 memory interface, and 64-lane PCIe. It is priced between the $390 6-core/12-thread Core i7-7800X and $590 i7-7820X.

AMD, presenting at a HotChips talk, packed with VLSI gurus, defended its decision to make AMD EPYC enterprise processors in the socket SP3r2 package a multi-chip module (MCM) of four 8-core "Summit Ridge" dies, rather than building a monolithic 32-core die. For starters, it stressed on the benefits of a single kind of silicon, which it can use across its performance-desktop, high-end desktop, and enterprise product-stacks; which translates into higher yields. "Summit Ridge" is the only CPU silicon based on the "Zen" micro-architecture, with the company giving finishing touches to the second silicon, codenamed "Raven Ridge," which will power mobile and desktop APUs. AMD has to pick the best-performing dies out of a common bin. The top 5% dies go into powering the company's Ryzen Threadripper HEDT processors, and a higher percentile go into making EPYC.

The relatively smaller 8-core common die has an inherently higher yield than a larger chip due to the rule of inverse-exponential reduction in yield with increasing die-size. This, coupled with the R&D costs that would have gone into developing the hypothetical monolithic 32-core "Zen" based silicon, works out to a significant cost saving for the company. A 4-die/32-core MCM is 0.59X the cost of a hypothetical monolithic 32-core die, according to the company, which is a cost-saving that enables the company to aggressively price its products. The slide AMD used in its presentation also confirms that each 8-core "Summit Ridge" die features four external Infinity Fabric links, besides the one that connects the two CCX units with each other. On a 4-die EPYC MCM, three out of four of those external IF links wire out to the neighboring dies, and one link per die probably wires out to a neighboring socket on 2P machines.

AMD revealed that the pair of 8-core "Summit Ridge" dies that make up the Ryzen Threadripper multi-chip module are heavily binned. AMD hand-selects the top-5% highest performing "Summit Ridge" dies for Ryzen Threadripper manufacturing, which makes these chips of a higher grade than even what AMD sets aside for Ryzen 7-series socket AM4 chips.

AMD requires the highest grade "Summit Ridge" dies to use in Threadripper chips, to keep electrical leakage to the minimum, so the chips can run as cool as possible, with the least power-draw. Choosing the best dies could also ensure that Threadripper chips have the highest overclocking-headroom taking into account other electrical and thermal constraints. A 7-series chip such as the 1800X could still achieve higher clocks than a Threadripper chip, in that sense.

AMD built its Ryzen Threadripper HEDT (high-end desktop) processor as a multi-chip module (MCM) of two 8-core "Summit Ridge" dies, each with its own dual-channel memory controller, and PCI-Express interface. This is unlike the competing Core "Skylake-X" from Intel, which is a monolithic 18-core die with a quad-channel DDR4 interface and 44-lane PCIe on one die. AMD has devised some innovative methods of overcoming the latency issues inherent to an MCM arrangement like the Ryzen Threadripper, by tapping into its nUMA technology innovation.

To the hardware, four 8 GB DDR4 memory modules populating the four memory channels of a Ryzen Threadripper chip is seen as 16 GB controlled by each of the two "Summit Ridge" dies. To the software, it is a seamless block of 32 GB. Blindly interleaving the four 8 GB memory modules for four times the bandwidth of a single module isn't as straightforward as it is on the Core X, and is fraught with latency issues. A thread being processed by a core on die-A, having half of its memory allocation on memory controlled by a different die, is hit with latency. AMD is overcoming this by treating memory on a Ryzen Threadripper machine like a 2-socket machine, in which each socket has its own memory.

AMD today announced its Ryzen 3 series value desktop processors in the socket AM4 package. The lineup consists of the Ryzen 3 1200 priced at $109, and the faster Ryzen 3 1300X priced at $129; and compete with Intel Core i3 dual-core SKUs, such as the i3-7100 and the i3-7300, respectively. What AMD has going for these chips is that they are quad-core, even if they lack SMT featured on Ryzen 5 series quad-core parts. Both are endowed with 8 MB of shared L3 cache, and unlocked base-clock multipliers.

The Ryzen 3 1200 is clocked at 3.10 GHz, with 3.40 GHz boost, and XFR (extended frequency range) adding another 50 MHz; while the Ryzen 3 1300X is clocked at 3.40 GHz, with 3.70 GHz boost, and XFR adding a further 200 MHz. In most scenarios, the chip should boost up to 3.90 GHz. AMD carved the two Ryzen 3 series parts out of its 14 nm "Summit Ridge" silicon, by disabling two cores and 4 MB L3 cache per CCX, resulting in 4 cores and 8 MB of total L3 cache. Both chips feature TDP ratings of 65W, and include AMD Wraith Stealth cooling solutions.

NVIDIA's GeForce 384 series drivers seem to have quite a few secrets, beginning with DirectX 12 API support on 5-plus year old GeForce "Fermi" GPUs, and now 4K Ultra HD support for Netflix UWP app without the need of new-generation CPUs (namely Intel "Kaby Lake," AMD "Summit Ridge," and AMD "Bristol Ridge."). The new-generation CPUs feature a host of hardware-level DRM features which the Netflix app needs to playback 4K Ultra HD content. The new GeForce 384 series drivers let you circumvent that requirement.

Reddit user aethervisor discovered that the Windows Store (UWP platform) app of Netflix could play back content at full 4K Ultra HD resolution on their machine with an older CPU and GeForce GTX 1080 graphics. New-generation CPUs had become a requirement for this to happen, besides the latest Windows 10 version, an HDCP 2.2-compliant 4K display (and no active secondary displays that don't satisfy HDCP 2.2), a powerful enough GPU, and either the UWP app or the Netflix website on Microsoft's Edge web-browser. NVIDIA struck down a big requirement that opens up Netflix 4K to a much wider user-base.

GIGABYTE introduced the AB350N-Gaming WiFi, its first socket AM4 motherboard in the mini-ITX form-factor, with support for the entire Ryzen "Summit Ridge" processor family, the 7th generation "Bristol Ridge" A-series APUs, and the upcoming Ryzen "Raven Ridge" APUs. The board draws power from a combination of 24-pin ATX and 8-pin EPS power connectors, and conditions it for the AM4 SoC with a 6-phase VRM. The motherboard is based on AMD B350 chipset.

The AM4 SoC is wired to two DDR4 DIMM slots, supporting up to 32 GB of dual-channel memory, the lone PCI-Express 3.0 x16 slot, a 32 Gb/s M.2 slot on the reverse side of the PCB, two out of four of the board's SATA 6 Gb/s ports, and two out of six of the board's USB 3.0 ports. Other USB connectivity includes two USB 3.0 ports from the B350 chipset, and two 10 Gb/s USB 3.1 ports (both type-A). Networking includes a WLAN card with 802.11ac WiFi, and Bluetooth 4.2, and gigabit Ethernet. 8-channel HD audio driven by a 120 dBA SNR CODEC makes for the rest of it. The company didn't reveal pricing.

AMD today posted an updated compatibility list of DDR4 memory kits for Ryzen processors. While just about any DDR4 memory kit will run on socket AM4 motherboards, a limited few have been tested by AMD to run reliably at speeds such as DDR4-3200, DDR4-2933, DDR4-2667, and DDR4-2400. AMD's new compatibility list contains a wider selection of DDR4 memory modules that have been tested by AMD to work reliably on Ryzen processors.

To make the most of these modules, however, AMD asks you to look out for and install motherboard BIOS updates which contain the AGESA 1.0.0.6 micro-code update. This should be prominently displayed in the change-logs of BIOS updates from motherboard manufacturers, and the latest batches of motherboards should come with AGESA 1.0.0.6 pre-installed.The revised DDR4 compatibility list can be accessed here.

AMD is readying a new stepping of its 14 nm "Summit Ridge" eight-core CPU silicon, which powers its socket AM4 Ryzen processors, according to Canard PC. The new B2 stepping reportedly addresses a lot of hardware-level errata which cannot be fixed merely by AGESA updates. According to Canard PC, the changes seem to be focused on the uncore components of "Summit Ridge." Typically, uncore refers to the integrated northbridge, which includes components such as the memory controllers, PCI-Express root complex, etc.

If the B2 stepping is mostly focused on uncore-level errata, it could mean improved PCI-Express device support, and perhaps even memory support improvements beyond even what AGESA 1.0.0.6 brings to the table. Canard PC reports that it hasn't come across any CPU core-specific errata being addressed with the B2 stepping. The glaring FMA3-related bug has been patched through BIOS updates, and most newer batches of socket AM4 motherboards come with the patch pre-installed.

AMD Ryzen Threadripper is a really big processor, and here's what its underside looks like. A multi-chip module (MCM) of two eight-core "Summit Ridge" dies, it is also AMD's first client-segment processor to feature a land-grid array (LGA) socket interface, since the decade-old Athlon64 FX 72; with the pins being located on the motherboard, and contact-points on the CPU package. Until now, AMD has limited large LGA sockets to its enterprise processors. The processor is based on the 4,094-pin socket SP3r2, which is increasingly being referred to by motherboard and cooler manufacturers as "TR4."

Given that it is an MCM of two dies, you can see a clear dividing line between two groups of the contact points that make up the total pin count of 4,094 pins. There are also two distinct ancillary cutouts which holds critical electrical components for the dies above. Something like this is lacking on the socket AM4 Ryzen "Summit Ridge" processors, where the cutout is blank, and the ancillaries are located around the CPU die, on the other side of the fiberglass substrate. AMD Ryzen Threadripper could be available from 27 July.

AMD recently cut the price of its current flagship desktop processor Ryzen 7 1800X from its USD $499 launch price to $469. At the time, it left prices of the Ryzen 7 1700 and Ryzen 7 1700X untouched. It looks like the two received small price-cuts as well. The Ryzen 7 1700X is now priced at $349 in leading online stores, down from its launch price of $399. The Ryzen 7 1700 (non-X), on the other hand, is now selling for $319, down from its launch price of $329. The two cuts may seem minor, but could help AMD turn up the heat against Intel's Core i7-7700K and its upcoming "Kaby Lake-X" Core i7-7740X and i5-7640X.

Based on the 14 nm "Summit Ridge" silicon, the Ryzen 7 1700 and 1700X are eight-core processors. The 1700 ships with clock speeds of 3.00 GHz, with 3.70 GHz boost, while the 1700X ships with higher 3.40 GHz clocks, with 3.80 GHz boost, and XFR, which adds a further 200 MHz to the boost clock. The Ryzen 7 1700 includes an AMD Wraith Spire RGB cooling solution, while the 1700X lacks a stock cooling solution.Update 03/06: AMD reached out to us and commented that this is not an official price-change. It could be implemented by local retailers or distributors.

AMD, which announced its Ryzen Threadripper HEDT processor at its 2017 Computex show, closely followed by certain motherboard manufacturers' unveiling of their compatible AMD X399 chipset motherboards; is readying nine SKUs based on the dual "Summit Ridge" MCM. This includes 10-core (3+2+3+2), 12-core (3+3+3+3), 14-core (4+3+4+3), and 16-core (4+4+4+4) models, all of which have SMT enabled, resulting in 20, 24, 28, and 32 threads, respectively; full 64-lane PCI-Express gen 3.0 root-complexes; and full quad-channel DDR4 memory interfaces. Some of these models with the "X" brand extension feature XFR (extended frequency range), which adds 200 MHz to the boost clock, if the cooling is sufficient.

The lineup is led by the 16-core/32-thread Ryzen Threadripper 1998X, with a healthy clock speed of 3.50 GHz, and 3.90 GHz boost, a TDP of 155W, and XFR. This is closely followed by the 16-core/32-thread 1998, clocked lower, at 3.20 GHz with 3.60 GHz boost, 155W TDP, and lack of XFR. The 16-core chips are followed by 14-core models. The 14-core/28-thread Ryzen Threadripper 1977X ships with 3.50 GHz core clock speed, but 4.00 GHz boost, XFR, and the same 155W TDP as the 16-core parts. This is closely followed by the 14-core/28-thread 1977 (non-X), with lower clocks of 3.20 GHz core, 3.70 GHz boost, and again, the same 155W TDP.

At its Analyst Day follow-up conference call, AMD confirmed that the company could build a new generation of Ryzen processors on 14 nm (albeit refined 14 nm) process, before transitioning to "Zen2," which will be built on the 7 nm process. As the first "Zen" based products built on the 14 nm process, the Ryzen "Summit Ridge" processors are based on the current-generation 14 nm FinFET process. AMD hopes to tap into a more refined version of this process before moving on to "Zen 2."

This could indicate that AMD's next generation of Ryzen processors, likely the Ryzen # 2xxx series, could be minor incremental updates to the current product stack, likely in the form of higher clock speeds or better energy-efficiency facilitated by the refined 14 nm process, but nothing major in the way of micro-architecture. Assuming the current Ryzen product stack, which will be augmented by Ryzen 3 series, Ryzen Pro series, and Ryzen APUs in the second half of 2017; last till mid-2018, one could expect a follow-up or refreshed Ryzen # 2xxx series run up to another year, before AMD makes a "leapfrog" upgrade to the 7 nm process with "Zen2," in all likelihood, by 2019.