With the new VIA 15 Pro, SCHENKER has put together a unique overall package: The 1.45 kg ultrabook integrates AMD's efficient eight-core Ryzen 7 5700U, a 15.6 inch WQHD IPS display and two freely accessible and upgradeable M.2 SSD and RAM slots - a combination that is usually only found in significantly heavier gaming laptops with dedicated graphics cards. Unlike these, however, the VIA 15 Pro features AMD's energy-efficient, integrated Radeon graphics unit. With this outfit, the ultrabook is aimed at developers, programmers, and creative professionals, among others. The all-round office laptops SCHENKER WORK 15 and WORK 17 are also being updated with Intel's Alder Lake-P processors.

One of the most striking features of the SCHENKER VIA 15 Pro is a performance-enhanced AMD Ryzen 7 5700U with eight cores and 16 threads: instead of running the CPU with a TDP of 15 watts, which is common in the ultrabook sector, it can operate permanently at 35 watts in the highest performance profile ("enthusiast") - this way, it outperforms the majority of ULV processors and achieves a multi-score of 3937 points in Cinebench R20. The laptop's dual-fan cooling system was adopted from the 2020 predecessor model of the VIA 15 Pro, so it is designed for less efficient CPUs from the 54 watt TDP class and therefore guarantees superior and quiet cooling. Those who require somewhat less performance may select the medium performance profile ("balanced") for particularly quiet operation. Switching is possible in real time at the touch of a button via a keyboard shortcut.

Maxsun has recently announced the MS-Meterstone i7-11800H Plus motherboard with an integrated Intel 10 nm Tiger Lake-H mobile processor. The integrated 8 core, 16 thread Intel Core i7-11800H features a base clock speed of 2.3 GHz and a boost of 4.6 GHz with a 45 W TDP and 109 W boost. This motherboard is the second desktop platform to feature Intel 11th Gen Core mobile processors after the Intel NUC 11 Extreme with its higher power Intel Core i9-11900KB. The Maxsun MS-Milestone features a Micro-ATX design with the HM570 chipset and measures 245 mm x 190 mm.

The motherboard includes x16, x4, and x1 PCIe slots alongside dual PCIe M.2 slots for NVMe drives and a dedicated slot for an E-Key WiFi card. The two full-sized DDR4 DIMM slots support speeds of up to 2933 MHz with the potential for further overclocking. The board also includes a variety of connectivity options including x4 USB 3.2 Gen 1, x2 USB 2.0, x2 HDMI, x2 DisplayPort, PS2, and 2.5 GbE. The Maxsun MS-Milestone i7-11800H Plus is now available to purchase in China from online retailer JD for 2,899 Chinese Yuan (~450 USD).

Intel's upcoming lineup of mobile processors with the novel hybrid core technology are codenamed Alder Lake-P. Contrary to the desktop Alder Lake-S, the P variant was envisioned with a lower power budget in mind to fit various form factors. Today, we get to see some of the first benchmarks of the Alder Lake-P processors and get to compare them to AMD's competing products. In the Geekbench 5 listing discovered by BechLeaks, Intel's Core i7-12800H processor with six performance and eight efficiency cores appear. The CPU ran at a base frequency of 2.8 GHz, while Geekbench didn't show boosting clocks in the submission.

The CPU managed to score 1654 points in single-core results and 9618 points in multi-core runs. If we compare this to AMD Ryzen 7 5800H, a direct competitor, the CPU is faster by 25% and 35% in single-core and multi-core results, respectively. If the previous Tiger Lake-H generation is a reference, the Alder Lake-P chip manages 12% and 20% higher single-core and multi-core scores. This specific processor is part of the GIGABYTE AORUS 15 YE4 laptop used for the Geekbench 5 benchmark test run.

Razer, the leading global lifestyle brand for gamers, today announced the next generation of Razer Blade 17 gaming laptops, built-on the latest 11th Gen Intel Core H-series Processors and featuring up to the NVIDIA GeForce RTX 3080 Laptop GPU. Making a first-time debut in the Blade 17 is the Intel Core i9-11900H, the most powerful Intel processor ever found in a Razer Blade. With its many improvements, the new ultra-thin Blade 17 continues to be a powerhouse desktop replacement for gamers and creators alike.

With the inclusion of the i9-11900H processor, packed with eight cores and 16 threads, the Blade 17 reaches new levels of performance that were previously unheard of in an Intel-based Razer Blade. The CPU clocks in with a max turbo frequency of up to 4.90 GHz, meaning users can expect drastically improved speeds both in-game and in multi-threaded workloads. By pairing it with the NVIDIA GeForce RTX 3080 Laptop GPU and display options up to a 4k Touchscreen, Razer has created one of the most powerful 17-inch gaming laptops on the market.

The Beast Canyon NUC 11 Extreme is an upcoming small form factor PC from Intel featuring their latest Tiger Lake-H processors. The processors will be installed on new compute units with options for various Tiger Lake-H SKUs including Core i5, i7, and i9 models. The compute element will also include support for dual-channel DDR4 3200 MHz memory and three M.2 devices. The 8L NUC 11 Extreme enclosure will also feature support for full-length discrete GPUs. The connectivity options for the upcoming NUC include WiFi 6E, Bluetooth 5.2, 2.5/10 GbE, dual Thunderbolt 4 ports, and triple HDMI 2.0b connectors. Intel is expected to provide a "sneak peek" of the NUC 11 Extreme during COMPUTEX 2021.

The new Razer Blade 15 Advanced Model lineup continues to present the best gaming laptops on the market. Armed with the new 11th Gen Intel Core H-Series Processor up to an Intel Core i9, NVIDIA GeForce RTX 30-Series Laptop GPU, and the fastest available displays with up to 360Hz, the new Razer Blade 15 Advanced Model delivers ultimate power in a premium compact form factor. The RTX 3060 version stands at an impressive height of only 15.8 mm, making it the thinnest gaming laptop in the world with a GeForce RTX 3060 Laptop GPU.

To ensure a smooth experience, the new Razer Blade 15 Advanced Model utilizes the latest PCIe Gen 4 configuration and is powered by DDR4 3200 MHz memory. The innovative M.2 design returns, with dual slots available on RTX 3070 versions and above, allowing users to easily expand the SSD according to their storage needs. Be it hardcore gaming or content creation, the Razer Blade 15 Advanced Model laptops are built to handle intensive usage and multitasking.

Alongside Intel's launch of the 11th Gen Core "Tiger Lake-H" desktop processor series, NVIDIA debuted its mid-range GeForce RTX 3050 Ti (mobile) and RTX 3050 (mobile) graphics processors. Both chips are designed with typical 3D power ranging between 35 W and 80 W. Both chips are based on the new 8 nm "GA107" silicon. This "Ampere" chip physically packs 2,560 CUDA cores across 20 streaming multiprocessors, with 80 tensor cores, 20 RT cores, and a 128-bit wide GDDR6 memory interface.

The GeForce RTX 3050 Ti (mobile) appears to be maxing out the GA107 silicon, featuring all 2,560 CUDA cores, 80 tensor cores, 20 RT cores, and 4 GB of GDDR6 memory across the chip's 128-bit wide memory bus. The RTX 3050 is slightly cut down, with 16 out of 20 SM enabled. This works out to 2,048 CUDA cores, 64 tensor cores, and 16 RT cores. The memory remains the same—4 GB GDDR6. Clock speeds will vary wildly depending on the notebook model, but typically, the RTX 3050 Ti can boost up to 1695 MHz, while the RTX 3050 can boost up to 1740 MHz. Both chips take advantage of PCI-Express 4.0 and Resizable BAR. The company didn't reveal memory clocks.

Ahead of its launch later this month, notebook OEMs are beginning to tease their upcoming gaming notebooks powered by 11th Gen Core "Tiger Lake-H" mobile processors that come in core counts of up to 8. ASUS will be hosting a media event tomorrow (May 11) launching its first "Tiger Lake-H" notebooks, which probably follows Intel's own public unveiling of the new processors. The teaser video to the ASUS event reveals at least two notebooks under the company's ROG Zephyrus brand, the Zephyrus S17, and the Zephyrus M16.

The M16 looks to be the more compact of the two, with styling characteristic of past generations of ROG Zephyrus notebooks. The lid-mounted LEDs now come in color. while the S17 is a whole different beast. The teasers reveal an elevated keyboard+touchscreen on the lower half of the clamshell. The gap between this elevation and the base probably opens up additional vents to cool the processor and GPU underneath. This could be the notebook from ASUS's lineup that uses the 65-Watt Core i9-11980HK, the 8-core/16-thread beast that can tick at speeds of 5.00 GHz.

Yesterday, we got information that Intel's upcoming DG2 discrete graphics card is "right around the corner". That means that we are inching closer to the launch of Intel's discrete GPU offerings, and we are going to get another major player in the current GPU market duopoly. Today, however, we are in luck because Igor from Igor's LAB has managed to get ahold of the specifications of Intel's Xe-HPG DG2 graphics card. For starters, it is important to note that DG2 GPU will first come to laptops later this year. More precisely, laptops powered by Alder Lake-P processors will get paired with DG2 discrete GPU in the second half of 2021. The CPU and GPU will connect using the PCIe 4.0 x12 link as shown in the diagram below, where the GPU is paired with the Tiger Lake-H processor. The GPU has its subsystem that handles the IO as well.

Intel's fabled 8-core "Tiger Lake-H" silicon built on the 10 nm SuperFin process, is close to reality. The company's upcoming 11th Gen Core "Tiger Lake-H" processors for performance- and gaming notebooks, leverages this die. An HD Tecnologia report leaks alleged company slides from Intel that detail the processor line up and feature-set. To begin with, the 11th Gen Core-H series processors come in core-counts ranging from 4-core/8-thread, to 6-core/12-thread, and 8-core/16-thread. Look at the embargo date on the leaked slides, one could expect a formal launch as close as May 11, 2021.

The 10 nm SuperFin "Tiger Lake-H" silicon features 8 "Willow Cove" CPU cores, and an updated iGPU based on the company's latest Gen12 Xe LP graphics architecture. Each of the eight CPU cores has 1.25 MB of L2 cache, and they share a massive 24 MB of L3 cache. The Gen12 Xe LP iGPU only has 32 execution units (EUs), according to the slides, 1/3rd those of the 96 EUs on the "Tiger Lake-U." The uncore component is also updated, now featuring dual-channel DDR4-3200 native support, and a 28-lane PCI-Express 4.0 root-complex. 16 of these lanes are wired out as PEG (PCI-Express Graphics), four as a CPU-attached NVMe slot, and eight toward the 8-lane DMI 3.0 chipset bus.

Intel is expected to unveil its 11th generation Core "Tiger Lake-H" performance-segment mobile processor, and the highly anticipated 11th Gen Core "Rocket Lake-S" desktop processor family on March 18, 2021. The two will be launched on the sidelines of the 2021 GDC (Game Developers Conference), an online event. The agenda page of GDC mentions both "Tiger Lake-H" and "Rocket Lake." The "Tiger Lake-H" family of processors begin with quad-core SKUs based on the 4-core "Tiger Lake" silicon, extending to 6-core and 8-core ones based on a newer 8-core silicon. Both dies are built on the 10 nm SuperFin node, and combine Intel's highest-IPC "Willow Cove" CPU cores with a Gen 12 Xe iGPU.

The 11th Gen Core "Rocket Lake-S" has been unveiled back at the 2021 International CES (online event) in January, and is heading toward a mid/late-March launch. The chips pack up to eight "Cypress Cove" CPU cores, which are a back-port of Intel's 10 nm CPU core architectures to the 14 nm node, bringing the first IPC increase on the client desktop platform from Intel since 2015. At GDC, we expect Intel to detail individual SKUs within the 11th Gen Core processor family, giving us a broader idea of what chips will launch this month. The GDC backdrop also foreshadows the marketing strategy for Intel with both these platforms—gaming. The company will take advantage of the IPC uplift to present its processors as being better for gaming, and sufficiently fast in most client-relevant tasks. The GDC backdrop could also let Intel show off the ISV relations it's built with game developers, detailing how certain popular game engines are optimized for Intel.

Intel's new 8-core "Tiger Lake" silicon will play a major role in holding the company's dominance in the mobile processor space, with plans for new 6-core and 8-core SKUs being in motion. OneRaichu on Twitter, a reliable source with Intel leaks, points to several unreleased model numbers. The 8-core "Tiger Lake-H" die is expected to be built on the same 10 nm SuperFin process as the "Tiger Lake-U" silicon. The lineup is led by the Core i9-11980HK, an 8-core/16-thread processor that uses eight "Willow Cove" CPU cores, 2.60 GHz nominal- and 5.00 GHz max-Turbo frequency, and 3.30 GHz AVX512 frequency. This chip will be in a class of its own, as its TDP is rated at 65 W, significantly above the 35-45 W TDP range that constitutes the H-segment. It will likely power large gaming notebooks with elaborate cooling solutions. It will also come with an unlocked base-clock multiplier.

The Core i9-11900H is the next chip in the lineup, with slightly lower clock speeds of 2.50 GHz base, 4.90 GHz max-Turbo, and 2.10 GHz AVX512. This chip features a much lower 35 W TDP, and will come with aggressive power management compared to the i9-11980HK. The Core i7-11800H will be the slowest 8-core part, with clock speeds of 2.40 GHz nominal, 4.60 GHz max-Turbo, and 2.00 GHz AVX512. It comes with the same 35 W TDP as the i9-11900H. Next up, are 6-core/12-thread parts, likely under the Core i5 brand. These include the i5-11400H, clocked at 2.70 GHz nominal, 4.50 GHz max-Turbo, and 2.20 GHz AVX512. At the bottom of the pile is the i5-11260H, clocked at 2.60 GHz, with 4.40 GHz max-Turbo, and 2.10 GHz AVX512. Both Core i5 parts are 35-Watt.

Intel announced their 11th Generation Tiger Lake-H processors for high-end gaming laptops at CES 2021. The three models announced are now shipping in slim gaming machines and target the AMD Ryzen 5000H series processors. The Intel models compete favorably in single-core performance but only feature four cores and eight threads while the Ryzen 5000H series processors include up to 8 cores and 16 threads giving them the clear advantage in multi-core performance.

Intel is planning to close this performance gap with the launch of three new 45 W 8 core 11th Generation H-series processors in Q2 2021 with a possible announcement at Computex. The three models include the unlocked Core i9-11980HK, Core i9-11900H, and the Core i7-11800H along with the Core i5-11400H with six cores. These new processors will compete directly with the Ryzen 9 5980HX, Ryzen 9 5900H, and Ryzen 7 5800H with the Core i9-11980HK likely to feature a boost clock of 5 GHz on multiple cores.

Intel at its recent 2021 International CES call confirmed the existence of an 8-core version of its 11th Gen Core "Tiger Lake" processor, and held the chip for the camera. The visibly bigger chip will be slated in Intel's H-segment (35 W to 45 W TDP), meaning it will only power gaming notebooks and mobile workstations; while the mainstream mobility segment will still be in the hands of its 4-core "Tiger Lake-H35" silicon. The 8-core "Tiger Lake-H" processor will also receive reasonably high clock-speeds, boosting up to 5.00 GHz.

Assuming the cache hierarchy and uncore/iGPU setup is unchanged between the 8-core and 4-core dies, we're looking at 24 MB of shared L3 cache, and 1.25 MB of dedicated L2 cache per core. These alone take up a big slice of the die-area. Add to this, the uncore features a PCI-Express Gen 4 root-complex and memory controllers that support dual-channel DDR4 and LPDDR4x memory types. The iGPU is expected to be based on the same Gen12 Xe-LP architecture as the 4-core die; although its execution unit count remains to be seen. In all likelihood, the 8-core "Tiger Lake-H" silicon is based on the same 10 nm SuperFin node.

Semiconductor manufacturing is not an easy feat to achieve. Especially if you are constantly chasing the smaller and smaller node. Intel knows this the best. The company has had a smooth transition from other nodes to the smaller ones until the 10 nm node came up. It has brought Intel years of additional delay and tons of cost improving the yields of a node that was seeming broken. Yesterday the company announced the new Tiger Lake-H processors for laptops that are built using the 10 nm process, however, we are questioning whatever Intel can keep up with the semiconductor industry and deliver the newest nodes on time, and with ease. During an interview with Intel's CEO Bob Swan, we can get a glimpse of Intel's plans for the future of semiconductors at the company.

In the interview, Mr. Swan has spoken about the technical side of Intel and how the company plans to utilize its Fabs. The first question everyone was wondering was about the state of 10 nm. The node is doing well as three Fabs are ramping up capacity every day, and more products are expected to arrive on that node. Mr. Swan has also talked about outsourcing chip production, to which he responded by outlining the advantage Intel has with its Fabs. He said that outsourcing is what is giving us shortages like AMD and NVIDIA experience, and Intel had much less problems. Additionally, Mr. Swan was asked about the feasibility of new node development. To that, he responded that there is a possibility that Intel could license its competitor's node and produce it in their Fabs.

Hey, we're live from Intel's Event at CES. We expect to hear about Rocket Lake, and possibly get a glimpse into the future beyond that.

More and more people continue to turn to gaming for entertainment, escape, and socializing with friends & family. This has lead to unprecedented demand for enthusiast level gaming laptops. This growing demographic demands a design language that addresses their need for a sleek lifestyle device for work, school, everyday tasks AND gaming. The 11th Gen Intel Core H Series Processors for Ultraportable Gaming builds on the best of what our 11th Gen Intel Core U-series processors have already delivered, adds more performance to enable this new class of Ultraportable Gaming systems.

Intel's return to discrete gaming GPUs may have had a modest beginning with the Iris Xe MAX, but the company is looking to take a real stab at the gaming market. Driver code from the latest 100.9126 graphics driver, and OEM data-sheets pieced together by VideoCardz, reveal that its next attempt will be substantially bigger. Called "DG2," and based on the Xe-HPG graphics architecture, a derivative of Xe targeting gaming graphics, the new GPU allegedly features 512 Xe execution units. To put this number into perspective, the Iris Xe MAX features 96, as does the Iris Xe iGPU found in Intel's "Tiger Lake" mobile processors. The upcoming 11th Gen Core "Rocket Lake-S" is rumored to have a Xe-based iGPU with 48. Subject to comparable clock speeds, this alone amounts to a roughly 5x compute power uplift over DG1, 10x over the "Rocket Lake-S" iGPU. 512 EUs convert to 4,096 programmable shaders.

A leaked OEM data-sheet referencing the DG2 also mentions a rather contemporary video memory setup, with 8 GB of GDDR6 memory. While the Iris Xe MAX is built on Intel's homebrew 10 nm SuperFin node, Intel announced that its Xe-HPG chips will use third-party foundries. With these specs, Intel potentially has a GPU to target competitive e-sports gaming (where the money is). Sponsorship of major e-sports clans could help with the popularity of Intel Graphics. With enough beans on the pole, Intel could finally invest in scaling up the architecture to even higher client graphics market segments. As for availability, VideoCardz predicts a launch roughly coinciding with that of Intel's "Tiger Lake-H" mobile processor series, possibly slated for mid-2021.

Intel has launched its Tiger Lake-U lineup of products back in September, with the availability of the first products in October. The launched lineup was part of the "U" variant of ultra-portable devices that stretched only to four core, eight threaded configurations. However, given that the new competitor in mobile space, AMD, has a wide portfolio of offerings that are coming with up to 8C/16T variants, Intel needs a proper response to that. Despite having a better single-threaded performance, the multi-threaded capability of the Ryzen 4000 series is delivering better performance. Thanks to the popular hardware leaker, TUM APISAK, we have the first appearance of Intel's 11th generation Tiger Lake-H processor.

Appearing in Userbenchmark, the processor was tested on a platform codenamed "Insyde TigerLake". The processor was spotted running 8 cores and 16 threads, at the average frequency of 2.75 GHz. This is only an engineering sample, meaning that these clocks do not represent the final frequencies of the processor. As a reminder, Intel's Tiger Lake CPU is a Willow Cove based design manufactured on Intel's 10 nm SuperFin silicon node. We are yet to see the capabilities of the new node and how the chip performs once the reviews arrive.

Intel's Corporate Vice President of Client Computing Group Boyd Phelps posted an article on medium where he confirms development of 8-core Tiger Lake-based CPU solutions, to be released during the year 2021. This was confirmed by Boyd saying that 8-core Tiger Lake CPUs would have access to 24 MB of LLC cache (adequately doubling the 12 MB available for 4-core Tiger Lake-U parts that we already know about); Boyd then simply added in parentheticals "more detail on 8-core products at a later date".

The 8-core processors will be part of the Tiger Lake-H product stack, which, according to a leaker on PTT Shopping, would scale between the 35 W-45 W TDPs with various core and GPU Execution Unit counts. The 45 W high-performance parts can feature between 4, 6, and 8-cores - but additional space taken up by the CPU cores is thus unavailable for GPU resources, which top out at 32 Intel Xe EUs (and will make use of a BGA1787 socket). The 35 W variants, on the other hand, will be installed in the same socket as Tiger Lake-U - BGA 1449 - and reportedly only offer a 4-core design with 96 EUs.

Intel is preparing to launch an 8-core mobile processor based on its 10 nm "Tiger Lake" microarchitecture, according to a corporate memo by leading notebook OEM Compal, which serves major notebook brands such as Acer. The memo was drafted in May, but unearthed by momomo_us. Compal expects Intel to launch the 8-core "Tiger Lake-H" processor in Q1 2021. This is big, as it would be the first large 10 nm client-segment silicon that goes beyond 4 cores. The company's first 10 nm client silicon, "Ice Lake," as well as the "Tiger Lake-U" silicon that's right around the corner, feature up to 4 cores. As an H-segment part, the new 8-core processor could target TDPs in the range of 35-45 W, and notebooks in the "conventional thickness" form-factor, as well as premium gaming notebooks and mobile workstations.

The 8-core "Tiger Lake-H" silicon is the first real sign of Intel's 10 nm yields improving. Up until now, Intel confined 10 nm to the U- and Y-segments (15 W and below), addressing only ultra-portable form-factors. Even here, Intel launched U-segment 14 nm "Comet Lake" parts at competitive prices, to take the market demand off "Ice Lake-U." The H-segment has been exclusively held by "Comet Lake-H." Intel is planning to launch "Ice Lake-SP" Xeon processors later this year, but like all server parts, these are high-margin + low-volume parts. Compal says Intel will refresh the H-segment with a newer 8-core "Comet Lake-H" part in the second half of 2020, possibly to bolster the high-end against the likes of AMD's Ryzen 9 4900H. Later in 2021, Intel is expected to introduce its 10 nm "Alder Lake" processor, including a mobile variant. These processors will feature Hybrid technology, combining "Golden Cove" big CPU cores with "Gracemont" small ones.