xMEMS Shows New Cooling Solutions a Range of New MEMS based Speaker Drivers at CES 2025
xMEMS is a company that so far is best known for its MEMS—or microelectromechanical systems—based speaker drivers, but since around the middle of last year, the company has also developed a range of MEMS based cooling solutions. The xMEMS µCooling is competing with a range of new cooling solutions from several new companies and, although their current solution is unlikely to find its way into laptops today, the company has tested to cool hotter running chips using multiple MEMS µCooling modules to great success. The XMC-2400—also known as Sequoia—is the first product and it has an airflow of up to 35 cubic centimeters per second, which isn't a huge amount, but the cooler is said to be inaudible during operation and it also has the added benefit of being waterproof and the entire MEMS cooling module can be soldered in place. At an estimated power consumption of a mere 30 mW, it's also a very power efficient cooling solution. xMEMS had some demos at its booth, of which the one pictured below shows the XMC-2400 blowing or sucking air, with a small fan-wheel spinning to show the movement of the air. Another showcased the static pressure, pushing air through tubing and into a beaker filled with water. Potential applications include removing hot air from phones, although we may see some smaller SoCs getting cooled too.