Phison, a global leader in NAND controllers and storage solutions, is set to showcase its cutting-edge technologies at the Future of Memory and Storage (FMS) 2024. The event will highlight the new Pascari D-Series D200V, a datacenter SSD with up to 61.44 TB alongside the latest capabilities of aiDAPTIV+ Pro Suite, the company's end-to-end on-premises generative AI solution. Each solution is purpose-built to meet the demands of modern, data-intensive workloads, from small to medium-sized businesses looking to leverage GenAI through aiDAPTIV+, to enterprises scaling quickly with Pascari Data Center storage. These solutions allow users the necessary storage, scalability and processing power for data-hungry AI workloads.

The Pascari D200V is the latest addition to Phison's renowned D-Series product family. This SSD is designed for data centers and comes in the most popular form factors. "Pascari's new D200V scales to 61.44 TB today with Kioxia BiCS FLASH generation 8 QLC flash memory," says K.S. Pua, CEO of Phison Electronics. "The D-Series also allows room to scale beyond 100 TB, providing data centers with the large capacity options needed to reduce operating costs."

ScaleFlux, a leader in developing storage and memory technologies, marks its 10th anniversary by sampling its latest NVMe SSDs, the CSD5000 series. Purpose-built for the AI Era, CSD5000 is designed to alleviate bottlenecks in the AI/ML, Cloud, and Data Center computing infrastructure. Getting jobs on and off the GPUs and CPUs rapidly is crucial to reaching optimal utilization of the infrastructure for AI/ML, HPC, AI analytics, and cloud-native computing. "To enable high xPU utilization levels, the storage devices must be up to the tasks of reliably delivering massive amounts of data at blinding speeds and of rapidly and securely storing the checkpoints and outputs, all in a power-efficient manner - exactly what the CSD5000 was designed to do," said ScaleFlux CEO, Hao Zhong. Coinciding with the company's 10th anniversary, this release highlights a decade of remarkable achievements and sets the stage for an exciting future of continued growth and technological advancements.

Introducing the CSD5000: A New Chapter in SSD Storage
Built on the ScaleFlux FX5016 PCIe 5 SSD controller, the CSD5000 series sets a new bar for SSD performance, capacity density, efficiency, and feature set. Expanding upon the innovative write reduction technology and capacity expansion features from the previous generations of ScaleFlux drives, CSD5000 brings unrivaled capabilities to data storage.

Samsung has introduced its latest BM1743 SSD, boasting an impressive 61.44 TB of storage capacity. The BM1743 utilizes Samsung's seventh-generation 3D NAND (V-NAND) technology, featuring 176 layers of memory cells. This represents a significant leap from its predecessor, the BM1733, which debuted in 2020 with 96-layer technology and a maximum capacity of 32 TB. Performance-wise, the BM1743 doesn't disappoint. It delivers up to 1.6 million random read IOPS and 110,000 random write IOPS, with sequential read and write speeds of 7.2 GB/s and 2.0 GB/s, respectively. These figures position the drive as a highly capable solution for read-intensive workloads. Samsung claims that the new SSD offers double the sequential read and write speeds of its fifth-generation technology, with random reads quadrupling in performance. This advancement suggests that quad-level cell (QLC) SSDs are now approaching the performance levels of their triple-level cell (TLC) counterparts while offering superior storage density.

The BM1743 is available in the traditional U.2 form factor, with an E3.S variant supporting PCIe Gen 5 also in the lineup, thanks to the custom Samsung controller. Samsung has enhanced the durability and data retention capabilities of the BM1743. The new drive boasts an improved endurance rating of 0.26 drive writes per day (DWPD) throughout its warranty period, a notable increase from the BM1733's 0.18 DWPD. Additionally, the BM1743 extends its power-off data retention to three months, tripling the one-month period of its predecessor. In a hint of things to come, Samsung has suggested that a 122.88 TB model may be on the horizon, potentially doubling the capacity of the BM1743. This new offering puts Samsung in direct competition with Solidigm's D5-P5336, which has dominated the high-capacity SSD market for the past year. High-density storage solutions are becoming more important as AI and HPC tasks require and produce massive amounts of data.

The Minisforum MS-01 is a mini workstation with a sleek and portable design, rich ports and strong expansion capabilities. It has four M.2 slots and PCIE×16 slots inside, which can be used to install half-height graphics cards. Optional Intel 13th generation Core i9-13900H and other processors offering high cost performance.The efficient cooling design ensures optimal performance, meeting the needs of professional users in fields such as engineering, design, and programming.

At this year's product launch event, Minisforum showcased the MS-01 i9-12900H version, i9-13900H version, positioned as a mini workstation. As a potential competitor to the known brands, this new model impressed me with its dual 10-gigabit network ports and unparalleled expansion capabilities. Now the Minisforum MS-01 i5 version has finally been officially launched, provides users who have been struggling with the high prices of top brand mini workstations that are always lacking in expansion capabilities with a relatively affordable option.

Fueling the next wave of AI innovation, Western Digital today introduced a six-stage AI Data Cycle framework that defines the optimal storage mix for AI workloads at scale. This framework will help customers plan and develop advanced storage infrastructures to maximize their AI investments, improve efficiency, and reduce the total cost of ownership (TCO) of their AI workflows. AI models operate in a continuous loop of data consumption and generation - processing text, images, audio and video among other data types while simultaneously producing new unique data. As AI technologies become more advanced, data storage systems must deliver the capacity and performance to support the computational loads and speeds required for large, sophisticated models while managing immense volumes of data. Western Digital has strategically aligned its Flash and HDD product and technology roadmaps to the storage requirements of each critical stage of the cycle, and today introduced a new industry-leading, high-performance PCIe Gen 5 SSD to support AI training and inference; a high-capacity 64 TB SSD for fast AI data lakes; and the world's highest capacity ePMR, UltraSMR 32 TB HDD for cost-effective storage at scale.

"There's no doubt that Generative AI is the next transformational technology, and storage is a critical enabler. The implications for storage are expected to be significant as the role of storage, and access to data, influences the speed, efficiency and accuracy of AI Models, especially as larger and higher-quality data sets become more prevalent," said Ed Burns, Research Director at IDC. "As a leader in Flash and HDD, Western Digital has an opportunity to benefit in this growing AI landscape with its strong market position and broad portfolio, which meets a variety of needs within the different AI data cycle stages."

The subsidiary of MiTAC Holdings Corp, MiTAC Computing Technology and its server brand TYAN, the leading manufacturer in server platform design worldwide, unveil their new server systems and motherboards optimized for today's AI, HPC, cloud, and enterprise workloads at COMPUTEX 2024, Booth # M1120 in Taipei, Taiwan from June 4 to June 7. Harnessing the power of the latest Intel Xeon 6 processor and 4th and 5th Gen Intel Xeon Scalable processors, these solutions deliver cutting-edge performance.

"For over a decade, MiTAC has worked with Intel at the forefront of server technology innovation, consistently delivering cutting-edge solutions tailored for AI and high-performance computing (HPC). The integration of Intel's latest Xeon 6 processors into our MiTAC and TYAN server platforms transforms computational capabilities, significantly enhancing AI performance, boosting efficiency, and scaling cloud operations. These advancements empower our customers with a competitive edge through superior performance and optimized total cost of ownership," said Rick Hwang, President of MiTAC Computing Technology Corporation.

Phison Electronics, a leading provider of NAND controllers and storage solutions, today announced aiDAPTIV+ partnerships with ASUS, Gigabyte, MAINGEAR, and MediaTek. At GTC 2024, Phison and partners will demonstrate aiDAPTIV+, a hybrid hardware and software large language model (LLMs) fine-tune training solution that enables small and medium-sized businesses (SMBs) to process and retain local control of their sensitive machine learning (ML) data.

Foundational training of LLMs gives a broad understanding of language but aiDAPTIV+ enables the fine-tuning process that molds these models into specialized tools capable of understanding the topics that deliver precise results for your business needs. Commodity workstation hardware is enhanced with aiDAPTIV+ software, and first generation aiDAPTIVCache Series ai100 SSDs to enable larger training models than previously possible in a workstation form-factor.

KIOXIA brought a handful of its latest data center SSDs to the 2024 International CES. The lineup begins with the CD8P series designed for a balance in data-heat (frequency of access) and capacity, with applications that include CDN, compute, read-intensive use-cases, and data streaming. The drive comes in the 2.5-inch 18 mm U.2 and EDSFF E3.8 form-factors. The CD8P features a PCI-Express 5.0 x4 host interface, and comes in capacities ranging between 1.92 TB, going all the way up to 15.36 TB. Write endurance recommended is between 1 DWPD to 3 DWPD, so this really isn't a major write-intensive drive, for that, you'll need to pay attention to our next drive, the KIOXIA FL6.

The FL6 from KIOXIA is a scribe par none. It's aimed at write heavy applications such as server caching, and the hottest tiers in tiered storage; and Big Iron database machines. The FL6 comes in capacities of up to 3.2 TB, but offers a mammoth 60 DWPD write endurance. It comes in the 2.5-inch 18 mm form factor with PCI-Express 3.0 x4 interface. Security features include SIE, SED, and FIPS 140-2.

MINISFORUM's first Mini WorkStation MS-01, is officially available for pre-order on the official store. Tailored for tech-savvy gamers, this high-performance Mini WorkStation boasts the fastest network speed, strongest expansion capabilities, and maximum storage. It offers options with Intel Core i9-13900H and i9-12900H processors, starting at a price of $549 USD.

The MS-01 is powered by the Intel 13th generation's most robust mobile Core i9 processor, the i9-13900H, featuring 14 cores and 20 threads, a base frequency of 2.6 GHz, and a turbo boost frequency of 5.4 GHz. With the integrated 96EU Intel Iris Xe graphics, running at up to 1.5 GHz, it delivers outstanding flagship performance for tasks ranging from daily graphics processing to video production. In addition to its impressive performance, the MS-01 boasts a plethora of interfaces, enabling network transfer speeds of up to 65 Gbps, making it the fastest Mini PC in terms of network speed of MINISFORUM.

TYAN, a leading server platform design manufacturer and a MiTAC Computing Technology Corporation subsidiary, today introduced upgraded server platforms and motherboards based on the brand-new 5th Gen Intel Xeon Scalable Processors, formerly codenamed Emerald Rapids.

5th Gen Intel Xeon processor has increased to 64 cores, featuring a larger shared cache, higher UPI and DDR5 memory speed, as well as PCIe 5.0 with 80 lanes. Growing and excelling with workload-optimized performance, 5th Gen Intel Xeon delivers more compute power and faster memory within the same power envelope as the previous generation. "5th Gen Intel Xeon is the second processor offering inside the 2023 Intel Xeon Scalable platform, offering improved performance and power efficiency to accelerate TCO and operational efficiency", said Eric Kuo, Vice President of Server Infrastructure Business Unit, MiTAC Computing Technology Corporation. "By harnessing the capabilities of Intel's new Xeon CPUs, TYAN's 5th-Gen Intel Xeon-supported solutions are designed to handle the intense demands of HPC, data centers, and AI workloads.

TYAN, an industry leader in server platform design and a subsidiary of MiTAC Computing Technology Corporation, debuts its new server line-up for 4th Gen AMD EPYC & AMD Ryzen Processors at SC23, Booth #1917, in the Colorado Convention Center, Denver, CO, November 13-16.

AMD EPYC 9004 processor features leadership performance and is optimized for a wide range of HPC, cloud-native computing and Generative AI workloads
TYAN offers server platforms supporting the AMD EPYC 9004 processors that provide up to 128 Zen 4C cores and 256 MB of L3 Cache for dynamic cloud-native applications with high performance, density, energy efficiency, and compatibility.

With a simple mod, Storage Review got a Valve Steam Deck handheld gaming console to work with the world's highest capacity SSD, the mammoth 61.44 TB variant of the Solidigm D5-P5336. At its core, the Steam Deck is a highly compacted x86-64 PC powered by an AMD Ryzen mobile processor that features an industry standard PCIe interface, which it uses for an onboard M.2-2230 NVMe SSD. Storage Review used a simple adapter that converts M.2 to U.2—the interface of the D5-P5336—and the Steam Deck just worked.

Out of the box, the Steam Deck uses Valve's SteamOS, although it's fairly straightforward to install Windows, and get the Steam application to present its user interface (with which you can play just about any Windows PC game that's not yet available on SteamOS). A quick benchmark with KDiskMark (the Linux analog of CDM) sees the D5-P5336 post sequential read speeds of 3.6 GB/s, with 2.8 GB/s sequential writes. There's a catch here, though. It's not practical to lug the D5-P5336 along with your Steam Deck, the Solidigm drive is designed for servers, and besides the U.2 connection, requires a power input that a U.2 enclosure can provide.

Solidigm today announced the D7-5810, an enterprise SSD for extremely intensity write workloads. Such a drive would be capable of write endurance in the neighborhood of 50 DWPD. For reference, the company's D7-P5620, a write-centric/mixed workload drive for data-logging, and AI ingest/preparation, offers around 3 DWPD of endurance, depending on the variant; and the read-intensive drive meant for CDNs, the D5-P5336, offers around 0.5 DWPD. Use cases for the new D7-P5810 include high performance caching for flash arrays dealing with "cooler" data; high-frequency trading, and HPC.

Solidigm D7-P5810 uses SK hynix 144-layer 3D NAND flash that's made to operate in a pure SLC configuration. The drive comes in 800 GB and 1.6 TB capacities, and offers 50 DWPD over an endurance period of 5 years (4K random writes). More specifically, both models offer 73 PBW (petabytes written) of endurance. The drive comes in enterprise-relevant 15 mm-thick U.2 form-factor, with PCIe Gen 4 x4 interface, with NVMe 1.3c and NVMe MI 1.1 protocols.

TYAN, an industry-leading server platform design manufacturer and a subsidiary of MiTAC Computing Technology Corporation, today announced availability of new single-socket server platforms supporting AMD EPYC 8004 Series processors. These platforms are purpose built for cloud services and intelligent edge deployments while offering lower operating costs and delivering impressive energy efficiency.

"The AMD EPYC 8004 Series CPUs deliver a great combination of impressive performance and streamlined platform componentry which enables us to develop business-relevant server configurations for our customers," said Eric Kuo, Vice President of the Server Infrastructure Business Unit at MiTAC Computing Technology. "TYAN's innovative server platform, fueled by EPYC 8004 Series CPUs, empowers us to provide our customers with cost-effective solutions while also expanding into new markets."

Frore Systems, the maker of AirJet Mini, the World's first solid-state active cooling chip, demonstrated record breaking large capacity SSD performance, in an industry first 64 TB SSD storage device with AirJet. The collaboration with OWC, a leader in reliable solutions for computer hardware, accessories, and software, showcases the 64 TB OWC Mercury Pro U.2 Dual storage device with silent active cooling using 8 AirJet Minis, unleashing performance and enabling the fastest, compact, 64 TB capacity SSD storage device in its class.

Heat is the single biggest problem facing the electronics industry, and SSDs are no exception. The excessive heat generated by the fully loaded operation of 64 TB SSD renders the device inoperable when using traditional cooling methods like noisy mechanical fans or bulky ineffective heat sinks. With AirJet, the 64 TB OWC Mercury Pro U.2 Dual storage device operates between 2200 MB/s to 2600 MB/s sustained sequential writes, enabling large scale data storage in a compact form factor for the first time. This is great news for industries like film and television, that need silent, fast, secure and large-scale storage in small portable packages. The live demonstration of the 64 TB OWC Mercury Pro U.2 Dual storage device is on display at the Flash Memory Summit 2023 in Santa Clara, California.

KIOXIA America, Inc. today announced that its CD8P Series data center SSD has received a Flash Memory Summit "Best of Show" award in the "Most Innovative Memory Technology" category. These awards recognize the most significant products and companies worldwide within the flash memory and solid-state storage industries.

"We are proud to recognize KIOXIA for their unwavering commitment to advancing flash memory," said Jay Kramer, Chairman of the Awards Program and President of Network Storage Advisors Inc. "KIOXIA was the first vendor to offer drives designed with PCIe 5.0 NVMe 2.0 interface technology. The new KIOXIA CD8P drives continue the company's momentum by delivering the high performance and low latency required by next-generation digital enterprise and data center infrastructures."

KIOXIA America, Inc. today announced the addition of the KIOXIA CD8P Series to its lineup of data center-class solid state drives (SSDs). KIOXIA CD8P drives are well-suited to general purpose server and cloud environments that can take advantage of PCIe 5.0 (32 gigatransfers/s x4) performance. These data center applications can generate complex mixed workloads spread across large scale virtualized systems. The new drives are available in capacities up to 30.72 terabytes (TB) and in both Enterprise and Data Center Standard Form Factor (EDSFF) E3.S and 2.5-inch (U.2) form factors.

Optimized for the performance, latency, reduced power and thermal requirements of data center environments where power and cooling efficiency is critical, the KIOXIA CD8P Series provides the predictability and consistency needed for a seamless user experience. According to Jeff Janukowicz, Research Vice President, IDC, "Growth in NVMe SSDs continues with PCIe capacity shipments in servers and storage systems expected to grow at a 40% CAGR between 2022 and 2027. The new CD8P Series SSDs gives these customers the range of performance, capacity, and security choices essential for meeting the storage requirements of next-generation digital enterprise and data center infrastructure."

Inventec, a global leader in high-powered servers headquartered in Taiwan, is launching its cutting-edge C805G6 server for data centers based on AMD's newest 4th Gen EPYC platform—a major innovation in computing power that provides double the operating efficiency of previous platforms. These innovations are timely, as the industry worldwide faces converse challenges—on one hand, a growing need to reduce carbon footprints and power consumption, while, on the other hand, the push for ever higher computing power and performance for AI. In fact, in 2022 MIT found that improving a machine learning model tenfold will require a 10,000-fold increase in computational requirements.

Addressing both pain points, George Lin, VP of Business Unit VI, Inventec Enterprise Business Group (Inventec EBG) notes that, "Our latest C805G6 data center solution represents an innovation both for the present and the future, setting the standard for performance, energy efficiency, and security while delivering top-notch hardware for powering AI workloads."

Transcend Information (Transcend), a leading manufacturer of embedded memory products, is proud to release the latest U.2 NVMe SSD, the UTE210T. Designed for generative AI, high-performance computing (HPC), and big data analytics, this powerful SSD is built with the 112-layer 3D NAND flash, an 8-channel controller, and a PCIe Gen 4x4 interface. Experience high speeds, low latency, and minimal power consumption with your systems, but most of all, enjoy sequential R/W speeds of up to 7,200/6,500 MB/s and stable and reliable system performance that supports various applications of use.

Compliant with the NVMe 1.4 specification, Transcend's UTE210T comes bundled with a U.2 connector, enabling the drive to configure the PCIe interface with the U.2 backplane, ultimately enhancing transfer stability without compromising your servers. To address the demanding workloads associated with AI, its built-in DRAM provides exceptional random read speeds, which not only reduces NAND flash Program/Erase cycles (P/E cycles), but effectively extends drive lifespan to help manage a wide range of workloads. The UTE210T comes with up to 8 TB of storage capacity, ensuring servers and data centers are able to process vast amounts of data without compromising system performance.

ATP Electronics, the global leader in specialized storage and memory solutions, introduces its latest high-speed N601 Series M.2 2280 and U.2 solid state drives (SSDs) sporting the 4th generation PCIe interface and supporting the NVMe protocol. The new ATP PCIe Gen 4 SSDs' 16 GT/s data rate is double that of the previous generation, translating to a bandwidth of 2 GB/s for every PCIe lane.

Using x4 lanes, these SSDs have a maximum bandwidth of 8 GB/s, meeting the growing need for high-speed data transfer in today's demanding applications and making them suitable for both read/write-intensive, mission-critical industrial applications such as networking/server, 5G, data logging, surveillance, and imaging, with performance on par, if not better, than mainstream PCIe Gen 4 consumer SSDs in the market.

Introducing the CP132 - a PCIe 5.0 NVMe Sneakernet Solution specifically designed for large digital file transport and offline data backup, fitting any standard 5.25" optical drive bay of a computer case or rackmount. The CP132 enables businesses and professionals to physically transfer data with up to 4x U.2/U.3 NVMe SSD capacity at a whopping 128 Gbps transfer rate from one system or workstation to another. The CP132 is ideal for large-scale data backup or transfer in enterprises or video production studios, data transport between remote areas lacking network connectivity, or data migration between large data centers and clients.

The CP132 features a heavy-duty, fully-enclosed removable drive caddy that allows users to remove/install 4x U.2/U.3 NVMe SSDs together for physically transporting large amounts of data between systems. To remove the drive caddy, simply rotate the center thumb screw to release the retractable mechanical handle and pull the handle to remove the drive caddy from the system. To reinstall the drive caddy quickly, just reverse the previous steps. The rugged, all-metal enclosed drive caddy securely protects the installed U.2/U.3 SSDs, preventing damage to the valuable SSDs and data during transportation.

TYAN, an industry-leading server platform design manufacturer and a subsidiary of MiTAC Computing Technology Corporation, will be showcasing its latest HPC, cloud and storage platforms at Computex 2023, Booth #M0701a in Taipei, Taiwan from May 30 to June 2. These platforms are powered by AMD EPYC 9004 Series processors, which offer superior energy efficiency and are designed to enhance data center computing performance.

"As businesses increasingly prioritize sustainability in their operations, data centers - which serve as the computational core of an organization - offer a significant opportunity to improve efficiency and support ambitious sustainability targets," said Eric Kuo, Vice President of the Server Infrastructure Business Unit at MiTAC Computing Technology Corporation. "TYAN's server platforms powered by 4th Gen AMD EPYC processor enable IT organizations to achieve high performance while remaining cost-effective and contributing to environmental sustainability."

Solidigm, a leading global provider of innovative NAND flash memory solutions, is expanding its D5 Product Series with the Solidigm D5-P5430, a new QLC solid-state storage drive (SSD) optimized for mainstream and read-intensive workloads. With most of today's enterprise applications read-dominant, the D5-P5430—a 4th gen PCIe QLC SSD—offers substantial storage density and Total Cost of Ownership (TCO) opportunities while delivering read performance that is equivalent to the most widely-adopted TLC SSDs.

The D5-P5430 is optimized for mainstream workloads (e.g., email/unified communications, decision support systems, object storage, and virtual desktop infrastructure) and read-intensive workloads (e.g., content delivery networks, data lakes/pipelines, video-on-demand). These workloads are typically 80% reads or higher and need to move massive amounts of data at high throughput.

TYAN, an industry-leading server platform design manufacturer and a MiTAC Computing Technology Corporation subsidiary, will showcase its latest cloud server platforms powered by AMD EPYC 9004 Series processors and 4th Gen Intel Xeon Scalable processors for next-generation data centers at CloudFest 2023, Booth #H12 in Europa-Park from March 21-23.

"With the exponential advancement of technologies like AI and Machine Learning, data centers require robust hardware and infrastructure to handle complex computations while running AI workloads and processing big data," said Danny Hsu, Vice President of MiTAC Computing Technology Corporation's Server Infrastructure BU. "TYAN's cloud server platforms with storage performance and computing capability can support the ever-increasing demand for computational power and data processing."

AIC today announced its EB202-CP is ready to support newly launched 4th Gen AMD EPYC Embedded 9004 processors. By leveraging the five-year product longevity supported by AMD EPYC Embedded processors, EB202-CP provides customers with stable and long-term support. AIC and AMD will join forces to showcase EB202-CP at Embedded World in AMD stand No. 2-411 from 14th to 16th March, 2023 in Nuremberg, Germany.

AIC EB202-CP, a 2U rackmount server designed for AI and edge appliances, is powered by the newly released 4th Gen AMD EPYC Embedded processors. Featuring the world's highest-performing x86 processor and PCIe 5.0 ready, the 4th Gen AMD EPYC Embedded processors enable low TCO and delivers leadership energy efficiency as well as state-of-the-art security, optimized for workloads across enterprise and edge. EB202-CP, with 22 inch in depth, supports eight front-serviceable and hot-swappable E1.S/ E3.S and four U.2 SSDs. By leveraging the features of the 4th Gen AMD Embedded EPYC processors, EB202-CP is well suited for broadcasting, edge and AI applications, which require greater processing performance and within the most efficient, space-saving format.