
GIGABYTE Releases its First Entry-Level Motherboard with Dual-UEFI BIOS
After trying to avoid UEFI BIOS by sticking to "HybridEFI" workarounds to its existing AwardBIOS code on most of its socket LGA1155 and AM3+ motherboards, GIGABYTE reluctantly transitioned to UEFI with its socket LGA2011 motherboards, on which it fused its innovative Dual-BIOS technology with UEFI to come up with Dual-UEFI technology. One can imagine this to be particularly tough to implement on lower-end models, since UEFI with graphical setup program requires higher-capacity EEPROM chips, and since Dual-UEFI would need two, it would stress component costs, but GIGABYTE did it anyway.
In Japan, the company released the latest revision of the GA-H61MA-D3V (rev. 2.0), an entry-level socket LGA1155 motherboard based on the Intel H61 chipset, which features Dual-UEFI. Apart from this, the board also features GIGABYTE's Ultra-Durable 4 Classic component loadout, which consists of a new fiberglass fabric weave PCB that's more resistant to humidity that causes short-circuits, high ESD-resistance ICs, anti-surge ICs located on critical circuits, low RDS (on) MOSFETs, and a 100% high-grade solid-state capacitor design.
In Japan, the company released the latest revision of the GA-H61MA-D3V (rev. 2.0), an entry-level socket LGA1155 motherboard based on the Intel H61 chipset, which features Dual-UEFI. Apart from this, the board also features GIGABYTE's Ultra-Durable 4 Classic component loadout, which consists of a new fiberglass fabric weave PCB that's more resistant to humidity that causes short-circuits, high ESD-resistance ICs, anti-surge ICs located on critical circuits, low RDS (on) MOSFETs, and a 100% high-grade solid-state capacitor design.