To satisfy more than just the requirements of typical desktop applications, with the XPC Barebone SW580R8 the Taiwanese Mini-PC pioneer Shuttle is for the first time marketing a model with a cube format which impresses with features that were previously only found with traditional server and workstation products. Based on the Intel W580 chipset, as well as Intel Core processors of the 10th and 11th generation, the SW580R8 also supports Intel Xeon W series processors whose strengths lie in VFX, 3D rendering, complex 3D CAD and AI development & edge management.

For the first time in a Mini-PC from Shuttle, you can choose error-correcting ECC RAM. Spread over four slots, a maximum of 128 gigabytes is possible. Another first is the total of four network ports, two with a bandwidth of 2.5 Gbit and two with 1 Gbit, which support separate networks, offer failover and load balancing. One of the ports is vPro-compatible and AMT-compatible and, in conjunction with a suitable processor, enables convenient remote management, even when the PC is switched off.

Intel has quietly let out details of its latest-generation Xeon W series workstation processors based on the 14 nm "Rocket Lake" silicon. These chips are built in the same Socket LGA1200 package as the 11th Gen Core desktop processors, but compatible with the W580 chipset. The lineup includes two 6-core/12-thread; and five 8-core/16-thread parts. Leading the pack is the Xeon W-1390P, with clock speeds of up to 5.30 GHz, followed by the W-1390, at 5.20 GHz. These two SKUs feature Thermal Velocity Boost, and are analogous with the 11th Gen Core i9 series.

Next up, are the Xeon W-1370P and W-1370, clocked at speeds of up to 5.20 GHz, and 5.10 GHz respectively, These parts lack Thermal Velocity Boost, and are comparable in many ways to the 11th Gen Core i7 SKUs. The slowest of these 8-core parts is the energy-efficient W-1390T, ticking at nominal clocks of just 1.50 GHz, with 4.90 GHz maximum boost, but a TDP of just 35 W. Among the other SKUs, the "P" SKUs have rated TDP of 125 W, while the non-P ones have 80 W. The 6-core/12-thread SKUs include the W-1350P and W-1350, clocked up to 5.10 GHz and 5.00 GHz, respectively. All Xeon W processors support up to 128 GB of dual-channel DDR4-3200 memory with ECC support.

Intel will debut its 500-series desktop motherboard chipset series with its 11th Gen Core "Rocket Lake-S" desktop processors. A leaked alleged roadmap slide possibly from a presentation targeting an Intel ecosystem partner, reveals that the 500-series chipset will debut no sooner than March 2021, which could also mean "Rocket Lake-S" chips themselves could launch around that time, since Intel tends to launch new processor generations alongside new chipsets that are compatible out of the box. Even the 9th Generation "Coffee Lake Refresh" was accompanied by new Z390 and B365 chipsets. That said, Socket LGA1200 motherboards based on the existing 400-series chipset are expected to be compatible with "Rocket Lake-S," with BIOS updates. 500-series chipset motherboards might also support older 10th Gen Core "Comet Lake-S" processors.

The roadmap slide reveals that "Rocket Lake-S" could debut with strictly client-segment chipsets, such as the Z590 targeting overclockers, H570 targeting premium desktops, B560 targeting mid-range desktops, and H510 for entry-level desktops. Later in April, Intel could debut the Q570 chipset for commercial desktops, and W580 for workstations. What sets the 500-series chipset apart from the 400-series, appears to be a standardization of PCI-Express Gen 4, at least for the main PEG slot. Certain premium 400-series chipset motherboards already come with preparation for PCIe Gen 4 PEG. The "Rocket Lake-S" processor sees the first IPC increase by Intel on the desktop platform in five years, as the 14 nm chips are expected to feature new "Cypress Cove" CPU cores, which are a back-port of "Willow Cove" for the older 14 nm process. The chips could also feature a Gen12 Xe iGPU.